Die cutting device for processing and cutting circuit board substrate

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a die cutting device for processing and cutting a circuit board substrate, which comprises a bottom plate, a support plate is fixedly arranged on the bottom plate, an air cylinder is fixedly arranged on the support plate, the output end of the air cylinder penetrates through the upper end of the support plate and is fixedly connected with an upper die seat, and a die cutter is fixedly arranged at the bottom end of the upper die seat; a machining groove is formed in the lower die base, the lower die base is arranged on the mounting base through the connecting assembly and the auxiliary assembly, the mounting base is fixedly arranged on the bottom plate, and the side wall of the mounting base is connected with the supporting plate in a clamped mode. The mounting plate is moved along the mounting groove until the sliding block is clamped with the limiting plate, so that the movable plate is inserted into the position, where the mounting plate is fixed, in the inserting groove, the lower die base is conveniently rotated, and the circuit board substrates subjected to die cutting machining in the lower die base are poured into a collecting box at a time to complete centralized collection. And convenience is brought to an operator to collect the circuit board substrate, so that the processing efficiency of the circuit board substrate cutting plate is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board processing technical field, concretely is a die cutting device for circuit board substrate processing cutting. BACKGROUND

[0002] For the existing announcement number CN220922692U Chinese patent document discloses a kind of for flexible circuit board processing punching die, including base and mounting seat, the top side of the base is fixedly connected with support plate. Advantage lies in: when punching circuit board, start telescopic cylinder and push upper die holder, upper die holder makes cutter descend and processes the circuit board in the inside of groove and cuts, upper die holder can make upper die holder in the stable punching of the lifting of limit frame fixedly connected to the top, it is relatively easy to operate and save time and labour, by handle make rotating gear of rotating lever pull control rod, control rod makes positioning block shrink to the inside of sliding slot, lower die holder is pulled to the side of mounting seat, circuit board is placed in the inside of processing groove again and then lower die holder is pushed, spring will push positioning block and insert in positioning groove, lower die holder can be pulled out, it is relatively easy for staff to place or take out the circuit board in the processing groove and can avoid staff and cutter too close to affect staff safety.

[0003] But above-mentioned scheme and prior art, circuit board substrate die cutting processing, after lower die holder is pulled out from mounting seat, circuit board substrate is manually picked up and concentrated collection, it is inconvenient to operate and time-consuming, affect subsequent circuit board cutting board processing efficiency. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of die cutting device for circuit board substrate processing cutting to solve the problems raised in the above background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of die cutting device for circuit board substrate processing cutting includes:

[0006] The bottom plate is fixedly provided with a support plate, and the support plate is fixedly provided with an air cylinder. The output end of the air cylinder penetrates the upper end of the support plate and is fixedly connected with the upper die holder. The bottom end of the upper die holder is fixedly provided with a die cutter. A groove is opened in the bottom plate, and a collecting box is inserted into the groove.

[0007] The lower die holder is provided with a processing groove. The lower die holder is arranged on the mounting seat through a connecting assembly and an auxiliary assembly. The mounting seat is fixedly arranged on the bottom plate. The side wall of the mounting seat is clamped with the support plate.

[0008] Preferably, the mounting groove in the connecting assembly is arranged on the mounting seat. The side walls of the mounting groove are symmetrically provided with sliding grooves. The end of the sliding groove is fixedly provided with a limiting plate. The lower die holder is rotatably arranged on the mounting plate. The mounting plate is movably clamped with the mounting groove.

[0009] Preferably, symmetrically fixed sliding blocks are arranged on the two side walls of the mounting plate, the sliding blocks are movably connected in the sliding groove, and the sliding blocks are connected with the limiting plate.

[0010] Preferably, a straight groove is arranged on the mounting plate, a connecting plate is fixedly arranged at the bottom end of the lower die seat, the connecting plate is movably arranged in the straight groove, protruding plates are symmetrically fixedly arranged at the two ends of the connecting plate, and the protruding plates are movably connected with the sliding groove.

[0011] Preferably, a trapezoidal groove is arranged on the side wall of the mounting base in the auxiliary assembly, a trapezoidal block is movably connected in the trapezoidal groove, a moving plate is fixedly arranged on the side wall of the trapezoidal block, and the moving plate is connected with the mounting plate.

[0012] Preferably, a clamping groove is arranged on the moving plate, a rotating plate is rotatably arranged on the side wall of the mounting base, the rotating plate is connected with the clamping groove, and a slot is arranged on the side wall of the mounting plate, and the moving plate is inserted into the slot.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] By moving the mounting plate along the mounting groove until the sliding block is connected with the limiting plate, the moving plate is inserted into the slot to fix the position of the mounting plate, the lower die seat is conveniently rotated, the circuit board substrate processed by die cutting in the lower die seat is once poured into the collecting box to complete centralized collection, the operation is simple, the circuit board substrate is conveniently collected for the operator, and the circuit board substrate processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is a partial enlarged view in the utility model Figure 1 ;

[0017] Figure 3 It is a structural schematic diagram of the mounting base of the utility model;

[0018] Figure 4 It is a structural schematic diagram of the mounting plate of the utility model;

[0019] Figure 5 It is a structural schematic diagram of the moving plate of the utility model.

[0020] In the drawing: bottom plate 1, support plate 2, air cylinder 3, upper die seat 4, die cutting knife 5, recess 6, collecting box 7, lower die seat 8, processing groove 9, mounting base 10, mounting groove 11, sliding groove 12, limiting plate 13, mounting plate 14, sliding block 15, straight groove 16, connecting plate 17, protruding plate 18, trapezoidal groove 19, trapezoidal block 20, moving plate 21, slot 22, clamping groove 23, rotating plate 24. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme of the utility model carry out clearly, complete description, and the advantage is more clear and distinct, the following combining with the drawings to the utility model embodiment carries out further detailed explanation. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all embodiments, only to explain the embodiments of the utility model, and not for limiting the embodiments of the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor are within the scope of the utility model protection.

[0022] Please refer to Figures 1-5 The utility model provides the following two preferred scheme embodiments:

[0023] Embodiment one: a die cutting device for circuit board substrate processing cutting, it includes: bottom plate 1, it is fixedly arranged with support plate 2 on bottom plate 1, support plate 2 is fixedly arranged with pneumatic cylinder 3, pneumatic cylinder 3 output end penetrates support plate 2 upper end and is fixedly connected with upper mould base 4, upper mould base 4 bottom end is fixedly arranged with die cutter 5, recess 6 is opened in bottom plate 1, recess 6 is inserted with collecting box 7;Lower mould base 8, recess 9 is opened in lower mould base 8, lower mould base 8 is set on mounting seat 10 by connecting assembly and auxiliary assembly, mounting seat 10 is fixedly arranged on bottom plate 1, and mounting seat 10 side wall is clamped with support plate 2;The installation groove 11 in connecting assembly is opened in mounting seat 10, and the sliding slot 12 is opened symmetrically in the both sides wall of installation groove 11, and the end of sliding slot 12 is fixedly arranged with limiting plate 13, and lower mould base 8 is rotatably arranged on mounting plate 14, and mounting plate 14 is movably clamped with installation groove 11;The both sides wall of mounting plate 14 is fixedly arranged with sliding block 15 symmetrically, and sliding block 15 is movably clamped in sliding slot 12, and sliding block 15 is clamped with limiting plate 13;Straight slot 16 is opened in mounting plate 14, and connecting plate 17 is movably arranged in straight slot 16, and connecting plate 17 both ends are fixedly arranged with convex plate 18 symmetrically, and convex plate 18 is movably clamped with sliding slot 12.

[0024] In use, the circuit board substrate is placed in the processing groove 9, the cylinder 3 is started to push the upper die seat 4 to move downwards, the die cutting knife 5 is used for die cutting processing of the circuit board substrate, the lower die seat 8 and the mounting plate 14 are both fixedly provided with handrails on the side walls, so that the movement is controlled, after the circuit board substrate is processed, the collecting box 7 is positioned and inserted in the groove 6, the mounting plate 14 is moved along the mounting groove 11 until the sliding block 15 is clamped with the limiting plate 13, so that the position of the mounting plate 14 is fixed, at this time, the convex plate 18 slides out of the sliding groove 12, so that the lower die seat 8 is unlocked and rotated, the processed circuit board substrate in the processing groove 9 is poured into the collecting box 7, then the lower die seat 8 is reset to place the new circuit board substrate in the processing groove 9, the mounting plate 14 is moved along the mounting groove 11 until the mounting plate 14 is clamped with the supporting plate 2, so that the position is fixed, at this time, the convex plate 18 is clamped into the sliding groove 12 to avoid the rotation of the lower die seat 8, the operation is simple, the processed circuit board substrate can be poured into the collecting box 7 at one time to complete centralized collection, the convenience is brought to the operator, and the circuit board die cutting plate processing efficiency is improved.

[0025] In the embodiment one, the trapezoidal groove 19 in the auxiliary assembly is arranged on the side wall of the mounting seat 10, the trapezoidal block 20 is movably clamped in the trapezoidal groove 19, the moving plate 21 is fixedly arranged on the side wall of the trapezoidal block 20, and the moving plate 21 is clamped with the mounting plate 14.

[0026] In use, when the circuit board substrate is processed, the trapezoidal block 20 is moved along the trapezoidal groove 19 to clamp the moving plate 21 with the mounting plate 14, so that the mounting plate 14 is limited, then the rotating plate 24 is rotated to clamp into the clamping groove 23 to fix the position of the moving plate 21, and the position of the lower die seat 8 is fixed.

[0027] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the range of the utility model is defined by the appended claims and their equivalents.

Claims

1. A die cutting apparatus for processing and cutting of circuit board substrates, characterized by: Include: The bottom plate (1), the support plate (2) is fixedly arranged on the bottom plate (1), the cylinder (3) is fixedly arranged on the support plate (2), the output end of the cylinder (3) penetrates the upper end of the support plate (2) and is fixedly connected with the upper die seat (4), the die cutting knife (5) is fixedly arranged at the bottom end of the upper die seat (4), the recess (6) is arranged on the bottom plate (1), and the collecting box (7) is insertedly arranged in the recess (6); The lower die seat (8) is provided with a processing groove (9), and the lower die seat (8) is arranged on the mounting seat (10) through a connecting assembly and an auxiliary assembly, the mounting seat (10) is fixedly arranged on the bottom plate (1), and the side wall of the mounting seat (10) is clamped with the support plate (2).

2. The die cutting device for processing and cutting of a circuit board substrate according to claim 1, wherein: The mounting groove (11) in the connecting assembly is arranged on the mounting seat (10), the sliding grooves (12) are symmetrically arranged on the two side walls of the mounting groove (11), the limit plates (13) are fixedly arranged at the ends of the sliding grooves (12), the lower die seat (8) is rotatably arranged on the mounting plate (14), and the mounting plate (14) is movably clamped with the mounting groove (11).

3. The die cutting apparatus for processing and cutting of a circuit board substrate according to claim 2, wherein: The sliding blocks (15) are symmetrically fixedly arranged on the two side walls of the mounting plate (14), the sliding blocks (15) are movably clamped in the sliding grooves (12), and the sliding blocks (15) are clamped with the limit plates (13).

4. The die cutting apparatus for processing and cutting of a circuit board substrate according to claim 3, wherein: The straight groove (16) is arranged on the mounting plate (14), the connecting plate (17) is fixedly arranged at the bottom end of the lower die seat (8), the connecting plate (17) is movably arranged in the straight groove (16), the convex plates (18) are symmetrically fixedly arranged at the two ends of the connecting plate (17), and the convex plates (18) are movably clamped with the sliding grooves (12).

5. The die cutting device for cutting a circuit board substrate according to claim 1, wherein: The trapezoidal groove (19) in the auxiliary assembly is arranged on the side wall of the mounting seat (10), the trapezoidal block (20) is movably clamped in the trapezoidal groove (19), the side wall of the trapezoidal block (20) is fixedly provided with the moving plate (21), and the moving plate (21) is clamped with the mounting plate (14).

6. The die cutting apparatus for processing and cutting of a circuit board substrate according to claim 5, wherein: The clamping groove (23) is arranged on the moving plate (21), the rotating plate (24) is rotatably arranged on the side wall of the mounting seat (10), the rotating plate (24) is clamped with the clamping groove (23), the insertion groove (22) is arranged on the side wall of the mounting plate (14), and the moving plate (21) is insertedly arranged in the insertion groove (22).

Images