Cooling device and controller system
By designing the cooling chamber and cooling nozzle structure in the cooling device, the problem of large temperature differences in the power modules inside the motor controller was solved, achieving uniform cooling and temperature consistency, and improving the reliability and service life of the motor controller.
Patent Information
- Application Number
- CN202520041645.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-08
AI Technical Summary
The existing cooling structure results in significant temperature differences within the power modules of the motor controller, affecting its reliability and lifespan.
A cooling device is designed, including a first cooling chamber, a second cooling chamber, and multiple cooling nozzles. Coolant enters the second cooling chamber through the first cooling chamber and cools the power module uniformly through the multiple cooling nozzles. Heat sink and partition ribs are combined to improve cooling uniformity.
It effectively reduces the temperature difference between power modules, improves the working performance and reliability of power modules, ensures temperature consistency, and extends service life.
Smart Images

Figure CN223730165U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of cooling structure, in particular to a cooling device and controller system. BACKGROUND
[0002] The motor controller is the core component of the new energy automobile, and plays a key role in the vehicle power performance. The controller obtains the electric energy from the power battery pack, and through the action of the internal capacitor and the power module, the voltage and current required by the motor are output, and the speed and torque required by the motor under different working conditions of the vehicle are ensured. With the further improvement of the customer's requirement for the power performance of the new energy automobile, the motor controller also develops towards high integration, high frequency, high efficiency, high safety and high power density, which also leads to the temperature rise problem of the motor controller. The main part of the controller heating is the power module, and a large amount of heat will be generated when the internal IGBT (power device single tube) crystal is worked at high frequency and high efficiency. If cooling measures are not taken, the IGBT will exceed the temperature threshold, resulting in "explosion", affecting the reliability, service life and safety of the controller.
[0003] The prior art usually adopts water cooling mode for the power module cooling mode, and the heat generated by the IGBT during work is taken away through the heat exchange between the cooling liquid and the radiator. The cooling structure includes series and parallel types:
[0004] (1) The series cooling structure is that the power module U / V / W three-phase modules are distributed in the same main cooling flow channel, which will cause the IGBT junction temperature value to be low near the water nozzle inlet and the IGBT junction temperature value to be high near the water nozzle outlet, resulting in a large IGBT junction temperature difference;
[0005] (2) The parallel cooling structure is that the power module U / V / W three-phase modules are in three independent branch cooling flow channels, which can ensure the temperature consistency of the U / V / W three-phase modules in the same bridge arm, but the upper and lower bridge arms of the U / V / W three-phase modules are close to the water inlet and outlet of the controller respectively, resulting in a large temperature difference between the upper and lower bridge arms.
[0006] The threshold temperature of IGBT safe and efficient work is 150 DEG C, and the temperature difference not only limits the maximum flow capacity of IGBT, but also causes the difference between the reliability and service life of each IGBT crystal. INVENTION CONTENTS
[0007] Therefore, a cooling device and controller system are provided to solve the problem of large temperature difference between the power device single tubes in the prior art due to uneven cooling of the power device single tubes in the controller.
[0008] The utility model provides a cooling device, cooling device is used for carrying out cooling to power module in the inside of controller,
[0009] The cooling device comprises:
[0010] A first cooling cavity is used for containing the cooling liquid;
[0011] A second cooling cavity is used for being arranged in close contact with the power module and cooling the power module;
[0012] A plurality of cooling nozzles are arranged, one end of the cooling nozzle is connected to the first cooling cavity, and the other end of the cooling nozzle is connected to the second cooling cavity;
[0013] When cooling, the first cooling cavity is used for containing the cooling liquid, and the plurality of cooling nozzles simultaneously guide the cooling liquid from the first cooling cavity into the second cooling cavity.
[0014] On the basis of the above technical scheme, the utility model further can make the following improvement.
[0015] In one of the implementation modes, the second cooling cavity further comprises:
[0016] A heat dissipation plate surrounds one side wall of the second cooling cavity, the heat dissipation plate is connected with the controller, and the heat dissipation plate is arranged opposite to the cooling nozzle and is used for receiving the cooling liquid sprayed by the cooling nozzle;
[0017] A first partition rib is located in the second cooling cavity and is in a convex shape, the first partition rib is located on the heat dissipation plate or a plane arranged opposite to the heat dissipation plate, the first partition rib has a plurality of first partition ribs, the plurality of first partition ribs surround a plurality of cooling areas, and each cooling area corresponds to at least two cooling nozzles.
[0018] In one of the implementation modes, the first partition rib is uniformly arranged on the heat dissipation plate, and the cooling nozzle is uniformly arranged along the plane parallel to the heat dissipation plate.
[0019] In one of the implementation modes, the second cooling cavity further comprises:
[0020] A heat dissipation tooth is arranged on one side of the heat dissipation plate in the second cooling cavity and is in a convex shape, and the heat dissipation tooth has a plurality of heat dissipation teeth.
[0021] In one of the implementation modes, the second cooling cavity further comprises:
[0022] An avoidance position is used for containing the cooling nozzle and is formed on the heat dissipation plate and surrounded by the heat dissipation tooth;
[0023] The heat dissipation tooth comprises a tooth bottom and a tooth top, one end of the heat dissipation tooth connected with the heat dissipation plate is the tooth bottom, and the other end of the heat dissipation tooth protruding from the heat dissipation plate is the tooth top;
[0024] One end of the cooling nozzle extends into the space between the tooth top and the tooth bottom along the avoidance position.
[0025] In one implementation, the first cooling cavity comprises:
[0026] A water inlet for the cooling liquid to enter;
[0027] A second partition rib, which divides the first cooling cavity into at least two independent areas connected to the water inlet, and each area is provided with uniformly arranged cooling nozzles.
[0028] In one implementation, the first cooling cavity comprises:
[0029] A partition plate, which forms a side wall of the first cooling cavity, is detachable, the water inlet is provided on the partition plate, and the second partition rib is also provided on the partition plate.
[0030] In one implementation, the cooling device further comprises:
[0031] A third cooling cavity connected to the second cooling cavity, and the cooling liquid enters the third cooling cavity in sequence through the first cooling cavity and the second cooling cavity;
[0032] A connecting channel for connecting the second cooling cavity and the third cooling cavity, which is provided at the edge of the second cooling cavity in the width direction or the length direction, and the size of the second cooling cavity in the direction where the connecting channel is provided is greater than the corresponding size of the first cooling cavity.
[0033] In one implementation, the cooling device further comprises:
[0034] A water inlet nozzle, which is connected to the first cooling cavity and used for introducing the cooling liquid;
[0035] A water outlet nozzle, which is connected to the third cooling cavity and used for discharging the cooling liquid;
[0036] The third cooling cavity comprises:
[0037] A sealing plate, which forms a side wall of the third cooling cavity, and the water inlet nozzle and the water outlet nozzle are fixed on the sealing plate, and the water inlet nozzle penetrates through the sealing plate to be connected to the first cooling cavity;
[0038] The third cooling cavity, the first cooling cavity and the second cooling cavity are sequentially connected.
[0039] On the other hand, the utility model also provides a kind of controller system, including cooling device, and controller system further includes:
[0040] A power module, which is attached to the outer wall of the second cooling cavity;
[0041] The temperature sensor is arranged in the gap of the power module and is attached to the outer wall of the second cooling cavity.
[0042] The utility model discloses the beneficial effects are: through setting up first cooling cavity, first cooling cavity is used to accommodate and pass in cooling liquid, make cooling liquid in first cooling cavity pass in, then, through cooling nozzle introduction to second cooling cavity and the power module that is attached to second cooling cavity is cooled down. BRIEF DESCRIPTION OF DRAWINGS
[0043] Figure 1 It is structural schematic diagram of cooling device in one embodiment;
[0044] Figure 2 It is structural schematic diagram of cooling device in another embodiment;
[0045] Figure 3 It shows Figure 2 Sectional view at A-A in it;
[0046] Figure 4 It shows the local structural schematic diagram of cooling device in another embodiment;
[0047] Figure 5 It shows Figure 4 Sectional view at B-B in it;
[0048] Figure 6 It shows the structural schematic diagram of partition plate;
[0049] Figure 7 It shows the structural schematic diagram of radiating plate;
[0050] Figure 8 It shows the back structural schematic diagram of radiating plate.
[0051] In the drawings, the components represented by each reference sign are as follows:
[0052] 10, first cooling cavity;11, water inlet;12, second partition rib;13, partition plate;
[0053] 20, second cooling cavity;21, radiating plate;22, first partition rib;23, radiating tooth;24, avoidance position;
[0054] 30, third cooling cavity; 31, sealing plate;
[0055] 40, cooling nozzle; 50, connecting channel; 60, water inlet nozzle; 70, water outlet nozzle;
[0056] 80, power module; 90, temperature sensor. DETAILED DESCRIPTION
[0057] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application. It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and therefore the drawings only show the components related to the present application, not the components number, shape and size when actually implemented. The shape, number and proportion of each component can be randomly changed when actually implemented, and the component layout form can also be more complex.
[0058] In the prior art, when the power module 80 mainly generating heat of the controller is cooled, due to the problem of the existing cooling structure arrangement, the power module 80 close to the cooling liquid inlet is cooled quickly and has low temperature, and the power module 80 close to the cooling liquid outlet is cooled slowly and has high temperature, so that the cooling of the power module 80 has large temperature difference, thereby limiting the use of the power module 80. In order to solve the problem of large temperature difference during cooling of the power module 80, the scheme of the present application is proposed:
[0059] A cooling device, see Figure 1 , Figure 2 and Figure 3 , the cooling device is used for cooling the power module 80 inside the controller, and the cooling device comprises a first cooling cavity 10, a second cooling cavity 20 and a cooling nozzle 40, the first cooling cavity 10 is used for containing the cooling liquid; the second cooling cavity 20 is used for being arranged in close contact with the power module 80 and cooling the power module 80; the cooling nozzle 40 is provided with a plurality of cooling nozzles 40, one end of the cooling nozzle 40 is connected to the first cooling cavity 10, and the other end of the cooling nozzle 40 is connected to the second cooling cavity 20; wherein, during cooling, the first cooling cavity 10 is used for containing the cooling liquid, and the plurality of cooling nozzles 40 simultaneously guide the cooling liquid from the first cooling cavity 10 into the second cooling cavity 20.
[0060] With the above scheme, by setting the first cooling cavity 10, the first cooling cavity 10 is used to contain and pass in the cooling liquid, so that the cooling liquid is first passed into the first cooling cavity 10, and then introduced into the second cooling cavity 20 through the cooling nozzle 40 and cools the power module 80 attached to the second cooling cavity 20. Since there are a plurality of cooling nozzles 40, and the cooling nozzle 40 serves as a passage for the cooling liquid from the first cooling cavity 10 into the second cooling cavity 20, so that the second cooling cavity 20 is simultaneously connected to a plurality of cooling liquid inlets, compared with the prior art structure of one end inlet and the other end outlet, a plurality of cooling nozzles 40 are arranged along the direction of the attachment of the second cooling cavity 20 and the power module 80, which can effectively reduce the influence of the excessive temperature difference between the power modules 80 on the working performance of the power module 80.
[0061] In one implementation, referring to Figure 1 and Figure 7 , the second cooling cavity 20 further comprises a heat dissipation plate 21 and a first partition rib 22, the heat dissipation plate 21 surrounds one side wall of the second cooling cavity 20, the heat dissipation plate 21 is connected to the controller, and the heat dissipation plate 21 is arranged opposite to the cooling nozzle 40 and used to receive the cooling liquid sprayed by the cooling nozzle 40. In this way, by setting the first partition rib 22 to divide the area in the second cooling cavity 20, the uniform distribution of the cooling liquid is facilitated, thereby effectively improving the uniformity of cooling of the plurality of power modules 80 connected to the heat dissipation plate 21, facilitating the balanced cooling of the power modules 80, thereby effectively ensuring the temperature consistency of the power modules 80 to be reduced, thereby improving the precision of program control.
[0062] The first partition rib 22 is located in the second cooling cavity 20 and is in a convex shape, and the first partition rib 22 is located on the heat dissipation plate 21 or a plane arranged opposite to the heat dissipation plate 21. There are a plurality of first partition ribs 22, and the plurality of first partition ribs 22 surround a plurality of cooling regions, and each cooling region corresponds to at least two cooling nozzles 40. In this way, since the purpose of the first partition rib 22 is to make the cooling liquid in the second cooling cavity 20 uniformly distributed, the first partition rib 22 can be provided with a plurality of first partition ribs 22, and corresponding cooling nozzles 40 are arranged in the plurality of cooling regions surrounded by the first partition rib 22, so that there is enough cooling liquid in each cooling region, thereby ensuring the cooling effect in each cooling region, that is, ensuring the cooling effect of the power module 80 of the controller.
[0063] In some embodiments, referring to Figure 1 and Figure 7, the first partitioning ribs 22 play a role in avoiding uneven distribution of the cooling liquid caused by the cooling liquid running around. The height of the first partitioning ribs 22 can be set to be less than the height of the second cooling cavity 20, and a gap is formed between adjacent first partitioning ribs 22, i.e., the cooling regions surrounded by the first partitioning ribs 22 are non-closed independent regions, and a certain exchange of the cooling liquid between the regions is allowed.
[0064] In one implementation, referring to Figure 1 and Figure 7 , the first partitioning ribs 22 are uniformly arranged on the heat dissipation plate 21, and the cooling nozzles 40 are uniformly arranged along a plane parallel to the heat dissipation plate 21. In this way, the uniform arrangement of the first partitioning ribs 22 and the cooling nozzles 40 ensures that the area of each cooling region and the amount of the cooling liquid entering the region are balanced, thereby ensuring balanced cooling of the power modules 80.
[0065] In some embodiments, referring to Figure 1 and Figure 7 , the first partitioning ribs 22 are uniformly arranged along the length and width directions of the heat dissipation plate 21. In one implementation, two first partitioning ribs 22 are arranged along the width direction, and three first partitioning ribs 22 are arranged along the length direction and extend in the same direction, thereby dividing the heat dissipation plate 21 into six cooling regions by the first partitioning ribs 22. Four cooling nozzles 40 can enter each cooling region, and the four cooling nozzles 40 are arranged in the same length direction, effectively ensuring the cooling effect of the corresponding power module 80 in each cooling region, so that all the power modules 80 can be balancedly cooled.
[0066] In one implementation, referring to Figure 1 and Figure 7 , the second cooling cavity 20 further includes heat dissipation teeth 23, which are arranged on one side of the heat dissipation plate 21 in the second cooling cavity 20 and protrude. The heat dissipation teeth 23 are provided in multiple numbers. In this way, since the heat dissipation plate 21 is connected to the controller and used to cool the controller, the heat exchange area between the cooling liquid and the heat dissipation plate 21 is increased by arranging the heat dissipation teeth 23 on the heat dissipation plate 21, thereby enabling faster cooling of the controller and effectively improving the heat exchange efficiency of the cooling liquid, thereby accelerating the cooling of the power modules 80.
[0067] In some embodiments, referring to Figure 1 and Figure 7 , the heat dissipation teeth 23 are circular teeth, which effectively ensure the contact area between the heat dissipation teeth 23 and the cooling liquid, thereby facilitating efficient cooling.
[0068] In one implementation, referring to Figure 1 and Figure 7The second cooling cavity 20 further comprises an emptying position 24 for accommodating the cooling nozzle 40 extending into the emptying position 24, the emptying position 24 is formed on the heat dissipation plate 21 and surrounded by the heat dissipation teeth 23; the heat dissipation teeth 23 comprise a tooth bottom and a tooth top, the tooth bottom is connected to the heat dissipation plate 21, and the tooth top is protruded from the heat dissipation plate 21; one end of the cooling nozzle 40 extends into the emptying position 24 between the tooth top and the tooth bottom. In this way, the emptying position 24 is arranged to facilitate the cooling nozzle 40 to extend into the heat dissipation teeth 23, and to facilitate the cooling liquid sprayed from the cooling nozzle 40 to spread after being sprayed to the tooth bottom of the heat dissipation teeth 23, so as to avoid splashing after being sprayed to the tooth top; the emptying position 24 also has the effect of positioning when the heat dissipation plate 21 is installed, and the remaining heat dissipation teeth 23 can be arranged in close arrangement, so as to increase the heat exchange area with the cooling liquid, thereby accelerating the heat dissipation effect of the controller.
[0069] In some embodiments, referring to Figure 1 and Figure 3 , the length direction of the heat dissipation teeth 23 is the distance from the tooth top to the tooth bottom, and the end of the cooling nozzle 40 extends at least to the middle of the length direction of the heat dissipation teeth 23, so as to ensure that more cooling liquid sprayed from the cooling nozzle 40 can be sprayed to the tooth bottom.
[0070] In one implementation, referring to Figure 1 and Figure 6 , the first cooling cavity 10 comprises a water inlet 11 and a second partition rib 12, the water inlet 11 is used for the inlet of the cooling liquid; the second partition rib 12 divides the first cooling cavity 10 into at least two independent regions connected to the water inlet 11, and each region is provided with uniformly arranged cooling nozzles 40. In this way, the first cooling cavity 10 is provided with the water inlet 11 for the inlet of the cooling liquid, and the cooling liquid is discharged through the cooling nozzles 40, and the second partition rib 12 is arranged in the first cooling cavity 10 to divide at least two regions, and each region is connected to the water inlet 11, so that the cooling liquid can be timely introduced into each region, and the second partition rib 12 is arranged to balance the liquid inlet of different positions of the first cooling cavity 10, so as to ensure that the cooling nozzles 40 in each region can timely discharge the liquid, and avoid the problem of uneven distribution of the cooling liquid.
[0071] In some embodiments, referring to Figure 1 and Figure 6 , the cooling nozzles 40 are arranged in two rows, and the second partition rib 12 is arranged in one row, and the second partition rib 12 divides all the cooling nozzles 40 in each row into one region of the first cooling cavity 10.
[0072] In one implementation, referring to Figure 1 and Figure 6The first cooling cavity 10 comprises a partition plate 13, the partition plate 13 forms a side wall of the first cooling cavity 10, the partition plate 13 is detachable, the water inlet 11 is arranged on the partition plate 13, and the second partition rib 12 is arranged on the partition plate 13. In this way, by arranging the partition rib on the detachable partition plate 13, the number or width of the partition rib can be adjusted, and only the corresponding partition plate 13 needs to be replaced.
[0073] In one of the implementations, referring to Figure 1 and Figure 3 The cooling device further comprises a third cooling cavity 30 and a connecting channel 50, the third cooling cavity 30 is connected with the second cooling cavity 20, and the cooling liquid sequentially enters the third cooling cavity 30 from the first cooling cavity 10 and the second cooling cavity 20; the connecting channel 50 is arranged at the edge of the second cooling cavity 20 in the width direction or the length direction, and the size of the second cooling cavity 20 in the direction in which the connecting channel 50 is arranged is greater than the corresponding size of the first cooling cavity 10. In this way, for the cooling device, the first cooling cavity 10 is used for the entry of the cooling liquid, the third cooling cavity 30 is used for the discharge of the cooling liquid, the first cooling cavity 10 and the second cooling cavity 20 are connected through the cooling nozzle 40, and the second cooling cavity 20 and the third cooling cavity 30 are connected through the connecting channel 50; when the connecting channel 50 is arranged at the edge of the second cooling cavity 20 and the connecting channel 50 is arranged in the height direction of the cooling cavity, the condition to be met is that the size of the second cooling cavity 20 in the direction in which the connecting channel 50 is arranged is greater than the corresponding size of the first cooling cavity 10, so that the connecting channel 50 can be conveniently arranged.
[0074] In some embodiments, referring to Figure 4 and Figure 5 The connecting channel 50 can be arranged in the form of a long strip-shaped through hole, and the connecting channel 50 can be arranged in the length direction and / or the width direction of the second cooling cavity 20; when the first partition rib 22 divides the second cooling cavity 20 into six cooling areas in the form of 2X3, the length direction of the second cooling cavity 20 has two rows of cooling areas, each row has three cooling areas, and in this case, the connecting channel 50 can be arranged at the edges of the two long sides of the second cooling cavity 20, and the corresponding cooling channels can be arranged at the positions of each cooling area, so that the cooling liquid can be quickly discharged to the third cooling cavity 30.
[0075] In one of the implementations, referring to Figure 1The cooling device further comprises a water inlet nozzle 60 and a water outlet nozzle 70, the water inlet nozzle 60 is communicated with the first cooling cavity 10 and used for guiding the cooling liquid to flow in, the water outlet nozzle 70 is communicated with the third cooling cavity 30 and used for guiding the cooling liquid to flow out, the third cooling cavity 30 comprises a sealing plate 31, the sealing plate 31 surrounds a side wall of the third cooling cavity 30, the water inlet nozzle 60 and the water outlet nozzle 70 are both fixed on the sealing plate 31, and the water inlet nozzle 60 is communicated to the first cooling cavity 10 through the sealing plate 31; wherein, the third cooling cavity 30, the first cooling cavity 10 and the second cooling cavity 20 are sequentially arranged. In this way, the water inlet nozzle 60 and the water outlet nozzle 70 are both fixed at adjacent positions, so that the setting of the cooling liquid inlet pipeline and the cooling liquid outlet pipeline is facilitated, and the integration of the pipeline setting is improved; thus, the cooling liquid flows through the water inlet nozzle 60, the first cooling cavity 10, the second cooling cavity 20, the third cooling cavity 30 and the water outlet nozzle 70.
[0076] A controller system, see Figure 1 and Figure 8 , comprising a cooling device, the controller system further comprises a power module 80 and a temperature sensor 90, the power module 80 is arranged in close contact with the outer wall of the second cooling cavity 20; the temperature sensor 90 is arranged in the gap of the power module 80, and the temperature sensor 90 is arranged in close contact with the outer wall of the second cooling cavity 20. In this way, the temperature of the heat dissipation plate 21 is fed back through the temperature sensor 90, that is, the junction temperature of the power module 80 is fed back, and the result measured by the temperature sensor 90 facilitates the operation of timely cooling.
[0077] In some embodiments, see Figure 8 , the installation position of the temperature sensor 90 is provided with a circular groove, and the temperature sensor 90 is fixed in the circular groove, and the circular shape of the temperature sensor 90 in the figure can be understood as the installation position of the temperature sensor 90, and is not understood as the limitation of the shape of the temperature sensor 90.
[0078] In some embodiments, the power module 80 is a MOSFET single tube, an IGBT crystal element is located inside the MOSFET single tube, the MOSFET single tube is fixed on the welding table of the heat dissipation plate 21 by welding, and the heat generated by the IGBT during operation is transferred to the heat dissipation plate 21 and then taken away by the cooling liquid. By arranging the cooling teeth 23 in the second cooling cavity 20 and the cooling nozzle 40 extending into the gap between the cooling teeth 23, the temperature and flow state consistency of the cooling liquid around the cooling teeth 23 under the welding pad are ensured, and the IGBT junction temperature consistency is ensured; and the speed of the sprayed cooling liquid is high, the heat exchange capacity with the heat dissipation plate 21 is enhanced, and the IGBT junction temperature is further reduced.
[0079] In some embodiments, the IGBT junction temperature model comprises a first temperature threshold value and a second temperature threshold value, wherein the second temperature threshold value is a maximum threshold value of IGBT tolerance temperature, and the second temperature threshold value is usually 175℃, and the first temperature threshold value is an IGBT manufacturer recommended temperature threshold value, and the first temperature threshold value is usually 150℃, and the corresponding control strategy can be:
[0080] determining whether the real-time temperature measured by the temperature sensor 90 exceeds the first temperature threshold value or the second temperature threshold value;
[0081] If the real-time temperature exceeds the first temperature threshold value, AC refrigeration is performed to reduce the temperature of the cooling liquid.
[0082] If the real-time temperature exceeds the second temperature threshold value, the vehicle controller VCU issues a control instruction to limit the output power of the MCU controller.
[0083] As can be seen from the above, the first temperature preset value is lower than the second temperature preset value, and the higher the measured real-time temperature, the more rapid and effective cooling operation is required, so different operations are taken for the above two temperature states. By limiting the output power of the controller and adjusting the thermal management strategy, the needs of various operating conditions of the vehicle are guaranteed, and the risk of IGBT "pipe explosion" in extreme operating conditions is avoided.
[0084] The structures, proportions, sizes, etc. shown in the drawings attached to the specification are only used to cooperate with the content disclosed in the specification for understanding and reading by those skilled in the art, and do not define the limiting conditions for the implementation of the utility model, so they do not have substantial technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects and purposes that the utility model can produce, should still fall within the scope of the technical content disclosed by the utility model.
[0085] Furthermore, the terms "first", "second", etc. are used only for descriptive purposes and do not connote or imply relative importance or a quantity of the indicated technical features. Thus, a feature defined with "first" or "second" can include at least one of the features explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically limited. In the description of the present application, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, a person skilled in the art can combine and combine different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.
[0086] The above-described embodiments only express several embodiments of the present application, which are described in detail and specifically, but should not be understood as limiting the scope of the utility model patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.
Claims
1. Cooling device, characterized in that The cooling device is used for cooling a power module (80) inside a controller, The cooling device comprises: a first cooling cavity (10) for containing cooling liquid; a second cooling cavity (20) for being arranged in close contact with the power module (80) and cooling the power module (80); a plurality of cooling nozzles (40), one end of each of the cooling nozzles (40) being connected to the first cooling cavity (10), and the other end of each of the cooling nozzles (40) being connected to the second cooling cavity (20); wherein, during cooling, the first cooling cavity (10) is used for containing cooling liquid, and the plurality of cooling nozzles (40) simultaneously guide the cooling liquid from the first cooling cavity (10) into the second cooling cavity (20).
2. Cooling device according to claim 1, characterized in that The second cooling cavity (20) further comprises: a heat dissipation plate (21) forming one side wall of the second cooling cavity (20), the heat dissipation plate (21) being connected to the controller, the heat dissipation plate (21) being arranged opposite to the cooling nozzles (40) and used for receiving the cooling liquid sprayed by the cooling nozzles (40); a plurality of first partition ribs (22) located in the second cooling cavity (20) and protruding, the first partition ribs (22) being located on the heat dissipation plate (21) or a plane arranged opposite to the heat dissipation plate (21); the first partition ribs (22) form a plurality of cooling areas, and each of the cooling areas corresponds to at least two of the cooling nozzles (40).
3. Cooling device according to claim 2, characterized in that The first partition ribs (22) are uniformly arranged on the heat dissipation plate (21), and the cooling nozzles (40) are uniformly arranged along a plane parallel to the heat dissipation plate (21).
4. Cooling device according to claim 2 or 3, characterized in that The second cooling cavity (20) further comprises: a plurality of heat dissipation teeth (23) arranged on one side of the heat dissipation plate (21) located in the second cooling cavity (20) and protruding.
5. Cooling device according to claim 4, characterized in that The second cooling cavity (20) further comprises: a plurality of avoidance positions (24) for accommodating the cooling nozzles (40) to extend into, the avoidance positions (24) being formed on the heat dissipation plate (21) and surrounded by the heat dissipation teeth (23); The heat dissipation teeth (23) comprise a tooth bottom and a tooth top, one end of the heat dissipation teeth (23) connected to the heat dissipation plate (21) being the tooth bottom, and the other end of the heat dissipation teeth (23) protruding from the heat dissipation plate (21) being the tooth top; One end of the cooling nozzles (40) extends into the tooth top and the tooth bottom along the avoidance positions (24).
6. The cooling device of claim 1, wherein The first cooling cavity (10) comprises: a water inlet (11) for the cooling liquid to enter. A second partition rib (12) is arranged along the middle part of the water inlet (11) to divide the first cooling cavity (10) into at least two independent areas each of which is connected with the water inlet (11) and in which the cooling nozzles (40) are arranged uniformly.
7. Cooling device according to claim 6, characterized in that The first cooling cavity (10) comprises: A partition plate (13) is arranged to form a side wall of the first cooling cavity (10), the partition plate (13) is detachable, the water inlet (11) is arranged on the partition plate (13), and the second partition rib (12) is also arranged on the partition plate (13).
8. The cooling device of claim 1, wherein, The cooling device further comprises: A third cooling cavity (30) is connected with the second cooling cavity (20), and the cooling liquid sequentially enters the third cooling cavity (30) from the first cooling cavity (10) and the second cooling cavity (20). A connecting channel (50) is arranged to connect the second cooling cavity (20) and the third cooling cavity (30), the connecting channel (50) is arranged at the edge of the second cooling cavity (20) in the width direction or the length direction, and the size of the second cooling cavity (20) in the direction in which the connecting channel (50) is arranged is greater than the corresponding size of the first cooling cavity (10).
9. Cooling device according to claim 8, characterized in that The cooling device further comprises: A water inlet nozzle (60) is arranged to communicate with the first cooling cavity (10) and guide the cooling liquid into the first cooling cavity (10); A water outlet nozzle (70) is arranged to communicate with the third cooling cavity (30) and guide the cooling liquid out of the third cooling cavity (30); The third cooling cavity (30) comprises: A sealing plate (31) is arranged to form a side wall of the third cooling cavity (30), the water inlet nozzle (60) and the water outlet nozzle (70) are fixed on the sealing plate (31), and the water inlet nozzle (60) penetrates through the sealing plate (31) to communicate with the first cooling cavity (10). The third cooling cavity (30), the first cooling cavity (10) and the second cooling cavity (20) are arranged sequentially.
10. A controller system characterized by, The controller system further comprises: A power module (80) is arranged to be attached to the outer wall of the second cooling cavity (20); A temperature sensor (90) is arranged in the gap of the power module (80) and is attached to the outer wall of the second cooling cavity (20).