Camera module and electronic equipment
By using a drive component to control the movement of the carrier board and image sensor in the camera module, the problems of increased size and electromagnetic interference from magnetic components are solved, achieving optical image stabilization and improved reliability.
Patent Information
- Application Number
- CN202423136835.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-18
AI Technical Summary
The magnetic components in existing camera modules increase the module size and are susceptible to electromagnetic interference, resulting in lower reliability. Furthermore, the increased lens weight requires larger magnetic components to provide driving force.
Optical image stabilization is achieved by connecting a drive assembly to a carrier plate and controlling the movement of the carrier plate and image sensor in a plane perpendicular to the lens optical axis via a circuit board, thus avoiding the use of magnetic components.
It achieves optical image stabilization while avoiding the increase in module size and electromagnetic interference caused by magnetic components, thus improving the reliability and miniaturization of the camera module.
Smart Images

Figure CN223729828U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of camera modules and electronic devices. BACKGROUND
[0002] A camera module is a module for taking images.
[0003] The current camera module includes a magnetic element, so that the optical anti-shake can be completed by using the principle of electromagnetic induction, that is, the force of the energized conductor in the magnetic field. In order to realize higher pixels, the increase in the size of the lens will cause the weight of the lens to become heavier, which will also cause the need to set larger magnetic elements to provide force to realize optical anti-shake.
[0004] However, the magnetic element in the above-mentioned camera module increases the size of the camera module, and is easy to be affected by electromagnetic interference, resulting in low reliability of the camera module. INVENTION CONTENTS
[0005] The present application provides a camera module and an electronic device. The technical solution is as follows:
[0006] According to an aspect of the present application, a camera module is provided, comprising: a circuit board, a carrier plate, an image sensor, a lens component, and a driving assembly;
[0007] The carrier plate is located on one side of the circuit board, and the carrier plate is electrically connected with the circuit board;
[0008] The image sensor is fixed on the side of the carrier plate away from the circuit board, and the image sensor is electrically connected with the carrier plate;
[0009] At least part of the lens component is located on the side of the image sensor away from the circuit board, and the lens component is fixedly connected with the circuit board;
[0010] The driving assembly is located on the side of the circuit board where the carrier plate is arranged, the driving assembly is distributed on the periphery of the carrier plate and connected with the carrier plate, and the driving assembly is electrically connected with the circuit board;
[0011] The driving assembly is configured to exert a pulling force on the carrier plate under the control of the circuit board, so as to drive the image sensor to move in a plane perpendicular to the optical axis of the lens component through the carrier plate.
[0012] Optionally, the driving assembly comprises a plurality of pulling elements, the plurality of pulling elements are distributed around the periphery of the carrier plate, one end of each pulling element is fixedly connected with the side surface of the carrier plate, and the other end of each pulling element is fixed on the circuit board and electrically connected with the circuit board;
[0013] The circuit board is configured to control at least one of the pulling elements to apply a pulling force to the carrier plate, so as to drive the image sensor to move in a first direction and / or a second direction, the first direction and the second direction being perpendicular to an optical axis of the lens component, and the second direction intersecting the first direction.
[0014] Optionally, in the plurality of pulling elements, there are at least two pulling elements arranged oppositely in the first direction, and there are at least two pulling elements arranged oppositely in the second direction.
[0015] For two pulling elements arranged oppositely in the first direction or the second direction, the circuit board is configured to control one of the two pulling elements to shorten in length, so as to drive the carrier plate to move towards the pulling element that shortens in length, and the other pulling element to lengthen in length.
[0016] Optionally, the pulling element is a wire structure made of a memory metal, and the circuit board is configured to apply a driving current to the pulling element, so as to heat the pulling element and shorten the length of the pulling element.
[0017] Optionally, the camera module further comprises a plurality of first elastic components, the plurality of first elastic components being distributed around the carrier plate, one end of each of the first elastic components being fixedly connected to a side surface of the carrier plate, and the other end of each of the first elastic components being fixed to the circuit board.
[0018] Optionally, the plurality of first elastic components correspond to the plurality of pulling elements, and the first elastic components and the corresponding pulling elements are located on the same side of the carrier plate.
[0019] Optionally, the camera module further comprises an optical filter component and a plurality of second elastic components.
[0020] The optical filter component is located between the carrier plate and the lens component, and the optical filter component has a plurality of first grooves on a surface close to the carrier plate.
[0021] The plurality of second elastic components are located between the carrier plate and the optical filter component, the deformation direction of the plurality of second elastic components being parallel to the optical axis of the lens component, the plurality of second elastic components corresponding to the plurality of first grooves, one end of each of the second elastic components being fixedly connected to the carrier plate, and the other end of each of the second elastic components being located in the corresponding first groove and in contact with the groove bottom of the corresponding first groove.
[0022] Optionally, the carrier plate and the circuit board are provided with a plurality of second grooves in opposite positions.
[0023] The camera module further comprises a plurality of balls corresponding to the plurality of second grooves, at least part of the balls being located in the corresponding second grooves.
[0024] Optionally, there is a gap between the carrier plate and the circuit board, and in a direction perpendicular to the circuit board, the size of the gap between the carrier plate and the circuit board ranges from 30 microns to 50 microns.
[0025] Optionally, the camera module further comprises a U-shaped flexible circuit board, one end of the U-shaped flexible circuit board being electrically connected to the carrier plate, and the other end of the U-shaped flexible circuit board being electrically connected to the circuit board.
[0026] In another aspect, an electronic device is provided, which comprises any of the above camera modules.
[0027] The technical scheme provided by the embodiments of the present application has at least the following beneficial effects:
[0028] In the camera module provided by the present application, the driving assembly is connected to the carrier plate, and the driving assembly is electrically connected to the circuit board. In this way, the driving assembly can exert a pulling force on the carrier plate under the control of the circuit board, and pull the carrier plate and the circuit board to move relatively. Since the image sensor is fixed on the carrier plate, the image sensor can also move under the pulling of the driving assembly, so that external shaking can be compensated for, achieving the effect of optical image stabilization. Moreover, compared with the prior art, the camera module provided by the present application does not need to be provided with a magnetic element, and can also avoid the magnetic element being too large to increase the size of the camera module, and avoid the magnetic element being affected by electromagnetic interference, so that the reliability of the camera module can be improved. BRIEF DESCRIPTION OF DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0030] Figure 1 is a structural schematic diagram of a camera module provided by an embodiment of the present application;
[0031] Figure 2 is Figure 1 is an exploded view of the camera module provided by the present application;
[0032] Figure 3 is Figure 1An exploded view of part of the camera module is provided.
[0033] Figure 4 is Figure 1 A structural schematic view of part of the camera module is provided.
[0034] Figure 5 is Figure 4 A sectional structural schematic view of the camera module is provided.
[0035] Figure 6 is Figure 4 Another sectional structural schematic view of the camera module is provided.
[0036] The specific embodiments of the present application have been shown and described in the above drawings and text, and will be described in more detail below. These drawings and text are not intended to limit the scope of the present application concept in any way, but to illustrate the present application concept to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application will be described in more detail below with reference to the drawings.
[0038] The present application provides a camera module, please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic view of a camera module provided by the present application, Figure 2 is Figure 1 An exploded view of the camera module is provided, the camera module 10 includes: a circuit board 11, a carrier board 12, an image sensor 13, a lens component 14 and a driving assembly 15.
[0039] Here, the circuit board 11 is used to carry other components in the camera module 11, for example, the carrier board 12, the lens component 14 and the driving assembly 15. Some electronic components are provided on the circuit board 11 to facilitate the electrical connection between the camera module 10 and the external circuit structure, to realize the function of transmitting data and signals, such as image data.
[0040] The carrier board 12 is located on one side of the circuit board 11, and the carrier board 12 is electrically connected with the circuit board 11. Here, the carrier board 12 is used to carry the image sensor 13 in the camera module 11, and can be used to transmit electrical signals between the circuit board 11 and the image sensor 13. For example, the inside of the carrier board 12 can be provided with a wire, which can serve as a medium between the circuit board 11 and the image sensor 13, so that the circuit board 11 and the image sensor 13 can realize circuit conduction. For example, the wire inside the carrier board 12 can be gold wire, which has high conductivity.
[0041] The image sensor 13 is fixed on the side of the carrier plate 12 away from the circuit board 11, and the image sensor 13 is electrically connected with the carrier plate 12. Here, the light receiving surface of the image sensor 13 can receive light rays passing through the lens component 14, so that the image sensor 13 converts the light image on the light receiving surface into an electrical signal in a corresponding proportional relationship with the light image by using the photoelectric conversion function of the photoelectric device. The side of the carrier plate 12 away from the circuit board 11 can have a recess, and the image sensor 13 can be located in the recess, so as to improve the bonding strength of the carrier plate 12 and the image sensor 13, and also reduce the thickness of the camera module 11.
[0042] At least part of the lens component 14 is located on the side of the image sensor 13 away from the circuit board 11, and the lens component 14 is fixedly connected with the circuit board 11. Here, the lens component 14 is used to obtain external light rays and shoot them into the image sensor 13.
[0043] It should be noted that the lens component 14 can include a lens 141 and an autofocus (AF) motor 142. The lens 141 can include multiple lenses to converge external light rays, and the autofocus (AF) motor 142 can drive the lens 141 to move. When the distance between the shooting object and the lens changes, the autofocus motor 142 moves the focusing lens group in the lens 141 to the correct focus position, so as to ensure that the shooting object is clearly visible, and the autofocus function is realized. The lens 141 and the autofocus motor 142 can be rigidly connected by glue, and the lens component 14 and the circuit board 11 can also be fixedly connected by forming an adhesive layer between them. For example, the adhesive layer between the lens component 14 and the circuit board 11 can be annular.
[0044] The driving assembly 15 is located on the side of the circuit board 11 where the carrier plate 12 is arranged, and the driving assembly 15 is distributed on the periphery of the carrier plate 12 and connected with the carrier plate 12. The driving assembly 15 is electrically connected with the circuit board 11. Here, the driving assembly 15 is a structure capable of deforming in response to an electrical signal, so as to drive the image sensor 13 to move and realize optical anti-shake effect.
[0045] The driving assembly 15 is configured to apply a pulling force to the carrier plate 12 under the control of the circuit board 11, so as to drive the image sensor 13 to move in a plane perpendicular to the optical axis L of the lens component 14 through the carrier plate 12.
[0046] In the electronic device in which the camera module 10 is applied in the embodiment of the present application, a gyroscope and a processor can be arranged, and the process of the camera module 10 to realize optical image stabilization can be: when the electronic device shakes, the gyroscope can feed back the posture of the electronic device to the processor, and then the processor can calculate compensation data of external shaking based on the posture of the electronic device and send a control signal to the circuit board 11. In this way, the circuit board 11 can control the driving assembly 15 to exert a pulling force on the carrier plate 12 in a timely manner based on the control signal, and drive the image sensor 13 to move, so as to compensate for the shaking of the electronic device.
[0047] To sum up, the embodiment of the present application provides a camera module, wherein the driving assembly is connected with the carrier plate, and the driving assembly is electrically connected with the circuit board. In this way, the driving assembly can exert a pulling force on the carrier plate under the control of the circuit board, and drive the carrier plate and the circuit board to move relatively. Since the image sensor is fixed on the carrier plate, the image sensor can also move under the pulling of the driving assembly, so as to compensate for external shaking and realize the effect of optical image stabilization.
[0048] In the related art, the camera module adopts an optical image stabilization (OIS) technology to realize the anti-shaking effect, that is, the movement of the lens is controlled to compensate for the shaking, so as to reduce the imaging blur. The movement of the lens in the camera module needs to use a magnetic element as a driving force to drive the movement of the lens. After the camera module is integrated in the electronic device, other elements in the electronic device will also emit a magnetic field signal, which may interfere with the magnetic element, causing the magnetic element to be unable to normally drive the movement of the lens, thereby causing the camera module to have low reliability. Moreover, in order to realize higher pixels, the increase in the size of the lens will cause the weight of the lens to become heavier, which will also cause a larger magnetic element to be arranged to provide the driving force, thereby causing the camera module to have a large size.
[0049] In the embodiment of the present application, the camera module drives the movement of the image sensor through the driving component, without using a magnetic element, so as to realize the anti-shaking effect. In this way, after the camera module in the embodiment of the present application is integrated in the terminal device, the magnetic field generated by other elements in the terminal device will not interfere with the movement of the lens component, ensuring that the lens component can always normally move under the driving of the driving component, thereby effectively improving the reliability of the camera module. Moreover, since the image sensor has a light weight, the driving component has a small size, and the miniaturization of the camera module can be realized.
[0050] In the embodiment of the present application, in order to improve the driving force and stability of the driving assembly to drive the movement of the image sensor, please refer to Figure 2 and Figure 3 , Figure 3 isFigure 1 An exploded view of part of the camera module is provided. The driving assembly 15 comprises a plurality of pulling elements 151, which are distributed around the periphery of the carrier plate 12, and one end of each pulling element 151 is fixedly connected to the side surface of the carrier plate 12 to drive the carrier plate 12 to move. The other end of each pulling element 151 is fixed on the circuit board 11 and electrically connected to the circuit board 11, so that the circuit board 11 can control the pulling element 151 to exert a pulling force or not through an electrical signal.
[0051] The circuit board 11 is configured to control at least one pulling element 151 to exert a pulling force on the carrier plate 12 to drive the image sensor 13 to move in a first direction X and / or in a second direction Y. The first direction X and the second direction Y are both perpendicular to the optical axis L of the lens component 14, and the second direction Y intersects the first direction X. The first direction X and the second direction Y can be any two intersecting directions in a plane perpendicular to the optical axis L of the lens component 14. For example, Figure 3 The first direction X and the second direction Y shown can be perpendicular to each other.
[0052] By arranging a plurality of pulling elements 151 distributed around, the plurality of pulling elements 151 can exert a pulling force on the plurality of side surfaces of the carrier plate 12. In this way, the movement of the image sensor 13 in any direction in a plane perpendicular to the optical axis L of the lens component 14 can be achieved, thereby improving the accuracy and stability of the anti-shake control, and further improving the optical anti-shake effect of the camera module. In addition, by arranging a plurality of pulling elements 151, the driving force of the driving assembly 15 can also be increased. The number of pulling elements 151 in the driving assembly 15 can also be determined according to the size and weight of the carrier plate 12 and the image sensor 13, and the embodiments of the present application do not limit this.
[0053] In addition, since one end of each pulling element 151 is fixedly connected to the side surface of the carrier plate 12, and the other end of each pulling element 151 is fixed on the circuit board 11, the pulling element 151 maintains a certain angle relative to the circuit board 11. Therefore, a smaller part of the pulling force exerted by the pulling element 151 acts in a third direction Z, thereby improving the stability of the carrier plate 12 and the image sensor 13 in the third direction Z, which is a direction parallel to the optical axis L of the lens component 14.
[0054] It should be noted that, Figure 3The plurality of pulling elements 151 are distributed around the carrier plate 12, and the carrier plate 12 is in the shape of a rectangle. The plurality of pulling elements 151 can be distributed on the four sides of the carrier plate 12, and two pulling elements 151 are arranged on each side, so as to improve the stability of the movement of the carrier plate 12. However, the present application is not limited thereto. For example, the plurality of pulling elements 151 can also be equidistantly arranged on the side of the carrier plate 12.
[0055] The working principle of the plurality of pulling elements 151 will be described below in an exemplary embodiment.
[0056] Optionally, in the plurality of pulling elements 151, at least one set of two pulling elements 151 arranged oppositely in the first direction X, and at least one set of two pulling elements 151 arranged oppositely in the second direction Y.
[0057] For the two pulling elements 151 arranged oppositely in the first direction X or the second direction Y, the circuit board 11 is configured to control the length of one of the two pulling elements 151 to be shortened, so that the carrier plate 12 moves towards the pulling element 151 with the shortened length, and the length of the other pulling element 151 is lengthened.
[0058] Here, taking a set of pulling elements 151 in the first direction X as an example, when the first pulling element 151a is controlled by the circuit board 11 to be shortened in length, the first pulling element 151a can drive the carrier plate 12 to move towards the first pulling element 151a, and at this time, the second pulling element 151b is also lengthened in length under the driving of the carrier plate 12. When the second pulling element 151b is controlled by the circuit board 11 to be shortened in length, the second pulling element 151b can drive the carrier plate 12 to move towards the second pulling element 151b, and at this time, the first pulling element 151a is also lengthened in length under the driving of the carrier plate 12.
[0059] Therefore, taking the initial position of the carrier plate 11 as the origin, through a set of pulling elements 151 in the first direction X, the carrier plate 12 can realize positive and negative movements in the first direction X. Similarly, through a set of pulling elements 151 in the second direction Y, the carrier plate 12 can also realize positive and negative movements in the second direction Y. The initial position of the carrier plate 11 is the position when no anti-shake compensation is performed, and when the carrier plate 11 is in the initial position, the central axis of the image sensor 11 can coincide with the optical axis L of the lens component 14.
[0060] Optionally, the pulling element 151 is in the form of a wire structure made of a memory metal, and the circuit board 11 is configured to apply a driving current to the pulling element 151 to heat the pulling element 151, so as to shorten the length of the pulling element 151.
[0061] In this case, the initial length of the pulling element 151 can be designed as a shorter length, and after the length of the pulling element 151 is elongated, the length of the pulling element 151 can be shortened to the initial length by heating. Therefore, the pulling element 151 is made of a memory metal, and the driving assembly 15 can be effectively reduced in size by only providing a circuit structure for applying a driving current in the circuit board 11, which is beneficial to the miniaturization of the camera module 10.
[0062] In the process of driving the carrier plate 12 to move, for the two pulling elements 151 arranged opposite to each other in the first direction X or the second direction Y, the length of one pulling element 151 is shortened, i.e., the pulling element 151 is heated by the driving current and returns to the initial length. The length of the other pulling element 151 is elongated, i.e., the pulling element 151 still has a margin that can be deformed when not heated, so that the movement of the carrier plate 12 is not limited. For example, the pulling element 151 provided in the present application can be a bent memory metal wire, which has a smaller bending degree when not heated, and the length of the pulling element 151 is longer at this time, and the pulling element 151 can be stretched. After the temperature of the pulling element 151 reaches the above-mentioned other temperature range after heating, the pulling element 151 can return to the original state with a larger bending degree, i.e., the length of the pulling element 151 is shortened, so that the carrier plate 12 can be pulled.
[0063] Of course, in other possible implementations, if the size of the camera module 10 is not considered, the pulling element 151 can also be made of a common metal instead of a memory metal. In this way, the structure of the pulling element 151 can be a pull rope or a spring, and the driving assembly 15 can include a driving motor, which can also elongate or shorten the length of the pulling element 151 under the control of the driving motor.
[0064] In the embodiment of the present application, in order to quickly return the carrier plate to the initial position, please refer to Figure 2 and Figure 3 The camera module 10 further includes a plurality of first elastic components 16, which are distributed around the carrier plate 12, and one end of each first elastic component 16 is fixedly connected to the side surface of the carrier plate 12, and the other end of each first elastic component 16 is fixed to the circuit board 11. The first elastic component 16 can be a component that can be elastically deformed, so as to apply an elastic force to the carrier plate 12, so that the carrier plate 12 can be quickly returned to the initial position when there is no need for anti-shake. For example, the first elastic component 16 can be a spring piece structure.
[0065] Optionally, the plurality of first elastic components 16 correspond to the plurality of pulling elements 151, and the first elastic component 16 and the corresponding pulling element 151 are located on the same side of the carrier plate 12.
[0066] For example, the first elastic component 16 can be in a spring structure, and the initial state of the first elastic component 16 can be in a stretched state. During the driving of the carrier plate 12 to move, the length of the pulling element 151 is shortened, which exerts a pulling force to move the carrier plate 12 in the direction close to the pulling element 151 with shortened length, so as to drive the corresponding first elastic component 16 to be compressed. When the driving of the carrier plate 12 is not required to move for anti-shake compensation, the pulling element 151 does not exert a pulling force, and the elastic force of the corresponding first elastic component 16 can quickly recover to the stretched state and provide an elastic force to the carrier plate 12, so as to return the carrier plate 12 to the initial position.
[0067] In addition, since one end of each first elastic component 16 is fixedly connected to the side surface of the carrier plate 12, and the other end of each first elastic component 16 is fixed on the circuit board 11, the first elastic component 16 maintains a certain angle relative to the circuit board 11, and a small part of the elastic force exerted by the first elastic component 16 is also in the third direction Z, thereby improving the stability of the carrier plate 12 and the image sensor 13 in the third direction Z.
[0068] It should be noted that, Figure 3 Only an exemplary distribution of the first elastic component 16 around the carrier plate 12 is shown, and the shape of the carrier plate 12 is rectangular, so that the plurality of first elastic components 16 can be distributed on the four side surfaces of the carrier plate 12, wherein one first elastic component 16 is arranged at the center position of each side surface, so as to improve the stability of the movement of the carrier plate 12. However, the present application is not limited thereto.
[0069] In addition, two pulling elements 151 are arranged on the same side of the carrier plate 12, and the two pulling elements 151 can be distributed on the two sides of the first elastic component 16, so as to ensure the stability of the carrier plate 12, thereby improving the stability of the movement of the carrier plate 12.
[0070] Another camera module is provided in the embodiment of the present application, please refer to Figure 4 and Figure 5 , Figure 4 is Figure 1 a structural schematic view of part of the structure of the camera module provided by the present application, Figure 5 is Figure 4 a sectional structural schematic view of the camera module provided by the present application Figure 5 may be Figure 4The camera module also comprises a light filtering component 17 and a plurality of second elastic components 18.
[0071] The light filtering component 17 is located between the carrier plate 12 and the lens component 14, and has a plurality of first grooves B1 on the side close to the carrier plate 12. Since the human eye can only see light in the visible light range, while the photosensitive surface of the image sensor 13 can sense a wider spectrum range including infrared light, which will cause the color of the captured image to deviate from what the naked eye sees. The light filtering component 17 can be used to filter out infrared light to ensure the color accuracy of the captured image. The light filtering component 17 and the circuit board 11 can also form an adhesive layer through glue, and the light filtering component 17 and the autofocus motor 142 in the lens component 14 can also form an adhesive layer through glue, so that the light filtering component 17 is fixed between the circuit board 11 and the autofocus motor 142. Exemplarily, both of the two adhesive layers can be annular.
[0072] The light filtering component 17 can comprise a light filter 171 and a shell 172, and the orthographic projection of the light filter 171 on the circuit board 11 overlaps the orthographic projection of the image sensor 13 on the circuit board 11, so that the light incident on the photosensitive surface of the image sensor 13 passes through the light filter 171. The plurality of first grooves B1 are arranged on the side of the shell 172 close to the carrier plate 12, and the first grooves B1 are used to accommodate at least part of the second elastic components 18. The light filter 171 and the shell 172 can also be fixed by glue.
[0073] The plurality of second elastic components 18 are located between the carrier plate 12 and the light filtering component 17, and the deformation direction of the plurality of second elastic components 18 is parallel to the optical axis L of the lens component 14, so that the direction of the elastic force applied by the plurality of second elastic components 18 to the carrier plate 12 is parallel to the optical axis L of the lens component 14, i.e. the third direction Z. Exemplarily, the second elastic component 18 can be a spring in a compressed state, and the second elastic component 18 can apply a downward elastic force to the carrier plate 12, thereby ensuring the reliability and stability of the carrier plate 12 and the image sensor 13 in the third direction Z, and further improving the optical anti-shake effect.
[0074] The plurality of second elastic components 18 correspond to the plurality of first grooves B1. One end of each second elastic component 18 is fixedly connected to the carrier plate 12, and the other end of each second elastic component 18 is located in the corresponding first groove B1 and in contact with the groove bottom of the corresponding first groove B1. In this way, the distance between the carrier plate 12 and the light filtering component 17 can be further reduced on the basis of ensuring the reliability and stability of the carrier plate 12 and the image sensor 13, which is conducive to the miniaturization of the camera module 13. In addition, the end of the second elastic component 18 in contact with the groove bottom of the first groove B1 can be circular to reduce friction and increase the supporting strength.
[0075] The size of the first groove B1 can be greater than the size of the other end of the corresponding second elastic component 18, so that the friction caused by the contact between the groove wall of the first groove B1 and the second elastic component 18 can be avoided, and the elastic deformation of the second elastic component 18 can be limited, so that the normal work of the second elastic component 18 can be ensured.
[0076] Optionally, please refer to Figure 3 , Figure 4 and Figure 6 , Figure 6 is Figure 4 another cross-sectional structure diagram of the camera module provided by Figure 6 may be Figure 4 a cross-sectional structure diagram of the camera module provided by at A2-A2, the carrier plate 12 and the circuit board 11 are oppositely provided with a plurality of second grooves B2. Each group of second grooves B2 includes two second grooves B2 arranged on the carrier plate 12 and the circuit board 11 respectively, and the two second grooves B2 are oppositely arranged to form a communication accommodating space.
[0077] The camera module further comprises a plurality of balls 191, and the plurality of balls 191 correspond to the plurality of groups of second grooves B2. At least part of the balls 191 is located in the corresponding second groove B2. The balls 191 can be used to support the carrier plate 12 in the third direction Z. Since the balls 191 are spherical, the friction can be reduced to facilitate the relative movement of the carrier plate 12 and the circuit board 11, so that the driving force required when the driving assembly 15 drives the carrier plate 12 to move can be reduced. By arranging at least part of the balls 191 in the corresponding second groove B2, on the one hand, the second groove B2 can limit the range of relative movement of the carrier plate 12 and the circuit board 11, and on the other hand, the balls 191 can also avoid increasing the thickness of the camera module.
[0078] In the present application, the orthographic projection of the plurality of balls 191 on the circuit board 11 is located outside the orthographic projection of the image sensor 13 on the circuit board 11, so as to avoid the setting position of the image sensor 13, thereby the thickness of the camera module can be reduced. Figure 4The second groove B2 and the setting position of the ball 191 are shown in the example. The shape of the carrier plate 12 is rectangular. A plurality of second grooves B2 can be distributed at the positions of the four corners of the carrier plate 12. Each of the positions of the four corners is provided with a group of second grooves B2 and corresponding balls 191. In this way, the stability of the movement of the carrier plate 12 can be improved. However, the present application is not limited thereto. For example, the second grooves B2 can also be distributed at positions close to the four sides of the carrier plate 12.
[0079] Optionally, there is a gap between the carrier plate 12 and the circuit board 11. The gap can reduce the contact area between the carrier plate 12 and the circuit board 11, thereby reducing the friction, and facilitating the movement of the carrier plate 12. In the direction perpendicular to the circuit board 11, the size of the gap between the carrier plate 12 and the circuit board 11 ranges from 30 microns to 50 microns. By setting the size of the gap in this range, not only can the friction be reduced, but also the influence of the gap on the thickness of the camera module can be ensured to be not too large.
[0080] Optionally, the camera module further comprises a U-shaped flexible circuit board 192. One end of the U-shaped flexible circuit board 192 is electrically connected to the carrier plate 12, and the other end of the U-shaped flexible circuit board 192 is electrically connected to the circuit board 11. The U-shaped flexible circuit board 192 can serve as a medium for electrical connection between the carrier plate 12 and the circuit board 11. The U-shaped flexible circuit board 192 adopts a flexible substrate, so it still has high reliability when the carrier plate 12 moves.
[0081] Furthermore, in the direction of the wire outlet side of the U-shaped flexible circuit board 192, for example Figure 3 the first direction X shown, the U-shaped flexible circuit board 192 can have a certain allowance to avoid hindering the movement of the carrier plate 12, and also to avoid being damaged by the pulling of the U-shaped flexible circuit board 192 when the carrier plate 12 moves. In the direction of the non-wire outlet side of the U-shaped flexible circuit board 192, for example Figure 3 the second direction Y shown, the U-shaped flexible circuit board 192 can deform when the carrier plate 12 moves, and also will not hinder the movement of the carrier plate 12.
[0082] In summary, the camera module provided by the embodiments of the present application comprises a driving assembly connected to the carrier plate and electrically connected to the circuit board. In this way, the driving assembly can exert a pulling force on the carrier plate under the control of the circuit board, and pull the carrier plate to move relative to the circuit board. Since the image sensor is fixed on the carrier plate, the image sensor can also move under the pulling of the driving assembly, so that external shaking can be compensated for, and the effect of optical image stabilization can be achieved. Furthermore, compared with the prior art, the camera module provided by the present application also does not need to be provided with a magnetic element, and can avoid the magnetic element being too large to increase the size of the camera module, and can avoid the magnetic element being affected by electromagnetic interference, thereby improving the reliability of the camera module.
[0083] In another aspect, the embodiments of the present application also provide an electronic device, which comprises the camera module provided by any of the above embodiments. The electronic device can include a webcam, a smartphone, a smartwatch, a tablet computer, and the like.
[0084] Since the electronic device comprises the camera module provided by the above embodiments, the electronic device can also have similar effects, i.e., the effect of optical image stabilization can be achieved.
[0085] In the present application, the term "and / or" is only used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.
[0086] It should be noted that in the drawings, the sizes of the layers and regions can be exaggerated for clarity. It can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer, or there can be an intermediate layer. In addition, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there can be one or more intermediate layers or elements. In addition, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there can be one or more intermediate layers or elements. Similar reference numerals refer to similar elements throughout.
[0087] In the present application, the terms "first", "second", "third" and "fourth" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "multiple" refers to two or more, unless otherwise explicitly limited.
[0088] The above is only an optional embodiment of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A camera module, comprising: The camera module comprises a circuit board (11), a carrier board (12), an image sensor (13), a lens component (14) and a driving assembly (15); The carrier board (12) is located on one side of the circuit board (11), and the carrier board (12) is electrically connected with the circuit board; The image sensor (13) is fixed on the side of the carrier board (12) away from the circuit board, and the image sensor (13) is electrically connected with the carrier board (12); At least part of the lens component (14) is located on the side of the image sensor (13) away from the circuit board (11), and the lens component (14) is fixedly connected with the circuit board (11); The driving assembly (15) is located on the side of the circuit board (11) where the carrier board (12) is arranged, the driving assembly (15) is distributed on the periphery of the carrier board (12) and connected with the carrier board (12), and the driving assembly (15) is electrically connected with the circuit board (11); The driving assembly (15) is configured to exert a pulling force on the carrier board (12) under the control of the circuit board (11) to drive the image sensor (13) to move in a plane perpendicular to the optical axis of the lens component (14) through the carrier board (12).
2. The camera module of claim 1, wherein, The driving assembly (15) comprises a plurality of pulling elements (151) which are distributed around the periphery of the carrier board (12), and one end of each pulling element (151) is fixedly connected with the side surface of the carrier board (12), and the other end of each pulling element (151) is fixed on the circuit board (11) and electrically connected with the circuit board (11); The circuit board (11) is configured to control at least one pulling element (151) to exert a pulling force on the carrier board (12) to drive the image sensor (13) to move in a first direction (X) and / or in a second direction (Y) through the carrier board (12); the first direction (X) and the second direction (Y) are both perpendicular to the optical axis of the lens component (14), and the second direction (Y) intersects the first direction (X).
3. The camera module of claim 2, wherein, Among the plurality of pulling elements (151), there are at least two pulling elements (151) arranged oppositely in the first direction (X), and there are at least two pulling elements (151) arranged oppositely in the second direction (Y); For two pulling elements (151) arranged oppositely in the first direction (X) or the second direction (Y), the circuit board (11) is configured to control one of the two pulling elements (151) to shorten in length, so that the carrier board (12) moves towards the pulling element (151) that shortens in length, and the other pulling element (151) is elongated in length.
4. The camera module of claim 3, wherein, The pulling element (151) is a wire structure made of a memory metal, and the circuit board (11) is configured to apply a driving current to the pulling element (151) to heat the pulling element (151) and shorten the length of the pulling element (151).
5. The camera module of claim 2, wherein, The camera module further comprises a plurality of first elastic components (16) which are distributed around the carrier plate (12), and one end of each of the first elastic components (16) is fixedly connected to the side surface of the carrier plate (12), and the other end of each of the first elastic components (16) is fixed to the circuit board (11).
6. The camera module of claim 5, wherein, The plurality of first elastic components (16) correspond to the plurality of pulling elements (151), and the first elastic component (16) and the corresponding pulling element (151) are located on the same side of the carrier plate (12).
7. The camera module of any one of claims 1-6, wherein, The camera module further comprises a light filtering component (17) and a plurality of second elastic components (18). The light filtering component (17) is located between the carrier plate (12) and the lens component (14), and the light filtering component (17) has a plurality of first grooves (B1) on the side close to the carrier plate (12). The plurality of second elastic components (18) are located between the carrier plate (12) and the light filtering component (17), the deformation direction of the plurality of second elastic components (18) is parallel to the optical axis of the lens component (14), and the plurality of second elastic components (18) correspond to the plurality of first grooves (B1), one end of each of the second elastic components (18) is fixedly connected to the carrier plate (12), and the other end of each of the second elastic components (18) is located in the corresponding first groove (B1) and in contact with the groove bottom of the corresponding first groove (B1).
8. The camera module of any one of claims 1-6, wherein, The carrier plate (12) and the circuit board (11) are oppositely provided with a plurality of second grooves (B2). The camera module further comprises a plurality of balls (191) corresponding to the plurality of second grooves (B2), and at least part of the balls (191) are located in the corresponding second grooves (B2).
9. The camera module of claim 8, wherein, There is a gap between the carrier plate (12) and the circuit board (11), and in the direction perpendicular to the circuit board (11), the size of the gap between the carrier plate (12) and the circuit board (11) ranges from 30 microns to 50 microns.
10. The camera module of any one of claims 1-6, wherein, The camera module further comprises a U-shaped flexible circuit board (192), one end of the U-shaped flexible circuit board (192) is electrically connected to the carrier plate (12), and the other end of the U-shaped flexible circuit board (192) is electrically connected to the circuit board (11).
11. An electronic device, comprising: The electronic device comprises the camera module of any one of claims 1 to 10.