Double-shaft driving structure of full-automatic precision wafer cutting machine

Abstract

The utility model relates to a double-shaft driving structure of a full-automatic precise wafer cutting machine, which effectively solves the problems that the conventional detection mode is that the heights of two blades are detected in advance before cutting operation is started so as to judge whether the heights of the blades are consistent or not, but the conventional mode has obvious defects, and the working efficiency is low. The problems that whether the heights of the blades are the same or not cannot be accurately judged when the detection link is inaccurate or detection equipment breaks down suddenly, so that the heights of the two blades are inconsistent in the actual cutting process, finally the cutting precision is greatly reduced, and the product quality is influenced are solved. According to the double-shaft driving structure of the full-automatic precision wafer cutting machine, through mutual cooperation of the infrared receiver and the infrared transmitter, the height difference between the two cutting knives can be detected in time, then it is guaranteed that the height between the two cutting knives is accurate, and the position of the positioning block can be adjusted on the outer surface of the guide frame.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to the dual-axis drive structure of a fully automatic precision wafer dicing machine. Background Technology

[0002] Fully automatic precision dicing machines are specialized equipment for precision cutting. Before cutting, they typically cut thin circular slices with an outer diameter of 6 to 12 inches into different sizes of grains according to the user's different needs. The abrasive wheel cutting process, also known as dicing or scribing, uses high-power grinding. An electric spindle supported by air static pressure drives an ultra-thin diamond blade to rotate at high speed. The fine abrasive grains on the blade come into contact with the workpiece, causing the material at the dicing point to break. At the same time, the worktable carrying the workpiece moves linearly at a certain speed along the contact direction between the blade and the workpiece. Then, under the rotation of the blade itself and the action of the cutting water, the dicing eyebrow is carried out, ultimately achieving workpiece separation or grooving.

[0003] In dual-spindle cutting operations, cutting accuracy is a key factor in ensuring product quality. However, in actual operation, the height difference between the two blades often has a serious impact on the precision of the cutting. Since the blade height is fixed, the height relationship between the two cutting blade mounts is particularly important.

[0004] Currently, the traditional inspection method involves pre-checking the height of the two blades before the cutting operation begins to determine whether the blade heights are consistent. However, this method has obvious drawbacks. When the inspection process is inaccurate or the inspection equipment malfunctions, it is impossible to accurately determine whether the blade heights are the same. This results in the two blades having inconsistent heights during actual cutting, ultimately leading to a significant reduction in cutting accuracy and affecting product quality. Utility Model Content

[0005] To address the above issues and overcome the shortcomings of existing technologies, this utility model provides a dual-axis drive structure for a fully automatic precision wafer dicing machine. This dual-axis drive structure, through the cooperation of an infrared receiver and an infrared transmitter, can detect the height difference between the two dicing blades in a timely manner, thereby ensuring the accuracy of the height between the two dicing blades. The positioning block can be adjusted on the outer surface of the guide frame, thereby enabling the detection of multiple positions of the dicing blades and further improving the relative accuracy between the dicing blades.

[0006] The fully automatic precision wafer dicing machine features a dual-axis drive structure, comprising two tool holders. Each tool holder's output end is connected to a dicing blade. Guide frames are fitted onto the outer surfaces of both tool holders. Positioning blocks are slidably connected to the inner walls of the guide frames. Support seats are fixedly connected to both sides of the outer surface of each positioning block. A threaded rod is connected to the inner wall of one of the support seats via a bearing. An adjusting seat is threaded onto the outer surface of the threaded rod. A fixing plate is fixedly connected to the end of the adjusting seat. An infrared transmitter is bolted to the outer surface of the fixing plate on one of the guide frames, and an infrared receiver is bolted to the outer surface of the fixing plate on the other guide frame.

[0007] Preferably, guide grooves are provided on both sides of the outer surfaces of the two guide frames, and a sliding groove adapted to the guide groove is provided on the outer surface of the positioning block. The inner wall of the sliding groove is slidably connected to the inner wall of the guide groove.

[0008] Preferably, drive wheels are fixedly installed on the top and bottom of the positioning block, and a first motor is fixedly installed on the outer surface of the drive wheels.

[0009] Preferably, the output end of the first motor is connected to the end of the drive wheel via a key, and the outer surface of the drive wheel is in contact with the outer surface of the guide frame.

[0010] Preferably, a second motor is fixedly mounted on one end of one of the support bases, and the output end of the second motor is connected to the end of the threaded rod by a key.

[0011] Preferably, a guide rod is fixedly connected to the inner wall of another support seat, the middle part of the outer surface of the adjustment seat is slidably connected to the outer surface of the guide rod, and a limit rod is threadedly connected to one end of the guide rod that protrudes from the adjustment seat.

[0012] The beneficial effects of the above technical solution are as follows:

[0013] (1) The dual-axis drive structure of the fully automatic precision wafer dicing machine, through the combination of infrared transmitter and infrared receiver, can determine the height position of the two dicing blades by emitting and receiving light at different positions, and the position of the fixing plate can be adjusted according to the different diameters of the dicing blades, so as to be suitable for different detection needs.

[0014] (2) The dual-axis drive structure of the fully automatic precision wafer dicing machine, through the cooperation of the guide frame and the positioning block, can adjust the position of the positioning block to different degrees, and then move the infrared transmitter and infrared receiver to the appropriate position according to different detection requirements, further improving the applicability of the device, and different positions can also detect the position consistency between the two dicing blades from different positions. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall installation structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the positioning block installation structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the exploded structure of the positioning block of this utility model;

[0018] Figure 4 This is a schematic diagram of the installation structure of the infrared transmitter of this utility model.

[0019] In the diagram: 1. Tool holder; 2. Cutting blade; 3. Guide frame; 4. Guide groove; 5. Positioning block; 6. Slide groove; 7. Drive wheel; 8. First motor; 9. Support seat; 10. Threaded rod; 11. Guide rod; 12. Second motor; 13. Adjusting seat; 14. Limiting rod; 15. Fixing plate; 16. Infrared transmitter; 17. Infrared receiver. Detailed Implementation

[0020] The foregoing and other technical contents, features and effects of this utility model are described in conjunction with the appendix below. Figures 1 to 4 The embodiments are described in detail below.

[0021] This embodiment provides a dual-axis drive structure for a fully automatic precision wafer dicing machine, as shown in the attached figure. It includes two tool holders 1, each with a dicing blade 2 connected to its output end. Guide frames 3 are fitted onto the outer surfaces of both tool holders 1. Positioning blocks 5 are slidably connected to the inner walls of the guide frames 3. Guide grooves 4 are formed on both sides of the outer surfaces of the two guide frames 3. Sliding grooves 6, matching the guide grooves 4, are formed on the outer surface of the positioning blocks 5. The inner walls of the sliding grooves 6 and guide grooves 4 are slidably connected. The tool holders 1 serve as the power transmission unit for the dicing blades 2. The output end of the component is connected to the dicing blade 2, providing rotational power to the dicing blade 2, enabling it to rotate at high speed and perform dicing operations on the wafer. As the component that directly acts on the wafer, the dicing blade 2, under high-speed rotation, utilizes the fine abrasive particles on its blade to contact the wafer, causing the material at the dicing point to break up, achieving wafer separation or grooving. It is the core execution component for completing the dicing task. The guide frame 3 is sleeved on the outer surface of the blade holder 1, and its inner wall is slidably connected to the positioning block 5, providing guidance for the movement of the positioning block 5. Meanwhile, the guide groove 4 on the guide frame 3 cooperates with the sliding groove 6 of the positioning block 5 to ensure the stability and accuracy of the positioning block 5 during movement, enabling the positioning block 5 to move along a predetermined trajectory, thereby meeting the detection requirements of different positions. The guide groove 4 limits the movement direction of the positioning block 5, so that the positioning block 5 can only slide along the direction of the guide groove 4 on the guide frame 3, ensuring that the positioning block 5 will not deviate during movement and ensuring the accuracy of detection. The positioning block 5 can slide on the inner wall of the guide frame 3. The drive wheel 7 and the first motor 8 installed at its top and bottom can drive the positioning block 5 to move on the guide frame 3. Through the movement of the positioning block 5, the infrared transmitter 16 and infrared receiver 17 installed on the support seats 9 on both sides of its outer surface can be moved to different positions to detect multiple positions of the cutting blade 2, thereby improving the relative accuracy between the cutting blades 2. The existence of the sliding groove 6 allows the positioning block 5 to move smoothly along the direction of the guide groove 4, and also provides a certain degree of freedom for the movement of the positioning block 5, so that it can flexibly adjust its position according to the detection requirements.

[0022] A drive wheel 7 is fixedly installed on both the top and bottom of the positioning block 5. A first motor 8 is fixedly installed on the outer surface of the drive wheel 7. The output end of the first motor 8 is connected to the end of the drive wheel 7 via a key. The outer surface of the drive wheel 7 contacts the outer surface of the guide frame 3. Driven by the first motor 8, the drive wheel 7 rotates, causing the positioning block 5 to move on the guide frame 3. The drive wheel 7 provides a power transmission method for the movement of the positioning block 5, enabling the positioning block 5 to be easily and quickly adjusted on the guide frame 3. The output end of the first motor 8 is connected to the end of the drive wheel 7 via a key, providing rotational power to the drive wheel 7. By controlling the start, stop, and speed of the first motor 8, the rotation of the drive wheel 7 can be precisely controlled, thereby achieving precise control of the moving speed and position of the positioning block 5, meeting the needs of position adjustment of the positioning block 5 in different detection scenarios.

[0023] Both sides of the outer surface of the positioning block 5 are fixedly connected to support seats 9. The inner wall of one support seat 9 is connected to a threaded rod 10 via a bearing. A second motor 12 is fixedly installed at one end of one support seat 9. The output end of the second motor 12 is connected to the end of the threaded rod 10 via a key. An adjusting seat 13 is threadedly connected to the outer surface of the threaded rod 10. A guide rod 11 is fixedly connected to the inner wall of the other support seat 9. The middle part of the outer surface of the adjusting seat 13 is slidably connected to the outer surface of the guide rod 11. A limit rod 14 is threadedly connected to one end of the guide rod 11 that protrudes from the adjusting seat 13. The support base 9 is fixedly connected to both sides of the outer surface of the positioning block 5, and is used to support and install components such as the threaded rod 10, guide rod 11, adjusting seat 13, fixing plate 15, infrared transmitter 16, and infrared receiver 17. The support base 9 provides a stable mounting foundation for these components, ensuring that they can function properly during operation. Driven by the second motor 12, the threaded rod 10 rotates, causing the adjusting seat 13 to move along the axial direction of the threaded rod 10. The function of the threaded rod 10 is to convert the rotational motion of the second motor 12 into the linear motion of the adjusting seat 13. This allows for precise adjustment of the position of the fixed plate 15 to meet the detection requirements of cutting blades 2 with different diameters. The guide rod 11 provides guidance for the movement of the adjusting seat 13, preventing it from rotating or shifting during movement and ensuring that the adjusting seat 13 can move smoothly along the axial direction of the threaded rod 10, making the position adjustment of the fixed plate 15 more accurate. The second motor 12 provides power for the rotation of the threaded rod 10. By controlling the forward and reverse rotation and speed of the second motor 12, the rotation direction and speed of the threaded rod 10 can be precisely controlled, thereby achieving precise adjustment of the position of the adjusting seat 15. Precise position control of the 3 positions meets the requirements for adjusting the position of the fixed plate 15 under different detection needs. Driven by the threaded rod 10, the adjusting seat 13 moves along the axial direction of the threaded rod 10, thereby driving the fixed plate 15 to move, realizing the adjustment of the position of the infrared transmitter 16 and the infrared receiver 17 to adapt to the detection needs of cutting blades 2 with different diameters. The function of the limiting rod 14 is to limit the movement range of the adjusting seat 13 on the guide rod 11, prevent the adjusting seat 13 from falling off the guide rod 11, and ensure the safety and stability of the adjusting seat 13 during the movement process.

[0024] An adjusting base 13 is fixedly connected to a fixing plate 15 at its end. An infrared transmitter 16 is bolted to the outer surface of the fixing plate 15 on one guide frame 3, and an infrared receiver 17 is bolted to the outer surface of the fixing plate 15 on the other guide frame 3. The fixing plate 15 is used to install the infrared transmitter 16 and the infrared receiver 17. The position of the fixing plate 15 can be adjusted by moving the adjusting base 13, so that the infrared transmitter 16 and the infrared receiver 17 can be adjusted to the appropriate position according to the different diameters of the cutting blades 2, so as to detect the height difference of cutting blades 2 with different diameters. The infrared transmitter 16 emits infrared rays, which cooperate with the infrared receiver 17 on the fixing plate 15 on the other guide frame 3. By emitting and receiving light, the infrared transmitter 16 determines whether the height position between the two cutting blades 2 is consistent. The infrared transmitter 16 is the signal emission source for height difference detection. The infrared signal emitted by it provides the data basis for detection. The infrared receiver 17 analyzes the received infrared signal to determine the height position relationship between the two cutting blades 2. When the height of the two cutting blades 2 is not consistent, it promptly feeds back to the operator for adjustment to ensure cutting accuracy.

[0025] In summary, the operating steps of this fully automatic precision wafer dicing machine with dual-axis drive structure are as follows:

[0026] 1. Based on the diameter of the cutting blade 2, start the second motor 12 to drive the threaded rod 10 to rotate, so that the adjusting seat 13 moves along the axial direction of the threaded rod 10, thereby driving the fixing plate 15 to be adjusted to a suitable position, and install the infrared transmitter 16 and the infrared receiver 17 to complete the initial position setting of the detection equipment.

[0027] 2. Turn on the first motor 8 to drive the positioning block 5 to move on the guide frame 3, and move the infrared transmitter 16 and infrared receiver 17 to the initial detection position to prepare for detecting the height difference of the cutting blade 2;

[0028] 3. The infrared transmitter 16 emits infrared rays, and the infrared receiver 17 receives the signal. By analyzing the emission and reception of the light, it is determined whether the height position between the two cutting blades 2 is consistent. If a height inconsistency is detected, it is promptly reported to the operator.

[0029] 4. As needed, restart the first motor 8 to drive the positioning block 5 to move to different positions on the guide frame 3. The infrared transmitter 16 emits infrared rays and the infrared receiver 17 receives the signal. By analyzing the emission and reception of light, determine whether the height position between the two cutting blades 2 is consistent. If a height inconsistency is detected, promptly report it to the operator. Detect multiple positions of the cutting blades 2 to improve the relative accuracy between the cutting blades 2.

[0030] 5. After completing the height difference detection and confirming that there are no errors, start the cutting blade 2 to cut the wafer. During the cutting process, the detection steps can be repeated as needed to ensure cutting accuracy.

[0031] The above description is only for illustrating the present utility model. It should be understood that the present utility model is not limited to the above embodiments, and various modifications that conform to the concept of the present utility model are within the protection scope of the present utility model.

Claims

1. A double-shaft driving structure of a full-automatic precision wafer cutting machine, comprising two knife holders (1), characterized in that: The output end of two knife holders (1) is drivingly connected with a cutting knife (2), the outer surface of two knife holders (1) is sleeved with a guide frame (3), the inner side wall of the guide frame (3) is slidably connected with a positioning block (5), the outer surface of the positioning block (5) is fixedly connected with a support seat (9) on both sides, the inner wall of one support seat (9) is connected with a threaded rod (10) through a bearing, the outer surface of the threaded rod (10) is threadedly connected with an adjusting seat (13), the end of the adjusting seat (13) is fixedly connected with a fixed plate (15), the outer surface of the fixed plate (15) on the surface of one guide frame (3) is connected with an infrared emitter (16) through bolts, and the outer surface of the fixed plate (15) on the surface of the other guide frame (3) is connected with an infrared receiver (17) through bolts.

2. The double-shaft driving structure of a full-automatic precision wafer cutting machine according to claim 1, wherein: The outer surface of two guide frames (3) is provided with a guide groove (4) on both sides, the outer surface of the positioning block (5) is provided with a sliding groove (6) matched with the guide groove (4), and the inner side wall of the sliding groove (6) is slidably connected with the inner side wall of the guide groove (4).

3. The double-shaft driving structure of the full-automatic precision wafer cutting machine according to claim 1, wherein: The top and bottom of the positioning block (5) are fixedly installed with a driving wheel (7), and the outer surface of the driving wheel (7) is fixedly installed with a first motor (8).

4. The double-shaft driving structure of the full-automatic precision wafer cutting machine according to claim 3, wherein: The output end of the first motor (8) is drivingly connected with the end of the driving wheel (7) through a key, and the outer surface of the driving wheel (7) is in contact with the outer surface of the guide frame (3).

5. The double-shaft driving structure of the full-automatic precision wafer cutting machine according to claim 1, wherein: One end of one support seat (9) is fixedly installed with a second motor (12), and the output end of the second motor (12) is connected with the end of the threaded rod (10) through a key.

6. The double-shaft driving structure of the full-automatic precision wafer cutting machine according to claim 5, wherein: The inner wall of the other support seat (9) is fixedly connected with a guide rod (11), the outer surface of the guide rod (11) is slidably connected with the outer surface of the guide rod (11), and the end of the guide rod (11) penetrating out of the adjusting seat (13) is threadedly connected with a limiting rod (14). The output end of two knife holders (1) is drivingly connected with a cutting knife (2), the outer surface of two knife holders (1) is sleeved with a guide frame (3), the inner side wall of the guide frame (3) is slidably connected with a positioning block (5), the outer surface of the positioning block (5) is fixedly connected with a support seat (9) on both sides, the inner wall of one support seat (9) is connected with a threaded rod (10) through a bearing, the outer surface of the threaded rod (10) is threadedly connected with an adjusting seat (13), the end of the adjusting seat (13) is fixedly connected with a fixed plate (15), the outer surface of the fixed plate (15) on the surface of one guide frame (3) is connected with an infrared emitter (16) through bolts, and the outer surface of the fixed plate (15) on the surface of the other guide frame (3) is connected with an infrared receiver (17) through bolts.

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