Electronic equipment, photovoltaic module and photovoltaic system

Abstract

The utility model discloses electronic equipment, a photovoltaic module and a photovoltaic system. The electronic equipment comprises an equipment main body and a mounting base, the installation base is suitable for being installed on a back plate of a photovoltaic module, an installation cavity is formed in the installation base, the equipment body is detachably connected into the installation cavity, the installation cavity is provided with a cavity opening for the equipment body to go in and out, the installation base is provided with a first limiting structure at the cavity opening, and the equipment body is provided with a second limiting structure. The first limiting structure is in limiting fit with the second limiting structure. According to the invention, the equipment main body can be installed and fixed on the back plate of the photovoltaic module through the installation base, and the equipment main body is detachably connected in the installation cavity of the installation base, thereby facilitating the assembly, disassembly and subsequent maintenance of the equipment main body. And meanwhile, the first limiting structure is arranged to be matched with a second limiting structure in the equipment body in a limiting mode, and the installation stability of the equipment body and the installation base can be improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of photovoltaic technology, and particularly relates to an electronic device, a photovoltaic module and a photovoltaic system. BACKGROUND

[0002] A solar photovoltaic cell is a device for directly converting solar radiation energy into electric energy, a photovoltaic module is a product formed by connecting a plurality of photovoltaic cells in series and parallel and then encapsulating, and is a basic unit in a photovoltaic power generation system. A photovoltaic module optimizer is a key device for introducing electric energy generated by a solar photovoltaic cell into a power supply system.

[0003] In the related art, an optimizer is usually installed and fixed on a frame of a photovoltaic module by using a fastener such as a screw or a bolt; and for a photovoltaic module without a frame, an adhesive fixing method is usually used to directly adhere and fix the optimizer to a back plate of the photovoltaic module. However, the adhesive fixing method is inconvenient for subsequent disassembly and maintenance. CONTENT OF THE UTILITY MODEL

[0004] The application aims to provide an electronic device, a photovoltaic module and a photovoltaic system, and can solve the problem that an optimizer in the related art adopts an adhesive fixing method and is inconvenient for subsequent disassembly and maintenance.

[0005] To solve the above technical problem, the application is implemented as follows:

[0006] In a first aspect, an embodiment of the application provides an electronic device, which comprises a device main body and a mounting base.

[0007] The mounting base is adapted to be mounted on a back plate of a photovoltaic module, the mounting base is provided with a mounting cavity, the device main body is detachably connected in the mounting cavity, the mounting cavity has a cavity opening for the device main body to enter and exit, the mounting base is provided with a first limiting structure at the cavity opening, the device main body is provided with a second limiting structure, and the first limiting structure and the second limiting structure are in limiting cooperation.

[0008] In a second aspect, an embodiment of the application provides a photovoltaic module, which comprises a back plate and the electronic device of the first aspect, and the mounting base is mounted on the back plate.

[0009] In a third aspect, an embodiment of the application provides a photovoltaic system, which comprises the photovoltaic module of the second aspect.

[0010] In the embodiments of the present application, the device body can be mounted and fixed to the back plate of the photovoltaic module through the mounting base, so as to realize the connection and fixation of the device body and the back plate, and avoid the heat dissipation problem caused by the direct connection of the device body and the back plate. At the same time, the device body is detachably connected in the mounting cavity of the mounting base, which facilitates the assembly, disassembly and subsequent maintenance of the device body. In addition, by arranging the first limiting structure at the cavity opening of the mounting cavity, the first limiting structure and the second limiting structure in the device body are limited and matched, so that the device body can be limited in the mounting cavity of the mounting base, avoiding the device body from being taken out of the mounting cavity, thereby improving the installation stability of the device body and the mounting base.

[0011] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings, wherein:

[0013] Figure 1 is a perspective view of a first electronic device according to an embodiment of the present application;

[0014] Figure 2 is a front view of the first electronic device according to the embodiment of the present application;

[0015] Figure 3 is a schematic view of a first mounting base according to the embodiment of the present application;

[0016] Figure 4 is a top view of the first mounting base according to the embodiment of the present application;

[0017] Figure 5 is one of the perspective views of the device body according to the embodiment of the present application;

[0018] Figure 6 is the second perspective view of the device body according to the embodiment of the present application;

[0019] Figure 7 is a front view of the device body according to the embodiment of the present application;

[0020] Figure 8 is a schematic view of the heat dissipation fin in the device body according to the embodiment of the present application;

[0021] Figure 9 is a schematic view of a second electronic device according to the embodiment of the present application;

[0022] Figure 10 is a schematic view of a second mounting base according to the embodiment of the present application;

[0023] Figure 11 is Figure 9 is an enlarged view of A part shown in the middle circle;

[0024] Figure 12 is a schematic view of a third electronic device according to an embodiment of the present application;

[0025] Figure 13 is a schematic view of a third mounting base according to an embodiment of the present application;

[0026] Figure 14 is a schematic view of a photovoltaic module according to an embodiment of the present application.

[0027] Reference Signs:

[0028] 1: electronic device; 10: mounting base; 101: mounting cavity; 101a: cavity opening; 11: sliding table; 111: groove structure; 112: limiting piece; 1121: clamping groove; 113: accommodating groove; 12: stop piece; 121: elastic arm; 122: stop portion; 102: mounting surface; 103: heat dissipation gap; 104: heat dissipation hole; 105: reinforcing rib; 20: device main body; 21: sliding groove; 211: protruding structure; 212: limiting groove; 213: protruding portion; 22: heat dissipation fin; 2: back plate; 3: junction box; X: first direction. DETAILED DESCRIPTION

[0029] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0030] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] The electronic devices and photovoltaic modules provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0034] like Figures 1 to 5 As shown, an electronic device 1 according to some embodiments of this application includes: a device body 20 and a mounting base 10; the mounting base 10 is adapted to be mounted on the backsheet 2 of a photovoltaic module, the mounting base 10 has a mounting cavity 101, the device body 20 is detachably connected to the mounting cavity 101, the mounting cavity 101 has a cavity opening 101a for the device body 20 to enter and exit, the mounting base 10 has a first limiting structure at the cavity opening 101a, the device body 20 has a second limiting structure, and the first limiting structure and the second limiting structure limit each other.

[0035] In this embodiment, the device body 20 can be mounted and fixed to the backsheet 2 of the photovoltaic module via the mounting base 10, thereby achieving a connection and fixation between the device body 20 and the backsheet 2 and avoiding heat dissipation problems caused by direct connection between the device body 20 and the backsheet 2. Simultaneously, the device body 20 is detachably connected to the mounting cavity 101 of the mounting base 10, facilitating assembly, disassembly, and subsequent maintenance of the device body 20. Furthermore, by providing a first limiting structure at the cavity opening 101a of the mounting cavity 101, which engages with a second limiting structure in the device body 20, the device body 20 can be confined within the mounting cavity 101 of the mounting base 10, preventing it from detaching from the mounting cavity 101 and thus improving the installation stability of the device body 20 and the mounting base 10.

[0036] It can be understood that the electronic device 1 of the embodiments of the present application can be applied to a photovoltaic module, and in particular, can be applied to a frameless photovoltaic module. It is generally necessary to provide electronic components in a photovoltaic module, such as an inverter, a photovoltaic optimizer, a shutdown device, etc. Specifically, a junction box 3 is provided in the photovoltaic module, through which the electrical energy generated by the photovoltaic module can be exported, and then the input end of the electronic component is electrically connected to the junction box 3, and the output end of the electronic component can be electrically connected to an energy storage device or an electrical device, so as to utilize the electronic component to control and manage the performance of the photovoltaic module.

[0037] In actual application, photovoltaic modules are divided into photovoltaic modules with frames and frameless photovoltaic modules. For photovoltaic modules with frames, the corresponding electronic components are generally installed and fixed to the frame through connecting members; and for frameless photovoltaic modules, the electronic components need to be directly bonded and fixed to the backboard 2 of the photovoltaic module.

[0038] It can be understood that for frameless photovoltaic modules, the electronic components are fixed to the backboard 2 by bonding, if the amount of glue applied during bonding is too small, the bonding strength is insufficient and cannot meet the bonding requirements, and if the amount of glue applied is too large, the coverage area of the glue on the electronic components is too large, which will affect the heat conduction of the electronic components and thus affect the heat dissipation of the electronic components. Moreover, the electronic components are directly bonded and fixed to the backboard 2, and the electronic components are attached to the backboard 2, which is also not conducive to the heat dissipation of the electronic components.

[0039] Therefore, the electronic device 1 in the present application comprises a device main body 20 and a mounting base 10, the device main body 20 can be the above-mentioned electronic component, the mounting base 10 is used to be connected and fixed with the backboard 2 of the photovoltaic module, and the device main body 20 is detachably connected in the mounting cavity 101 provided in the mounting base 10. In this way, the mounting base 10 can be used to realize the mounting and fixing of the device main body 20 on the backboard 2, which can improve the flexibility of the installation and use of the electronic device 1 and facilitate the disassembly and maintenance of the device main body 20 during use. At the same time, by using the structure of the electronic device 1 of the present application, the mounting base 10 can be bonded and fixed with the backboard 2 of the photovoltaic module, and the device main body 20 is installed in the mounting base 10, which effectively avoids the heat dissipation problem caused by the direct bonding and fixing of the device main body 20 to the backboard 2.

[0040] Furthermore, a first limiting structure is arranged on the mounting base 10 at a position close to the cavity opening 101a, and a second limiting structure is correspondingly arranged in the device main body 20. The position of the device main body 20 in the mounting base 10 can be limited by the limiting cooperation of the first limiting structure and the second limiting structure, so as to improve the installation firmness and stability of the device main body 20 in the mounting base 10.

[0041] The first limiting structure can be formed by the structure of the mounting base 10 itself, or can be formed by a separate structural member mounted on the mounting base 10. The second limiting structure is matched with the first limiting structure, and can be arranged in the same way.

[0042] In some embodiments, the photovoltaic module can further include a front plate, an encapsulant film layer, and a cell sheet layer. The front plate, the encapsulant film layer, and the back plate 2 are sequentially stacked, the cell sheet layer is embedded in the encapsulant film layer, the encapsulant film layer covers the four sides of the cell sheet layer to form an encapsulation and protection effect on the cell sheet layer, and the cell sheet layer is formed by a plurality of cell sheets that are conductively interconnected with each other. One side of the photovoltaic module provided with the front plate is a light receiving side. The electronic device 1 is mounted on the back plate 2 to reduce the shading of the photovoltaic module receiving light.

[0043] Optionally, as shown in Figures 3 to 5 The opposite sides of the device body 20 are provided with sliding grooves 21, and the side of the mounting base 10 facing the mounting cavity 101 is provided with corresponding sliding platforms 11 that are slidingly connected to the sliding grooves 21.

[0044] In the embodiments of the present application, by providing the sliding grooves 21 on the device body 20 and the sliding platforms 11 on the mounting base 10, when the device body 20 is mounted, the sliding grooves 21 can be inserted into the sliding platforms 11, and then the device body 20 is pushed into the mounting cavity 101, facilitating the assembly and disassembly of the device body 20 and the mounting base 10. In addition, the cooperation of the sliding platforms 11 and the sliding grooves 21 between the device body 20 and the mounting base 10 also plays a limiting role on the device body 20.

[0045] As can be understood, as shown in Figure 1 When the device body 20 is mounted into the mounting cavity 101 of the mounting base 10, the sliding platforms 11 extend into the sliding grooves 21, and the sliding platforms 11 and the upper and lower groove walls of the sliding grooves 21 can form a mutual limiting effect in the thickness direction of the device body 20. At the same time, the cooperation of the two sliding platforms 11 and the sliding grooves 21 on the two sides of the device body 20 can form clamping and limiting from both sides. Further, the cooperation of the first limiting structure and the second limiting structure provided at the cavity opening 101a of the mounting cavity 101, so that the limiting of the device body 20 in three different dimensions can be realized, thereby ensuring the stability and firmness of the installation of the device body 20 in the mounting base 10.

[0046] In some embodiments, the side of the sliding platform 11 facing the mounting cavity 101 can be provided with a plurality of recess structures arranged at intervals, so that while ensuring the cooperation structure of the sliding platform 11 and the sliding groove 21, the contact area of the sliding platform 11 and the sliding groove 21 can be minimized, thereby reducing the friction in the sliding process, and facilitating the assembly and disassembly between the device body 20 and the mounting base 10.

[0047] Optionally, as shown in Figure 3 and Figure 4 , the first limiting structure comprises a groove structure 111 arranged at one end of the sliding table 11 close to the cavity opening 101a; as shown in Figure 6 , the second limiting structure comprises a protruding structure 211 arranged at the groove bottom of the sliding groove 21, which is clamped in the groove structure 111 to limit the device body 20 and the mounting base 10.

[0048] In the embodiment of the present application, by arranging the groove structure 111 at one end of the sliding table 11 towards the cavity opening 101a, and correspondingly arranging the protruding structure 211 in the device body 20, after the device body 20 is installed into the mounting cavity 101 of the mounting base 10 along the sliding table 11, the protruding structure 211 and the groove structure 111 are clamped, which can limit the device body 20 and the mounting base 10, preventing the device body 20 from being pulled out of the mounting cavity 101. At the same time, this limiting method has simple structure and is convenient for design and processing.

[0049] Optionally, as shown in Figures 9 to 11 , and Figure 9 , another schematic diagram of an electronic device is shown, wherein, Figure 9 only part of the structure of the device body 20 is shown. The first limiting structure comprises a limiting piece 112, the cavity wall of the mounting cavity 101 is provided with a receiving groove 113 arranged close to the cavity opening 101a, and the limiting piece 112 is movably connected in the receiving groove 113; the second limiting structure comprises a limiting groove 212 arranged on the outer side of the device body 20; the limiting piece 112 can move relative to the receiving groove 113 to switch between a limiting state and a non-limiting state.

[0050] Further, when the limiting piece 112 is in the limiting state, the limiting piece 112 at least partially protrudes from the receiving groove 113, and the protruding part of the limiting piece 112 is inserted into the limiting groove 212 to limit the device body 20 and the mounting base 10; when the limiting piece 112 is in the non-limiting state, the limiting piece 112 is retracted into the receiving groove 113 to release the limitation of the device body 20 and the mounting base 10.

[0051] In the embodiment of the present application, the accommodating groove 113 is arranged on the side of the cavity wall of the mounting cavity 101 close to the cavity opening 101a, and the limiting member 112 is movably connected in the accommodating groove 113. Correspondingly, the limiting groove 212 is arranged on the outer side of the device main body 20, and the position of the limiting groove 212 corresponds to the position of the limiting member 112. Further, the position of the limiting member 112 is adjusted by the telescopic movement of the limiting member 112 in the accommodating groove 113, and the limiting or unlimiting between the device main body 20 and the mounting base 10 is realized by the cooperation of the limiting member 112 and the limiting groove 212, which facilitates flexible operation in actual use.

[0052] Specifically, when the device main body 20 is mounted, the device main body 20 is pushed into the mounting cavity 101 from the cavity opening 101a of the mounting cavity 101. When the device main body 20 is installed in place, the position of the limiting member 112 corresponds to the position of the limiting groove 212, and the limiting member 112 is at least partially extended from the accommodating groove 113 and inserted into the limiting groove 212. The limiting cooperation of the limiting member 112 and the limiting groove 212 can limit the device main body 20 and the mounting base 10.

[0053] When the device main body 20 needs to be disassembled, the limiting member 112 is retracted into the accommodating groove 113, and the limiting member 112 is separated from the limiting groove 212, so that the limiting effect between the device main body 20 and the mounting base 10 can be eliminated, and the device main body 20 can be taken out of the mounting cavity 101, thereby realizing the quick disassembly of the device main body 20.

[0054] In some embodiments, the mounting base 10 can also be provided with an adjusting mechanism connected with the limiting member 112. The position of the limiting member 112 in the accommodating groove 113 can be adjusted by the adjusting mechanism, so as to realize the telescopic movement of the limiting member 112 in the accommodating groove 113.

[0055] For example, the adjusting mechanism can be a driving member, which can drive the limiting member 112 to move telescopically in the accommodating groove 113. Alternatively, the adjusting mechanism can also be an adjusting rod, which is arranged in the mounting base 10. One end of the adjusting rod is arranged opposite to the limiting member 112, and the other end is exposed outside the mounting base 10. The limiting member 112 can be driven to move telescopically in the accommodating groove 113 by pushing and pulling the adjusting rod.

[0056] Of course, the adjusting mechanism can also adopt other structural members capable of realizing the telescopic adjustment of the limiting member 112, which can be selected flexibly according to actual conditions, and is not limited herein.

[0057] Optionally, as Figure 11As shown, the outer side of the device body 20 is further provided with a protruding portion 213, which is closer to the cavity opening 101a than the limiting groove 212 in the direction in which the device body 20 enters the mounting cavity 101; when the limiting member 112 is in the limiting state, the protruding portion 213 acts on the limiting member 112 to push the limiting member 112 to at least partially extend out of the accommodating groove 113 and make the limiting member 112 at least partially limitingly fit with the limiting groove 212.

[0058] In the embodiment of the present application, by arranging the protruding portion 213 on the outer side of the device body 20, the protruding portion 213 is located on the side of the limiting groove 212 facing the cavity opening 101a; during the installation of the device body 20, the device body 20 is pushed into the mounting cavity 101, and when the device body 20 moves to the position corresponding to the protruding portion 213 and the accommodating groove 113, the protruding portion 213 partially contacts the limiting member 112 to push the limiting member 112 to move relative to the accommodating groove 113, so that the limiting member 112 at least partially extends out of the accommodating groove 113, and the extended limiting member 112 extends into the limiting groove 212, thereby achieving the limiting effect between the device body 20 and the mounting base 10. In this way, the limiting adjustment effect of the device body 20 and the mounting base 10 can be achieved by the cooperation of the protruding portion 213, the limiting member 112 and the limiting groove 212, which is simple in structure and convenient to operate.

[0059] Optionally, as shown in Figure 11 The limiting member 112 is rotationally connected in the accommodating groove 113, and the limiting member 112 and the groove wall of the accommodating groove 113 are arc surface fitted, the side of the limiting member 112 facing the mounting cavity 101 is a plane, and the side of the plane facing the cavity opening 101a is provided with a clamping groove 1121; when the limiting member 112 is in the limiting state, the protruding portion 213 is clamped into the clamping groove 1121 and pushes the limiting member 112 to rotate, so that the limiting member 112 at least partially extends out of the accommodating groove 113 and limitingly fits with the limiting groove 212; when the limiting member 112 is in the non-limiting state, the protruding portion 213 is separated from the clamping groove 1121 and pushes the limiting member 112 to rotate in the opposite direction, so that the limiting member 112 is retracted into the accommodating groove 113 to release the limiting of the device body 20 and the mounting base 10.

[0060] In the embodiment of the present application, the structure of the limiting member 112 is set so that the surface of the limiting member 112 cooperating with the accommodating groove 113 is arc-shaped, and the side facing the mounting cavity 101 is planar, that is, the limiting member 112 is a semicircular shaft structure. Thus, when the device main body 20 is moved to abut against the side edge of the planar side of the limiting member 112, the limiting member 112 can be rotated clockwise relative to the accommodating groove 113 under the extrusion force, and at this time, the other side edge of the planar surface extends out of the accommodating groove 113 and extends into the limiting groove 212 in the device main body 20. Meanwhile, the protruding portion 213 is located in the clamping groove 1121 in the planar surface. In this way, the position adjustment of the limiting member 112 can be automatically realized when the device main body 20 is mounted, so that the limiting member 112 is limited and cooperates with the limiting groove 212.

[0061] Further, when the device main body 20 needs to be dismounted, the device main body 20 is pressed towards the mounting cavity 101, so that the protruding portion 213 is out of the clamping groove 1121 and moves towards the center of the planar surface, the limiting member 112 can be rotated counterclockwise relative to the accommodating groove 113, so that the limiting member 112 is entirely withdrawn into the accommodating groove 113, so that the limiting action of the limiting member 112 and the limiting groove 212 can be released, so that the device main body 20 can be smoothly pulled out of the mounting cavity 101. Thus, by using the structure in the present application, the protruding portion 213 cooperates with the limiting member 112 in the semicircular shaft structure, and the automatic adjustment of the limiting member 112 can be realized during the mounting and dismounting of the device main body 20, which is simple in structure and convenient to operate.

[0062] Optionally, as shown in Figure 12 and Figure 13 , the mounting base 10 is further provided with a stop member 12, which is arranged at the cavity opening 101a, and the stop member 12 is used to limit the device main body 20 from being pulled out of the cavity opening 101a.

[0063] In the embodiment of the present application, the stop member 12 is arranged at the cavity opening 101a of the mounting base 10, so that when the device main body 20 is mounted into the mounting cavity 101 of the mounting base 10, the stop action of the stop member 12 can be used to limit the device main body 20 from being pulled out of the cavity opening 101a of the mounting cavity 101, thereby improving the mounting stability of the device main body 20 and the mounting base 10.

[0064] Optionally, as shown in Figure 13 , the stop member 12 includes an elastic arm 121 and a stop portion 122, one end of the elastic arm 121 is connected to the cavity opening 101a of the mounting base 10, and the stop portion 122 is connected to the other end of the elastic arm 121, and the stop portion 122 protrudes towards the cavity opening 101a to limit the device main body 20 from being pulled out of the cavity opening 101a.

[0065] In a specific application, the position of the stop portion 122 can correspond to the end position of the sliding platform 11. When installing the device body 20, the stop portion 122 can be first matched with the sliding groove 21. At this time, the stop portion 122 can be pried open to both sides by the groove wall of the sliding groove 21, the elastic arm 121 is deformed, and then the device body 20 is pushed to match the sliding groove 21 with the sliding platform 11, until the device body 20 is completely installed into the installation cavity 101 of the installation base 10, and the device body 20 is separated from the stop portion 122. Under the rebound action of the elastic arm 121, the stop portion 122 protrudes towards the cavity opening 101a, which can play a stop limiting role on the device body 20, thereby avoiding the device body 20 from being pulled out from the cavity opening 101a, and improving the installation firmness of the device body 20 in the installation base 10.

[0066] In the application, the two ends of the sliding groove 21 along the extension direction thereof can be provided with arc transition surfaces, so as to facilitate the cooperation between the arc transition surfaces and the stop portion 122 when the device body 20 is installed or dismounted.

[0067] It can be understood that the first limiting structure and the stop piece 12 described in the above embodiments can be applied separately or in combination, and can be flexibly set according to actual needs, which is not limited herein.

[0068] Optionally, as shown in Figure 1 and Figure 2 , the installation base 10 is provided with an installation surface 102 for connecting with the back plate 2. In the direction perpendicular to the installation surface 102 (i.e. the first direction X), a heat dissipation gap 103 is formed between the side end surface of the device body 20 towards the installation surface 102 and the installation surface 102.

[0069] In the embodiments of the present application, the installation base 10 has the installation surface 102 for connecting with the back plate 2 of the photovoltaic module. Further, a height difference is formed between the side end surface of the device body 20 towards the installation surface 102 and the installation surface 102 to form the heat dissipation gap 103. That is, when the installation base 10 is installed on the back plate 2 of the photovoltaic module, the heat dissipation gap 103 can be formed between the device body 20 and the back plate 2. The heat dissipation gap 103 is helpful for heat dissipation between the device body 20 and the back plate 2, thereby improving the heat dissipation performance of the device body 20.

[0070] In a specific application, the installation surface 102 of the installation base 10 can be connected and fixed with the back plate 2 of the photovoltaic module by means of gluing or the like. Since the heat dissipation gap 103 is formed between the side end surface of the device body 20 towards the installation surface 102 and the installation surface 102 in the electronic device 1, after the electronic device 1 is completely installed on the back plate 2, a corresponding gap space can be formed between the device body 20 and the back plate 2, so as to facilitate the heat dissipation of the device body 20.

[0071] Optionally, as shown in Figure 1 The mounting base 10 is provided with a heat dissipation hole 104, which is in communication with the heat dissipation gap 103.

[0072] In the embodiment of the present application, by providing the heat dissipation hole 104 in the mounting base 10, the heat dissipation gap 103 can be communicated with the environment around the mounting base 10 through the heat dissipation hole 104, so that the heat dissipation gap 103 can be in air circulation with the environment around the mounting base 10 through the heat dissipation hole 104 during use of the electronic device 1, thereby facilitating the rapid heat transfer from the heat dissipation gap 103 to the environment around the mounting base 10, and improving the heat dissipation effect of the electronic device 1.

[0073] The heat dissipation hole 104 can be a regular-shaped hole structure such as a circular hole, a square hole, an elliptical hole, a triangular hole, or a non-regular-shaped hole structure formed by combination of regular-shaped hole structures. The shape structure of the heat dissipation hole 104 can be flexibly set according to actual conditions, which is not limited herein.

[0074] Optionally, as shown in Figure 1 The heat dissipation hole 104 is provided in multiple numbers and arranged in a circumferential direction of the mounting base 10. By providing multiple heat dissipation holes 104 in the mounting base 10 and arranging the multiple heat dissipation holes 104 in a circumferential direction of the mounting base 10, the heat dissipation uniformity can be improved.

[0075] Optionally, as shown in Figure 1 The mounting base 10 is provided with multiple reinforcing ribs 105 arranged in a spaced manner on a side of the mounting base 10 away from the mounting cavity 101, and at least one heat dissipation hole 104 is arranged between adjacent two reinforcing ribs 105.

[0076] In the embodiment of the present application, multiple reinforcing ribs 105 are arranged on the side of the mounting base 10 away from the mounting cavity 101, and at least one heat dissipation hole 104 is arranged between adjacent two reinforcing ribs 105, so that the reinforcing ribs 105 can play a role in reinforcing the structure of the mounting base 10, and the heat dissipation hole 104 can improve the heat dissipation effect during use of the electronic device 1, thereby ensuring the heat dissipation performance of the electronic device 1 and taking into account the structural strength of the mounting base 10.

[0077] Optionally, as shown in Figure 2 The height of the heat dissipation gap 103 in a direction perpendicular to the mounting surface 102 (i.e., the first direction X) is H1, and 1mm≤H1≤10mm is satisfied; preferably, 4mm≤H1≤6mm.

[0078] In the embodiments of the present application, the height H1 of the heat dissipation gap 103 is set in a reasonable range, so that after the electronic device 1 is installed on the back plate 2 of the photovoltaic module, a certain gap space is ensured between the device body 20 and the back plate 2, which helps to improve the heat dissipation effect of the device body 20. At the same time, it is avoided that the heat dissipation gap 103 is too large, which needs to occupy more internal space of the electronic device 1, so that the volume of the electronic device 1 is increased, which is not conducive to the packaging, transportation and installation of the electronic device 1.

[0079] Specifically, the height H1 of the heat dissipation gap 103 can be set as: 1mm, 2mm, 3mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc. Any value or range between any two values.

[0080] In some embodiments, different specifications of electronic devices 1 are installed in the photovoltaic module, and the temperature rise test (the test method can refer to the standard IEC62109-1) is performed on the device body 20. The different specifications of electronic devices 1 are the same in structure except that the size of the heat dissipation gap 103 is different. Five groups of each specification of electronic device 1 are selected for testing, and the average temperature of the five groups is taken as the final test temperature. The test results are as shown in Table 1:

[0081] Table 1

[0082] H1 (mm) Average temperature (°C) Example 1 4 77.3 Example 2 5 75.8 Example 3 6 73.7 Example 4 7 71.6 Example 5 2 85.3 Example 6 3 82.4

[0083] From the test results in Table 1, it can be seen that in Embodiments 5 and 6, when the height H1 of the heat dissipation gap 103 is less than 4mm, the device body 20 is close to the back plate 2, although the heat dissipation gap 103 can also play a role in heat dissipation, but due to the close distance between the device body 20 and the back plate 2 of the photovoltaic module, the heat dissipation effect is affected, and the temperature rise of the device body 20 is relatively large.

[0084] Further, from the test data in Table 1, it can be seen that as the height H1 of the heat dissipation gap 103 increases, the test temperature of the device body 20 gradually decreases, that is, it is helpful for the heat dissipation of the device body 20, but if the heat dissipation gap 103 is too large, the overall height of the electronic device 1 is increased, the volume of the electronic device 1 is increased, which is not conducive to the packaging, transportation and use of the electronic device 1. Therefore, in the present application, the height H1 of the heat dissipation gap 103 is preferably set to be between 4mm and 6mm, so that the heat dissipation effect of the device body 20 can be ensured, and the appropriate size of the electronic device 1 can be considered.

[0085] Optionally, as Figure 2As shown, along the direction perpendicular to the mounting surface 102 (i.e., the first direction X), the height H2 of the side end face of the device body 20 away from the mounting surface 102 is H2, which satisfies: 21mm≤H2≤50mm; preferably, 35mm≤H2≤39mm; wherein, the height H2 of the side end face of the device body 20 away from the mounting surface 102 is the total height of the electronic device 1.

[0086] It is understandable that the main body 20 of the device has a certain height to meet structural design requirements during its design and manufacturing. If the height H2 is less than 21mm, and the height of the main body 20 is fixed, the distance between the main body 20 and the backsheet 2 of the photovoltaic module will be too close, which is not conducive to heat dissipation between the main body 20 and the backsheet 2. On the other hand, if the height H2 is greater than 50mm, the total height of the electronic device 1 will be too large, requiring more packaging and installation space, which is not conducive to the packaging, transportation and use of the electronic device 1.

[0087] Therefore, in this embodiment of the application, the height H2 is set between 21mm and 50mm to ensure both the heat dissipation effect of the electronic device 1 when applied to photovoltaic modules and the overall design rationality of the height of the electronic device 1, so as to facilitate the actual packaging, transportation and use of the electronic device 1.

[0088] Specifically, the height H2 of the side end face of the equipment body 20 away from the mounting surface 102 to the mounting surface 102 can be set to any value or a range between any two values, such as 21mm, 25mm, 30mm, 35mm, 36mm, 37mm, 38mm, 39mm, 40mm, 42mm, 45mm, 47mm, 50mm.

[0089] Optionally, such as Figure 7 As shown, along the direction perpendicular to the mounting surface 102, that is, along the first direction X, the thickness of the equipment body 20 is H3, which satisfies: 20mm≤H3≤40mm; preferably, 31mm≤H3≤35mm.

[0090] In this embodiment of the application, by setting a reasonable range of values ​​for the thickness H3 of the main body 20, the structural design needs of the main body 20 itself are met, while avoiding the space occupied by the main body 20 in the overall electronic device 1, thereby ensuring the heat dissipation effect when the electronic device 1 is applied to photovoltaic modules.

[0091] Specifically, the thickness H3 of the main body 20 of the equipment can be set to any value or a range between any two values, such as 20mm, 22mm, 25mm, 27mm, 30mm, 31mm, 32mm, 33mm, 34mm, 35mm, 38mm, 40mm.

[0092] Optionally, as shown in Figures 5 to 8 The mounting base 10 is provided with a mounting surface 102 for connecting with the back plate 2, and the heat dissipation fins 22 are arranged on the side of the device body 20 away from the mounting surface 102 and extend away from the mounting surface 102.

[0093] In the embodiment, the heat dissipation fins 22 are arranged in the device body 20 to quickly dissipate the heat generated during the operation of the device body 20 to the external environment by the heat conduction and heat exchange of the heat dissipation fins 22, thereby improving the heat dissipation effect of the device body 20.

[0094] Specifically, the heat dissipation fins 22 can be made of a heat-conducting material, such as a heat-conducting metal material such as copper or aluminum. Of course, the heat dissipation fins 22 can also be made of other materials, which can be flexibly selected according to actual conditions, and are not limited herein.

[0095] Optionally, as shown in Figure 8 The heat dissipation fins 22 are arranged in the device body 20 to improve the dissipation effect, and at the same time, the heat dissipation fins 22 are arranged at intervals to form a heat dissipation channel between adjacent two heat dissipation fins 22, which is beneficial to air circulation, thereby helping to improve the heat dissipation efficiency of the device body 20.

[0096] Optionally, the height of the heat dissipation fins 22 in the direction perpendicular to the mounting surface 102, i.e., in the first direction X, is H4, which satisfies: 1mm≤H4≤10mm; preferably, 7mm≤H4≤10mm. In the present application, the height H4 of the heat dissipation fins 22 is set to be between 1mm and 10mm, which can improve the heat dissipation performance of the device body 20 by using the heat dissipation fins 22, and also take into account the influence of the arrangement of the heat dissipation fins 22 on the overall volume of the electronic device 1.

[0097] It can be understood that if the height H4 is less than 1mm, the height of the heat dissipation fins 22 is relatively small and cannot effectively dissipate heat from the device body 20; and if the height H4 is greater than 10mm, the height of the heat dissipation fins 22 is relatively large, which can improve the heat dissipation effect of the heat dissipation fins 22, but as the height of the heat dissipation fins 22 increases, the overall height of the electronic device 1 will also increase, i.e., the overall volume of the electronic device 1 will also increase, which is not convenient for packaging, transportation and use of the electronic device 1, and also increases the production and use cost.

[0098] Specifically, the height H4 of the heat dissipation fins 22 can be set to be: 1mm, 3mm, 5mm, 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, etc., or any range between any two numerical values.

[0099] In some embodiments, the electronic device 1 with different heights of the heat dissipation fins 22 is respectively selected to be installed into the photovoltaic module, and the temperature rise test is performed on the device body 20 (the test method can refer to the standard IEC60947), wherein each electronic device 1 is the same in structure except the height of the heat dissipation fins 22, 5 groups of each specification of the electronic device 1 are selected for testing, the average temperature of the 5 groups is taken as the final test temperature, and the test results are as shown in Table 2.

[0100] Table 2

[0101] H4 (mm) Average temperature (°C) Example 7 7 86.7 Example 8 8 84.3 Example 9 9 83.8 Example 10 10 83.3 Example 11 5 90.1 Example 12 6 88.6

[0102] As can be seen from the test results in Table 2, compared with the embodiments 7-10, the height H1 of the heat dissipation gap 103 in the embodiments 11-12 is less than 7 mm, and the height of the heat dissipation fin 22 is low. Although the heat dissipation fin 22 can also play a role in heat dissipation of the device body 20, the heat dissipation area of the heat dissipation fin 22 is relatively small, and the heat dissipation effect on the device body 20 is limited, and the temperature rise of the device body 20 is relatively large.

[0103] Further, as can be seen from the test data in Table 2, with the increase of the height H4 of the heat dissipation fin 22, the test temperature of the device body 20 gradually decreases, which is helpful for heat dissipation of the device body 20. However, if the height of the heat dissipation fin 22 is too large, the overall height of the electronic device 1 will be increased, and the volume of the electronic device 1 will be increased, which is not conducive to the packaging, transportation and use of the electronic device 1. Therefore, in the present application, the height H4 of the heat dissipation fin 22 is preferably set to be between 7 mm and 10 mm, so that the heat dissipation effect on the device body 20 can be ensured, and the appropriate size of the volume of the electronic device 1 can be considered.

[0104] Alternatively, as shown in Figure 14 the present application also provides a photovoltaic module, which comprises a back plate 2 and the electronic device 1 in the above embodiments, the mounting base 10 is mounted on the back plate 2, and the device body 20 is electrically connected with a junction box 3 in the photovoltaic module.

[0105] In the embodiment of the present application, the device body 20 can be fixedly installed on the backboard 2 of the photovoltaic module through the installation base 10, so as to realize the connection and fixation of the device body 20 and the backboard 2, and avoid the heat dissipation problem caused by the direct connection of the device body 20 and the backboard 2. At the same time, the device body 20 is detachably connected in the installation cavity 101 of the installation base 10, facilitating the assembly, disassembly and subsequent maintenance of the device body 20. In addition, by arranging the first limiting structure at the cavity opening 101a of the installation cavity 101, the first limiting structure and the second limiting structure in the device body 20 are limited and matched, so as to limit the device body 20 in the installation cavity 101 of the installation base 10, avoid the device body 20 from being taken out of the installation cavity 101, and thus improve the installation stability of the device body 20 and the installation base 10.

[0106] Optionally, the embodiment of the present application also provides a photovoltaic system, which comprises a plurality of photovoltaic modules as described above, and in the photovoltaic system, each photovoltaic module can be arrayed. The photovoltaic system can be applied in a photovoltaic power station, such as a ground power station, a roof power station, a water surface power station, etc., or directly exists as a building roof, etc., and can also be applied in a device or apparatus using solar energy to generate electricity, such as a user solar power source, a solar street lamp, a solar car, a solar building, etc., and the specific form of the photovoltaic system is not limited. Of course, it can be understood that the application scenarios of the photovoltaic system are not limited to this, that is to say, the photovoltaic system can be applied in all fields requiring the use of solar energy to generate electricity.

[0107] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0108] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The utility model relates to a kind of photovoltaic module installation device, including: Device body and mounting base; The mounting base is suitable for being mounted on the backboard of photovoltaic module, installation cavity is equipped in the mounting base, the device body is detachably connected in the installation cavity, the installation cavity has cavity mouth for the device body to go in and out, the mounting base is equipped with first limit structure at the cavity mouth, the device body is equipped with second limit structure, the first limit structure and the second limit structure limit cooperation.

2. The electronic device of claim 1, wherein, The opposite sides of the device body are provided with sliding grooves, and the side of the mounting base facing the installation cavity is provided with corresponding sliding platforms, which are slidingly connected to the sliding grooves.

3. The electronic device of claim 2, wherein, The first limit structure includes a groove structure, which is provided at one end of the sliding platform close to the cavity mouth;The second limit structure includes a protruding structure, which is provided at the bottom of the sliding groove, and the protruding structure is clamped in the groove structure to limit the device body and the mounting base.

4. The electronic device of claim 1, wherein, The first limit structure includes a limiting member, and the cavity wall of the installation cavity is provided with a receiving groove, which is arranged close to the cavity mouth, and the limiting member is movably connected in the receiving groove;The second limit structure includes a limiting groove provided on the outer side of the device body, and the outer side of the device body is also provided with a protruding portion;The limiting member can be moved relative to the receiving groove to switch between the limiting state and the non-limiting state; When the limiting member is in the limiting state, the protruding portion acts on the limiting member to push the limiting member to at least partially extend out of the receiving groove, and the extended part of the limiting member is inserted into the limiting groove to limit the device body and the mounting base;When the limiting member is in the non-limiting state, the protruding portion is separated from the limiting member, and the limiting member is retracted into the receiving groove to release the limiting of the device body and the mounting base.

5. The electronic device of claim 4, wherein, The limiting member is rotatably connected in the receiving groove, and the limiting member and the groove wall of the receiving groove are arc surface matched, one side of the limiting member facing the installation cavity is provided as a plane, and the plane is provided with a clamping groove on one side facing the cavity mouth; When the limiting member is in the limiting state, the protruding portion is clamped into the clamping groove and pushes the limiting member to rotate, so that the limiting member at least partially extends out of the receiving groove and is limited by the limiting groove; When the limiting member is in the non-limiting state, the protruding portion is separated from the clamping groove and pushes the limiting member to rotate in the opposite direction, so that the limiting member is retracted into the receiving groove to release the limiting of the device body and the mounting base.

6. The electronic device of claim 1, wherein, The mounting base is also provided with a stopper, which is arranged at the cavity mouth, and the stopper is used to limit the device body from being pulled out of the cavity mouth.

7. The electronic device of claim 6, wherein, The stopper includes an elastic arm and a stopper, one end of the elastic arm is connected to the cavity mouth of the mounting base, the stopper is connected to the other end of the elastic arm, and the stopper protrudes towards the cavity mouth to limit the device body from being pulled out of the cavity mouth.

8. The electronic device of any of claims 1-7, wherein, The mounting base is provided with a mounting surface for connecting with the back plate, and a heat dissipation gap is formed between a side end surface of the device body facing the mounting surface and the mounting surface in a direction perpendicular to the mounting surface.

9. The electronic device of claim 8, wherein, The mounting base is provided with a heat dissipation hole, which is in communication with the heat dissipation gap.

10. The electronic device of claim 9, wherein, The heat dissipation hole is provided in a plurality of forms, and the plurality of heat dissipation holes are arranged in a circumferential direction of the mounting base. The mounting base is provided with a plurality of reinforcing ribs arranged in a spaced manner on a side thereof away from the mounting cavity, and at least one heat dissipation hole is arranged between two adjacent reinforcing ribs.

11. The electronic device of claim 8, wherein, In a direction perpendicular to the mounting surface, the height of the heat dissipation gap is H1, and 1mm≤H1≤10mm is satisfied.

12. The electronic device of claim 8, wherein, In a direction perpendicular to the mounting surface, the height from a side end surface of the device body away from the mounting surface to the mounting surface is H2, and 21mm≤H2≤50mm is satisfied. In a direction perpendicular to the mounting surface, the thickness of the device body is H3, and 20mm≤H3≤40mm is satisfied.

13. The electronic device of any of claims 1-7, wherein, The device body is provided with a heat dissipation fin, and the mounting base is provided with a mounting surface for connecting with the back plate. The heat dissipation fin is provided in a plurality of forms, and the plurality of heat dissipation fins are arranged in a spaced manner. In a direction perpendicular to the mounting surface, the height of the heat dissipation fin is H4, and 1mm≤H4≤10mm is satisfied.

14. A photovoltaic module, characterized by The electronic device comprises: The back plate and the electronic device according to any one of claims 1-13, and the mounting base is mounted on the back plate.

15. A photovoltaic system characterized by, The photovoltaic module comprises: The photovoltaic module according to claim 14.

Images