Chip packaging and loading mechanism
By using a cylinder to drive a piston rod to generate negative pressure and the synergistic effect of the adsorption and clamping mechanism, the stability problem of traditional chip packaging and mounting mechanisms is solved, achieving stable adsorption and clamping of chips, and improving packaging quality and efficiency.
Patent Information
- Application Number
- CN202520279203.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Traditional chip packaging mounting mechanisms have poor stability during chip adsorption and clamping, which can easily lead to chip drop and displacement, making it difficult to meet high-precision packaging requirements, reducing yield and increasing production costs.
The system uses a cylinder to drive the piston rod, which in turn drives the piston block to generate negative pressure for adsorption. The chip is then pressured by a clamping mechanism. Combined with a mirror-symmetrical clamping unit and a suction cup, the system achieves stable adsorption and clamping, enhancing the stability and positional accuracy of chip gripping.
It improves the yield and production efficiency of chip packaging, reduces chip drop and misalignment, lowers production costs, and meets the packaging requirements for high precision and high stability.
Smart Images
Figure CN223728760U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip packaging equipment technical field especially relates to a chip packaging mechanism. BACKGROUND
[0002] Chip packaging mechanism is the key equipment for transferring chips from the feeding position to the packaging position in the semiconductor packaging process. In the semiconductor manufacturing field, chip packaging is an important link, and the chip pickup mechanism is responsible for accurately picking up chips and placing them accurately in the designated packaging position, and its performance directly affects the quality and production efficiency of chip packaging.
[0003] The traditional chip packaging mechanism has obvious deficiencies in chip adsorption and clamping. In the adsorption link, most traditional mechanisms rely only on single suction method, such as simple vacuum adsorption. When facing uneven chip surface, small impurities and other situations, the adsorption effect is poor, and the chip adsorption is not firm, which is easy to fall off in the transfer process. In terms of clamping, the traditional mechanism often lacks reliable auxiliary clamping means, or the clamping structure is simple, and cannot be effectively adjusted according to the size and shape of the chip, resulting in uneven clamping force, and the chip is easy to deviate or tilt in the clamping process, which is difficult to meet the requirements of high-precision chip packaging, reduces the yield of chip packaging, and increases the production cost. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing a kind of chip packaging mechanism to solve the problem that the stability of traditional chip packaging mechanism is poor in chip adsorption and clamping process, and the precision is insufficient, ensure that chip does not fall off, not deviate in the transfer process, improve the yield and production efficiency of chip packaging.
[0005] The utility model realizes by the following technical scheme:
[0006] A kind of chip packaging mechanism, including base and the mechanical arm being located on the base, the end of mechanical arm away from the base is connected with connecting shaft, the end of connecting shaft away from the mechanical arm is equipped with protective shell, the connecting shaft is equipped with cylinder, the piston rod of cylinder passes through protective shell and then extends into the inside of protective shell, the inside of protective shell is equipped with sleeve, which is sleeved on the outer edge of piston rod, the end of piston rod away from the cylinder is equipped with piston block matched with the inner diameter of sleeve;When the piston block moves upward, chip can be adsorbed;The protective shell is also equipped with clamping mechanism, and the clamping mechanism can press chip when the piston rod moves upward.
[0007] Preferably, the clamping mechanism comprises a rotating rod and a hinged rod connected with the rotating rod, the hinged rod is arranged on the inner wall of the protective shell, the sleeve is provided with an opening, the piston rod is provided with a connecting block penetrating through the opening, and one end of the rotating rod is hinged to the connecting block; when the piston rod moves upward, the end of the rotating rod away from the connecting block is brought close to the chip.
[0008] Preferably, the opening, the connecting block, the hinged rod and the rotating rod form a first clamping unit, and a second clamping unit which is mirror-symmetric with the first clamping unit is further arranged in the protective shell.
[0009] Preferably, one end of the sleeve is connected to the inner wall of the protective shell, and the other end of the sleeve is provided with a suction disc for adsorbing the chip.
[0010] Preferably, the surface of the rotating rod in contact with the chip is provided with a rubber pad.
[0011] Preferably, the lower end of the protective shell is provided with a baffle.
[0012] Preferably, the length of the baffle in the vertical direction is greater than the length of the rubber pad in the vertical direction.
[0013] Preferably, the rotating rod is composed of a first rod segment and a second rod segment, and the included angle between the first rod segment and the second rod segment is 90°.
[0014] Compared with the prior art, the utility model has the advantages and beneficial effects that: the utility model moves the piston block upward by the piston rod driven by the cylinder to generate the adsorption effect, can stably suck the chip, compared with the traditional single adsorption mode, utilizes the negative pressure principle, can realize the better adsorption to the chips of different surface conditions, reduces the situation that the chip drops due to the unstable adsorption. Meanwhile, the clamping mechanism arranged in the protective shell synchronously presses and clamps the chip when the piston rod moves upward, the mode that the adsorption and the clamping cooperate greatly enhances the stability of the chip grabbing. In actual production, whether facing the miniaturization, high-precision chip or in the high-speed packaging operation, the position precision of the chip in the transfer process can be effectively guaranteed, the chip deviation or inclination is reduced, the yield of the chip packaging is obviously improved, the production cost is reduced, the production efficiency is improved, and the demand of the modern semiconductor packaging industry for high-precision, high-stability wafer operation is met. BRIEF DESCRIPTION OF DRAWINGS
[0015] The drawings described herein are used to provide further understanding of the embodiments of the utility model and form part of the present application and do not constitute limitation to the embodiments of the utility model. In the drawings:
[0016] Figure 1 It is the whole structure schematic view of the utility model.
[0017] Figure 2 The utility model discloses a
[0018] Figure 3 The utility model discloses a Figure 2 The enlarged view of A.
[0019] The utility model discloses a
[0020] 10, base, 11, mechanical arm, 12, connecting shaft, 13, protective housing, 131, baffle, 14, cylinder, 15, piston rod, 151, connecting block, 152, piston block, 16, sleeve, 161, opening, 17, rotating rod, 171, rubber pad, 172, articulated rod, 18, suction cup, 19, chip. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical scheme and advantage of the utility model embodiment more clear, the following will combine the drawings of the utility model embodiment, and the technical scheme of the utility model embodiment is clearly and completely described. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiment. Unless otherwise defined, the technical terms or scientific terms used in the utility model should be the usual meaning understood by the person skilled in the art to which the utility model belongs.
[0022] Embodiment 1:
[0023] As Figures 1 to 3 As shown in a chip 19 packaging piece mechanism, including base 10 and being located on base 10 mechanical arm 11, the end of mechanical arm 11 away from base 10 is connected with connecting shaft 12, the end of connecting shaft 12 away from mechanical arm 11 is equipped with protective housing 13, connecting shaft 12 is equipped with cylinder 14 in, the piston rod 15 of cylinder 14 passes through protective housing 13 and then extends into the inside of protective housing 13, the inside of protective housing 13 is equipped with sleeve 16 of setting on the outer edge of piston rod 15, the end of piston rod 15 away from cylinder 14 is equipped with piston block 152 matching with the inner diameter of sleeve 16;When piston block 152 moves upwards, can produce adsorption effect to chip 19;Protective housing 13 is also equipped with clamping mechanism, when piston rod 15 moves upwards, can drive clamping mechanism to pressurize chip 19.
[0024] In the process of chip 19 packaging, the chip 19 is often unstable, easy to fall off or offset, and the scheme aims to solve these problems to improve the packaging precision and efficiency. The key components are cylinder 14, piston rod 15, piston block 152, sleeve 16 and clamping mechanism. When working, the mechanical arm 11 drives the connecting shaft 12 and the protective shell 13 to move above the chip 19, starts the cylinder 14, the cylinder 14 drives the piston rod 15 to move upward, the piston block 152 moves upward, and the negative pressure is formed between the sleeve 16 and the piston block 152, so that the chip 19 is adsorbed. At the same time, the upward movement of the piston rod 15 drives the clamping mechanism to press the chip 19, further fixing the chip 19. In practical application, this double fixing method greatly enhances the stability of chip 19 grabbing, reduces the falling and offset of chip 19 in the transfer process, improves the yield of chip 19 packaging, and reduces the production cost.
[0025] In this embodiment, the clamping mechanism includes a hinge rod 172 connected to the rotating rod 17, and the hinge rod 172 is arranged on the inner wall of the protective shell 13. The sleeve 16 is provided with an opening 161, and the piston rod 15 is provided with a connecting block 151 passing through the opening 161. One end of the rotating rod 17 is hinged to the connecting block 151. When the piston rod 15 moves upward, the end of the rotating rod 17 away from the connecting block 151 can be brought closer to the chip 19.
[0026] When the piston rod 15 moves upward under the action of the cylinder 14, the connecting block 151 on the piston rod 15 moves upward. Since the connecting block 151 passes through the opening 161 on the sleeve 16 and is hinged to the rotating rod 17, the upward movement of the connecting block 151 causes the rotating rod 17 to rotate around the hinge rod 172, thereby bringing the end of the rotating rod 17 away from the connecting block 151 closer to the chip 19, and achieving clamping of the chip 19. In practical application, this structure is simple and reliable, can accurately control the clamping action of the rotating rod 17 according to the movement of the piston rod 15, enhances the reliability and stability of clamping the chip 19, adapts to the clamping requirements of chips 19 of different sizes, and improves the versatility of the chip 19 packaging mechanism.
[0027] In this embodiment, the opening 161, the connecting block 151, the hinge rod 172 and the rotating rod 17 form a first clamping unit, and a second clamping unit which is mirror-symmetric to the first clamping unit is also arranged in the protective shell 13.
[0028] The scheme aims to solve the problems of uneven clamping force and easy tilting of the chip 19 when clamping the chip 19 by a single clamping unit. The first clamping unit and the second clamping unit are key parts. When the piston rod 15 moves upward, the connecting block 151 in the first clamping unit drives the rotating rod 17 to move close to one side of the chip 19 for clamping; at the same time, the connecting block 151 in the mirror-symmetrical second clamping unit also moves upward with the piston rod 15, driving the rotating rod 17 to move close to the other side of the chip 19 for clamping. In actual application scenarios, the two mirror-symmetrical clamping units can simultaneously and uniformly exert clamping force on the chip 19 from both sides, effectively avoiding the tilting or uneven force of the chip 19 during clamping, further improving the stability and accuracy of the chip 19 grabbing, and improving the quality and efficiency of the chip 19 packaging.
[0029] In the embodiment, one end of the sleeve 16 is connected to the inner wall of the protective shell 13, and the other end of the sleeve 16 is provided with a suction cup 18 for adsorbing the chip 19.
[0030] The sleeve 16 is fixed at one end to the inner wall of the protective shell 13 to ensure structural stability, and the suction cup 18 at the other end can be more closely attached to the surface of the chip 19 when the piston block 152 moves upward to generate negative pressure. During operation, the piston block 152 moves upward to form negative pressure, and the suction cup 18 tightly adsorbs the chip 19 under the action of negative pressure, cooperating with the subsequent clamping action. In the actual chip 19 packaging operation, the setting of the suction cup 18 increases the adsorption area and strengthens the adsorption force, making the chip 19 more stable in the initial grabbing stage, reducing the risk of chip 19 falling due to poor adsorption, and improving the reliability of the entire on-chip process.
[0031] In the embodiment, the surface of the rotating rod 17 in contact with the chip 19 is provided with a rubber pad 171. The rubber pad 171 has a certain elasticity and friction, and when the rotating rod 17 clamps the chip 19, the rubber pad 171 can on the one hand fill the small gap between the rotating rod 17 and the chip 19, increase the contact area, and improve the stability of clamping; on the other hand, the rubber pad 171 is soft in texture, which can avoid direct scratching of the surface of the chip 19 by the rotating rod 17, and protect the chip 19 from damage. In the actual chip 19 packaging process, the application of the rubber pad 171 can effectively protect the integrity of the chip 19, reduce the scrap rate caused by damage to the chip 19, improve production efficiency, and at the same time enhance the reliability of clamping, ensuring that the chip 19 will not easily slip during the transfer process.
[0032] In this embodiment, the lower end of the protective shell 13 is provided with a baffle 131. The baffle 131 at the lower end of the protective shell 13 can block from below after the chip 19 is adsorbed and clamped. When unexpected situations such as instantaneous weakening of adsorption force, abnormality of clamping mechanism, etc. occur, the baffle 131 can prevent the chip 19 from falling directly. In actual application, the setting of the baffle 131 provides additional safety for the chip 19, reduces the loss caused by the falling of the chip 19, improves the safety and stability of the chip 19 packaging operation, and reduces the risk in the production process.
[0033] Working process:
[0034] In the chip 19 packaging operation, the mechanism starts to work. The mechanical arm 11 drives the connecting shaft 12 and the protective shell 13 to move above the chip 19. At this time, the cylinder 14 in the connecting shaft 12 starts to work, and the piston rod 15 moves through the protective shell 13 to the inside of the protective shell 13. The piston block 152 at the end of the piston rod 15 moves upward, and since the piston block 152 matches the inner diameter of the sleeve 16, the upward movement of the piston block 152 forms a negative pressure in the sleeve 16, and the suction cup 18 at the other end of the sleeve 16 tightly adsorbs the chip 19. At the same time, the connecting block 151 on the piston rod 15 moves upward, the connecting block 151 passes through the opening 161 of the sleeve 16 and drives the hinge rod 17 connected thereto to move, the hinge rod 17 rotates around the hinge rod 172 fixed on the inner wall of the protective shell 13, and the end of the hinge rod 17 away from the connecting block 151 moves close to the chip 19. Moreover, the first and second clamping units in the protective shell 13 move synchronously and clamp the chip 19 from both sides. After the adsorption and clamping of the chip 19 are completed, the mechanical arm 11 drives the connecting shaft 12 and the chip 19 to move to the designated packaging position, and then the cylinder 14 reverses the movement of the piston rod 15, the piston block 152 moves downward to release the negative pressure, and the hinge rod 17 also reverses the rotation under the drive of the piston rod 15 to loosen the chip 19, completing the placement operation of the chip 19. Thus, the chip 19 packaging operation is performed in a cycle.
[0035] Embodiment 2:
[0036] In this embodiment, the length of the baffle 131 in the vertical direction is greater than the length of the rubber pad 171 in the vertical direction. The length of the baffle 131 in the vertical direction is greater than the length of the rubber pad 171, which means that even if the chip 19 slides downward to a certain extent during clamping, the baffle 131 can block the chip 19 before the rubber pad 171 fails. In the actual chip 19 packaging process, this design enhances the protection of the chip 19, effectively deals with various unexpected situations that may occur, such as vibration, clamping force change caused by equipment failure, etc., further improves the safety of the chip 19 during transfer, reduces the loss caused by the falling of the chip 19, and ensures the smooth progress of production.
[0037] In the embodiment, the rotating rod 17 is composed of a first rod segment and a second rod segment, and the included angle between the first rod segment and the second rod segment is 90°. The rotating rod 17 with the included angle of 90° is hinged with the connecting block 151 through the first rod segment, so as to facilitate the transmission of the movement of the piston rod 15. When clamping the chip 19, the second rod segment can contact the chip 19 at a more suitable angle, thereby increasing the contact area and clamping force with the chip 19. In actual application, the structure can more stably clamp chips 19 of different shapes and sizes, especially some chips 19 with specific shapes, thereby improving the reliability and adaptability of clamping, and thus improving the working efficiency and applicability of the chip 19 packaging and mounting mechanism.
[0038] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. A chip packaging upper piece mechanism, comprising a base (10) and a mechanical arm (11) arranged on the base (10), and a connecting shaft (12) connected to an end of the mechanical arm (11) away from the base (10), characterized in that, an end of the connecting shaft (12) away from the mechanical arm (11) is provided with a protective shell (13), the connecting shaft (12) is provided with a pneumatic cylinder (14) inside, a piston rod (15) of the pneumatic cylinder (14) extends into the protective shell (13) after passing through the protective shell (13), the inside of the protective shell (13) is provided with a sleeve (16) sleeved on the outer edge of the piston rod (15), and an end of the piston rod (15) away from the pneumatic cylinder (14) is provided with a piston block (152) matching the inner diameter of the sleeve (16); when the piston block (152) moves upward, a chip (19) can be adsorbed. The protective shell (13) is also provided with a clamping mechanism, which can press the chip (19) when the piston rod (15) moves upward.
2. The chip encapsulation sheet attaching mechanism according to claim 1, wherein The clamping mechanism comprises a rotating rod (17) and a hinged rod (172) rotationally connected to the rotating rod (17), the hinged rod (172) is arranged on the inner wall of the protective shell (13), the sleeve (16) is provided with an opening (161), the piston rod (15) is provided with a connecting block (151) passing through the opening (161), and one end of the rotating rod (17) is hinged to the connecting block (151); when the piston rod (15) moves upward, the end of the rotating rod (17) away from the connecting block (151) can be brought close to the chip (19).
3. The chip encapsulation sheet attaching mechanism according to claim 2, wherein The opening (161), the connecting block (151), the hinged rod (172) and the rotating rod (17) form a first clamping unit, and a second clamping unit that is mirror-symmetric to the first clamping unit is also arranged in the protective shell (13).
4. The chip encapsulation sheet attaching mechanism according to claim 2, wherein One end of the sleeve (16) is connected to the inner wall of the protective shell (13), and the other end of the sleeve (16) is provided with a suction disc (18) for adsorbing the chip (19).
5. The chip encapsulation sheet attaching mechanism according to claim 2, wherein The surface of the rotating rod (17) in contact with the chip (19) is provided with a rubber pad (171).
6. The chip encapsulation sheet attaching mechanism according to claim 5, wherein The lower end of the protective shell (13) is provided with a baffle (131).
7. The chip encapsulation sheet attaching mechanism according to claim 6, wherein The length of the baffle (131) in the vertical direction is greater than the length of the rubber pad (171) in the vertical direction.
8. The chip encapsulation sheet attaching mechanism according to claim 2, wherein The rotating rod (17) is composed of a first rod piece and a second rod piece, and the included angle between the first rod piece and the second rod piece is 90°.