Semiconductor ultrasonic cleaning equipment

Abstract

The utility model discloses semiconductor ultrasonic cleaning equipment, which relates to the technical field of semiconductor cleaning and comprises a cleaning cavity, electric push rods are mounted at four corners of the top end of the cleaning cavity through notches, connecting rods are mounted at the tops of the four electric push rods, and upright posts are mounted at the bottoms of one ends of the four connecting rods. The bottom ends of the four stand columns are jointly connected with a supporting shell, four long grooves are formed in the top end of the supporting shell, clamping blocks are installed at the top ends of the four long grooves, clamping blocks are installed at the bottom ends of the four clamping blocks, and the bottoms of the four clamping blocks penetrate through the corresponding long grooves to extend into the supporting shell. And one ends of the four clamping blocks are connected with linkage rods in a hinged mode, and one ends of the four linkage rods are jointly provided with a rotating disc in a hinged mode. According to the semiconductor cleaning device, a series of structures are arranged, it is guaranteed that semiconductors can be completely cleaned during cleaning, the semiconductors can be away from the clamping blocks after cleaning is completed, and the semiconductors are convenient to take and feed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning technology, specifically to a semiconductor ultrasonic cleaning device. Background Technology

[0002] In the production and processing of semiconductor silicon wafers, an ultrasonic cleaning machine is needed to clean the surface stains. This ultrasonic cleaning machine is a common ultrasonic cleaning equipment.

[0003] Most existing ultrasonic cleaning machines require operators to extend their arms into the machine to place the semiconductor during loading, which limits the operating space. Furthermore, most current ultrasonic cleaning machines require support at the bottom of the semiconductor when fixing it, which can obstruct the support during cleaning and lead to incomplete cleaning. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor ultrasonic cleaning device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor ultrasonic cleaning device, comprising a cleaning chamber, wherein electric push rods are installed at the four corners of the top of the cleaning chamber via slots, connecting rods are installed at the top of the four electric push rods, and columns are installed at the bottom of one end of each of the four connecting rods. The bottom ends of the four columns are connected to a support housing, four elongated slots are provided at the top of the support housing, clamping blocks are installed at the top of each of the four elongated slots, and locking blocks are installed at the bottom of each of the four clamping blocks. The bottoms of the four locking blocks extend through the corresponding elongated slots into the interior of the support housing, a connecting rod is hinged to one end of each of the four locking blocks, and a turntable is hinged to one end of each of the four connecting rods. A sleeve is provided at the bottom of the turntable, and a screw is threadedly connected to the middle of the sleeve. The top of the screw extends out of the middle of the top of the support housing, a flexible pad is provided at the extended end of the screw, and a support column is inserted into the bottom of the screw.

[0006] Preferably, a top cover is hinged to one end of the cleaning chamber, and a handle is installed at the front end of the top cover. When performing semiconductor ultrasonic cleaning, the top cover is closed to prevent the cleaning fluid from splashing out of the cleaning chamber, and the handle is used to assist in opening or closing the top cover.

[0007] Preferably, the top of the outer turntable of the screw is provided with a convex ring, the top of which is rotatably connected to the inside of the support housing. The convex ring limits the turntable, allowing it to rotate.

[0008] Preferably, the bottom end of the support column is fixedly connected to the inside of the support housing. The support column limits the screw, preventing the screw from rotating. The screw, sleeved on the outer surface of the support column, can move linearly up and down.

[0009] Preferably, a toothed disc is provided at the bottom edge of the sleeve, and a drive gear is meshed with the outer edge of the toothed disc. When the drive gear rotates, it will drive the toothed disc to rotate.

[0010] Preferably, a waterproof motor is installed at the bottom of the drive gear. The waterproof motor is mounted inside the support housing via a bracket. The waterproof motor is controlled by a forward and reverse rotation control circuit and can drive the drive gear to perform reciprocating rotational motion.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This semiconductor ultrasonic cleaning equipment uses four clamping blocks and a flexible pad that can move up and down. When the four clamping blocks move to the middle of the support housing to clamp the semiconductor, the flexible pad descends away from the bottom of the semiconductor silicon wafer, so that the bottom of the semiconductor silicon wafer is not blocked during ultrasonic cleaning, resulting in incomplete cleaning. When the four clamping blocks move to the four corners of the support housing to release the semiconductor silicon wafer, the flexible pad rises and pushes the semiconductor silicon wafer away from the clamping blocks, making it easier to pick up. This ensures that the semiconductor can be completely cleaned during cleaning, and after cleaning, the semiconductor can be moved away from the clamping blocks for easy removal.

[0013] 2. This semiconductor ultrasonic cleaning equipment uses four electric push rods to move the support housing up and down. When placing semiconductors, the support housing rises to the top of the cleaning chamber to facilitate loading. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a top-view perspective schematic diagram of the cross-sectional structure of the supporting shell of this utility model;

[0016] Figure 3 This is a bottom-view perspective view of the cross-sectional structure of the supporting shell of this utility model.

[0017] In the diagram: 1. Cleaning chamber; 2. Top cover; 3. Handrail; 4. Support shell; 5. Column; 6. Connecting rod; 7. Electric push rod; 8. Locking block; 9. Turntable; 10. Flexible pad; 11. Clamping block; 12. Long groove; 13. Convex ring; 14. Sleeve; 15. Gear plate; 16. Support column; 17. Screw; 18. Waterproof motor; 19. Drive gear; 20. Connecting rod. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] like Figures 1 to 3As shown in the figure, this embodiment of a semiconductor ultrasonic cleaning device includes a cleaning chamber 1. At each of the four corners of the top of the cleaning chamber 1, an electric push rod 7 is installed via slots. Each of the four electric push rods 7 has a connecting rod 6 mounted on its top. A column 5 is mounted on the bottom of one end of each of the four connecting rods 6. The bottom ends of the four columns 5 are connected to a support housing 4. The output ends of the four electric push rods 7, through the connecting rods 6 and the columns 5, can drive the support housing 4 to move up and down inside the cleaning chamber 1. During semiconductor cleaning, the support housing 4 is driven into the cleaning fluid inside the cleaning chamber 1. After semiconductor cleaning is completed, the support housing 4 rises away from the cleaning fluid. The top of the support housing 4 has four elongated slots 12, each with a clamping block 11 mounted at its top. Each clamping block 11 has a locking block 8 mounted at its bottom. The bottom of each locking block 8 extends through the corresponding elongated slot 12 into the support housing 4. The locking blocks 8 and the elongated slots 12 work together to limit the clamping blocks 11. One end of each locking block 8 is hinged to a connecting rod 20. One end of each connecting rod 20 is hinged to a turntable 9. When the turntable 9 rotates, it pulls or pushes the connecting rods 20, causing the locking blocks to... 8 moves linearly along the long groove 12, driving the four clamping blocks 11 to move linearly towards the middle of the top of the support housing 4 or towards the four corners, so as to clamp or loosen the semiconductor silicon wafer. The bottom of the turntable 9 is provided with a sleeve 14, and a screw 17 is threadedly connected to the middle of the sleeve 14. The top of the screw 17 extends out of the middle of the top of the support housing 4. A flexible pad 10 is provided at the extended end of the screw 17. A support column 16 is inserted into the bottom of the screw 17. The support column 16 limits the screw 17, and the screw 17 can move upwards from the top of the support column 16. In the linear motion, when the turntable 9 drives the sleeve 14 to rotate, the screw 17 is driven to move up and down. When the four clamping blocks 11 move linearly towards the middle position of the support housing 4, the screw 17 is driven to move downward, causing the flexible pad 10 to descend away from the bottom of the semiconductor silicon wafer. This prevents the semiconductor silicon wafer from being blocked at the bottom during ultrasonic cleaning, thus avoiding incomplete cleaning. When the four clamping blocks 11 move towards the four corners of the support housing 4 to release the semiconductor silicon wafer, the flexible pad 10 will rise and push the semiconductor silicon wafer away from the clamping blocks 11, making it easier to pick up.

[0021] Specifically, a top cover 2 is hinged to one end of the cleaning chamber 1, and a handle 3 is installed at the front end of the top cover 2. When performing semiconductor ultrasonic cleaning, the top cover 2 is closed to prevent the cleaning fluid from splashing out of the cleaning chamber 1. The handle 3 is used to assist in opening or closing the top cover 2.

[0022] Furthermore, a convex ring 13 is provided at the top of the outer turntable 9 of the screw 17. The top of the convex ring 13 is rotatably connected to the inside of the support housing 4. The convex ring 13 limits the turntable 9, allowing the turntable 9 to rotate.

[0023] Furthermore, the bottom end of the support column 16 is fixedly connected to the inside of the support housing 4. The support column 16 limits the screw 17 so that the screw 17 will not rotate. The screw 17 is sleeved on the outer surface of the support column 16 and can move up and down linearly.

[0024] Furthermore, a toothed disc 15 is provided at the bottom edge of the sleeve 14, and a drive gear 19 is meshed with the outer edge of the toothed disc 15. When the drive gear 19 rotates, it will drive the toothed disc 15 to rotate.

[0025] Furthermore, a waterproof motor 18 is installed at the bottom of the drive gear 19. The waterproof motor 18 is installed inside the support housing 4 via a bracket. The waterproof motor 18 is controlled by a forward and reverse rotation control circuit and can drive the drive gear 19 to perform reciprocating rotational motion.

[0026] The usage method of this embodiment is as follows: When using this semiconductor ultrasonic cleaning equipment, open the top cover 2. The output ends of the four electric push rods 7 cooperate with the connecting rod 6 and the column 5 to drive the support housing 4 to rise inside the cleaning chamber 1, so that the support housing 4 rises away from the cleaning liquid. At this time, the four clamping blocks 11 are located near the four corners of the top of the support housing 4, and the flexible pad 10 is located at a higher position. Then, place the top of the flexible pad 10 at the middle position of the bottom end of the semiconductor silicon wafer. Then, start the waterproof motor 18 to drive the turntable 9 to rotate. When the turntable 9 rotates, it will pull or push the connecting rod 20, so that the clamping block 8 follows the trajectory of the long groove 12. The turntable 9 moves linearly, causing the four clamping blocks 11 to move linearly towards the middle of the top of the support housing 4, clamping the semiconductor silicon wafer. When the four clamping blocks 11 move linearly towards the middle of the support housing 4, the screw 17 is driven to move downward, causing the flexible pad 10 to descend away from the bottom of the semiconductor silicon wafer, so that the semiconductor silicon wafer will not be blocked at the bottom during ultrasonic cleaning, resulting in incomplete cleaning. After cleaning is completed, the turntable 9 drives the four clamping blocks 11 to move towards the four corners of the support housing 4 to release the semiconductor silicon wafer. The flexible pad 10 will rise and push the semiconductor silicon wafer away from the clamping blocks 11, making it easier to pick up.

[0027] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A semiconductor ultrasonic cleaning apparatus comprising a cleaning chamber (1), characterized in that: The top end four corner positions of the cleaning cavity (1) are all installed with electric push rods (7) through notches, the top of the four electric push rods (7) is all installed with connecting rods (6), one end of the bottom of the four connecting rods (6) is all installed with vertical columns (5), the bottom end of the four vertical columns (5) is commonly connected with a support shell (4), the top end of the support shell (4) is provided with four long grooves (12), the top end of the four long grooves (12) is all installed with clamping blocks (11), the bottom end of the four clamping blocks (11) is all installed with clamping blocks (8), the bottom of the four clamping blocks (8) extends to the inside of the support shell (4) through the corresponding long grooves (12), one end of the four clamping blocks (8) is all hingedly connected with connecting rods (20), one end of the four connecting rods (20) is commonly hingedly installed with a rotating disc (9), the bottom end of the rotating disc (9) is provided with a sleeve (14), the middle position of the sleeve (14) is threadedly connected with a screw rod (17), the top of the screw rod (17) extends out of the top middle position of the support shell (4), the extending end of the screw rod (17) is provided with a flexible pad (10), the bottom of the screw rod (17) is inserted with a support column (16).

2. The apparatus of claim 1, wherein: The top end of the cleaning cavity (1) is hingedly installed with an upper cover (2), the front end of the upper cover (2) is installed with a handrail (3).

3. The apparatus of claim 1, wherein: The top end of the rotating disc (9) outside the screw rod (17) is provided with a convex ring (13), the top of the convex ring (13) is rotatably connected in the inside of the support shell (4).

4. The apparatus of claim 1, wherein: The bottom end of the support column (16) is fixedly connected in the inside of the support shell (4).

5. The apparatus of claim 1, wherein: The bottom edge of the sleeve (14) is provided with a gear disc (15), the outer edge of the gear disc (15) is meshingly connected with a driving gear (19).

6. A semiconductor ultrasonic cleaning apparatus according to claim 5, wherein: The bottom of the driving gear (19) is installed with a waterproof motor (18), the waterproof motor (18) is installed in the inside of the support shell (4) through a support.

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