FC-BAG chip with protection support and packaging chip

Abstract

The utility model provides an FC-BAG chip with a protection support and a packaging chip, comprising a substrate, a wafer chip and a support bench, the wafer chip is arranged on the substrate, and the support bench is arranged on the upper surface of the substrate and surrounds the periphery of the wafer chip; the height of the support table relative to the upper surface of the substrate is greater than or equal to the height of the wafer chip relative to the upper surface of the substrate; the pressure of the heat dissipation device above the wafer chip is buffered through the support table, and the phenomenon that the wafer chip is damaged due to the fact that large pressure is applied to the edge area of the wafer chip in the process that the heat dissipation device is installed above the wafer chip is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially to a FC-BAG chip with a protective support and a packaged chip. BACKGROUND

[0002] In the existing flip chip ball grid array (FC-BAG) packaged chip, in order to better dissipate heat, the wafer chip is usually directly exposed, which facilitates the wafer chip to contact the heat dissipation device for heat dissipation. In order to ensure that the temperature of the wafer chip can be quickly transferred to the heat dissipation device, so that the temperature of the wafer chip can be quickly and effectively controlled, the heat dissipation efficiency is improved, and the service life of the wafer chip is prolonged, usually when assembling the heat dissipation device, the edge position of the heat dissipation device and the peripheral side position of the substrate of the packaged chip are fixed, and the central heat dissipation area of the heat dissipation device is placed above the wafer chip for heat dissipation. When the edge position of the heat dissipation device and the peripheral side of the substrate are fixed, each position is usually fixed by screw cooperation one by one. In the process of fixing one by one, the heat dissipation device will inevitably be relatively inclined in the direction of the current fixed position, which will cause pressure on the corresponding position of the wafer chip in that direction, resulting in uneven pressure on the wafer chip, and the wafer chip is more likely to be damaged due to compression.

[0003] Therefore, it is urgent to overcome the defects of the prior art in the technical field. UTILITY MODEL CONTENTS

[0004] The utility model needs to solve the problem of how to avoid the wafer chip from being damaged due to the inclination of the heat dissipation device during the process of assembling the heat dissipation device on the wafer chip.

[0005] In the first aspect, a FC-BAG chip with a protective support is provided, comprising: a substrate 1, a wafer chip 2 and a support table 3, wherein:

[0006] The wafer chip 2 is arranged on the substrate 1, and the support table 3 is arranged on the upper surface of the substrate 1 and surrounds the circumferential position of the wafer chip 2.

[0007] The height of the support table 3 relative to the upper surface of the substrate 1 is greater than or equal to the height of the wafer chip 2 relative to the upper surface of the substrate 1.

[0008] Preferably, the height of the support table 3 relative to the upper surface of the substrate 1 is 0.5mm-0.8mm.

[0009] Preferably, the upper surface of the substrate 1 is further provided with a plurality of capacitors 8, and the plurality of capacitors 8 are distributed at the circumferential position of the wafer chip 2.

[0010] Preferably, the support platform 3 is arranged along the edge of the upper surface of the substrate 1, and the wafer chip 2 and all capacitors 8 are arranged in the inner circle of the support platform 3.

[0011] Preferably, the lower surface of the substrate 1 is also provided with a plurality of tin balls 9 arranged in an array.

[0012] Preferably, double-sided adhesive tape is arranged between the support platform 3 and the substrate 1, and the support platform 3 is fixed to the substrate 1 by the double-sided adhesive tape.

[0013] Preferably, the height difference between the height of the support platform 3 relative to the upper surface of the substrate 1 and the height of the wafer chip 2 relative to the upper surface of the substrate 1 is less than or equal to 0.1 mm.

[0014] In a second aspect, a packaged chip is provided, which comprises the FC-BAG chip with a protective support, a base 4, and a heat sink 5, wherein:

[0015] The substrate 1 is arranged above the base 4, and the heat sink 5 is arranged above the substrate 1, the wafer chip 2, and the support platform 3, and the side of the heat sink 5 is fixed to the base 4.

[0016] The heat sink 5 is arranged on the upper surface of the wafer chip 2 and is used for dissipating heat from the wafer chip 2.

[0017] Preferably, the FC-BAG chip with a protective support further comprises at least four screws 6.

[0018] The base 4 is provided with at least four through holes, and the at least four through holes are arranged at the side of the substrate 1.

[0019] The heat sink 5 is provided with at least four screw holes, and each screw hole corresponds to one of the through holes.

[0020] Each screw 6 is inserted into one of the through holes and is fixed to the corresponding screw hole, thereby achieving the fixation between the heat sink 5 and the base 4.

[0021] Preferably, each screw 6 is further provided with a spring 7, and the spring 7 is arranged between the nut of the screw 6 and the lower surface of the base 4.

[0022] The utility model provides a kind of FC-BAG chip and package chip with protection support, comprising: substrate 1, wafer chip 2 and support table 3, wherein: the wafer chip 2 is set on the substrate 1, the support table 3 is set on the upper surface of the substrate 1 and surrounds the perimeter position of the wafer chip 2;The height of the support table 3 relative to the upper surface of the substrate 1 is greater than or equal to the height of the wafer chip 2 relative to the upper surface of the substrate 1;The pressure of the heat dissipation device from the upper side of the wafer chip 2 is buffered by the support table 3, to avoid the process of heat dissipation device installation on the wafer chip 2, greater pressure is applied to the edge area of wafer chip 2, resulting in damage to wafer chip 2. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0024] Figure 1 The device schematic diagram of the FC-BAG chip with protection support provided by the utility model embodiment is shown in the figure.

[0025] Figure 2 The cross-sectional view of the FC-BAG chip with protection support provided by the utility model embodiment is shown in the figure.

[0026] Figure 3 The schematic diagram of the existing FC-BAG chip when installing heat dissipation device is shown in the figure.

[0027] Figure 4 The schematic diagram of the package chip when installing heat dissipation device is shown in the figure.

[0028] Figure 5 The cross-sectional view of the FC-BAG chip with protection support provided by the utility model embodiment is shown in the figure.

[0029] Figure 6 The device schematic diagram of the FC-BAG chip with protection support provided by the utility model embodiment is shown in the figure.

[0030] Figure 7 The schematic diagram of the package chip when installing heat dissipation device is shown in the figure.

[0031] Among them, the drawing number is as follows:

[0032] Substrate 1; wafer chip 2; support table 3; base 4; heat sink 5; screw 6; spring 7; capacitor 8; solder ball 9. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the utility model clearer and more understandable, the utility model will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.

[0034] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure.

[0035] In the description of the utility model, the terms "first" and "second" are only for description purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, in the description, the same type of nouns can also be described as two independent individuals by adding "A" and "B" at the end, in which case the features limited by "A" and "B" are only used for the purpose of distinguishing the same type of individual description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated.

[0036] In describing some embodiments, "coupled", "coupling" and "connected" and their derivatives can be used. For example, the term "connected" can be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. For another example, the term "coupling" can be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the term "connected" or "coupled" can also refer to two or more components that do not have direct contact with each other, but still cooperate or interact with each other, such as "optical coupling", "wireless connection" and the like. The embodiments disclosed herein are not necessarily limited to the content of the utility model.

[0037] In the description of this utility model, "A and / or B" will be used to represent specific features. The corresponding expressions include the following three combinations: only A, only B, and a combination of A and B.

[0038] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the specified value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the specified quantity, i.e., the limitations of the measurement system.

[0039] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0040] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0041] This embodiment provides an FC-BAG chip with a protective bracket, such as Figure 1 and Figure 2 As shown, it includes: a substrate 1, a wafer chip 2, and a support platform 3, wherein: the wafer chip 2 is disposed on the substrate 1, the support platform 3 is disposed on the upper surface of the substrate 1 and surrounds the periphery of the wafer chip 2; the height of the support platform 3 relative to the upper surface of the substrate 1 is greater than or equal to the height of the wafer chip 2 relative to the upper surface of the substrate 1.

[0042] In this embodiment, the wafer chip 2 can be made of silicon crystal material. After the wafer chip 2 is disposed on the substrate 1, in order to ensure the heat dissipation of the wafer chip 2, the wafer chip 2 is exposed to the outside. At the same time, a heat dissipation device needs to be disposed on the wafer chip 2 to dissipate heat from the wafer chip 2.

[0043] If the support platform 3 is not installed, such as Figure 3As shown, the heat dissipation device 5 presses against the edge of the wafer chip 2, causing uneven pressure on the wafer chip 2, which makes the wafer chip 2 more susceptible to damage.

[0044] In this embodiment, such as Figure 4 As shown, a support platform 3, which can be made of plastic, is provided on the substrate 1. The support platform 3 is positioned around the periphery of the wafer chip 2, and its height relative to the upper surface of the substrate 1 is equal to or slightly higher than the height of the wafer chip 2 relative to the upper surface of the substrate 1. A heat dissipation device 5 is installed on the support platform 3. During the installation of the heat dissipation device 5, although it may be relatively tilted, it will be pressed against the support platform 3 and will not press on the wafer chip 2. This avoids the heat dissipation device 5 applying additional uneven pressure to the wafer chip 2 during installation, which could damage the wafer chip 2. After the heat dissipation device 5 is installed, it is fixed in various positions and the force is evenly distributed, so it will not tilt significantly in any direction and will not apply unbalanced pressure to the wafer chip 2. Furthermore, when the support platform 3 is slightly higher than the wafer chip 2, it can also abut against the heat dissipation device 5 above it, preventing the heat dissipation device 5 from directly applying excessive pressure to the wafer chip 2 and causing damage. The height of the support platform 3 relative to the upper surface of the substrate 1 is 0.5mm-0.8mm; in this embodiment, the height of the support platform 3 relative to the upper surface of the substrate 1 can be 0.5mm, 0.8mm, or 0.65mm.

[0045] In this embodiment, double-sided adhesive is provided between the support platform 3 and the substrate 1, and the support platform 3 is fixed to the substrate 1 by the double-sided adhesive.

[0046] If a gap exists between the heat dissipation device 5 and the wafer chip 2, thermal grease can be used to improve heat transfer efficiency. It is important to note that the gap between the heat dissipation device 5 and the wafer chip 2 should not be too large. If the gap is too large, more thermal grease needs to be applied, resulting in excessively thick thermal grease, which increases thermal resistance and affects heat transfer efficiency. Therefore, in this embodiment, the height difference between the support platform 3 and the wafer chip 2 relative to the upper surface of the substrate 1 is less than or equal to 0.1 mm to avoid an excessively large gap between the heat dissipation device 5 and the wafer chip 2, which would require excessively thick thermal grease and negatively impact heat dissipation efficiency.

[0047] In this embodiment, a filler adhesive is disposed between the wafer chip 2 and the substrate 1, and the wafer chip 2 is fixed to the substrate 1 by the filler adhesive. The filler adhesive can stably fix the wafer chip 2 and the substrate 1.

[0048] Furthermore, corresponding wiring and electrical interconnects need to be set up on the flip chip, therefore other basic components also need to be set up on substrate 1, such as... Figure 5 and Figure 6 As shown, a plurality of capacitors 8 are also disposed on the upper surface of the substrate 1, and the plurality of capacitors 8 are distributed on the periphery of the wafer chip 2.

[0049] Furthermore, since multiple capacitors 8 need to be installed on the substrate 1, and these capacitors 8 also occupy a large amount of space, the wafer chip 2, capacitors 8, and support platform 3 need to be arranged reasonably, and the support platform 3 needs to ensure a buffering effect against the downward pressure of the heat sink 5. The corresponding design is as follows: Figure 5 and Figure 6 As shown, the support platform 3 is arranged circumferentially along the edge of the upper surface of the substrate 1, and the wafer chip 2 and all capacitors 8 are located in the inner circle of the support platform 3. Figure 5 As shown, a plurality of solder balls 9 are also arranged in an array on the lower surface of the substrate 1.

[0050] like Figure 6 As shown, the wafer chip 2 is located in the middle of the upper surface of the substrate 1, and multiple capacitors 8 are distributed around the wafer chip 2. The support platform 3 is arranged around the outermost edge of the substrate 1, surrounding the wafer chip 2 and all the capacitors 8, so as to avoid the heat sink 5 from causing excessive pressure on the wafer chip 2 and capacitors 8 during the installation process and thus preventing damage.

[0051] In this embodiment, as Figure 7 As shown, a packaged chip is provided, which includes the above-mentioned FC-BAG chip with a protective bracket, and also includes a base 4 and a heat sink 5, wherein: the substrate 1 is disposed above the base 4, the heat sink 5 is located above the substrate 1, the wafer chip 2 and the support stage 3, and the periphery of the heat sink 5 is fixed to the base 4; the heat sink 5 is used to be placed on the upper surface of the wafer chip 2 and to dissipate heat from the wafer chip 2.

[0052] In the embodiment, the base 4 is used to carry the substrate 1 and to erect the heat sink 5, which can be fixed to the base 4 by screws 6. Specifically, the FC-BAG chip with the protective bracket is first arranged on the base 4, and then the heat sink 5 is arranged above the wafer chip 2 and the bracket table 3. Since the lower surface area of the heat sink 5 is much larger than the area of the substrate 1, the middle position of the heat sink 5 corresponds to the wafer chip 2, and the peripheral edge position of the heat sink 5 corresponds to the base 4. The peripheral edge of the heat sink 5 is fixed to the base 4. By fastening and fixing the peripheral edge of the heat sink 5 to the base 4, a downward force is applied to the peripheral edge of the heat sink 5, which in turn applies a downward force to the middle position of the heat sink 5, so that the middle position of the heat sink 5 can be closer to or in close contact with the wafer chip 2, thereby improving the heat dissipation effect of the heat sink 5 on the wafer chip 2.

[0053] Further, on the basis of the above-mentioned related structure design of the heat sink 5 and the base 4, the embodiment also relates to the following design: Figure 7 As shown in the figure, the packaging chip further comprises at least four screws 6; the base 4 is provided with at least four through holes, which are distributed at the peripheral position of the substrate 1; the heat sink 5 is provided with at least four screw holes, each of which corresponds to one of the through holes; each screw 6 passes through one of the through holes and is fixed with the corresponding screw hole, realizing the fixation between the heat sink 5 and the base 4.

[0054] In the embodiment, since the substrate 1, the wafer chip 2 and the heat sink 5 are all square, in order to ensure the stability of the fixation between the heat sink 5 and the base 4, at least four screws 6 are needed to fix the heat sink 5 and the base 4. The four screw holes can be arranged at the four top corner positions of the heat sink 5, and the four through holes correspond to the four screw hole positions respectively and are matched by the screws 6. The screws 6 are inserted into the corresponding through holes from below the base 4 and are fixed with the screw holes on the heat sink 5. By means of the at least four screws 6, the four top corner regions of the heat sink 5 are fixed and matched with the base 4, realizing the fixation of the heat sink 5.

[0055] Further, in order to ensure that the heat sink 5 can continuously adhere to the wafer chip 2 or maintain the closest distance between the heat sink 5 and the wafer chip 2, thereby maintaining a relatively excellent heat dissipation efficiency, it is necessary to continuously apply a downward force to the heat sink 5, in the embodiment, if the screw 6 is directly tightened to apply a downward pressure to the edge position of the heat sink 5, it can be difficult to better control the tightening degree of the screw 6, if the tightening degree is too large, it can apply an excessive downward force to the heat sink 5, which can cause damage to the heat sink 5, the wafer chip 2 or the substrate 1, in order to avoid the above situation, while continuously applying a downward force to the heat sink 5, the embodiment also relates to the following design:

[0056] As shown in Figure 7 each screw 6 is also sleeved with a spring 7, and the spring 7 is located between the nut of the screw 6 and the lower surface of the base 4.

[0057] In the embodiment, when the screw 6 is screwed into the screw hole upward, the screw 6 is screwed into the screw hole of the heat sink 5 upward, and since the position of the base 4 is unchanged, the screw 6 is matched through the through hole and the screw hole, therefore, in the process of screwing the screw 6 into the screw hole of the heat sink 5, the distance between the nut of the screw 6 and the lower surface of the base 4 is reduced, and the spring 7 sleeved on the screw 6 and located between the nut and the lower surface of the base 4 is compressed, the compressed spring 7 gives the nut and the lower surface of the base 4 an elastic restoring force, since the position of the base 4 is fixed and unchanged, the nut is subjected to a downward force under the action of the spring 7, since the screw 6 and the heat sink 5 are relatively matched and fixed, therefore the elastic restoring force of the spring 7 continuously gives the heat sink 5 a downward force, when the degree of screwing all the screws 6 into the corresponding screw holes is basically consistent, the degree of compression of each spring 7 is also relatively consistent, and then the elastic restoring force of each spring 7 is also basically consistent, so that the downward force received by each position of the heat sink 5 is consistent, which ensures that the heat sink 5 can be pressed on the support table or the wafer chip 2 with more balanced stress; on the other hand, since the elastic restoring force of the spring 7 when compressed is significantly smaller than the pressure generated by directly tightening the screw 6, therefore the downward force applied to the heat sink 5 by the elastic restoring force basically will not cause the heat sink 5 to excessively compress the support table 3, therefore the spring 7 realizes the adhesion between the heat sink 5 and the support table 3, and maintains a good heat dissipation efficiency.

[0058] The above only describes the preferred embodiment of the utility model, and does not limit the utility model, any modification, equivalent replacement and improvement made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An FC-BAG chip with a protective bracket, characterized by, include: Substrate (1), wafer chip (2), and support stage (3), wherein: The wafer chip (2) is disposed on the substrate (1), and the support platform (3) is disposed on the upper surface of the substrate (1) and surrounds the periphery of the wafer chip (2); The height of the support platform (3) relative to the upper surface of the substrate (1) is greater than or equal to the height of the wafer chip (2) relative to the upper surface of the substrate (1).

2. The FC-BAG chip with protective bracket according to claim 1, characterized in that, The height of the support platform (3) relative to the upper surface of the substrate (1) is 0.5mm-0.8mm.

3. The FC-BAG chip with protective bracket according to claim 1, characterized in that, The substrate (1) is also provided with a plurality of capacitors (8) on its upper surface, and the plurality of capacitors (8) are distributed on the periphery of the wafer chip (2).

4. The FC-BAG chip with protective bracket according to claim 3, characterized in that, The support platform (3) is arranged around the edge of the upper surface of the substrate (1), and the wafer chip (2) and all capacitors (8) are located in the inner circle of the support platform (3).

5. The FC-BAG chip with protective bracket of claim 1, wherein, The substrate (1) also has a plurality of solder balls (9) arranged in an array on its lower surface.

6. The FC-BAG chip with protective bracket of claim 1, wherein, Double-sided adhesive is provided between the support platform (3) and the substrate (1), and the support platform (3) is fixed to the substrate (1) by the double-sided adhesive.

7. The FC-BAG chip with protective bracket of claim 1, wherein, The height difference between the support platform (3) and the height of the wafer chip (2) relative to the upper surface of the substrate (1) is less than or equal to 0.1 mm.

8. A packaged chip, comprising: Includes the FC-BAG chip with a protective bracket as described in any one of claims 1 to 7, a base (4), and a heat sink (5), wherein: The substrate (1) is disposed above the base (4), and the heat sink (5) is located above the substrate (1), the wafer chip (2) and the support platform (3). The periphery of the heat sink (5) is fixed to the base (4). The heat sink (5) is placed on the upper surface of the wafer chip (2) and is used to dissipate heat from the wafer chip (2).

9. The chip package of claim 8, wherein, The FC-BAG chip with a protective bracket includes at least four screws (6). The base (4) is provided with at least four through holes, which are distributed on the periphery of the substrate (1); The radiator (5) is provided with at least four screw holes, each screw hole being used to correspond to one of the through holes; Each of the screws (6) is inserted into one of the through holes and is fixed in conjunction with the corresponding screw hole to achieve the fixation between the heat sink (5) and the base (4).

10. The chip package of claim 9, wherein, Each of the screws (6) is fitted with a spring (7) located between the nut of the screw (6) and the lower surface of the base (4).

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