Grinding and polishing device for curved-surface backboard mold
By introducing buffer pads and suction cups into the polishing device for curved back plate molds, the problem of uneven wear and deformation caused by the complexity of the curved surface during the polishing process is solved, achieving higher polishing precision and stability.
Patent Information
- Application Number
- CN202520023739.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-06
AI Technical Summary
During the grinding and polishing process, the complex curved shape of the curved back plate mold leads to excessive wear in some areas and uneven surface quality. It is also prone to deformation or damage due to uneven stress.
The system employs a structure including a worktable, polishing machine, positioning components, and a liquid storage tank. It provides stable support and positioning through buffer pads and suction cups, and utilizes coolant for heat dissipation and a dust collector to remove dust, reducing the impact of friction and heat and ensuring the stability and consistency of the polishing process.
It effectively reduces mold deformation and damage, improves polishing accuracy and uniformity, ensures stable positioning and precise polishing of complex curved surface molds, and reduces dust damage to the mold surface.
Smart Images
Figure CN223734547U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of backplate mold processing technology, and in particular to a grinding and polishing device for curved backplate molds. Background Technology
[0002] A curved backplate mold is a tool specifically designed for producing curved backplates. The main function of a curved backplate mold is to process raw materials into backplates with specific curved shapes.
[0003] Curved backplate molds typically consist of components such as a mold base, fixed support plate, arc-shaped metal plate, connecting block, and connecting plate. During the production process of curved backplates, they need to be ground and polished to remove burrs, scratches, and oxide layers from the mold surface, thereby increasing the mold's precision and stability. The grinding and polishing of curved backplate molds usually consists of a machine tool body, grinding head, and control system. Through the movement and control adjustment of the machine tool body, the grinding wheel performs fine processing on the mold surface.
[0004] During the grinding and polishing process of curved back plate molds, the molds are usually fixed in a designated position for grinding and polishing. Due to the complex and constantly changing curved shape of the mold, the grinding and polishing tools are prone to excessive pressure in some areas when they come into contact with the mold, which can lead to excessive wear of the mold or uneven surface quality. Utility Model Content
[0005] This utility model addresses the shortcomings of existing technologies by providing the following technical solution:
[0006] As an improvement to the above technical solution, a workbench is included. A moving module is installed on the top of the workbench, and a polishing machine is installed in the middle of the moving module. A base is fixed to the top of the workbench, and multiple support rods are fixed to the middle of the base. The multiple support rods are located in the middle of the base, and a first spring is fixed to the middle of the support rod. A sliding rod is fixed to the end of the first spring and is slidably connected in the middle of the support rod. A buffer pad is fixed to the end of the sliding rod. A positioning component is installed in the middle of the base. Through the above structure, adjustments can be made according to the shape of the mold, so that the mold maintains a stable posture during the polishing process. It can provide additional support force during the polishing process, effectively reducing the deformation or damage of the mold due to uneven force. It can better adapt to the contour of the mold when processing molds with complex curved surfaces, so that the polishing effect is consistent and uniform, and reduces the pressure and friction generated by the polishing tool on the mold, achieving better dispersion and absorption.
[0007] As an improvement to the above technical solution, the positioning component includes a pneumatic device, which is disposed on the side wall of the base. A connecting pipe is fixedly connected to the middle of the pneumatic device, and an air pipe is fixedly connected to the end of the connecting pipe. The air pipe is U-shaped and penetrates the bottom of the base. Multiple piston tubes are fixedly connected to the middle of the air pipe and penetrate the bottom of the base. A sleeve is slidably connected to the middle of the piston tube, and a piston plate is slidably connected to the middle of the sleeve. The piston plate is fixedly connected to the end of the piston tube, and a second spring is fixedly connected to the top of the piston plate. The end of the second spring is fixedly connected to the top of the sleeve, and a suction cup is fixedly connected to the top of the sleeve. A through hole is opened at the top of the sleeve and the middle of the suction cup. The above structure can generate a strong suction force on the mold, effectively realize the fixation and positioning of the mold, keep the mold stable during the polishing process, reduce the polishing error caused by the vibration or displacement of the mold during the polishing process, and provide stable support and positioning for molds with complex curved surfaces, thereby improving the polishing accuracy of curved back plate molds.
[0008] As an improvement to the above technical solution, a liquid storage tank is fixedly connected to the side wall of the base. The liquid storage tank has an inlet at the top and a water pump is fixedly connected to the top. An inlet pipe is fixedly connected to the middle of the water pump, and the end of the inlet pipe passes through the top of the liquid storage tank. A drain pipe is fixedly connected to the middle of the water pump, and an outlet pipe is fixedly connected to the end of the drain pipe. The outlet pipe is fixedly connected to the top of the base, and several nozzles are fixedly connected to the middle of the outlet pipe. Through the above structure, a large amount of heat is generated by the friction between the mold and the polishing tool during the polishing process. The heat can be dissipated in time to reduce the deformation of the mold due to thermal expansion and contraction, thereby reducing the decrease in precision and performance during the mold polishing process. In addition, the coolant can wash away the small particles and impurities on the surface of the mold, reducing the scratches or dents formed by particles on the surface of the mold.
[0009] As an improvement to the above technical solution, the polishing machine is equipped with a dust collector in the middle, and a dust suction pipe is fixedly connected to the middle of the dust collector. An annular pipe is fixedly connected to the end of the dust suction pipe, and a chip suction groove is opened in the middle of the annular pipe. Through the above structure, the dust and fine particles generated by the mold during the polishing process can be sucked away in time, which can reduce the dust concentration in the polishing area of the mold and effectively reduce the dust particles remaining on the mold surface, thus preventing scratches or damage to the mold surface during the polishing process.
[0010] As an improvement to the above technical solution, a guide plate is fixedly connected to the middle of the chip suction groove. The guide plate is flared and flexible. The above structure can effectively reduce the splashing of chips generated by the polishing head during the polishing process of the mold, reduce the splashing of chips into the external environment, and effectively reduce the impact force of the chip splashing on the surface of the equipment, thereby reducing wear and damage to the equipment.
[0011] As an improvement to the above technical solution, a filter screen is installed in the middle of the nozzle and fixed to the end of the nozzle. The above structure can effectively reduce the amount of debris splashed into the nozzle during the polishing process, reduce the amount of debris entering the water pump, reduce the blockage caused by debris accumulation inside the nozzle, and effectively reduce the amount of debris entering the liquid outlet pipe, which can cause scratches and wear on the inner wall.
[0012] The beneficial effects of this utility model are: it can be adjusted according to the shape of the mold, so that the mold can always maintain a stable posture during the polishing process, it can provide additional support during the polishing process, effectively reduce the deformation or damage of the mold due to uneven force, it can better adapt to the contour of the mold when processing molds with complex curved surfaces, so that the polishing effect is consistent and uniform, and reduce the pressure and friction generated by the polishing tool on the mold, which can be better dispersed and absorbed. Attached Figure Description
[0013] Figure 1 This is a perspective view of the present invention;
[0014] Figure 2 This is a schematic diagram of the structure of the buffer pad in this utility model;
[0015] Figure 3 This is a schematic diagram of the positioning component in this utility model;
[0016] Figure 4 This is a schematic diagram of the annular tube in this utility model.
[0017] Reference numerals: 1. Workbench; 10. Moving module; 11. Polishing machine; 12. Base; 13. Support rod; 14. First spring; 15. Slide rod; 16. Buffer pad; 2. Positioning assembly; 21. Pneumatic equipment; 22. Connecting pipe; 23. Air pipe; 24. Piston pipe; 25. Sleeve; 26. Piston plate; 27. Second spring; 28. Through hole; 29. Suction cup; 3. Liquid storage tank; 31. Liquid inlet; 32. Water pump; 33. Liquid inlet pipe; 34. Liquid outlet pipe; 35. Liquid outlet pipe; 36. Nozzle; 4. Dust collector; 41. Dust suction pipe; 42. Annular pipe; 43. Chip suction trough; 5. Guide plate; 6. Filter screen; 7. Elastic cloth. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the following provides a more detailed description of the utility model. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.
[0019] Please see Figures 1 to 3This utility model provides a technical solution: a polishing device for curved back plate molds, including a worktable 1, a movable module 10 installed on the top of the worktable 1, a polishing machine 11 installed in the middle of the movable module 10, a base 12 fixed to the top of the worktable 1, a plurality of support rods 13 fixed to the middle of the base 12, a first spring 14 fixed to the middle of the support rods 13, a slide rod 15 fixed to the end of the first spring 14, the slide rod 15 slidingly connected in the middle of the support rods 13, a buffer pad 16 fixed to the end of the slide rod 15, and a positioning component 2 installed in the middle of the base 12. During operation, the mold is placed in the middle of the base 12, and the bottom of the mold first contacts the buffer pads 16. The weight of the mold itself applies pressure to the buffer pads 16. At this time, the slide rod 15 slides downward in the middle of the support rods 13, the first spring 14 elastically contracts, and the buffer pads 16 contract with the shape of the mold, pressing against the bottom of the mold. This is achieved through positioning... Component 2 positions the mold, keeping it in the designated position. After the polishing machine 11 is powered on, it is turned on. The control system moves the polishing machine 11 left and right in the middle of the moving module 10, while the moving module 10 moves back and forth. The polishing head at the end of the polishing machine 11 moves to the mold surface and rotates at high speed to polish it. When the contact force of the polishing head on the mold surface is too large, the buffer pad 16 at the bottom of the mold retracts into the support rod 13 through the slide rod 15, thereby adjusting the contact force between the polishing head and the mold surface. The above structure can be adjusted according to the shape of the mold, so that the mold can always maintain a stable posture during the polishing process. It can provide additional support force during the polishing process, effectively reducing the deformation or damage of the mold due to uneven force. It can better adapt to the contour of the mold when dealing with molds with complex curved surfaces, so that the polishing effect is consistent and uniform, and reduces the pressure and friction generated by the polishing tool on the mold, which can be better dispersed and absorbed.
[0020] In this implementation plan, such as Figures 1 to 3 As shown, the positioning component 2 includes a pneumatic device 21, which is disposed on the side wall of the base 12. A connecting pipe 22 is fixedly connected to the middle of the pneumatic device 21, and an air pipe 23 is fixedly connected to the end of the connecting pipe 22. The air pipe 23 is U-shaped and penetrates the bottom of the base 12. Multiple piston pipes 24 are fixedly connected to the middle of the air pipe 23 and penetrate the bottom of the base 12. A sleeve 25 is slidably connected to the middle of the piston pipe 24, and a piston plate 26 is slidably connected to the middle of the sleeve 25. The piston plate 26 is fixedly connected to the end of the piston pipe 24, and a second spring 27 is fixedly connected to the top of the piston plate 26. The end of the second spring 27 is fixedly connected to the top of the sleeve 25. A suction cup 29 is fixedly connected to the top of the sleeve 25, and a through hole 28 is opened between the top of the sleeve 25 and the middle of the suction cup 29.
[0021] Specifically, during operation, when the mold is placed on top of multiple buffer pads 16, multiple suction cups 29 simultaneously contact the bottom of the mold. Under the pressure of the mold, the sleeve 25 moves downward, causing the piston plate 26 to move upward in the middle of the sleeve 25. At the same time, the second spring 27 elastically contracts, controlling the pneumatic device 21 to start. The pneumatic device 21 extracts the airflow inside the connecting pipe 22. At this time, the air between the suction cup 29 and the mold enters the piston tube 24 through the through hole 28, and then enters the connecting pipe 22 through the air pipe 23. The suction cup 29 tightly holds the mold, thereby positioning the mold during polishing. After the mold is polished, the pneumatic device 21 is turned off, and the suction cup 29 releases the mold. After the mold is removed, the second spring 27 moves the sleeve 25 upward to reset. The above structure can generate a strong suction force on the mold, effectively fixing and positioning the mold, keeping the mold stable during polishing, reducing polishing errors caused by vibration or displacement of the mold during polishing, and providing stable support and positioning for molds with complex curved surfaces, thereby improving the polishing accuracy of curved back plate molds.
[0022] In this embodiment, as Figures 1 to 3 As shown, a liquid storage tank 3 is fixedly connected to the side wall of the base 12. An inlet 31 is provided at the top of the liquid storage tank 3. A water pump 32 is fixedly connected to the top of the liquid storage tank 3. An inlet pipe 33 is fixedly connected to the middle of the water pump 32, with its end penetrating the top of the liquid storage tank 3. A drain pipe 34 is fixedly connected to the middle of the water pump 32, with an outlet pipe 35 fixedly connected to its end. The outlet pipe 35 is fixedly connected to the top of the base 12, and several nozzles 36 are fixedly connected to its middle.
[0023] Specifically, during operation, coolant is placed inside the storage tank 3 through the inlet 31. During the polishing process of the mold, the water pump 32 is powered on and turned on, and the coolant inside the storage tank 3 is discharged into the drain pipe 34 through the inlet pipe 33. After passing through the drain pipe 34, it enters the outlet pipe 35 and is discharged to the mold polishing position through multiple nozzles 36. Through the above structure, a large amount of heat is generated by the friction between the mold and the polishing tool during the polishing process. The heat can be dissipated in time to reduce the deformation of the mold due to thermal expansion and contraction, thereby reducing the decrease in precision and performance during the mold polishing process. In addition, the coolant can wash away the small particles and impurities on the mold surface, reducing the formation of scratches or dents on the mold surface by particles.
[0024] In this embodiment, as Figure 1 and Figure 4 As shown, a dust collector 4 is provided in the middle of the polishing machine 11. A dust suction pipe 41 is fixedly connected to the middle of the dust collector 4. An annular pipe 42 is fixedly connected to the end of the dust suction pipe 41. A chip suction groove 43 is opened in the middle of the annular pipe 42.
[0025] Specifically, during operation, when the mold is polished, the dust collector 4 is powered on and turned on. The dust collector 4 moves with the polishing machine 11. The suction pipe 41 is telescopic. When the polishing head moves downward, the suction pipe 41 is elastically stretched at the same time. The annular pipe 42 is set on the top of the polishing head. When the polishing head polishes the mold, the debris is splashed with the polishing head. The negative pressure airflow generated by the dust collector 4 causes the debris to pass through the debris suction groove 43 and enter the middle of the annular pipe 42. After passing through the negative pressure airflow, the debris enters the dust collector 4 through the suction pipe 41 and is collected inside the dust collector 4. The above structure can timely remove the dust and small particles generated by the mold during the polishing process, reduce the dust concentration in the mold polishing area, and effectively reduce the dust particles remaining on the mold surface, which can cause scratches or damage to the mold surface during the polishing process.
[0026] In this embodiment, as Figure 1 and Figure 4 As shown, a guide plate 5 is fixedly connected to the middle of the chip suction groove 43. The guide plate 5 is flared and flexible.
[0027] Specifically, during operation, when the mold is being polished, the debris is blocked by the guide plate 5 during the splashing process, allowing the debris to accurately enter the annular tube 42. When the polishing head contacts the mold, the guide plate 5 flexibly bends due to its curved surface. This structure effectively reduces the splashing of debris generated during the polishing process, reduces the amount of debris splashed into the external environment, and effectively reduces the impact force of the debris splashing on the equipment surface, thus reducing wear and damage to the equipment.
[0028] In this embodiment, as Figure 2 As shown, a filter screen 6 is installed in the middle of the nozzle 36, and the filter screen 6 is fixed to the end of the nozzle 36.
[0029] Specifically, during operation, when the mold is being polished, the filter screen 6 intercepts the debris and blocks it outside the nozzle 36. This structure effectively reduces the amount of debris splashing into the nozzle 36 during the polishing process, reduces the amount of debris entering the water pump 32, reduces the blockage caused by debris accumulation inside the nozzle 36, and effectively reduces the amount of debris entering the liquid outlet pipe 35, which can cause scratches and wear on the inner wall.
[0030] In this embodiment, as Figure 2 and Figure 3 As shown, an elastic cloth 7 is fixed to the top of the support rod 13, and the end of the elastic cloth 7 is fixed to the bottom of the buffer pad 16.
[0031] Specifically, during operation, when the slide bar 15 extends and retracts inside the support rod 13, the elastic cloth 7 contracts simultaneously with the slide bar 15. This structure reduces the amount of polishing debris entering the gap between the slide bar 15 and the support rod 13 during the mold polishing process, effectively reducing the blockage caused by debris entering the interior of the slide bar 15 and the support rod 13.
[0032] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A curved backplane mold polishing device, comprising a workbench (1), characterized in that: The top of the workbench (1) is provided with a moving module (10), the middle of the moving module (10) is provided with a polishing machine (11), the top of the workbench (1) is fixedly connected with a base (12), the middle of the base (12) is fixedly connected with a plurality of supporting rods (13), a plurality of supporting rods (13) are arranged in the middle of the base (12), the middle of the supporting rod (13) is fixedly connected with a first spring (14), the end of the first spring (14) is fixedly connected with a sliding rod (15), the sliding rod (15) is slidingly connected in the middle of the supporting rod (13), the end of the sliding rod (15) is fixedly connected with a buffer pad (16), and the middle of the base (12) is provided with a positioning assembly (2).
2. The device according to claim 1, wherein: The positioning assembly (2) comprises a pneumatic device (21), the pneumatic device (21) is arranged on the side wall of the base (12), the middle of the pneumatic device (21) is fixedly connected with a connecting pipe (22), the end of the connecting pipe (22) is fixedly connected with an air pipe (23), the air pipe (23) is arranged in a U shape, the middle of the air pipe (23) penetrates the bottom of the base (12), the middle of the air pipe (23) is fixedly connected with a plurality of piston pipes (24), the middle of the piston pipe (24) penetrates the bottom of the base (12), the middle of the piston pipe (24) is slidingly connected with a sleeve (25), the middle of the sleeve (25) is slidingly connected with a piston plate (26), the piston plate (26) is fixedly connected with the end of the piston pipe (24), the top of the piston plate (26) is fixedly connected with a second spring (27), the end of the second spring (27) is fixedly connected with the top of the sleeve (25), the top of the sleeve (25) is fixedly connected with a suction disc (29), and the top of the sleeve (25) and the middle of the suction disc (29) are provided with a through hole (28).
3. The apparatus of claim 1, wherein: The side wall of the base (12) is fixedly connected with a liquid storage tank (3), the top of the liquid storage tank (3) is provided with a liquid inlet (31), the top of the liquid storage tank (3) is fixedly connected with a water pump (32), the middle of the water pump (32) is fixedly connected with a liquid inlet pipe (33), the end of the liquid inlet pipe (33) penetrates the top of the liquid storage tank (3), the middle of the water pump (32) is fixedly connected with a liquid outlet pipe (34), the end of the liquid outlet pipe (34) is fixedly connected with a liquid outlet pipe (35), the liquid outlet pipe (35) is fixedly connected with the top of the base (12), and a plurality of spray heads (36) are fixedly connected with the middle of the liquid outlet pipe (35).
4. The apparatus of claim 1, wherein: The middle of the polishing machine (11) is provided with a dust extractor (4), the middle of the dust extractor (4) is fixedly connected with a dust suction pipe (41), the end of the dust suction pipe (41) is fixedly connected with a ring-shaped pipe (42), and the middle of the ring-shaped pipe (42) is provided with a chip suction groove (43).
5. A curved backplane mold polishing apparatus as claimed in claim 4, wherein: The middle of the chip suction groove (43) is fixedly connected with a guide plate (5), the guide plate (5) is arranged in a horn shape, and the guide plate (5) is flexible.
6. The apparatus of claim 3, wherein: The middle of the spray head (36) is provided with a filter screen (6), and the filter screen (6) is fixedly connected with the end of the spray head (36).
7. The apparatus of claim 1, wherein: The top of the supporting rod (13) is fixedly connected with an elastic cloth (7), and the end of the elastic cloth (7) is fixedly connected with the bottom of the buffer pad (16).