Electronic equipment

Abstract

The utility model provides electronic equipment which is used for solving the technical problem that the heat dissipation performance of existing electronic equipment becomes poor after the requirement for lightness and thinness is met, the electronic equipment comprises a screen, a battery cover and a middle frame, the middle frame is arranged between the screen and the battery cover, the middle frame comprises a middle frame body and a first vapor chamber connected to the middle frame body, and the first vapor chamber is arranged in the middle frame body. The middle frame body is provided with a battery bin, and the first vapor chamber is located between the battery bin and the screen and forms the bottom wall of the battery bin.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. BACKGROUND

[0002] With the updating and iteration of electronic device product technology, users have higher and higher requirements for the thinness of electronic devices, and the connecting pieces between various components of the electronic device not only need to meet the support requirements of various components, but also need to meet the heat dissipation requirements of the electronic device in use.

[0003] In the related art, especially in the internal space of a folding mobile phone, the support pieces of some devices have poor heat dissipation function when meeting the space utilization rate requirement, which cannot meet the requirement. And although some devices meet the requirement of the device for the heat dissipation function, the space utilization rate is poor. CONTENT OF THE UTILITY MODEL

[0004] The embodiment of the present application provides an electronic device, which is used to solve the technical problem that the heat dissipation performance of the existing electronic device becomes poor after meeting the requirement of thinness.

[0005] To achieve the above-mentioned purpose, the embodiment of the present application adopts the following technical scheme:

[0006] In a first aspect, an electronic device is provided, which includes a screen, a battery cover, and a middle frame disposed between the screen and the battery cover. The middle frame includes a middle frame body and a first vapor chamber connected to the middle frame body. The middle frame body is provided with a battery compartment, and the first vapor chamber is located between the battery compartment and the screen and forms a bottom wall of the battery compartment.

[0007] In some embodiments, the first vapor chamber includes a plate body and a vapor chamber cavity disposed in the plate body. The yield modulus of the plate body is greater than or equal to 200 MPa and less than or equal to 1200 MPa.

[0008] In some embodiments, the plate body includes a first cover plate and a second cover plate that are stacked and fixedly connected. The vapor chamber cavity is disposed between the first cover plate and the second cover plate.

[0009] In some embodiments, the first cover plate includes a first middle portion and a first edge portion disposed around the first middle portion. The second cover plate includes a second middle portion and a second edge portion disposed around the second middle portion. The first edge portion is fixedly connected to the second edge portion, and the vapor chamber cavity is disposed between at least part of the first middle portion and at least part of the second middle portion.

[0010] In some embodiments, at least one connecting portion is disposed in the vapor chamber cavity and connected between the first middle portion and the second middle portion.

[0011] In some embodiments, the application further includes a main circuit board assembly; the middle frame body includes a main board support portion, the main board support portion is located at the periphery of the battery compartment, and the main circuit board assembly is arranged between the main board support portion and the battery cover; the at least one connecting portion includes at least one first connecting portion, and the at least one first connecting portion is arranged in one end of the support area of the heat conduction cavity away from the main board support portion.

[0012] In some embodiments, the application further includes a hinge structure; the middle frame body has a first edge, the first edge is connected with the hinge structure, the at least one connecting portion includes at least one second connecting portion, and the at least one second connecting portion is arranged in one end of the heat conduction cavity away from the first edge.

[0013] In some embodiments, the first cover plate is located between the second cover plate and the screen, the first middle portion includes a first middle portion and a second middle portion, and the heat conduction cavity is arranged between the first middle portion and the second middle portion; the screen includes a screen body and a bending portion connected to the screen body, the bending portion is located between the second middle portion and the screen body, and the second middle portion is closer to the second middle portion than the first middle portion.

[0014] In some embodiments, the application further includes that the middle frame body includes a main board support portion, the main board support portion is located at the periphery of the battery compartment, and the main circuit board assembly is arranged between the main board support portion and the battery cover.

[0015] The main board support portion is provided with a avoiding opening, and the middle frame further includes a second heat conduction plate, a part of the second heat conduction plate is located between the avoiding opening and the screen, and a part of the second heat conduction plate is in thermal conduction with at least part of the main circuit board assembly through the avoiding opening; another part of the second heat conduction plate is located between the first heat conduction plate and the screen, and is in thermal conduction with the first heat conduction plate.

[0016] In some embodiments, a thermally conductive adhesive is arranged between the other part of the second heat conduction plate and the first heat conduction plate, and the thermal conductivity coefficient of the thermally conductive adhesive is greater than or equal to 3W / (m*K).

[0017] In some embodiments, a first annular sealing adhesive layer is arranged between the second heat conduction plate and the main board support portion and the first heat conduction plate, the first annular sealing adhesive layer includes a first part and a second part; the first part is arranged between the second heat conduction plate and the first heat conduction plate, the second part is arranged between the second heat conduction plate and the main board support portion, the two ends of the first part are respectively connected with the two ends of the second part, and the avoiding opening is located between the first part and the second part.

[0018] In some embodiments, the surface of the first heat conduction plate facing the screen includes a first surface area and a second surface area, the second surface area is located at the end of the first heat conduction plate facing the main board support portion, and the second surface area is farther away from the screen than the first surface area, and the first part is arranged between the second heat conduction plate and the second surface area.

[0019] In some embodiments, a second annular sealing glue layer is arranged between the second vapor chamber and the first surface area.

[0020] In some embodiments, the height difference between the first surface area and the second surface area is greater than or equal to 1 mm and less than or equal to 3 mm.

[0021] In some embodiments, the first vapor chamber is detachably connected with the middle frame body.

[0022] In some embodiments, the thickness of the first vapor chamber is less than or equal to 0.3 mm. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A structural schematic diagram of an electronic device is provided for embodiments of the present application;

[0024] Figure 2 A cross-sectional schematic diagram of a first vapor chamber is provided for embodiments of the present application;

[0025] Figure 3 A structural schematic diagram of a vapor chamber is provided for embodiments of the present application;

[0026] Figure 4 A cross-sectional schematic diagram of a first vapor chamber is provided for embodiments of the present application;

[0027] Figure 5 A structural schematic diagram of a connecting portion is provided for embodiments of the present application;

[0028] Figure 6 A stacking diagram of a first vapor chamber and a second vapor chamber is provided for embodiments of the present application;

[0029] Figure 7 A stacking diagram of a first vapor chamber and a second vapor chamber is provided for embodiments of the present application;

[0030] Figure 8 An unfolded schematic diagram of a folding mobile phone is provided for embodiments of the present application;

[0031] Figure 9 A folded schematic diagram of a folding mobile phone is provided for embodiments of the present application;

[0032] Figure 10 A cross-sectional diagram corresponding to the stacking diagram of the first vapor chamber and the second vapor chamber is provided for embodiments of the present application.

[0033] REFERENCE SIGNS:

[0034] 100, electronic device; 10, screen; 11, display screen; 12, light-transmitting cover plate; 101, screen main body; 102, bending part; 20, middle frame; 211, battery compartment; 212, middle frame main body; 212a, first edge; 213, mainboard support part; 22, first vapor chamber; 22a, first surface area; 22b, second surface area; 221, plate body; 221a, first cover plate; 221b, second cover plate; 221c, first connecting part; 221d, second connecting part; 222, vapor chamber cavity; 222a, capillary structure; 222b, support column; 23, second vapor chamber; 24, first annular sealant layer; 25, second annular sealant layer; 30, battery; 40, battery cover; 50, main circuit board assembly; 60, hinge structure; 70, sealant layer or other components; 80, graphite layer. DETAILED DESCRIPTION

[0035] In the embodiments of the present application, it should be noted that unless specifically defined and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through intermediate medium.

[0036] In the embodiments of the present application, it should be understood that the mentioned orientation terms, such as "upper", "lower", "left", "right", "inner", "outer" and the like, are only the directions of the drawings, therefore, the orientation terms used are for better and clearer illustration and understanding of the embodiments of the present application, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0037] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth", "sixth" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second", "third", "fourth", "fifth", "sixth" can explicitly or implicitly include one or more of the features.

[0038] In the embodiments of the present application, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or include elements inherent to such processes, methods, articles or devices. Without more limitations, the element limited by the sentence "including one" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0039] In the embodiments of the present application, "and / or" is only used to describe an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents an "or" relationship between the front and rear associated objects.

[0040] In the embodiments of the present application, it should be noted that "vertical" and "parallel" respectively represent approximately vertical and approximately parallel within a certain error range, which can be a range of deviation angle less than or equal to 5°, 8° or 10° with respect to absolute vertical and absolute parallel, which is not limited here. In addition, the shapes of various components in the following description are "rectangular", "square" and the like, which represent approximate shapes, and adjacent two sides can be provided with or without rounded corners.

[0041] The present application provides an electronic device 100, which includes but is not limited to a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, etc. Among them, the wearable device includes but is not limited to a smart bracelet, a smart watch, a smart head-mounted display, smart glasses, etc.

[0042] Please refer to Figure 1 , Figure 1 The structural diagram of the electronic device 100 provided in some embodiments of the present application is provided. The present embodiment and the following embodiments are exemplarily described by taking the electronic device 100 as a mobile phone. The electronic device 100 is approximately rectangular plate-shaped.

[0043] On this basis, in order to facilitate the description of each of the following embodiments, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, which is not limited here.

[0044] In some other embodiments, the shape of the electronic device 100 can also be square plate-shaped, circular plate-shaped, elliptical plate-shaped, etc., which is not limited here.

[0045] Please refer to Figure 1 , Figure 1 The exploded structural diagram of the electronic device 100 in the present application is provided, Figure 1In the illustrated embodiment, the electronic device 100 can include a screen 10, a battery cover 40, a battery 30, a main circuit board assembly 50, and a middle frame 20. It should be noted that Figure 1 Only some components included in the electronic device 100 are schematically shown, and the actual shape, actual size, actual position, and actual structure of these components are not limited Figure 1 .

[0046] The screen 10 is used to display images, videos, and the like. The screen 10 includes a light-transmitting cover plate 12 and a display screen 11 (English name: panel, also known as a display panel).

[0047] The light-transmitting cover plate 12 is arranged in a stack with the display screen 11. The light-transmitting cover plate 12 is mainly used to protect and prevent dust from the display screen 11. The material of the light-transmitting cover plate 12 includes, but is not limited to, glass. The display screen 11 can adopt a flexible display screen 11 or a rigid display screen 11.

[0048] For example, the display screen 11 can be an organic light-emitting diode (OLED) display screen 11, an active-matrix organic light-emitting diode (AMOLED) display screen 11, a mini organic light-emitting diode display screen 11, a micro organic light-emitting diode display screen 11, a micro organic light-emitting diode display screen 11, a quantum dot light emitting diode (QLED) display screen 11, a capacitive touch screen (TouchPanel, TP), a liquid crystal display (LCD).

[0049] In some embodiments, please continue to refer to Figure 1 , the middle frame 20 is arranged between the screen 10 and the battery cover 40, the middle frame 20 includes a middle frame body 212 and a first heat plate 22 connected to the middle frame body 212, the middle frame body 212 is provided with a battery compartment 211, the first heat plate 22 is located between the battery compartment 211 and the screen 10 and forms a bottom wall of the battery compartment 211.

[0050] It can be understood that the light-transmitting cover plate 12, the middle frame 20 and the battery cover 40 constitute the shell of the mobile phone, which is used to protect the internal electronic devices of the electronic device 100. The battery cover 40 is located on the side of the display screen 11 away from the light-transmitting cover plate 12, and is arranged in layers and spaced apart from the light-transmitting cover plate 12 and the display screen 11.

[0051] Referring to Figure 1 and in combination Figure 2 , the main body part of the middle frame 20 divides the shell into two areas, one part of the area is the area of the light-transmitting cover plate 12 and the middle frame main body 212, and the screen main body 101 is arranged in this area; the other part is the area of the middle frame main body 212 and the battery cover 40, and the battery 30 and the main board circuit assembly are arranged in this area, and the middle frame main body 212 is provided with the battery compartment 211 in the area.

[0052] Based on this, the first heat plate 22 can play a role in dissipating heat for the battery 30 while forming the bottom wall of the battery compartment 211, avoiding local overheating.

[0053] At this time, the "bottom wall" refers to the wall surface of the battery compartment 211 away from the battery cover 40 along the Z-axis direction. When the battery 30 is installed, the heat plate forms the bottom wall of the battery compartment 211, and the battery cover 40 forms the top wall of the battery compartment 211.

[0054] The first heat plate 22 is connected to the middle frame main body 212 and located between the battery compartment 211 and the screen 10 to form the bottom wall of the battery compartment 211. Such a design cleverly integrates the heat plate into the structure of the middle frame 20.

[0055] Compared with separately arranging a heat dissipation member to occupy space inside the mobile phone, arranging part of the middle frame 20 as the first heat plate 22 with heat conduction performance is an integrated design that saves valuable space resources inside the mobile phone, so that more space can be used for the layout of other key components or further space optimization in the design of foldable screen mobile phones pursuing extreme thinning and lightening.

[0056] When the battery 30 generates heat during use, the heat plate can act as a medium for heat conduction. Because the heat plate has good heat conduction performance, it can quickly absorb and evenly disperse the heat generated by the battery 30, preventing the heat from gathering locally in the battery compartment 211, thereby reducing the impact of local overheating on the performance and safety of the battery 30.

[0057] At the same time, the uniform dispersion of heat by the first heat plate 22 can also reduce the situation that heat is directly conducted to the screen 10, causing the screen 10 to be too hot. The screen 10 temperature that is too high may affect the display effect, touch sensitivity and the like of the screen 10, and the presence of the first heat plate 22 helps to maintain the screen 10 within an appropriate temperature range, ensuring normal use of the screen 10.

[0058] In addition, for the folding screen mobile phone, the screen 10 is divided into a first sub-screen and a second sub-screen. In order to improve the user experience, the thickness of the first sub-screen and the second sub-screen needs to be very thin, so that the thickness of the mobile phone in the folded state can meet the user's use demand.

[0059] In the present application, the middle frame 20 is divided into a middle frame body 212 and a first heat plate 22 connected to the middle frame body 212. No special heat dissipation component needs to be added in the first sub-screen or the second sub-screen, which greatly improves the space utilization inside.

[0060] While meeting the space utilization of the whole machine, the heat dissipation capacity of the whole machine is also ensured.

[0061] In some embodiments, the first heat plate 22 includes a plate body 221 and a heat cavity 222 in the plate body 221. The heat cavity 222 can effectively dissipate heat from the mobile phone. In order to ensure that the first heat plate 22 can provide effective support force for the battery 30, the yield modulus of the plate body 221 is greater than or equal to 200Mpa and less than or equal to 1200Mpa.

[0062] The yield modulus is a physical quantity that measures the material's resistance to elastic deformation. At this time, the plate body 221 with a yield modulus in this range will not easily deform excessively when bearing the weight of the battery 30 and possible external forces. When the yield modulus is too low, the plate body 221 will deform elastically under the action of a small external force, and will not be able to provide stable support for the battery 30. When the yield modulus is too high, the material may be too hard and lack the necessary flexibility, which can easily cause the plate body 221 to break during folding and other actions of the mobile phone.

[0063] For example, the yield modulus of the plate body 221 can be 200Mpa, 300Mpa, 400Mpa, 500Mpa, 550Mpa, 600Mpa, 700Mpa, 800Mpa, 900Mpa, 1000Mpa, 1100Mpa, 1200Mpa, etc.

[0064] In some embodiments, the material of the first heat plate 22 includes at least one of stainless steel, titanium alloy, high-modulus aluminum, etc., so as to effectively ensure that the yield modulus of the first heat plate 22 is in a suitable range.

[0065] Stainless steel has a complex crystal structure and chemical bond formed by internal elements such as iron, chromium, and nickel. Different types (such as austenitic and martensitic) are processed in a specific way. For example, martensitic stainless steel refines the grain size through heat treatment and adjusts the microstructure to match the required yield modulus. Titanium alloy is based on titanium, with the addition of elements such as aluminum and vanadium to form a special solid solution or compound. Common Ti-6Al-4V alloy adjusts the alloy ratio and undergoes processes such as forging and rolling to densify the structure and strengthen the atomic bond, ensuring that the yield modulus meets the standard. High-modulus aluminum is a special treated aluminum alloy with the addition of trace elements such as zinc, magnesium, and copper. The 7xxx series (such as 7075 aluminum alloy) is aged to significantly improve strength and yield modulus. In this way, by selecting appropriate materials and adapting the processing, a stable and required yield modulus is provided for the first uniform heating plate 22, which can provide reliable support for the battery 30.

[0066] In some embodiments, referring to Figure 3 The plate body 221 includes a first cover plate 221a and a second cover plate 221b arranged in layers and fixedly connected, and the uniform heating cavity 222 is arranged between the first cover plate 221a and the second cover plate 221b.

[0067] The first cover plate 221a and the second cover plate 221b are in close contact through fixed connection, preventing the leakage of the heat-conducting medium in the uniform heating cavity 222. At the same time, this connection mode also enables the two cover plates to work together to withstand external pressure, such as the weight of the battery 30 and possible external force impact.

[0068] Exemplarily, the first cover plate 221a and the second cover plate 221b are connected by adhesion.

[0069] The following is an exemplary description of the first cover plate 221a being close to the battery 30 and the second cover plate 221b being close to the screen 10.

[0070] When heat is generated on one side of the battery 30, the heat is conducted to the first cover plate 221a through the part of the battery 30 in contact with the first cover plate 221a, and then the first cover plate 221a transmits the heat to the uniform heating cavity 222, which can conduct the heat in a timely manner.

[0071] At the same time, when heat is generated on one side of the inner screen, the heat is conducted to the uniform heating cavity 222 through the part of the component on the side of the inner screen in contact with the second cover plate 221b, which can conduct the heat in a timely manner.

[0072] Exemplarily, the first cover plate 221a and the second cover plate 221b are fixedly connected by welding.

[0073] In some embodiments, referring to Figure 3The first cover plate 221a includes a first middle portion and a first edge portion surrounding the first middle portion, and the second cover plate 221b includes a second middle portion and a second edge portion surrounding the second middle portion.

[0074] It can be seen that the heat sink cavity 222 is formed by buckling the first cover plate 221a and the second cover plate 221b.

[0075] Exemplarily, the first chamber and the second chamber of the heat sink cavity 222 are connected in the thickness direction of the first heat plate 22, the first cover plate 221a is provided with the first chamber, and the second cover plate 221b is provided with the second chamber, wherein the first chamber is etched on the first cover plate 221a, and the second chamber is etched on the second cover plate 221b.

[0076] On the one hand, the first chamber and the second chamber are respectively located on the first cover plate 221a and the second cover plate 221b, which is similar to a "sandwich" stacked structure, and the connecting part between the two chambers and other parts of the chamber and the cover plate support each other. When the first heat plate 22 is subjected to external pressure (such as extrusion, collision or pressure of the battery 30 during use of the mobile phone), the first cover plate 221a and the second cover plate 221b can jointly bear the pressure, avoiding deformation or damage caused by excessive local stress.

[0077] On the other hand, for the first cover plate 221a and the second cover plate 221b, etching is respectively performed to form the chamber to control the processing precision, further avoiding the processing error of the heat sink cavity 222 due to separate processing of the two parts, and since the opening sizes of the connecting positions of the first cover plate 221a and the second cover plate 221b are consistent, the first cover plate 221a and the second cover plate 221b can be etched by using the same mold, and the thickness of the chamber can be adjusted according to the processing method of the mold.

[0078] It should be noted that the thickness of the first chamber and the second chamber in the thickness direction of the first heat plate 22 can be consistent or inconsistent, which is not limited in the present application.

[0079] Exemplarily, the thickness of the first chamber is smaller than the thickness of the second chamber, and therefore, the thickness of the first middle portion corresponding to the first cover plate 221a is thicker, that is, the corresponding position of the first cover plate 221a connected to the battery 30 can quickly introduce heat into the heat sink cavity 222.

[0080] Further, the first edge portion and the second edge portion are fixedly connected, and the heat sink cavity 222 is arranged between at least part of the first middle portion and at least part of the second middle portion.

[0081] The first edge portion and the second edge portion are fixedly connected portions, and this connection manner enables the first cover plate 221a and the second cover plate 221b to be closely combined to form a complete plate body 221 structure. The heat uniformizing cavity 222 is located between at least part of the first middle portion and at least part of the second middle portion, and heat is mainly conducted and uniformly distributed between the middle portion regions of the two cover plates.

[0082] The fixed connection of the first edge portion and the second edge portion forms a stable frame structure. This frame structure surrounds the heat uniformizing cavity 222 in the middle portion, and provides good support and protection for the heat uniformizing cavity 222. At the same time, the fixed connection manner of the edge portions also helps to ensure the sealing of the heat uniformizing cavity 222.

[0083] Exemplarily, the first edge portion and the second edge portion are connected by welding.

[0084] In some embodiments, at least one connecting portion is arranged in the heat uniformizing cavity 222, and the connecting portion is connected between the first middle portion and the second middle portion.

[0085] Exemplarily, the connecting portion is a welding region for fixedly connecting the first middle portion and the second middle portion, effectively connecting the metal materials of the first middle portion and the second middle portion, and ensuring the strength and stability of the connection.

[0086] The welding process can provide strong connection force, so that the first middle portion and the second middle portion are closely combined together. This close connection can withstand a large external force, such as the extrusion, collision in the daily use process of the mobile phone or the stress generated in the folding and unfolding process of the folding screen mobile phone. The welding region can effectively prevent the first middle portion and the second middle portion from separating or misplacing, and ensure the structural integrity of the heat uniformizing cavity 222, thereby ensuring that the heat dissipation function of the heat uniformizing plate is not affected.

[0087] In some embodiments, the middle frame body 212 includes a main board supporting portion 213, which is a connecting position of the middle frame body 212 corresponding to the circuit board assembly, and provides effective support for the circuit board assembly.

[0088] Exemplarily, the circuit board assembly is a main circuit board of the electronic device 100.

[0089] In some embodiments, referring to Figure 1 and combining Figure 2 and Figure 5 , the main board supporting portion 213 is located on the side of the battery compartment 211, and the main circuit board assembly 50 is arranged between the main board supporting portion 213 and the battery cover 40. The at least one connecting portion includes at least one first connecting portion 221c, and the at least one first connecting portion 221c is arranged in an end of the heat uniformizing cavity 222 away from the supporting region of the main board supporting portion.

[0090] Wherein, at least one first connecting portion 221c is located at one end of the heat dissipation cavity 222 away from the support area of ​​the motherboard support portion, meaning along... Figure 1 In the Y direction shown, the first connecting part 221c corresponds to one end of the support area away from the motherboard support part, that is, the two are located at opposite ends in the direction of the first heat spreader 22.

[0091] It should be noted that the welding wire corresponding to the first connecting part 221c in this application is longer than that of a normal welding wire.

[0092] In some embodiments, the electronic device 100 provided in this application is a foldable screen mobile phone. In this case, the application includes a hinge structure 60, a middle frame body 212 having a first edge 212a, the first edge 212a being connected to the hinge structure 60, and at least one connecting part including at least one second connecting part 221d, the at least one second connecting part 221d being disposed in the end of the heat dissipation cavity 222 away from the first edge 212a.

[0093] See Figure 8 and Figure 9 This application Figure 8 The diagram shown is a structural schematic of a foldable phone in its unfolded state. Figure 9 The diagram shown is a structural schematic of a foldable phone in its folded state.

[0094] In some embodiments, the middle frame body 212 has a first edge 212a, which is connected to the hinge structure 60, and at least one connection portion includes at least one second connection portion 221d, which is disposed in the end of the heat dissipation cavity 222 away from the first edge 212a.

[0095] Wherein, at least one first connecting portion 221c is located at one end of the heat dissipation cavity 222 away from the support area of ​​the motherboard support portion, meaning along... Figure 1 In the X direction shown, the first connecting part 221c corresponds to one end of the support area away from the motherboard support part, that is, the two are located at opposite ends in the direction of the first heat spreader 22.

[0096] Correspondingly, the welding wire corresponding to the second connection part 221d in this application is longer than that of a normal welding wire.

[0097] This application will be described by way of example with the first connecting part 221c and the second connecting part 221d having the same structure.

[0098] Firstly, for the first vapor chamber 22 in the application, the first vapor chamber 22 is a part of the middle frame 20, and the corresponding thickness size is very small. The application can strengthen the connection strength inside the first vapor chamber 22 through the first connecting part 221c and the second connecting part 221d. With the strengthening of the internal strength of the first vapor chamber, even if the thickness size of the first vapor chamber 22 is reduced, the first vapor chamber 22 with strengthened strength can meet the strength requirement of the adhesion between the first vapor chamber 22 and the battery 30.

[0099] Secondly, the application limits the positions of the first connecting part 221c and the second connecting part 221d. The corresponding positions are actually the positions of the first vapor chamber 22 away from the heat source,

[0100] In the heat source area corresponding to the first vapor chamber 22, the heat conduction path needs to be kept unobstructed and efficient. If the welding rib process is performed in this area, the newly added connecting rib may change the heat conduction path, or generate thermal resistance due to the difference in thermal conductivity of the connecting rib material and the main body of the vapor chamber.

[0101] Secondly, this position setting connecting rib does not conflict with the contact area of the vapor chamber 222 or the first vapor chamber 22 and the heat source, and from the perspective of structural mechanics, reasonably arranging the connecting rib in the non-heat source area can better balance the stress distribution of the vapor chamber when subjected to external force.

[0102] Exemplarily, the first connecting part 221c and the second connecting part 221d include a plurality of welding protrusions, and the welding protrusions surround a rectangle. The size of the rectangle is 6mm*2mm.

[0103] It should be noted that the corresponding size can be adjusted according to the specific size of the first vapor chamber 22. The application is only exemplarily described.

[0104] Specifically, the application makes three-point bending simulation tests on the first vapor chamber 22 provided with the first connecting part 221c and the second connecting part 221d (the specific position and size can be adjusted according to the simulated battery 30 drop stress and weak point of strength to achieve the purpose of improving reliability), and analyzes the simulation stiffness and reaction force.

[0105] Exemplarily, when the first vapor chamber 22 in the application is a high-modulus aluminum middle plate with a thickness of 0.15mm, the simulation stiffness corresponding to the three-point bending is 29.26N / mm, and the reaction force under 1.5mm displacement is 44.783N.

[0106] Exemplarily, when the first vapor chamber 22 in the present application is a stainless steel vapor chamber with a thickness of 0.20 mm, the simulation stiffness corresponding to three-point bending is 28.53 N / mm, and the reaction force under 1.5 mm displacement is 44.1882 N.

[0107] Exemplarily, when the first vapor chamber 22 in the present application is a titanium alloy vapor chamber with a thickness of 0.31 mm, the simulation stiffness corresponding to three-point bending is 28.26 N / mm, and the reaction force under 1.5 mm displacement is 43.8234 N.

[0108] Exemplarily, when the first vapor chamber 22 in the present application is a titanium alloy vapor chamber with a thickness of 0.35 mm, the simulation stiffness corresponding to three-point bending is 28.84 N / mm, and the reaction force under 1.5 mm displacement is 44.7006 N.

[0109] Further, please refer to Figure 3 The structure of the vapor chamber 222 in the present application is exemplarily described below. The vapor chamber 222 includes a communicating cavity portion and a support column 222b portion. The cavity portion is provided with a capillary structure 222a, and the capillary structure 222a is filled with a heat-conducting medium (for example, water).

[0110] When the heat in the vapor chamber 222 rises, the heat-conducting medium in the capillary structure 222a is evaporated by heat and enters the support column 222b, so as to conduct the heat received by the first vapor chamber 22 out. After the temperature in the support column 222b drops, the heat-conducting medium turns into liquid and returns to the capillary structure 222a under the guidance of the wall surface of the support column 222b.

[0111] The capillary structure 222a includes a porous medium (for example, copper mesh or the like), and the porous medium is filled with a heat-conducting medium. When the internal electronic components of the mobile phone (for example, the battery 30 during charging and discharging, and the main circuit board assembly 50 during high-intensity operation) continuously generate heat and conduct the heat to the first vapor chamber 22, the heat rapidly accumulates in the vapor chamber 222, so as to steadily increase the temperature of the cavity portion. At this time, the temperature of the heat-conducting medium in the capillary structure 222a is converted into water vapor. Under the action of a small air pressure difference and heat convection, the water vapor orderly and smoothly passes through the connecting portion and enters the support column 222b, so as to conduct the heat borne by the first vapor chamber 22 out.

[0112] Meanwhile, the support column 222b can be a hollow column structure, which can further improve the support strength of the first vapor chamber 22.

[0113] In some embodiments, in order to meet the space requirement, the thickness of the first vapor chamber 22 is less than or equal to 0.3 mm.

[0114] Exemplarily, the thickness of the first vapor chamber 22 is 0.1 mm, 0.2 mm, 0.3 mm, etc.

[0115] Exemplarily, the first vapor chamber 22 in the application can be reduced to 0.26 mm in thickness by setting the material and structure of the first vapor chamber 22 of the middle frame 20, so that the first vapor chamber 22 in the application can not only improve the utilization rate of the stacking space inside the mobile phone, but also meet the strength requirements of the mobile phone on the middle frame 20.

[0116] Correspondingly, on this basis, the size of the support column 222b and the capillary structure 222a is exemplarily described.

[0117] Along the thickness direction of the first vapor chamber 22, the thickness of the chamber where the capillary structure 222a is located is 0.05 mm, the bottom wall thickness of the chamber corresponding to the capillary structure 222a of the first cover plate 221a is 0.05 mm, and the bottom wall thickness of the chamber corresponding to the capillary structure 222a of the second cover plate 221b is 0.03 mm. The height of the support column 222b is 0.13 mm.

[0118] Since the first vapor chamber 22 replaces the area of the original battery compartment 211 corresponding to the connection part of the battery 30, the first cover plate 221a needs to provide the whole machine strength and the battery 30 bonding strength for the battery compartment 211 area, therefore, the bottom wall thickness of the chamber corresponding to the capillary structure 222a of the first cover plate 221a in the application is larger.

[0119] In some embodiments, the second cover plate 221b is located between the first cover plate 221a and the screen 10, the second middle part includes a first middle part and a second middle part, and the heat dissipation cavity 222 is arranged between the first middle part and the second middle part.

[0120] The screen 10 includes a screen 10 body and a bending part 102 connected to the screen 10 body, the bending part 102 is located between the second middle part and the screen 10 body, and the second middle part is closer to the first middle part than the first middle part.

[0121] Exemplarily, the bending part 102 is a flexible printed circuit board.

[0122] The second middle part is closer to the first middle part than the first middle part, and such a positional relationship makes it easier for heat to be conducted to the heat dissipation cavity 222 through the second middle part when the bending part 102 generates heat during work. Because the second middle part is closer to the heat dissipation cavity 222 in layout, the heat dissipation speed of the first vapor chamber 22 can be accelerated.

[0123] In other embodiments, referring to Figure 4The middle frame body 212 in the application includes a main plate supporting portion 213, the main plate supporting portion 213 is located at the periphery of the battery compartment 211, and the main circuit board assembly 50 is arranged between the main plate supporting portion 213 and the battery cover 40.

[0124] The main plate supporting portion 213 is provided with a avoiding opening, the middle frame 20 further includes a second vapor chamber 23, a part of the second vapor chamber 23 is located between the avoiding opening and the screen 10, and at least part of the second vapor chamber 23 is in thermal conduction with the main circuit board assembly 50 via the avoiding opening, another part of the second vapor chamber 23 is located between the first vapor chamber 22 and the screen 10, and is in thermal conduction with the first vapor chamber 22.

[0125] It should be noted that the position of the avoiding opening is different due to the different internal structures of different motor devices.

[0126] Exemplarily, the thermal conduction modes mentioned in the application are all thermal conduction through a graphite layer, that is, a graphite layer is arranged between two components.

[0127] Referring to Figure 2 and combining Figure 4 , the 70 part shown in the figure is the glue layer or other components of the electronic device, and the 80 part shows the graphite layer in the application.

[0128] It should be noted that the components corresponding to the 70 part and the 80 part of different electronic devices can also be different, and the application does not limit this.

[0129] In addition, when the second vapor chamber 23 and the above-mentioned bending portion 102 conflict in accommodation (that is, the space of the first vapor chamber 22 and the screen 10 cannot simultaneously accommodate the second vapor chamber 23 and the above-mentioned bending portion 102 along the Z-axis direction), the second vapor chamber 23 and the above-mentioned bending portion 102 are arranged apart along the X-axis direction and the Y-axis direction, and a graphite layer is filled between the second vapor chamber 23 and the above-mentioned bending portion 102 along the Y-axis direction.

[0130] The second vapor chamber 23 can form a specific heat conduction path with the screen 10 and other components near the avoiding opening. At the same time, the second vapor chamber 23 realizes thermal conduction with at least part of the main circuit board assembly 50 via the avoiding opening, and heat can be transferred between the main circuit board assembly 50 and the part of the second vapor chamber 23, thereby realizing effective management of the heat of the main circuit board assembly 50, avoiding performance degradation, failure and other problems of the main circuit board assembly 50 due to overheating.

[0131] The first and second vapor chambers 22 and 23 are shown as a whole heat conduction system. When the battery 30 or other components generate heat and the heat is initially evenly distributed through the first vapor chamber 22, the heat can be further conducted through the part of the second vapor chamber 23 in thermal conduction with the first vapor chamber 22, and then combined with the part of the second vapor chamber 23 located between the avoiding opening and the screen 10, so that the heat is more fully diffused and managed in the mobile phone, and finally a better heat dissipation effect is achieved to cope with the problem of reduced heat capacity and decreased heat dissipation capacity of the folding screen mobile phone in the case of extreme thinning and weight reduction.

[0132] In some embodiments, a thermally conductive adhesive having a thermal conductivity greater than or equal to 3 W / (m*K) is arranged between the other part of the second vapor chamber 23 and the first vapor chamber 22.

[0133] For example, the thermal conductivity of the thermally conductive adhesive can be 3 W / (m*K), 4 W / (m*K), 5 W / (m*K), 6 W / (m*K), etc.

[0134] The thermally conductive adhesive having a thermal conductivity greater than or equal to 3 W / (m*K) arranged between the second vapor chamber 23 and the first vapor chamber 22 can ensure that the heat is quickly and efficiently transferred between the two vapor chambers. Because a higher thermal conductivity means that the thermally conductive adhesive has a smaller resistance to heat conduction, when the first vapor chamber 22 absorbs heat in a certain area, the heat can be quickly conducted to the second vapor chamber 23 through the thermally conductive adhesive, and vice versa.

[0135] In the case of extreme thinning and weight reduction of the folding screen mobile phone, the internal space is very valuable, and the thermally conductive adhesive can achieve good heat conduction in a very thin layer of space, which not only ensures the effective transfer of heat, but also ensures the connection between components without occupying too much space, which meets the design requirements of the compact internal space of the folding screen mobile phone.

[0136] In some embodiments, a first annular sealing adhesive layer 24 is arranged between the second vapor chamber 23 and the mainboard support part 213, and the first vapor chamber 22, and the first annular sealing adhesive layer 24 includes a first part and a second part.

[0137] The first part is arranged between the second vapor chamber 23 and the first vapor chamber 22, and the second part is arranged between the second vapor chamber 23 and the mainboard support part 213. The two ends of the first part are respectively connected to the two ends of the second part, and the avoiding opening is located between the first part and the second part.

[0138] The hinge structure 60 is relatively complex, usually composed of multiple movable components such as shafts, connecting arms, etc. There are certain gaps between these components in order to achieve the folding and unfolding functions of the screen 10. However, these gaps become channels for moisture to easily enter. For example, when the phone is in a humid environment, or accidentally contacts liquid, water will slowly penetrate into the hinge along these gaps, enter between the first and second heat plates 22 and 23, and then enter between various electronic components inside the phone.

[0139] The first annular sealing glue layer 24, which includes a first part and a second part, can effectively seal the gap between the first and second heat plates 22 and 23, preventing moisture from entering the interior of the phone.

[0140] In some embodiments, referring to Figure 7 and in combination with Figure 10 , the surface of the first heat plate 22 facing the screen 10 includes a first surface area 22a and a second surface area 22b, the second surface area 22b is located at the end of the first heat plate 22 facing the main board support part 213, and the second surface area 22b is farther from the screen 10 than the first surface area 22a, and the first part is arranged between the second heat plate 23 and the second surface area 22b.

[0141] It can be understood that along the thickness direction of the first heat plate 22, the first surface and the second surface form a concave part like a slope, which is like a "buffer area" or "stress dispersion area", when external pressure acts on the heat plate, the pressure will first act on the concave part, and the concave part can absorb and disperse part of the pressure through its own shape and structural characteristics.

[0142] Referring to Figure 6 , after the end of the conventional dispensing process, the first heat plate 22 or the second heat plate 23 is extruded to achieve better gluing effect, and the preset concave part can avoid the collapse of the first heat plate 22 and the second heat plate 23 during extrusion.

[0143] In some embodiments, referring to Figure 7 , a second annular sealing glue layer 25 is arranged between the second heat plate 23 and the first surface area 22a.

[0144] In this way, in addition to preventing collapse, the recess can also ensure air tightness. During the extrusion process, the glue after dispensing will be further compacted around the recess and at the contact positions of the entire vapor chamber and other components. Due to the presence of the recess, the distribution of the glue at these positions is more reasonable, which can better fill the possible tiny gaps. Moreover, the shape and structure of the recess itself also help to form a kind of sealing effect, preventing external air, water vapor, etc. from entering the internal part of the vapor chamber or the connection area between the components connected to the vapor chamber through the gaps that may occur during the extrusion process, thereby ensuring the air tightness of the entire electronic device 100.

[0145] In some embodiments, the height difference between the first surface area 22a and the second surface area 22b is greater than or equal to 1 mm and less than or equal to 3 mm.

[0146] Exemplarily, the height difference can be 1 mm, 1.5 mm, 2 mm, 3 mm, etc.

[0147] This height difference area can guide the dispersion of pressure along the inclined surface (i.e. the recess), so that the pressure is not concentrated at a certain point or plane, thereby enhancing the pressure resistance of the first vapor chamber 22 and effectively avoiding deformation or damage caused by excessive local pressure.

[0148] At the same time, it provides accommodation space for the first annular sealing glue layer 24 and the second annular sealing glue layer 25.

[0149] In some embodiments, the first vapor chamber 22 and the middle frame body 212 are detachably connected.

[0150] Exemplarily, the first vapor chamber 22 and the middle frame body 212 are connected by bolts.

[0151] During the use of the foldable screen mobile phone, the first vapor chamber 22 may have problems for various reasons, such as leakage of the heat conducting medium in the heat conduction cavity 222, physical damage to the vapor chamber or a decrease in its heat dissipation performance, etc. Since it is detachably connected with the middle frame body 212, maintenance personnel can conveniently take out the first vapor chamber 22 from the mobile phone for maintenance or directly replace a new vapor chamber, without the need to disassemble the entire mobile phone on a large scale. This greatly reduces the maintenance cost and difficulty, shortens the maintenance time, and improves the user's experience.

[0152] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0153] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same; although the present application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising: The application relates to a mobile phone, which comprises a screen, a battery cover and a middle frame. The middle frame is arranged between the screen and the battery cover and comprises a middle frame body and a first heat plate connected to the middle frame body. The middle frame body is provided with a battery compartment, and the first heat plate is arranged between the battery compartment and the screen and forms a bottom wall of the battery compartment. The first heat plate comprises a plate body and a heat cavity arranged in the plate body. The yield modulus of the plate body is greater than or equal to 200 MPa and less than or equal to 1200 MPa.

2. The electronic device of claim 1, wherein, The plate body comprises a first cover plate and a second cover plate which are arranged in a laminated mode and fixedly connected.

3. The electronic device of claim 2, wherein, The first cover plate comprises a first middle part and a first edge part arranged around the first middle part.

4. The electronic device of claim 3, wherein, The second cover plate comprises a second middle part and a second edge part arranged around the second middle part. The first edge part is fixedly connected to the second edge part, and the heat cavity is arranged between at least part of the first middle part and at least part of the second middle part. At least one connecting part is arranged in the heat cavity and connected between the first middle part and the second middle part.

5. The electronic device of claim 4, wherein, The application further comprises a main circuit board assembly.

6. The electronic device of claim 5, wherein, The middle frame body comprises a main board supporting part which is located at the periphery of the battery compartment and between the main board supporting part and the battery cover. The at least one connecting part comprises at least one first connecting part which is arranged in one end of the heat cavity away from a supporting area of the main board supporting part. The application further comprises a hinge structure.

7. The electronic device of claim 5 or 6, wherein, The middle frame body has a first edge which is connected to the hinge structure. The at least one connecting part comprises at least one second connecting part which is arranged in one end of the heat cavity away from the first edge.

8. The electronic device of any of claims 4-7, wherein, The second cover plate is located between the first cover plate and the screen. The second middle part comprises a first middle part and a second middle part, and the heat cavity is arranged between the first middle part and the second middle part.

9. The electronic device of any of claims 1-8, wherein, The screen comprises a screen body and a bending part connected to the screen body. The bending part is located between the second middle part and the screen body, and the second middle part is closer to the second middle part than the first middle part. The application further comprises a main circuit board assembly. The middle frame body comprises a main board supporting part which is located at the periphery of the battery compartment and between the main board supporting part and the battery cover. The main board supporting part is provided with a avoiding opening. The middle frame further comprises a second heat plate. One part of the second heat plate is located between the avoiding opening and the screen and in thermal conduction with at least part of the main circuit board assembly via the avoiding opening. Another part of the second heat plate is located between the first heat plate and the screen and in thermal conduction with the first heat plate.

10. The electronic device of claim 9, wherein, The other part of the second vapor chamber is provided with a heat-conducting adhesive between the first vapor chamber, and a thermal conductivity of the heat-conducting adhesive is greater than or equal to 3 W / (m*K).

11. The electronic device of claim 9, wherein, The second vapor chamber is provided with a first annular sealing adhesive layer between the mainboard support part and the first vapor chamber, and the first annular sealing adhesive layer includes a first part and a second part. The first part is arranged between the second vapor chamber and the first vapor chamber, and the second part is arranged between the second vapor chamber and the mainboard support part.

12. The electronic device of claim 11, wherein, A surface of the first vapor chamber facing the screen includes a first surface area and a second surface area, the second surface area is located at an end of the first vapor chamber facing the mainboard support part, and the second surface area is farther from the screen than the first surface area, and the first part is arranged between the second vapor chamber and the second surface area.

13. The electronic device of claim 12, wherein, The second vapor chamber is provided with a second annular sealing adhesive layer between the first surface area.

14. The electronic device of claim 12, wherein, A height difference between the first surface area and the second surface area is greater than or equal to 1 mm and less than or equal to 3 mm.

15. The electronic device of any of claims 1-14, wherein, The first vapor chamber is detachably connected with the middle frame body.

16. The electronic device of any of claims 1-15, wherein, A thickness of the first vapor chamber is less than or equal to 0.3 mm.

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