Stamp assembly

Abstract

The utility model provides a printing die assembly. The stamp assembly includes: a stamp member having a plurality of protrusions arranged in a first direction and a second direction; and a press member including a plurality of press lines, in which the plurality of press lines may include press lines alternately arranged with the plurality of protrusions arranged in the first direction and arranged between adjacent ones of the plurality of protrusions arranged in the first direction.

Description

Technical Field

[0001] This utility model relates to a printing mold assembly and a method for transferring light-emitting elements using the printing mold assembly. Background Technology

[0002] Micro LEDs can be transferred onto a substrate using a printing assembly.

[0003] The printing assembly can bond or adhere microLEDs disposed in the first substrate to one of its surfaces and then transfer the microLEDs to the second substrate. However, when the microLEDs are aligned with the second substrate, there is a problem that a portion of the microLEDs remains bonded or adhered to one surface of the printing assembly. Utility Model Content

[0004] Technical issues

[0005] The technical problem to be solved by this utility model is to provide a printing mold assembly that can effectively transfer light-emitting elements and a transfer method using the printing mold assembly.

[0006] The technical problems of this utility model are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0007] Technical solution

[0008] An impression assembly according to an embodiment for solving the above-mentioned technical problems includes: an impression component having a plurality of protrusions arranged along a first direction and a second direction; and a stamping component including a plurality of stamping lines, wherein the plurality of stamping lines include stamping lines that are alternately arranged with the plurality of protrusions arranged along the first direction and arranged between adjacent protrusions among the plurality of protrusions arranged along the first direction.

[0009] In one embodiment, the stamping member may be arranged among the plurality of protrusions in a manner that allows it to move along the extension direction of the protrusion.

[0010] In one embodiment, the diameter of each of the plurality of stamping lines may be smaller than the spacing between the plurality of protrusions.

[0011] In one embodiment, the stamping component further includes: a first sidewall to a fourth sidewall defining a frame opening; and a frame defining slots arranged along the extension direction of the first sidewall to the fourth sidewall, wherein the plurality of stamping lines are respectively inserted into corresponding slots in the slots.

[0012] In one embodiment, the frame may further include: protrusions disposed on at least one pair of sidewalls facing each other and spaced apart from each other, the first sidewall and the second sidewall extending along the second direction and facing each other in a first direction through the frame opening, the third sidewall and the fourth sidewall extending along the first direction and facing each other in a second direction through the frame opening, each of the slots corresponding to the spacing space between the protrusions.

[0013] In one embodiment, each of the plurality of stamping lines includes a first end and a second end, the first end being disposed on the outer surface of any one of the first to fourth sidewalls, and the second end being disposed on the outer surface of a sidewall different from the first sidewall.

[0014] In one embodiment, each of the plurality of stamping lines is bent along the thickness direction and joined to the outer surface of the frame, the plurality of stamping lines including two or more stamping lines that are inclined and joined to each other on the outer surface in different directions.

[0015] In one embodiment, the plurality of stamping lines include: a first stamping line; and a second stamping line extending in a direction different from the extension direction of the first stamping line, the first stamping line and the second stamping line intersecting in a plane and defining a line opening that overlaps with the frame opening, each of the plurality of protrusions being inserted into the corresponding line opening and attached to the line opening.

[0016] In one embodiment, in the plurality of stamping lines, each of the first stamping lines may extend along the first direction and be arranged along the second direction, and each of the second stamping lines may extend along the second direction and be arranged along the first direction.

[0017] In one embodiment, each of the first stamping lines extends along the first direction and is arranged along the second direction, and each of the second stamping lines extends along a third direction and is arranged along a fourth direction that intersects the third direction, wherein the third direction may intersect the first direction and the second direction.

[0018] In one embodiment, each of the first stamping lines extends along a third direction and is arranged along a fourth direction that intersects the third direction, and each of the second stamping lines extends along the fourth direction and is arranged along a third direction that intersects the fourth direction, wherein the third direction and the fourth direction may intersect the first direction and the second direction, respectively.

[0019] In one embodiment, each of the plurality of stamping lines may include carbon nanotube fibers.

[0020] In one embodiment, the impression component may include a substrate layer and an impression layer disposed on a surface of the substrate layer, wherein the plurality of protrusions are integrally formed with the impression layer, and the impression layer may be formed using a material having adhesive or bonding properties.

[0021] In one embodiment, one end face of the plurality of protrusions may be flat.

[0022] A method for transferring a light-emitting element according to one embodiment may include the following steps: combining an impression component having a plurality of protrusions and a stamping component having a plurality of stamping lines, and arranging the plurality of stamping lines as including stamping lines that are alternately arranged with the plurality of protrusions arranged along a first direction and disposed between adjacent protrusions among the plurality of protrusions arranged along the first direction; picking up the light-emitting element on the donor substrate by using the plurality of protrusions; aligning the picked-up light-emitting element on the target substrate; applying pressure to the light-emitting element between the plurality of protrusions by the stamping lines to transfer the light-emitting element to the target substrate; and separating the impression assembly, which combines the impression component and the stamping component, from the light-emitting element.

[0023] In one embodiment, the impression component includes a substrate layer and an impression layer disposed at one end of the substrate layer, the plurality of protrusions being integrally formed with the impression layer, the height of the plurality of protrusions being greater than the diameter of the stamping lines, the diameter of each of the stamping lines being smaller than the spacing between the plurality of protrusions, and the stamping lines being combined in such a manner that they are arranged closer to the substrate layer than one end of the plurality of protrusions.

[0024] In one embodiment, the plurality of protrusions may be arranged along a first direction and a second direction, each of the stamping lines may be arranged along one direction, and each of the plurality of protrusions may be inserted into and attached to a line opening defined by the stamping line.

[0025] In one embodiment, the plurality of stamping lines includes: a first stamping line arranged in one direction; and a second stamping line arranged in a different direction from the first stamping line, each of the plurality of protrusions being insertable into and connected to a line opening defined by the first stamping line and the second stamping line.

[0026] In one embodiment, in the step of pressing the light-emitting element between the plurality of protrusions on the stamping line and transferring the light-emitting element to the target substrate, the stamping member descends so that the plurality of protrusions are below one end face of the plurality of protrusions, thereby pressing the light-emitting element.

[0027] In one embodiment, each of the plurality of protrusions is movable up and down within a line opening defined by the stamping line.

[0028] Technical effect

[0029] According to one embodiment of the display panel manufacturing method, the light-emitting elements can be effectively transferred to reduce defects, thereby improving the product quality and yield of the display panel. Furthermore, since no repair process for the display panel is required, equipment and process costs can be reduced.

[0030] The effects of the embodiments are not limited to the examples described above, and more diverse effects are included in this specification. Attached Figure Description

[0031] Figure 1 This is a layout diagram showing a display device according to an embodiment.

[0032] Figure 2 It is shown Figure 1 An example image of an example of pixels.

[0033] Figure 3 It is shown Figure 1 Another example of a pixel.

[0034] Figure 4 It is along Figure 2 A cross-sectional view of an example display panel taken along line A-A'.

[0035] Figure 5 This is a schematic diagram illustrating a transfer apparatus according to one embodiment.

[0036] Figure 6 This is a perspective view of an impression component according to one embodiment.

[0037] Figure 7 This is a perspective view of an impression component according to one embodiment.

[0038] Figure 8 This is a cross-sectional view of a stamping component according to one embodiment.

[0039] Figure 9 This is a perspective view of an impression assembly according to one embodiment.

[0040] Figure 10 This is a cross-sectional view of an impression assembly according to one embodiment.

[0041] Figure 11 This is a sequence diagram illustrating a transfer method for a light-emitting element according to an embodiment.

[0042] Figures 12 to 18This is a cross-sectional view used to illustrate the transfer method of the light-emitting element.

[0043] Figures 19 to 22 This is a perspective view of a stamping component according to another embodiment.

[0044] Explanation of reference numerals in the attached figures

[0045] Detailed Implementation

[0046] References and Appendix Figure 1 The advantages and features of this invention, as well as the methods for achieving these advantages and features, will become clear from the detailed embodiments described below. However, this invention is not limited to the embodiments disclosed below, which can be implemented in many different forms. These embodiments are provided only to complete the disclosure of this invention and to fully inform those skilled in the art of the invention. This invention is defined only by the scope of the claims.

[0047] When an element or layer is referred to as being "on" another element or layer, this includes all cases where another layer or other element is sandwiched between or immediately above or in the middle of another element or layer. Throughout this specification, the same reference numerals refer to the same constituent elements. The shapes, dimensions, ratios, angles, quantities, etc., disclosed in the figures used to illustrate embodiments are exemplary and therefore not limited to the matters shown in this utility model.

[0048] The specific embodiments will now be described with reference to the accompanying drawings.

[0049] Figure 1 This is a layout diagram showing a display device according to an embodiment. Figure 2 It is shown Figure 1 An example image of an example of pixels. Figure 3 It is shown Figure 1 Another example of a pixel.

[0050] Reference Figures 1 to 3Display devices, as devices for displaying dynamic or still images, can be used not only as displays for portable electronic devices such as mobile phones, smartphones, tablet personal computers (PCs), smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-mobile PCs (UMPCs), but also as displays for various products such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices.

[0051] The display panel 100 can be formed as a rectangular plane having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. The corner where the long side in the first direction DR1 meets the short side in the second direction DR2 can be smoothly formed with a predetermined curvature or formed as a right angle. The planar shape of the display panel 100 is not limited to a quadrilateral and can be formed as other polygons, circles, or ellipses. The display panel 100 can be formed flat, but is not limited to this. For example, the display panel 100 may include curved surfaces formed at the left and right ends with a predetermined curvature or a varying curvature. Furthermore, the display panel 100 can be flexibly formed to be bent, folded, folded, or rolled.

[0052] The display panel 100 may further include pixels PX, scan wiring extending along a first direction DR1, and data wiring extending along a second direction DR2 to display an image. The pixels PX may be arranged in a matrix configuration along the first direction DR1 and the second direction DR2.

[0053] Each of the pixels in PX is like Figure 2 and Figure 3 The area shown may include multiple sub-pixels RP, GP, and BP. Figure 2 and Figure 3 The diagram schematically illustrates a scenario where each pixel PX comprises three sub-pixels RP, GP, and BP (i.e., the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP), but the embodiments described herein are not limited thereto.

[0054] The first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be connected to any one of the data routes and at least one of the scan routes.

[0055] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a rectangular, square, or rhomboid planar shape. For example, as shown... Figure 2 As shown, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a planar shape that includes a short side in the first direction DR1 and a long side in the second direction DR2. Alternatively, as... Figure 3 As shown, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a planar shape that includes a square or rhombus shape with sides having the same length on the first direction DR1 and the same length on the second direction DR2.

[0056] like Figure 2 As shown, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be arranged along the first direction DR1. Alternatively, one of the second sub-pixel GP and the third sub-pixel BP can be arranged with the first sub-pixel RP along the first direction DR1, and the other can be arranged with the first sub-pixel RP along the second direction DR2. For example, as... Figure 3 As shown, the first sub-pixel RP and the second sub-pixel GP can be arranged along the first direction DR1, and the first sub-pixel RP and the third sub-pixel BP can be arranged along the second direction DR2.

[0057] Alternatively, one of the first sub-pixel RP and the third sub-pixel BP can be arranged along the first direction DR1 with the second sub-pixel GP, and the other can be arranged along the second direction DR2 with the second sub-pixel GP. Alternatively, one of the first sub-pixel RP and the second sub-pixel GP and the third sub-pixel BP can be arranged along the first direction DR1, and the other can be arranged along the second direction DR2 with the third sub-pixel BP.

[0058] The first sub-pixel RP may include a first light-emitting element that emits a first light, the second sub-pixel GP may include a second light-emitting element that emits a second light, and the third sub-pixel BP may include a third light-emitting element that emits a third light. The first light may be light in the red wavelength band, the second light may be light in the green wavelength band, and the third light may be light in the blue wavelength band. The red wavelength band may be approximately 600 nm to 750 nm, the green wavelength band may be approximately 480 nm to 560 nm, and the blue wavelength band may be approximately 370 nm to 460 nm, but the embodiments described in this specification are not limited to these.

[0059] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP may include an inorganic light-emitting element having an inorganic semiconductor as the light-emitting element. For example, the inorganic light-emitting element may be a flip-chip type micro light-emitting diode (LED), but the embodiments in this specification are not limited to this.

[0060] like Figure 2 and Figure 3 As shown, the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be substantially the same, but the embodiments in this specification are not limited thereto. At least one of the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be different from the others. Alternatively, any two of the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be substantially the same, and the remaining one can be different from the two said two. Alternatively, the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be different from each other.

[0061] Figure 4 It shows along Figure 2 A cross-sectional view of an example display panel taken at point A-A'.

[0062] Reference Figure 4 The display panel 100 may include a thin-film transistor layer (TFTL) and a light-emitting element (LE) disposed on a substrate SUB. The thin-film transistor layer (TFTL) may be a layer formed by thin-film transistors (TFT).

[0063] The thin-film transistor layer (TFTL) includes an active layer (ACT), a first gate layer (GTL1), a second gate layer (GTL2), a first data metal layer (DTL1), a second data metal layer (DTL2), a third data metal layer (DTL3), and a fourth data metal layer (DTL4). Furthermore, the TFTL includes a buffer film (BF), a gate insulating film (130), a first interlayer insulating film (141), a second interlayer insulating film (142), a first planarization film (160), a first insulating film (161), a second planarization film (180), and a second insulating film (181).

[0064] The substrate SUB can be a base substrate or base component used to support a display device. The substrate SUB can be a rigid substrate made of glass, but the embodiments described in this specification are not limited to this. The substrate SUB can be a flexible substrate capable of bending, folding, rolling, etc. In this case, the substrate SUB may include an insulating material such as a polymer resin like polyimide (PI).

[0065] A buffer film BF can be disposed on one surface of the substrate SUB. The buffer film BF can be a film used to prevent air or moisture penetration. The buffer film BF can be composed of multiple inorganic films stacked alternately. For example, the buffer film BF can be formed as a multiple film of one or more inorganic films selected from silicon nitride layers, silicon oxide nitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers stacked alternately. The buffer film BF can be omitted.

[0066] An active layer ACT can be disposed on the buffer film BF. The active layer ACT can include silicon semiconductors such as polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, and amorphous silicon, or it can include oxide semiconductors.

[0067] The active layer ACT may include a channel TCH of a thin-film transistor (TFT), a first electrode TE1, and a second electrode TE2. The channel TCH of the TFT may be a region on a third-direction DR3 (which is the thickness direction of the substrate SUB) that overlaps with the gate electrode TG of the TFT. The first electrode TE1 of the TFT may be disposed on one side of the channel TCH, and the second electrode TE2 may be disposed on the other side of the channel TCH. The first electrode TE1 and the second electrode TE2 of the TFT may be regions on the third-direction DR3 that do not overlap with the gate electrode TG. The first electrode TE1 and the second electrode TE2 of the TFT may be regions that are conductive by doping ions in a silicon semiconductor or an oxide semiconductor.

[0068] A gate insulating film 130 may be disposed on the active layer ACT. The gate insulating film 130 may be formed using an inorganic film (e.g., a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0069] A first gate layer GTL1 may be disposed on the gate insulating film 130. The first gate layer GTL1 may include the gate electrode TG of the thin-film transistor TFT and the first capacitor electrode CAE1. The first gate layer GTL1 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0070] A first interlayer insulating film 141 may be disposed on the first gate layer GTL1. The first interlayer insulating film 141 may be formed using an inorganic film (e.g., a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0071] A second gate layer GTL2 may be disposed on the first interlayer insulating film 141. The second gate layer GTL2 may include a second capacitor electrode CAE2. The second gate layer GTL2 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0072] A second interlayer insulating film 142 may be disposed on the second gate layer GTL2. The second interlayer insulating film 142 may be formed using an inorganic film (e.g., a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0073] A first data metal layer DTL1, including a first connecting electrode CE1, a first sub-pad, and data wiring, can be disposed on the second interlayer insulating film 142. The data wiring can be integrally formed with the first sub-pad, but the embodiments in this specification are not limited thereto. The first data metal layer DTL1 can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0074] The first connecting electrode CE1 can be connected to the first electrode TE1 or the second electrode TE2 of the thin-film transistor TFT through the first contact hole CT1 that passes through the first interlayer insulating film 141 and the second interlayer insulating film 142.

[0075] A first planarization film 160 may be disposed on the first data metal layer DTL1 to planarize the step difference caused by the active layer ACT, the first gate layer GTL1, the second gate layer GTL2, and the first data metal layer DTL1. The first planarization film 160 may be formed using an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0076] A second data metal layer DTL2 may be disposed on the first planarization film 160. The second data metal layer DTL2 may include a second connection electrode CE2 and a second sub-pad. The second connection electrode CE2 can be connected to the first connection electrode CE1 through a second contact hole CT2 that penetrates the first insulating film 161 and the first planarization film 160. The second data metal layer DTL2 may be formed as a single layer or multiple layers using any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0077] A second planarization film 180 may be disposed on the second data metal layer DTL2. The second planarization film 180 may be formed using an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0078] A third data metal layer DTL3 may be disposed on the second planarization film 180. The third data metal layer DTL3 may include a third connection electrode CE3 and a third sub-pad. The third connection electrode CE3 can be connected to the second connection electrode CE2 through a third contact hole CT3 penetrating the second insulating film 181 and the second planarization film 180. The third data metal layer DTL3 may be formed as a single layer or multiple layers composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0079] A third planarization film 190 may be disposed on the third data metal layer DTL3. The third planarization film 190 may be formed using organic films such as acrylamide resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0080] A fourth data metal layer DTL4 may be disposed on the third planarization film 190. The fourth data metal layer DTL4 may include an anode pad electrode APD, a cathode pad electrode CPD, and a fourth sub-pad. The anode pad electrode APD may be connected to the third connecting electrode CE3 through a fourth contact hole CT4 penetrating the third insulating film 191 and the third planarization film 190. The cathode pad electrode CPD may receive a first power supply voltage as a low potential voltage. The fourth data metal layer DTL4 may be formed as a single layer or multiple layers using any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0081] The illustration schematically depicts a flip-chip type microLED where the light-emitting element LE is arranged with the first contact electrode CTE1 and the second contact electrode CTE2 facing each other to the anode pad electrode APD and the cathode pad electrode CPD, but is not limited thereto. The light-emitting element LE can be an inorganic light-emitting element made of an inorganic material such as GaN. The lengths of the light-emitting element LE in the first direction DR1, the second direction DR2, and the third direction DR3 can each be from a few μm to several hundred μm. For example, each of the lengths of the light-emitting element LE in the first direction DR1, the second direction DR2, and the third direction DR3 can be less than approximately 100 μm.

[0082] Light-emitting elements (LEs) can be grown on a semiconductor substrate such as a silicon wafer. Each LE can be directly moved from the silicon wafer to the anode pad electrode (APD) and cathode pad electrode (CPD) of the substrate SUB. In this case, the first contact electrode (CTE1) and the anode pad electrode (APD) can be bonded together by a bonding process. Furthermore, the second contact electrode (CTE2) and the cathode pad electrode (CPD) can be bonded together by a bonding process. The first contact electrode (CTE1) and the anode pad electrode (APD) can be electrically connected to each other via a bonding electrode (23). Similarly, the second contact electrode (CTE2) and the cathode pad electrode (CPD) can be electrically connected to each other via the bonding electrode (23).

[0083] As an example, a bonding electrode 23 can be arranged on one surface of the light-emitting element LE. The bonding electrode 23 can be an adhesive bonded by pressure melting using a laser. Here, pressure melting bonding refers to the state in which the bonding electrode 23 is heated and melted, causing the light-emitting element LE to melt and mix with the anode pad electrode APD and the cathode pad electrode CPD, and then cooled and solidified when the laser supply ends. Since the conductivity between the light-emitting element LE and the anode pad electrode APD and the cathode pad electrode CPD is maintained even when cooled and solidified from the melt-mixed state, the anode pad electrode APD and the cathode pad electrode CPD can be electrically connected to the light-emitting element LE and physically connected, respectively. Therefore, the bonding electrode 23 can be arranged on the first contact electrode CTE1 and the second contact electrode CTE2 of the light-emitting element LE.

[0084] The bonding electrode 23 may include, for example, Au, AuSn, PdIn, InSn, NiSn, Au-Au, AgIn, AgSn, Al, Ag, or carbon nanotubes (CNTs). These may be used individually or in combination of two or more.

[0085] Each of the light-emitting elements (LEs) can be a light-emitting structure comprising a substrate (SSUB), an n-type semiconductor (NSEM), an active layer (MQW), a p-type semiconductor (PSEM), a first contact electrode (CTE1), and a second contact electrode (CTE2).

[0086] The substrate SSUB can be a sapphire substrate, but the embodiments in this specification are not limited to this.

[0087] An n-type semiconductor NSEM can be disposed on one surface of a substrate SSUB. For example, an n-type semiconductor NSEM can be disposed on the lower surface of a substrate SSUB. The n-type semiconductor NSEM can be constructed using GaN doped with n-type conductivity dopants such as Si, Ge, or Sn.

[0088] The active quantum well (MQW) layer can be disposed on a portion of a surface of an n-type semiconductor NSEM. The MQW layer can comprise a single quantum well structure or a multi-quantum well structure. In the case where the MQW layer comprises a multi-quantum well structure, it can also be a structure in which multiple well layers and barrier layers are stacked alternately. In this case, the well layers can be formed using InGaN, and the barrier layers can be formed using GaN or AlGaN, but are not limited thereto. Alternatively, the MQW layer can be a structure in which semiconductor materials with high band gaps and semiconductor materials with low band gaps are stacked alternately, and can also include different group III to group V semiconductor materials depending on the wavelength band of the emitted light.

[0089] In one embodiment of this utility model, a flip-chip type light-emitting element is used as an example for illustration, but it is not limited thereto; a vertical type light-emitting element can also be used.

[0090] Figure 5 This is a schematic diagram illustrating a transfer apparatus TD according to one embodiment.

[0091] According to one embodiment, the transfer apparatus TD can be used to manufacture display panel 100 (see reference). Figure 4 For example, the transfer device TD can be used to transfer the light-emitting element LE to the circuit board. Figure 4 10) of the transfer printing process.

[0092] Reference Figure 5 The transfer device TD may include a transfer head 40, an impression component 200, a stamping component 300, and a stage STG. The impression component 200 and the stamping component 300 may be referred to as the impression assembly SAB.

[0093] The transfer head 40 enables the impression component 200 to move in the up, down, left, and right directions.

[0094] For example, the transfer head 40 may include any one of the following suction cups: an electrostatic chuck, an adhesive chuck, a vacuum chuck, or a porous vacuum chuck. The transfer head 40 can move in the up, down, left, and right directions while holding the impression component 200 using the suction cup. The transfer head 40 may move, for example, on a guide rail in the first direction DR1, the second direction DR2, and the third direction DR3, but is not limited thereto.

[0095] The impression component 200 may include a substrate layer 210 and an impression layer 220.

[0096] The substrate layer 210 supports the impression layer 220. The substrate layer 210 may be composed of, for example, polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cyclic olefin polymer (COP), etc.

[0097] An impression layer 220 is disposed on one surface of the substrate layer 210. The impression layer 220 may include a plurality of protrusions 221 and may be bonded or adhered to the light-emitting element LE. The impression layer 220 may be constructed using adhesive or bonding materials, such as optically clear adhesives (OCA) and pressure-sensitive adhesives (PSA), and bonding materials such as acrylic, urethane, and silicone adhesives.

[0098] One end of the multiple protrusions 221 is flat, and the shape of the protrusions 221 can be a polygonal prism or a cylindrical shape.

[0099] The stamping component 300 can be movably coupled to the lower part of the mold component 200 in the vertical direction. The stamping component 300 can be coupled to the lower part of the mold component 200 by means of a separate fixing unit (e.g., a jig or a robotic arm).

[0100] The stamping component 300 may include a stamping line PL and a stamping frame PFR. The stamping line PL may be combined with the stamping frame PFR.

[0101] The stamping frame PFR can support the stamping line PL. An opening FR-O can be defined on the inner side of the stamping frame PFR. Figure 7 The stamped frame PFR can have a closed line shape around the frame opening FR-O in a plane. The shape of the stamped frame PFR can be quadrilateral, but is not limited to this.

[0102] The stamped frame PFR can have a predetermined stiffness. For example, the stamped frame PFR can include metallic materials such as stainless steel (SUS), Invar alloy, nickel (Ni), cobalt (Co), etc. However, the material of the stamped frame PFR is not limited to the examples described.

[0103] Each stamping line PL can be integrated into the stamping frame PFR, and multiple line openings PL-O can be defined by lines arranged on a plane. Figure 7 That is, each of the line openings PL-O can be formed to be surrounded by the corresponding stamping line in the stamping line PL.

[0104] The stamping line PL can include highly durable materials. For example, the stamping line PL can include carbon nanotube fibers. By improving the durability of the stamping line PL, damage to the stamping line PL caused by pressure applied to the light-emitting element LE during the transfer process can be prevented.

[0105] The line opening PL-O can overlap with the frame opening FR-O on the plane.

[0106] In this specification, "in a plane" is defined as a surface parallel to the surface defined by the first direction DR1 and the second direction DR2. In this specification, "in a cross-section" is defined as the state observed in the first direction DR1 or the second direction DR2.

[0107] When the impression component 200 is combined with the stamping component 300, the impression layer 220 can overlap with the frame opening FR-O on the plane. In addition, the line opening PL-O can overlap with a plurality of protrusions 221 respectively.

[0108] For example, in a transfer printing process, protrusions 221 of the impression component 200 can be arranged in each line opening PL-O, and the stamping line PL can be arranged adjacent to a surface of the impression layer 220. Then, when the light-emitting element LE attached to the protrusion of the impression component 200 is placed on the target substrate during the transfer printing process, the stamping line PL descends and applies pressure to the light-emitting element LE. Such a transfer printing process will be described later.

[0109] The STG stage supports the donor substrate or target substrate used for transfer printing.

[0110] Figure 6 This is a perspective view of an impression component according to one embodiment.

[0111] Reference Figure 6 The impression component 200 includes a substrate layer 210 and an impression layer 220 disposed on the lower surface of the substrate layer 210. An adhesive layer may also be disposed between the substrate layer 210 and the impression layer 220.

[0112] The impression layer 220 can conform to the shape of the substrate layer 210. For example, on a plane, if the substrate layer 210 is quadrilateral, the impression layer 220 can also be quadrilateral; if the substrate layer 210 is circular, the impression layer 220 can also be circular. The area of ​​the impression layer 220 is less than or equal to that of the substrate layer 210.

[0113] The impression layer 220 includes a plurality of protrusions 221 arranged at predetermined intervals. For example, the plurality of protrusions 221 may be arranged along a first direction DR1 and a second direction DR2. The plurality of protrusions 221 may be arranged along the first direction DR1 at a first interval D1, and may be arranged along the second direction DR2 at a first interval D1. The height H1 of the plurality of protrusions 221 may be greater than the diameter of the stamping line PL described later. For example, the height H1 of the plurality of protrusions 221 may be 1.5 to 2.5 times the diameter of the stamping line PL, but this is only an example and is not a limitation.

[0114] Figure 7 This is a perspective view of an impression component according to one embodiment.

[0115] Reference Figure 7The stamped frame PFR may include sidewalls S1, S2, S3, and S4. The frame opening FR-O may be defined by the inner surfaces of the interconnected sidewalls S1, S2, S3, and S4. That is, the interconnected sidewalls S1, S2, S3, and S4 may surround the frame opening FR-O in a plane. The outer surfaces of the interconnected sidewalls S1, S2, S3, and S4 may face the inner surfaces of the sidewalls S1, S2, S3, and S4, and may correspond to the outer surface of the stamped frame PFR. The sidewalls S1, S2, S3, and S4 may include a first sidewall S1, a second sidewall S2, a third sidewall S3, and a fourth sidewall S4.

[0116] Each of the first sidewall S1 and the second sidewall S2 may extend along the second direction DR2. The first sidewall S1 and the second sidewall S2 may face each other in the first direction DR1 through the frame opening FR-O.

[0117] The third sidewall S3 can extend along the first direction DR1 and can be connected to one end of the first sidewall S1 and one end of the second sidewall S2. That is, the first sidewall S1 and the second sidewall S2 can be connected to each other through the third sidewall S3. The fourth sidewall S4 can extend along the first direction DR1 and can be connected to the other end of the first sidewall S1 and the other end of the second sidewall S2. The third sidewall S3 and the fourth sidewall S4 can face each other in the second direction DR2 through the frame opening FR-O.

[0118] The first sidewalls S1 to the fourth sidewalls S4 may comprise the same material and be integrally formed. The first sidewalls S1 to the fourth sidewalls S4 may comprise a rigid material. For example, the first sidewalls S1 to the fourth sidewalls S4 may comprise metallic materials such as stainless steel (SUS), Invar alloy, nickel (Ni), cobalt (Co), etc. However, the material of the first sidewalls S1 to the fourth sidewalls S4 is not limited to the examples described.

[0119] The stamped frame PFR may include a protrusion PP. The protrusion PP may be disposed on the upper surface US of at least one pair of opposing sidewalls of the first sidewall S1 to the fourth sidewall S4 that are connected to each other. For example, it may be disposed on the upper surface US of the first sidewall S1 and the second sidewall S2.

[0120] Protrusions PP arranged adjacent to each other in one direction can be separated by grooves GV. Therefore, a stamping frame PFR can define multiple grooves GV by protrusions PP arranged spaced apart in one direction.

[0121] The protrusions PP arranged on the first sidewall S1 can form grooves GV along the second direction DR2 and be arranged accordingly. The protrusions PP arranged on the second sidewall S2 can form grooves GV along the second direction DR2 and be arranged accordingly. That is, the spacing between adjacent protrusions PP arranged on the first sidewall S1 or the second sidewall S2 in the second direction DR2 can correspond to grooves GV.

[0122] The protrusion PP may include a rigid material. For example, the protrusion PP may include metallic materials such as stainless steel (SUS), Invar alloy, nickel (Ni), and cobalt (Co). The protrusion PP may include the same material as the first sidewalls S1 to the fourth sidewalls S4 and be formed integrally. However, it is not limited to this; the protrusion PP may also include a different material from the material contained in the first sidewalls S1 to the fourth sidewalls S4.

[0123] in addition, Figure 4 The dimensions and shape of the protrusions PP shown are merely exemplary. As long as they can be arranged separately along one direction to form grooves GV, the dimensions and shape of the protrusions PP are not limited to the situation shown in the figure.

[0124] The stamping line PL can be attached to the stamping frame PFR. Each of the stamping lines PL can extend along the first direction DR1 and be attached to the first sidewall S1 and the second sidewall S2 of the stamping frame PFR.

[0125] For example, each of the stamping lines PL can be joined to the outer surfaces of the first sidewall S1 and the second sidewall S2 via the frame opening FR-O. For instance, the first end of the stamping line PL can be disposed on the outer surface of the first sidewall S1, and the portion adjacent to the first end can be joined to the first sidewall S1 via a first joining portion AP1a. Similarly, the second end of the stamping line PL can be disposed on the outer surface of the second sidewall S2 and can be joined to the second sidewall S2 via a second joining portion. The portion of the stamping line PL extending along the first direction DR1 can overlap with the frame opening FR-O.

[0126] Figure 7 An exemplary embodiment is shown in which a plurality of first joints AP1a are arranged on the outer surface of the first sidewall S1 and respectively coupled to the stamping line PL. However, the embodiment is not limited thereto, and the first joints AP1a may also be configured as integral joints extending in a direction parallel to the outer surface of the first sidewall S1 and overlapping the stamping line PL, thereby enabling the stamping line PL to be coupled to the first sidewall S1.

[0127] The stamping lines PL can be inserted into corresponding slots GV located on the first sidewall S1 or the second sidewall S2. The stamping lines PL inserted into the corresponding slots GV can be arranged spaced apart along the second direction DR2. Therefore, the spacing between the slots GV of the stamping frame PFR can be designed taking into account the arrangement spacing of the stamping lines PL to be arranged.

[0128] Figure 8 This is a cross-sectional view of a stamping component according to one embodiment. Figure 8 It corresponds to Figure 7 A cross-sectional view of a stamping component 300 according to an embodiment of line I1-I1'.

[0129] Reference Figure 8 The protrusions PP arranged on the first sidewall S1 can be spaced apart along the second direction DR2. Each of the protrusions PP can have a quadrilateral shape in cross-section, but is not limited thereto. The spacing between the protrusions PP can each correspond to a groove GV. The stamping lines PL can each be arranged within the groove GV.

[0130] The width WT of each groove GV can be greater than or equal to the diameter of the stamping line PL. If the width WT of each groove GV is less than the diameter of the stamping line PL, it may be difficult to insert the stamping line PL into the groove GV. Therefore, when the width WT of each groove GV is greater than the diameter of the stamping line PL, the stamping line PL can be easily inserted into the groove GV.

[0131] The protrusions PP may have a predetermined thickness TT on the third-direction DR3. The thickness TT of each protrusion PP may correspond to the depth of each groove GV. The thickness TT of each protrusion PP may be equal to or less than the diameter of the stamping line PL. However, the embodiments are not necessarily limited to this.

[0132] The sum of the width of one of the protrusions PP and the width WT of a groove GV adjacent to the protrusion PP in the first direction DR1 can be defined as the spacing PT. The spacing PT can be designed by taking into account the required arrangement interval of the stamping lines PL.

[0133] Figure 9 This is a perspective view of an impression assembly according to one embodiment. Figure 10 This is a cross-sectional view of the impression assembly SAB according to one embodiment. Figure 10 It corresponds to Figure 9 A cross-sectional view of a stamping component 300 according to an embodiment of line I2-I2'. Figure 9 and Figure 10 The impression assembly corresponds to Figure 5 The impression assembly described in the text, Figure 9 and Figure 10 The impression component 200 corresponds to Figure 6 200 impression components Figure 9 and Figure 10 The stamping part 300 corresponds to Figure 7 and Figure 8 300 stamped parts.

[0134] Reference Figure 9 and Figure 10 Multiple protrusions 221 can be arranged to overlap with the line opening PL-O defined by the stamping line PL. For example, the multiple protrusions 221 may include a first protrusion 221-1 and a second protrusion 221-2 arranged along the second direction DR2. Furthermore, the stamping line PL may include a first stamping line PL1 and a second stamping line PL2. The first stamping line PL1 and the second stamping line PL2 extend along the first direction DR1 and are spaced apart in the second direction DR2. The first line opening PL-O1 can be defined by the spacing between the first stamping line PL1 and the second stamping line PL2. The first protrusion 221-1 can be arranged within the first line opening PL-O1. Therefore, the spacing distance D2 between the first stamping line PL1 and the second stamping line PL2 can be greater than the width WP of the first protrusion 221-1. As described above, the spacing distance D2 between the first stamping line PL1 and the second stamping line PL2 can be designed taking into account the width WP of the first protrusion 221-1 to be arranged.

[0135] Figure 11 This is a sequence diagram illustrating a transfer method for a light-emitting element according to an embodiment. Figures 12 to 18 This is a cross-sectional view used to illustrate the transfer method of the light-emitting element. Figures 12 to 18 This is a cross-sectional view showing the structure of a transfer apparatus according to the transfer sequence of the light-emitting elements. Figures 12 to 18 The image mainly shows the impression assembly SAB and the light-emitting element LE, which can be roughly corresponding to the reference. Figures 5 to 10 A perspective or cross-sectional view of the impression assembly SAB is provided below. (The following is in conjunction with...) Figure 11 right Figures 12 to 18 The transfer method of the light-emitting element shown in the figure will be explained.

[0136] Reference Figure 12 Combining the mold part 200 and the stamping part 300 (S110) Figure 11 ).

[0137] For example, the impression component 200 is arranged overlapping the stamping component 300 at the frame opening FR-O ( Figure 7 On the stamping part 300, the protrusions 221 of the stamping part 200 are arranged overlappingly on the line opening PL-O of the stamping part 300. The protrusions 221 can be arranged between the stamping lines PL. In cross-section, the stamping lines PL and the protrusions 221 can be arranged alternately.

[0138] The stamping component 300 is moved upward (towards DR3) so that the stamping line PL is located on a surface of the die layer 220. When moving the stamping component 300, for example, it can be moved by operating a fixture or robotic arm that fixes the stamping frame PFR.

[0139] The mold assembly SAB, which combines the mold part 200 and the stamping part 300, can be arranged on the stage STG.

[0140] A donor substrate DS, on which multiple light-emitting elements to be transferred can be arranged, can be placed on the stage STG.

[0141] Reference Figure 13 The impression component 200 raises the light-emitting element LE (S120) ( Figure 11 ).

[0142] For example, the impression assembly 200 is aligned such that one surface of one of the plurality of protrusions 221 overlaps with the upper surface of the light-emitting element LE, and the impression assembly SAB is moved downward so that one surface of the plurality of protrusions 221 contacts the light-emitting element LE. The light-emitting element LE is attached to one surface of the protrusions 221 by means of the adhesiveness of one surface of the plurality of protrusions 221.

[0143] Then, the light-emitting element LE can be raised by moving the impression assembly SAB upwards (towards DR3).

[0144] The impression assembly SAB can be moved by operating a fixture or robotic arm that respectively fixes the impression component 200 and the stamping component 300.

[0145] Reference Figure 14 and Figure 15 The light-emitting element LE attached to the printing mold 200 is aligned onto the target substrate TS (S130). Figure 11 ).

[0146] For example, transfer head 40 ( Figure 5 The impression assembly SAB is placed on the target substrate TS. Then, the light-emitting element LE attached to the impression assembly 200 is aligned with the transfer position on the target substrate TS. For this purpose, alignment marks can be placed on the target substrate TS.

[0147] A flux TS-F of predetermined thickness can be coated onto a target substrate TS. The flux TS-F can be a substance that facilitates the alignment of the light-emitting element LE on the target substrate TS. Preferably, the flux TS-F can be coated to a thickness less than that of the light-emitting element LE. The flux TS-F can comprise fat-soluble or water-soluble natural or synthetic resins. The flux TS-F can be in liquid or gel form. The flux TS-F is removed after the transfer of the light-emitting element LE is completed.

[0148] Flux TS-F is removed using a flux cleaner. The flux cleaner can be any known flux cleaner (preferably an aqueous flux cleaner). Examples include, but are not limited to, CLEANTHROUGH 750HS and CLEANTHROUGH 750K manufactured by Kao Corporation, and PINE ALPHA ST-100S manufactured by Arakawa Chemical Industries, Ltd.

[0149] In another embodiment, an adhesive or binder can be used instead of a flux to coat the target substrate TS. The adhesion or bonding force between the flux, adhesive, or binder and the light-emitting element LE should be superior to the adhesion or bonding force between the protrusion 221 and the light-emitting element LE.

[0150] Reference Figure 16 and Figure 17 The light-emitting element LE is separated from the printing mold component 200 and transferred onto the target substrate TS (S140). Figure 11 ).

[0151] For example, refer to Figure 16 By lowering the stamping component 300, multiple stamping lines PL descend between multiple protrusions 221. Thus, the multiple stamping lines PL apply pressure to multiple light-emitting elements LE.

[0152] The width WP of the protrusion 221 can be narrower than the width of the light-emitting element LE. For example, the light-emitting element LE attached to the first protrusion 221-1 can protrude outward from the first protrusion 221-1. Therefore, when multiple stamping lines PL descend between the multiple protrusions 221, the stamping lines PL apply pressure to the upper surface of the light-emitting element LE protruding outward from the first protrusion 221-1. The first stamping line PL1 and the second stamping line PL2 descend and apply pressure to the light-emitting elements LE attached to the adjacently arranged first protrusions 221-1.

[0153] As described above, the first stamping line PL1 and the second stamping line PL2 can simultaneously press the first protrusion 221-1 and the multiple light-emitting elements LE arranged in the same row as the first protrusion 221-1. Therefore, the multiple stamping lines PL aligned side by side with the first stamping line PL1 and the second stamping line PL2 can simultaneously press the multiple light-emitting elements LE arranged on the same plane. Thus, the stamping lines PL can press the light-emitting elements LE in the thickness direction, thereby facilitating the transfer of the light-emitting elements LE onto the target substrate.

[0154] Reference Figure 17 and Figure 18 Separate the impression assembly SAB from the light-emitting element LE (S150) Figure 11 ).

[0155] For example, after the light-emitting element LE is transferred to the target substrate TS, the light-emitting element LE can be separated from the protrusion 221 by lifting the printing mold assembly SAB. For this purpose, the adhesive force or bonding force between the light-emitting element LE and the target substrate TS can be superior to the adhesive force or bonding force between the protrusion 221 and the light-emitting element LE.

[0156] According to one embodiment, when using the printing mold assembly SAB to transfer the light-emitting element LE, the situation where some of the light-emitting element LE adheres to the printing mold assembly 200 and fails to detach can be minimized. Therefore, in the transfer process, the product quality of the display panel can be improved and the yield increased. Furthermore, since no repair process for the display panel is required, equipment and process costs can be reduced.

[0157] Figures 19 to 22 This is a perspective view of a stamping component according to another embodiment.

[0158] Reference Figure 19 The stamping part 300 also includes a second stamping line PL-2 extending along the second direction DR2. Figure 7 The situation is different for the stamped parts 300.

[0159] Involving Figure 19 The extension direction and arrangement of the first stamping line PL-1 extending along the first direction DR1 can be applied in the same way. Figure 7 Based on the stamping line PL and the above explanation, the following explanation will focus on the second stamping line PL-2.

[0160] Reference Figure 19 The protrusions PP arranged on the third sidewall S3 can form grooves GV along the first direction DR1 and be arranged accordingly. The protrusions PP arranged on the fourth sidewall S4 can form grooves GV along the first direction DR1 and be arranged accordingly. The spacing between adjacent protrusions PP arranged on the third sidewall S3 or the fourth sidewall S4 in the first direction DR1 can correspond to the grooves GV.

[0161] Figure 19 An exemplary embodiment shows a plurality of third joints AP2a disposed on the outer surface of the third sidewall S3 and respectively engaged with the second stamping line PL-2. However, the embodiment is not limited thereto, and the third joints AP2a may also be configured as integral joints extending in a direction parallel to the outer surface of the third sidewall S3 and overlapping with the second stamping line PL-2, so as to engage the second stamping line PL-2 to the third sidewall S3.

[0162] The second stamping lines PL-2 can be inserted into the corresponding slots GV located on the third sidewall S3 or the fourth sidewall S4. The second stamping lines PL-2 inserted into the corresponding slots GV can be arranged separately along the first direction DR1.

[0163] Each of the second stamping lines PL-2 can extend along the second direction DR2, and the second stamping lines PL-2 can be arranged spaced apart from each other in the first direction DR1.

[0164] The portion adjacent to the third end of the second stamping line PL-2 can be joined to the third sidewall S3 via the third joint AP2a. Although in Figure 19 The portion not shown in the diagram, but adjacent to the fourth end of the second stamping line PL-2, can be joined to the fourth sidewall S4 via the fourth joint.

[0165] In the region corresponding to the frame opening FR-O, the first stamping line PL-1 and the second stamping line PL-2 may intersect and overlap each other. Specifically, in the region corresponding to the frame opening FR-O, each of the first stamping lines PL-1 extends along the first direction DR1, and the first stamping lines PL-1 are spaced apart from each other in the second direction DR2. Each of the second stamping lines PL-2 may extend along the second direction DR2, and the second stamping lines PL-2 may be spaced apart from each other in the first direction DR1.

[0166] In the region corresponding to the frame opening FR-O, the second stamping line PL-2 may be arranged on the first stamping line PL-1. However, it is not limited thereto; depending on the formation sequence, the first stamping line PL-1 may also be arranged on the second stamping line PL-2 in the region corresponding to the frame opening FR-O.

[0167] The first stamping line PL-1 and the second stamping line PL-2, which intersect and overlap each other, can be defined as a mask forming the deposition opening. That is, a mask according to an embodiment of the present invention may include the first stamping line PL-1 and the second stamping line PL-2 that intersect each other on a plane.

[0168] Each of the line openings PL-O can be defined by being surrounded by an adjacent first stamping line PL-1 in the second direction DR2 and an adjacent second stamping line PL-2 in the first direction DR1, wherein the second stamping line PL-2 intersects the first stamping line PL-1 in a plane. The line opening PL-O defined by the first stamping line P-1 and the second stamping line P-2 can overlap with the frame opening FR-O in a plane.

[0169] Reference Figure 20 The extension direction and arrangement of the second stamping line PL-2b are the same as Figure 19 The situation is different for the second stamping line PL-2.

[0170] about Figure 20 The extension direction and arrangement of the first stamping line PL-1 extending along the first direction DR1 can be applied in the same way. Figure 7 Based on the stamping line PL and the above explanation, the following explanation will focus on the second stamping line PL-2b.

[0171] Reference Figure 20 Each of the first stamping lines PL-1 can extend along the first direction DR1 via the frame opening FR-O, and bends along the thickness direction from the portion extending along the first direction DR1 to join the outer surfaces of the first sidewall S1 and the second sidewall S2. A portion of the second stamping lines PL-2b can extend along the fourth direction DR4 via the frame opening FR-O, and bends along the thickness direction from the portion extending along the fourth direction DR4 to join the outer surfaces of the second sidewall S2 and the fourth sidewall S4. The remaining portions of the second stamping lines PL-2b can extend along the fourth direction DR4 via the frame opening FR-O, and bend along the thickness direction from the portion extending along the fourth direction DR4 to join the outer surfaces of the first sidewall S1 and the third sidewall S3.

[0172] The first stamping line PL-1 can be inserted into the corresponding slot GV located on the first sidewall S1 or the second sidewall S2. The first stamping lines PL-1 inserted into the corresponding slot GV can be arranged separately along the second direction DR2.

[0173] A portion of the second stamping lines PL-2b can be inserted into corresponding slots GV located on the second sidewall S2 or the fourth sidewall S4. The portion of the second stamping lines PL-2b inserted into the corresponding slots GV can be arranged in a plane at intervals along a direction intersecting the fourth direction DR4.

[0174] The remaining portion of the second stamping lines PL-2b can be inserted into the corresponding slots GV located on the first sidewall S1 or the third sidewall S3. The remaining portion of the second stamping lines PL-2b inserted into the corresponding slots GV can be arranged spaced apart on the plane along a direction intersecting the fourth direction DR4. The arrangement direction of the second stamping lines PL-2b can vary depending on the position of the slot GV into which they are inserted.

[0175] In the region corresponding to the frame opening FR-O, the first stamping line PL-1 and the second stamping line PL-2b may intersect and overlap each other. Specifically, in the region corresponding to the frame opening FR-O, each of the first stamping lines PL-1 may extend along a first direction DR1, and each of the second stamping lines PL-2b may extend along a fourth direction DR4 that intersects the first direction DR1. In the region corresponding to the frame opening FR-O, the first stamping lines PL-1 are spaced apart from each other in the second direction DR2, and the second stamping lines PL-2b are spaced apart from each other in the direction that intersects the first direction DR1, the second direction DR2, and the fourth direction DR4.

[0176] The first stamping line PL-1 and the second stamping line PL-2b, which intersect and overlap each other, can define a line opening PL-O. Each of the line openings PL-O can be defined by being surrounded by the first stamping line PL-1 and the second stamping line PL-2b, wherein the first stamping line PL-1 is adjacent in the second direction DR2, and the second stamping line PL-2b intersects the first stamping line PL-1 in a plane. The line opening PL-O defined by the first stamping line PL-1 and the second stamping line PL-2b can overlap with the frame opening FR-O in a plane.

[0177] The direction of extension of the first stamping line PL-1 and the second stamping line PL-2b, and the position of the groove GV into which the first stamping line PL-1 and the second stamping line PL-2b are inserted, can vary depending on the width and spacing of the protrusion 221 of the combined mold component 200.

[0178] Reference Figure 21 The omission of the first stamping line PL-1 is consistent with... Figure 21 The situation is different for stamped parts 300. Figure 21 In the illustrated embodiment, except for the omission of the first stamping line PL-1, the same reference can be applied. Figure 20 The above explanation.

[0179] Reference Figure 22 The extension direction and arrangement of the first stamping line PL-1b are the same as those of the other two stamping lines. Figure 20The situation is different for the first stamping line PL-1. Except for the extension direction and arrangement of the first stamping line PL-1b, the same reference can be applied. Figure 20 Therefore, the extension direction and arrangement of the first stamping line PL-1b will be explained in detail above.

[0180] Reference Figure 22 A portion of the first stamping line PL-1b may extend through the frame opening FR-O in a direction intersecting the fourth direction DR4, and bends along the thickness direction from the portion extending in a direction perpendicular to the fourth direction DR4 to join the outer surfaces of the first sidewall S1 and the second sidewall S2. The remaining portion of the first stamping line PL-1b may extend through the frame opening FR-O in a direction intersecting the fourth direction DR4, and bends along the thickness direction from the portion extending in a direction intersecting the fourth direction DR4 to join the outer surfaces of the third sidewall S3 and the fourth sidewall S4.

[0181] The first stamping line PL-1b can be inserted into the corresponding slot GV located on the first sidewall S1 or the third sidewall S3. The first stamping lines PL-1 inserted into the corresponding slot GV can be arranged at intervals along a direction intersecting the fourth direction DR4.

[0182] The remaining portion of the first stamping lines PL-1b can be inserted into the corresponding slots GV located on the second sidewall S2 or the fourth sidewall S4. The remaining portion of the first stamping lines PL-1b inserted into the corresponding slots GV can be arranged spaced apart along the fourth direction DR4 on the plane.

[0183] In the region corresponding to the frame opening FR-O, the first stamping line PL-1b and the second stamping line PL-2b may intersect and overlap each other. Specifically, in the region corresponding to the frame opening FR-O, each of the second stamping lines PL-2b may extend along the fourth direction DR4, and the first stamping line PL-1b may extend along the direction intersecting the fourth direction DR4.

[0184] The above description refers to the preferred embodiments of the present utility model. However, it can be understood by those skilled in the art or those with general knowledge of the art that to which the present utility model pertains that various modifications and alterations can be made to the present utility model without departing from the concept and technical scope of the present utility model as described in the claims.

[0185] Therefore, the technical scope of this utility model is not limited to the contents described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A stamp assembly, characterized by Comprising: an impression member having a plurality of protrusions arranged in a first direction and a second direction; a punch member including a plurality of punch lines, wherein the plurality of punch lines includes punch lines alternately arranged with and arranged between adjacent protrusions of the plurality of protrusions arranged in the first direction.

2. The impression assembly of claim 1, wherein: the punch member is arranged between the plurality of protrusions in a manner movable in an extension direction of the protrusions, a diameter of each of the plurality of punch lines is smaller than a spacing distance between the plurality of protrusions.

3. The impression assembly of claim 1, wherein: the punch member further includes: first, second, third, and fourth side walls defining a frame opening; and a frame defining grooves arranged in an extension direction of the first to fourth side walls, each of the plurality of punch lines is inserted into a corresponding groove of the grooves.

4. The impression assembly of claim 3, wherein: the frame further includes: protrusions arranged on at least a pair of side walls of the first to fourth side walls facing each other and spaced apart from each other, the first and second side walls extend in the second direction and face each other in the first direction across the frame opening, the third and fourth side walls extend in the first direction and face each other in the second direction across the frame opening, each of the grooves corresponds to a spacing space between the protrusions.

5. The impression assembly of claim 3, wherein: each of the plurality of punch lines includes a first end and a second end, the first end is arranged on an outer surface of any one of the first to fourth side walls, and the second end is arranged on an outer surface of a side wall different from the any one of the first to fourth side walls.

6. The impression assembly of claim 3, wherein: each of the plurality of punch lines is bent in a thickness direction to be coupled to an outer surface of the frame, the plurality of punch lines includes two or more punch lines inclined and coupled on the outer surface in different directions from each other.

7. The impression assembly of claim 3, wherein: the plurality of punch lines includes: first punch lines; and second punch lines extending in different directions from an extension direction of the first punch lines, the first punch lines and the second punch lines cross each other in a plane and define line openings overlapping the frame opening, each of the plurality of protrusions is inserted into a corresponding line opening to be coupled to the line opening.

8. The impression assembly of claim 7, wherein: in the plurality of punch lines, each of the first punch lines extends in the first direction and is arranged in the second direction, each of the second punch lines extends in the second direction and is arranged in the first direction.

9. The impression assembly of claim 7, wherein: each of the first punch lines extends in the first direction and is arranged in the second direction, each of the second punch lines extends in a third direction and is arranged in a fourth direction crossing the third direction, wherein the third direction crosses the first direction and the second direction.

10. The die assembly of claim 7, wherein each of the first punch lines extends in a third direction and is arranged in a fourth direction crossing the third direction, each of the second punch lines extends in the fourth direction and is arranged in the third direction crossing the fourth direction, wherein the third direction and the fourth direction respectively cross the first direction and the second direction.

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