Semiconductor frame welding device
By designing a welding stabilization mechanism, the problem of inconsistent clamping force during semiconductor frame welding was solved, thereby improving the stability and convenience of welding and ensuring the high efficiency and consistency of semiconductor frame welding.
Patent Information
- Application Number
- CN202422872912.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In the existing semiconductor frame welding process, a single fixture can only perform stable single-point welding operations, resulting in inconsistent welding stability. Multiple fixtures are cumbersome to operate and are prone to inconsistent clamping forces, affecting the convenience and consistency of welding.
A semiconductor frame welding device was designed, including a welding table, a controller, a welding pen, and a welding stabilization mechanism. Through the coordinated work of components such as a stabilizing plate, a lifting groove, a lifting column, and a force application plate, a unified force application stabilization and flexible adjustment of the semiconductor frame are achieved, thereby improving welding stability and convenience.
This improves the stability and convenience of semiconductor frame welding process, avoids the problem of inconsistent clamping force, and enhances welding consistency and operational flexibility.
Smart Images
Figure CN223734165U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor processing, specifically, a kind of semiconductor frame welding device. BACKGROUND
[0002] Semiconductor frame welding device is a kind of equipment for assembling and connecting semiconductor components and substrate or other electronic components, such devices play a vital role in modern electronic manufacturing, especially in the production process of microelectronics and integrated circuits, the main function of semiconductor frame welding device is to fix semiconductor components on the corresponding frame or substrate through welding technology, during the semiconductor frame welding process, positioning: ensure the accurate alignment of semiconductor components and frame, heating: the solder is melted by heating the welding point to form a good electrical connection, cooling: after the welding point cools down, the solder solidifies to form a stable connection, as the semiconductor frame welding appears flaw, the staff needs to separately weld the semiconductor frame with welding flaw for rework operation, therefore, rework welding stable operation needs to be carried out on semiconductor frame.
[0003] In related art, during the semiconductor frame welding process, the semiconductor frame to be reworked is generally clamped stably on the top of the operation table by a clamp, and then rework welding operation is carried out on the semiconductor frame by welding tool, so as to be used.
[0004] However, in the current semiconductor frame welding process, since a single clamp can only perform single-point welding stable operation on the semiconductor frame, multiple clamps are needed to perform welding stable operation on the semiconductor frame during the semiconductor frame welding process, which leads to cumbersome semiconductor frame welding stability, and the clamping stability of multiple clamps during operation is inconsistent, which causes insufficient stability and affects the convenience and consistency of semiconductor frame welding stability. UTILITY MODEL CONTENTS
[0005] In order to make up for the above shortcomings, the utility model provides a semiconductor frame welding device which overcomes the above technical problems or at least partially solves the above problems.
[0006] The utility model is implemented as follows:
[0007] The utility model provides a semiconductor frame welding device, including welding table, the right side in the inside of welding table is installed with controller, the right side of welding table front side is installed with the welding pen that is electrically connected with controller;
[0008] Welding stability mechanism, the welding stability mechanism includes:
[0009] Stable plate;The stable plate is movably connected at the top of welding table, and the top of the stable plate is provided with an operation opening;
[0010] The lifting groove is arranged on both sides of the top of the welding table, and the lifting column is fixedly connected to the inside of the lifting groove.
[0011] The stable force applying mechanism is arranged on both sides of the top of the welding table.
[0012] In a preferred embodiment, the stable force applying mechanism comprises a screw groove, a screw column and a force applying plate, the screw groove is arranged on both sides of the top of the welding table, the screw column is threadedly connected to the inside of the screw groove, and the force applying plate is movably connected to the top of the screw column.
[0013] In a preferred embodiment, a connecting hole is arranged on the outside of the top of the force applying plate, a connecting frame is movably connected to the inside of the connecting hole, and the bottom of the connecting frame is fixedly connected to the top of the screw column.
[0014] In a preferred embodiment, a pushing groove is arranged on the bottom of the lifting column, a spring is arranged in the pushing groove, one end of the spring is connected to the inner wall of the pushing groove, and the other end of the spring is connected to the inner wall of the lifting groove.
[0015] In a preferred embodiment, a sliding groove is arranged on the outside of the inner wall of the lifting groove, a sliding block is movably connected to the inside of the sliding groove, and the inside of the sliding block is fixedly connected to the outside of the lifting column.
[0016] In a preferred embodiment, a reference hole is arranged on the rear side of the top of the stable plate, a reference frame is movably connected to the front side of the inside of the reference hole, and the bottom of the reference frame is in contact with the top of the welding table.
[0017] In a preferred embodiment, a translation frame is movably connected to the front side of the inside of the reference hole, a translation hole is arranged on the top of the translation frame, and the reference frame is in the inside of the translation hole.
[0018] In a preferred embodiment, a magnetic sheet is embeddedly connected to the top of the stable plate on both sides of the translation frame, and a magnetic strip that is magnetically connected to the magnetic sheet is embeddedly connected to both sides of the top of the stable plate.
[0019] The semiconductor frame welding device has the following advantages:
[0020] 1. The welding stability mechanism can provide a unified force stability medium for the user to the semiconductor frame to be welded, so that the semiconductor frame can be stably placed on the top of the welding table during the welding process, and the difficulty in uniformly applying force to the semiconductor frame during the use of the welding table is avoided, thereby improving the welding stability and consistency of the welding table.
[0021] 2、By setting stable force mechanism, the downward stable force medium can be applied to the stable plate, and the user can adjust the force position of the stable plate according to the stable demand of the semiconductor frame, so that the force effect and stability flexibility of the stable plate are improved.
[0022] 3、By setting the connecting hole and the connecting frame, the rotating connection between the force plate and the stud can be realized, so that the force plate and the stable plate can be separated during use, and the separation or position transfer difficulty of the force plate during use is avoided, thereby improving the use stability and flexibility of the force plate. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings used in the embodiments will be briefly introduced as follows, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can be obtained without creative labor on the basis of these drawings.
[0024] Figure 1 is the overall perspective view provided by the embodiments of the present application;
[0025] Figure 2 is the welding table perspective cross-section structure schematic view provided by the embodiments of the present application;
[0026] Figure 3 is the translation frame perspective cross-section structure schematic view provided by the embodiments of the present application;
[0027] Figure 4 is the lifting column perspective cross-section structure schematic view provided by the embodiments of the present application;
[0028] In the figure: 1, welding table; 2, controller; 3, welding pen; 4, stable plate; 5, operation port; 6, lifting groove; 7, lifting column; 8, screw groove; 9, stud; 10, force plate; 11, connecting hole; 12, connecting frame; 13, push groove; 14, spring; 15, sliding groove; 16, sliding block; 17, reference port; 18, reference frame; 19, translation frame; 20, translation port; 21, magnetic sheet; 22, magnetic strip. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical scheme and advantages of the utility model embodiment clearer, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment. Obviously, the described embodiment is part of the utility model, rather than all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.
[0030] With reference to Figures 1-4 The utility model provides a kind of technical scheme: a semiconductor frame welding device, including welding table 1 and welding stabilizing mechanism, controller 2 is installed in the right side inside welding table 1, welding pen 3 electrically connected with controller 2 is installed in the right side of the front side of welding table 1, can provide unified force stabilizing medium for the semiconductor frame to be welded outside for user, so that semiconductor frame is stably in the top of welding table 1 during semiconductor frame welding process, avoid the situation that it is difficult to carry out unified force stabilization for semiconductor frame when welding table 1 is used, thus improve the welding stability and consistency of welding table 1.
[0031] With reference to Figures 1-4 In a preferred embodiment, the welding stabilizing mechanism includes a stabilizing plate 4 that is movably connected to the top of the welding table 1. The top of the stabilizing plate 4 is provided with an operating port 5. Lifting grooves 6 are provided on both sides of the top of the welding table 1. Lifting columns 7 are fixedly connected to both sides of the stabilizing plate 4 and located inside the lifting grooves 6. A stabilizing force applying mechanism is provided on both sides of the top of the welding table 1. The semiconductor frame to be welded is placed on the top of the welding table 1, and the position to be welded of the semiconductor frame is located at the bottom of the operating port 5. Then, the stabilizing plate 4 is moved downward to contact the top of the semiconductor frame. The stabilizing plate 4 cooperates with the welding table 1 to clamp and stabilize the semiconductor frame on the top of the welding table 1. At this time, the lifting columns 7 move inside the lifting grooves 6 along with the stabilizing plate 4 to stably connect and move the stabilizing plate 4 and the welding table 1. Then, the operator can use the welding pen 3 to cooperate with the controller 2 to stably weld the semiconductor frame through the operating port 5. The stabilizing force applying mechanism includes screw grooves 8, screw columns 9, and force applying plates 10. The screw grooves 8 are provided on both sides of the top of the welding table 1. The screw columns 9 are screw-connected inside the screw grooves 8. The force applying plates 10 are movably connected to the top of the screw columns 9. The force applying plates 10 can apply downward stabilizing force to the stabilizing plate 4. The force applying position of the stabilizing plate 4 can be adjusted according to the stabilizing requirements of the semiconductor frame, so that the stabilizing plate 4 can be stably applied or the force applying position can be adjusted during use. Therefore, the force applying effect and flexibility of the stabilizing plate 4 are improved.
[0032] With reference to Figures 2-4In an preferred embodiment, the connecting hole 11 is arranged on the outer side of the top of the force applying plate 10, the connecting frame 12 is movably connected in the connecting hole 11, the bottom of the connecting frame 12 is fixedly connected with the top of the stud 9, the rotating connection between the force applying plate 10 and the stud 9 can be realized, the force applying plate 10 can be separated from the stable plate 4 during use, the force applying plate 10 is not separated from the stud 9 or difficult to move, the use stability and flexibility of the force applying plate 10 are improved, the push groove 13 is arranged at the bottom of the lifting column 7, the spring 14 is arranged in the push groove 13, one end of the spring 14 is connected with the inner wall of the push groove 13, the other end of the spring 14 is connected with the inner wall of the lifting groove 6, the upward reset pushing force of the stable plate 4 can be applied by the lifting column 7, and the reset convenience of the stable plate 4 is improved.
[0033] Referring to Figures 2-4 In an preferred embodiment, the sliding groove 15 is arranged on the outer side of the inner wall of the lifting groove 6, the sliding block 16 is movably connected in the sliding groove 15, the inner side of the sliding block 16 is fixedly connected with the outer side of the lifting column 7, the lifting sliding limiting work between the lifting column 7 and the lifting groove 6 can be realized, the lifting stability of the lifting column 7 and the stable plate 4 is improved, the reference hole 17 is arranged at the rear side of the top of the stable plate 4, the reference frame 18 is movably connected with the front side in the reference hole 17, the bottom of the reference frame 18 is in contact with the top of the welding table 1, the horizontal placement reference medium can be provided when the user places the semiconductor frame to be welded, and the convenience of the stable placement of the semiconductor frame is improved.
[0034] Referring to Figures 2-3 In an preferred embodiment, the translation frame 19 is movably connected with the front side in the reference hole 17, the translation hole 20 is arranged at the top of the translation frame 19, the reference frame 18 is in the translation hole 20, the translation connection work between the reference frame 18 and the stable plate 4 can be realized, the translation use stability of the reference frame 18 is improved, the magnetic sheet 21 is embeddedly connected on the top of the stable plate 4 on the two sides of the translation frame 19, the magnetic strip 22 is embeddedly connected on the top of the stable plate 4 on the two sides and is magnetically connected with the magnetic sheet 21, the magnetic attraction positioning work between the translated reference frame 18 and the stable plate 4 can be realized by the translation frame 19, and the positioning convenience of the reference frame 18 is improved.
[0035] Specifically, the working process or working principle of the semiconductor frame welding device is as follows: in use, the semiconductor frame to be stably welded is placed on the top of the welding table 1 and the bottom of the stabilizing plate 4, and the semiconductor frame is moved to contact the reference frame 18, so that the semiconductor frame is horizontally placed, and then the semiconductor frame is moved to position the semiconductor frame to be welded at the bottom of the operation port 5; at this time, the reference frame 18 moves with the semiconductor frame to continuously provide a horizontal placement medium for the semiconductor frame, and the translation frame 19 moves in the reference port 17 with the reference frame 18 through the translation port 20 to perform translation connection work between the reference frame 18 and the stabilizing plate 4, and then the magnetic sheet 21 cooperates with the magnetic strip 22 to magnetically attract and stabilize the translated reference frame 18; subsequently, the handheld stabilizing plate 4 is moved downward to contact the top of the semiconductor frame, so that the stabilizing plate 4 cooperates with the welding table 1 to clamp and stabilize the semiconductor frame on the top of the welding table 1; at this time, the lifting column 7 moves in the lifting groove 6 with the stabilizing plate 4 to perform moving force stabilization connection work between the stabilizing plate 4 and the welding table 1, and the spring 14 is contracted under the influence of the downward movement of the lifting column 7 to prepare for subsequent upward separation of the lifting column 7 and the stabilizing plate 4; at this time, the sliding block 16 moves to the bottom of the sliding slot 15 with the lifting column 7 to perform upward sliding limiting device for the lifting column 7 and the stabilizing plate 4; when the stabilizing plate 4 is used for the first time, the handheld force applying plate 10 is flipped inward to the top of the stabilizing plate 4; at this time, the connecting frame 12 cooperates with the connecting hole 11 to perform rotating connection work between the force applying plate 10 and the stud 9, and then the connecting frame 12 rotates the screw rod to cooperate with the screw groove 8 to drive the force applying plate 10 to move downward, so that the bottom of the force applying plate 10 contacts and abuts against the top of the stabilizing plate 4 to apply downward abutting force to the stabilizing plate 4, thereby promoting the stabilizing plate 4 to stably clamp and stabilize the semiconductor frame; then, the worker can use the welding pen 3 to cooperate with the controller 2 to stably weld the semiconductor frame through the operation port 5; if the semiconductor frame to be welded is of the same batch, the handheld force applying plate 10 is flipped to separate from the stabilizing plate 4; at this time, the spring 14 applies upward reset thrust to the lifting seat and the stabilizing plate 4 to separate the stabilizing plate 4 from the semiconductor frame, so that the welded semiconductor frame can be taken out; if the semiconductor frame to be welded is of different batches, the force applying plate 10 is lifted by rotating the stud 9 to adjust the force applying position of the stabilizing plate 4.
[0036] It should be noted that the controller 2 and the welding pen 3 are devices or equipment existing in the prior art, or devices or equipment that can be realized in the prior art, and their power supply, specific components and principles are clear to those skilled in the art, so they will not be described in detail.
Claims
1. A semiconductor frame welding device, comprising a welding table (1), a controller (2) is mounted on the right side inside the welding table (1), a welding pen (3) electrically connected with the controller (2) is mounted on the right side of the front side of the welding table (1), characterized in that ； The utility model relates to a welding stabilizing mechanism, which comprises the following parts: A stabilizing plate (4) is movably connected to the top of a welding table (1), and an operation opening (5) is formed in the top of the stabilizing plate (4); Lifting grooves (6) are formed on both sides of the top of the welding table (1), and lifting columns (7) are fixedly connected to the inside of the lifting grooves (6) on both sides of the stabilizing plate (4); A stabilizing force applying mechanism is arranged on both sides of the top of the welding table (1).
2. The semiconductor frame welding apparatus of claim 1, wherein The stabilizing force applying mechanism comprises screw grooves (8), screw columns (9) and force applying plates (10), the screw grooves (8) are formed on both sides of the top of the welding table (1), the screw columns (9) are threadedly connected to the inside of the screw grooves (8), and the force applying plates (10) are movably connected to the top of the screw columns (9).
3. A semiconductor frame welding apparatus according to claim 2, wherein A connecting hole (11) is formed in the outer side of the top of the force applying plate (10), a connecting frame (12) is movably connected to the inside of the connecting hole (11), and the bottom of the connecting frame (12) is fixedly connected to the top of the screw column (9).
4. The semiconductor frame welding apparatus of claim 1, wherein A pushing groove (13) is formed in the bottom of the lifting column (7), a spring (14) is arranged in the inside of the pushing groove (13), one end of the spring (14) is connected to the inner wall of the pushing groove (13), and the other end of the spring (14) is connected to the inner wall of the lifting groove (6).
5. The apparatus of claim 1, wherein the apparatus is a semiconductor frame welding apparatus. A sliding groove (15) is formed in the outer side of the inner wall of the lifting groove (6), a sliding block (16) is movably connected to the inside of the sliding groove (15), and the inner side of the sliding block (16) is fixedly connected to the outer side of the lifting column (7).
6. The semiconductor frame welding apparatus of claim 1, wherein A reference opening (17) is formed in the back of the top of the stabilizing plate (4), a reference frame (18) is movably connected to the front of the inside of the reference opening (17), and the bottom of the reference frame (18) is in contact with the top of the welding table (1).
7. A semiconductor frame welding apparatus according to claim 6, wherein A translation frame (19) is movably connected to the front of the inside of the reference opening (17), a translation opening (20) is formed in the top of the translation frame (19), and the reference frame (18) is in the inside of the translation opening (20).
8. A semiconductor frame welding apparatus according to claim 7, wherein Magnetic sheets (21) are embeddedly connected to both sides of the top of the stabilizing plate (4), and magnetic strips (22) that are magnetically connected to the magnetic sheets (21) are embeddedly connected to both sides of the top of the stabilizing plate (4).