Wafer heating device

Abstract

The utility model discloses a wafer heating device. The wafer heating device comprises a mounting rack, a base and a driving mechanism, the mounting frame is mounted at the bottom of the reaction chamber; the base is provided with a wafer bearing surface, a heating structure is arranged in the base to heat the wafer bearing surface, and the base is used for bearing and heating a wafer; the driving mechanism is installed on the installation frame and used for driving the base to ascend and descend. According to the utility model, the wafer is borne and heated through the heating structure, and the lifting motion of the base is realized by utilizing the driving mechanism, so that the base can move to a process position to execute heating and deposition operation. Compared with an existing heating device combining a carrying table and a heating lamp, the heating device has the advantages that the carrying table can be omitted in the mode that the base bears and heats the wafer, so that the structure is more compact, the size of the device is effectively reduced, and the structure of the device is simplified.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer heating device. Background Technology

[0002] In the semiconductor manufacturing process, materials need to be deposited on the surface of the wafer. During the deposition process, the wafer also needs to be heated in order to achieve a good deposition effect.

[0003] Existing heating devices include a stage, a heating module, and a lifting assembly. The stage has a bearing surface, with the center of the bearing surface used to place the wafer to be heated. The lifting assembly is used to cooperate with a robotic arm to pick up and place the wafer. After the stage rises to the process position, the lifting assembly descends to place the wafer on the bearing surface of the stage. The heating module heats the bearing surface from below the stage. However, existing heating devices still have the problems of complex structure and large size. Utility Model Content

[0004] This invention provides a wafer heating device to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A wafer heating device includes: a mounting frame, a base, and a driving mechanism; the mounting frame is used to be installed at the bottom of a reaction chamber; the base has a wafer bearing surface, and a heating structure is provided inside the base to heat the wafer bearing surface, and the base is used to support and heat the wafer; the driving mechanism is installed on the mounting frame and is used to drive the base to move up and down.

[0007] Preferably, the base includes: a hollow shaft, a base, and a top cover; the base is fixedly sleeved on the top end of the hollow shaft, the top cover is installed on the base, and the wafer bearing surface is located on the top cover; the heating structure includes a heating tube, a heating tube mounting cavity is formed between the base and the top cover, and the heating tube passes through the hollow shaft and is coiled inside the heating tube mounting cavity.

[0008] Preferably, the base has needle holes through which multiple pins of the pin lifting mechanism pass, and the multiple pins are used to support the lifting of the wafer.

[0009] Preferably, the base is fixed with a number of positioning pins corresponding to the number of ejector pins, and the upper cover is provided with positioning holes corresponding to the positioning pins. The positioning pins are inserted into the corresponding positioning holes but do not protrude from the positioning holes.

[0010] Preferably, the needle hole is located at the positioning post.

[0011] Preferably, the drive mechanism includes: a lead screw rotatably mounted on the mounting frame, a lead screw nut that is screw-driven by the lead screw, a transmission mechanism, and a rotary power source mounted on the mounting frame; the rotary power source drives the lead screw to rotate via the transmission mechanism, the lead screw drives the lead screw nut to rise and fall, and the lead screw nut drives the base to rise and fall.

[0012] Preferably, the drive mechanism further includes a slider mounting plate, which is fixedly connected to a lead screw nut, and the slider mounting plate drives the base to rise and fall.

[0013] Preferably, the drive mechanism further includes a guide assembly, which is disposed between the slider mounting plate and the mounting bracket, and guides the movement of the slider mounting plate.

[0014] Preferably, the mounting bracket includes: a base plate, a guide rail mounting plate, and a power mounting plate;

[0015] The base plate is used to connect to the bottom of the reaction chamber;

[0016] The power mounting plate is located on the side of the base plate away from the bottom of the reaction chamber, and the power mounting plate is used to install the rotary power source;

[0017] The guide rail mounting plate is set between the base plate and the power mounting plate, and the guide rail mounting plate is fixedly connected to both the base plate and the power mounting plate.

[0018] One end of the lead screw is rotatably connected to the base plate, and the other end is connected to the transmission mechanism. The lead screw is located on the side of the guide rail mounting plate facing the rotating power source.

[0019] The slider mounting plate includes a first mounting plate and a second mounting plate. One end of the first mounting plate is fixedly connected to the lead screw nut, and the other end passes through a clearance hole opened on the guide rail mounting plate and is fixedly connected to the second mounting plate. The second mounting plate is located on the side of the guide rail mounting plate away from the lead screw nut. In the direction perpendicular to the movement of the lead screw nut, both ends of the second mounting plate extend out of the first mounting plate to become free ends.

[0020] The guide assembly consists of two sets, both of which are located between the free end and the guide rail mounting plate and on both sides of the first mounting plate.

[0021] Preferably, the base is connected to the bellows assembly, and the bellows assembly is connected to the slider mounting plate.

[0022] Beneficial effects:

[0023] This application discloses a wafer heating device that supports and heats the wafer through a heating structure and uses a drive mechanism to move the base vertically, allowing the base to be moved to the process position to perform heating and deposition operations. Compared to existing heating devices that combine a stage and a heating lamp, the method of supporting and heating the wafer using the base in this application eliminates the need for a stage, resulting in a more compact structure, effectively reducing the size of the device and simplifying its structure. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a wafer heating device disclosed in this utility model. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the structure of a wafer heating device disclosed in this utility model. Figure 2 ;

[0027] Figure 3 This is a front view of a wafer heating device disclosed in this utility model;

[0028] Figure 4 for Figure 3 Sectional view of AA.

[0029] 1. Mounting bracket; 11. Base plate; 111. Adjusting screw assembly; 12. Guide rail mounting plate; 13. Power mounting plate; 14. Front stiffener plate; 15. Rear stiffener plate; 16. Bearing support; 2. Base; 21. Hollow shaft; 22. Base; 221. Positioning pin; 24. Top cover; 31. Lead screw; 32. Lead screw nut; 33. Transmission mechanism; 34. Rotary power source; 35. Slider mounting plate; 351. First mounting plate; 352. Second mounting plate; 3521. Free end; 36. Guide assembly; 4. Ejector pin; 5. Bellows assembly; 51. Bellows mounting block; 52. Welded bellows assembly; 53. End cover. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0031] A wafer heating device, combined with Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the device includes: a mounting frame 1, a base 2, and a drive mechanism. The mounting frame 1 is used to mount to the bottom of the reaction chamber. The base 2 has a wafer-bearing surface, and a heating structure is provided inside the base 2 to heat the wafer-bearing surface. The base 2 is used to support and heat the wafer. The drive mechanism is mounted on the mounting frame 1 and is used to drive the base 2 to move up and down. The heating device of this application supports and heats the wafer, and uses the drive mechanism to realize the lifting and lowering movement of the base 2. When the robot enters the reaction chamber to pick up and drop the wafer, the base 2 is located below the process position to make way for the robot. After the wafer is placed on the wafer-bearing surface, the robot withdraws, and the base 2 rises and moves to the process position to perform heating and deposition operations. Compared with the existing heating devices that combine a stage and a heating lamp, the method of supporting and heating the wafer using the base 2 in this application can eliminate the stage, thereby making the structure more compact, effectively reducing the size of the device and simplifying its structure.

[0032] Preferably, the base 2 includes a hollow shaft 21, a base 22, and a top cover 24; the base 22 is fixedly sleeved on the top end of the hollow shaft 21, the top cover 24 is mounted on the base 22, and the wafer bearing surface is located on the top cover 24; the heating structure includes a heating tube, a heating tube mounting cavity is formed between the base 22 and the top cover 24, and the heating tube passes through the hollow shaft 21 and is coiled inside the heating tube mounting cavity. The heat generated by the heating tube is transferred to the wafer through the top cover 24, achieving uniform heating of the wafer.

[0033] Preferably, the base 2 has needle holes through which multiple ejector pins 4 of the ejector pin lifting mechanism pass, and the multiple ejector pins 4 are used to support the lifting and lowering of the wafer. When the ejector pins 4 are raised, they can lift the wafer and cooperate with the robot arm to transfer the wafer; when the ejector pins 4 are lowered, they can drive the wafer to fall, so as to place the wafer on the upper surface of the upper cover 24 of the base 2.

[0034] Preferably, the base 22 is fixed with positioning posts 221 in number corresponding to the number of ejector pins 4, and the upper cover 24 is provided with positioning holes corresponding to the positioning posts 221. The positioning posts 221 are inserted into the corresponding positioning holes but do not protrude from the positioning holes. The positioning of the upper cover 24 is achieved by the cooperation of the positioning posts 221 and the positioning holes, and the wafer can be reliably placed on the upper surface of the upper cover 24.

[0035] Preferably, the needle hole is formed at the positioning post 221. Compared with forming a needle hole by forming a through hole on the base 22 and the top cover 24, forming a needle hole on the positioning post 221 is beneficial for processing and ensures processing accuracy.

[0036] Preferably, the drive mechanism includes: a lead screw 31 rotatably mounted on the mounting frame 1, a lead screw nut 32 that is screwed to the lead screw 31, a transmission mechanism 33, and a rotary power source 34 mounted on the mounting frame 1; the rotary power source 34 drives the lead screw 31 to rotate via the transmission mechanism 33, the lead screw 31 drives the lead screw nut 32 to rise and fall, and the lead screw nut 32 drives the base 2 to rise and fall, thereby enabling the base 2 to rise to the process position.

[0037] Preferably, the drive mechanism further includes a slider mounting plate 35, which is fixedly connected to the lead screw nut 32. The slider mounting plate 35 drives the base 2 to rise and fall, and the slider mounting plate 35 facilitates the connection between the base 2 and the lead screw nut 32.

[0038] Preferably, the drive mechanism further includes a guide assembly 36, which is disposed between the slider mounting plate 35 and the mounting bracket 1. The guide assembly 36 guides the movement of the slider mounting plate 35 to ensure that the base 2 can be raised and lowered stably.

[0039] Preferably, the mounting bracket 1 includes: a base plate 11, a guide rail mounting plate 12, and a power mounting plate 13; the base plate 11 is used to connect to the bottom of the reaction chamber; the power mounting plate 13 is located on the side of the base plate 11 away from the bottom of the reaction chamber, and the power mounting plate 13 is used to mount the rotary power source 34; the guide rail mounting plate 12 is located between the base plate 11 and the power mounting plate 13, and the guide rail mounting plate 12 is fixedly connected to the base plate 11 and the power mounting plate 13 respectively; one end of the lead screw 31 is rotatably connected to the base plate 11, and the other end is connected to the transmission mechanism 33, and the lead screw 31 is located on the side of the guide rail mounting plate 12 facing the rotary power source 34; the slider mounting plate 35 covers... The system includes a first mounting plate 351 and a second mounting plate 352. One end of the first mounting plate 351 is fixedly connected to the lead screw nut 32, and the other end passes through a clearance hole opened on the guide rail mounting plate 12 and is fixedly connected to the second mounting plate 352. The second mounting plate 352 is located on the side of the guide rail mounting plate 12 away from the lead screw nut 32. In the direction perpendicular to the movement of the lead screw nut 32, both ends of the second mounting plate 352 extend out of the first mounting plate 351 to become free ends 3521. There are two sets of guide components 36, and both sets of guide components 36 are located between the free ends 3521 and the guide rail mounting plate 12 and are respectively located on both sides of the first mounting plate 351. The lead screw 31, guide rail mounting plate 12, guide assembly 36, and slider mounting plate 35 have partially overlapping positions in the horizontal direction, which reduces the distance between the second mounting plate 352 and the lead screw 31, making the overall structure more compact. The guide assembly 36 is closer to the second mounting plate 352, which can better support and guide the second mounting plate 352. The two sets of guide assemblies 36 are located on both sides of the line of action of the lead screw 31 on the first mounting plate 351, which makes the guiding effect better. The increased distance between the line of action of the lead screw 31 on the first mounting plate 351 and the two sets of guide assemblies 36, which serve as fulcrums, makes the second mounting plate 352 connecting the base 2 closer to the two sets of guide assemblies 36, which helps to improve the rigidity of the structure and thus ensure the accuracy of linear motion.

[0040] Preferably, the base 2 is connected to the bellows assembly 5, the bellows assembly 5 is connected to the slider mounting plate 35, and the bellows assembly 5 is used to connect to the bottom of the reaction chamber for sealing.

[0041] Specifically, the bellows assembly 5 includes: a bellows mounting block 51, a welded bellows assembly 52, and an end cap 53. The side of the bellows mounting block 51 is connected to the second mounting plate 352. The lower end of the welded bellows assembly 52 is fixed to the upper surface of the bellows mounting block 51, and the upper end is fixed to the bottom of the reaction chamber. The bottom end of the hollow shaft 21 of the base 2 is installed in the inner hole of the bellows mounting block 51, and the top end passes through the welded bellows assembly 52 and the bottom wall of the reaction chamber to enter the reaction chamber. The end cap 53 is installed at the bottom of the inner hole of the bellows mounting block 51 for sealing.

[0042] Specifically, a circular hole is provided on the base plate 11 for the corrugated pipe assembly 52 to pass through.

[0043] Specifically, the base plate 11 and the power mounting plate 13 are both horizontally arranged, while the guide rail mounting plate 12 is vertically arranged. The top end of the guide rail mounting plate 12 abuts against and is fixed to the lower surface of the base plate 11, and the bottom end of the guide rail mounting plate 12 abuts against and is fixed to the upper surface of the power mounting plate 13, so as to facilitate the installation and debugging of the drive structure.

[0044] Specifically, three sets of adjusting screw assemblies 111 are installed on the base plate 11. The screws of the adjusting screw assemblies 111 pass through the base plate 11 and are fixed by nuts and washers on the upper and lower sides of the base plate 11. The adjusting screw assemblies 111 also have a set of nuts and washers located above the base plate 11 for connecting the reaction chamber. By adjusting the three sets of adjusting screw assemblies 111, the base plate 11 can be leveled.

[0045] Specifically, a front stiffener 14 and a rear stiffener 15 are provided at the angle between the base plate 11 and the guide rail mounting plate 12 for reinforcement. One front stiffener 14 is installed on the side of the guide rail mounting plate 12 facing the bellows assembly 5 and located between the two sets of guide assemblies 36; two rear stiffeners 15 are installed on the side of the guide rail mounting plate 12 facing the rotary power source 34 and located on both sides of the guide rail mounting plate 12.

[0046] Specifically, the top end of the lead screw 31 is rotatably connected to the base plate 11, and the bottom end passes through the bearing support 16. The lead screw 31 is rotatably connected to the bearing support 16, and the side of the bearing support 16 is fixedly installed on the guide rail mounting plate 12. The bearing support 16 supports the lead screw 31.

[0047] Specifically, the rotary power source 34 is a motor installed above the power mounting plate 13, and the transmission mechanism 33 is a synchronous belt transmission mechanism; the motor output end passes through the power mounting plate 13 and is connected to the first synchronous pulley, the bottom end of the lead screw 31 passes through the power mounting plate 13 and is connected to the second synchronous pulley, and the synchronous belt connects the first synchronous pulley and the second synchronous pulley.

[0048] Specifically, the first mounting plate 351 is perpendicular to the second mounting plate 352 and is integrally formed, meaning the slider mounting plate 35 is a horizontal "T"-shaped block. The guide assembly 36 uses a guide rail, the track of which is mounted on the guide rail mounting plate 12, and the slider of the guide rail is mounted on the free end 3521 of the second mounting plate 352.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer heating device, characterized in that, The utility model relates to a kind of reaction chamber heating device, including: Mounting frame (1), pedestal (2) and drive mechanism; The mounting frame (1) is used to install to reaction chamber bottom; The pedestal (2) has wafer bearing surface, heating structure is equipped in the pedestal (2), and the wafer bearing surface is heated, and the pedestal (2) is used to support and heat wafer; The drive mechanism is installed on the mounting frame (1), for driving the pedestal (2) to lift, and the drive mechanism includes: screw rod (31) rotationally installed on the mounting frame (1), screw rod nut (32) screw transmission with the screw rod (31), transmission mechanism (33) and rotating power source (34) installed on the mounting frame (1);The rotating power source (34) drives the screw rod (31) to rotate through the transmission mechanism (33), and the screw rod (31) drives the screw rod nut (32) to lift, and the screw rod nut (32) drives the pedestal (2) to lift.

2. The wafer heating apparatus of claim 1, wherein The pedestal (2) includes: hollow shaft (21), base (22) and upper cover (24);The base (22) is fixedly sleeved at the top of the hollow shaft (21), the upper cover (24) is installed on the base (22), and the wafer bearing surface is arranged on the upper cover (24);The heating structure includes heating pipe, the base (22) and the upper cover (24) form heating pipe installation cavity, and the heating pipe is wound in the heating pipe installation cavity through the hollow shaft (21).

3. The wafer heating apparatus of claim 2, wherein A plurality of needles (4) of the needle lifting mechanism are provided on the pedestal (2), and the plurality of needles (4) are used to support wafer lifting.

4. The wafer heating apparatus of claim 3, wherein A plurality of positioning columns (221) corresponding to the number of needles (4) are fixedly arranged on the base (22), and a plurality of positioning holes corresponding to the positioning columns (221) are arranged on the upper cover (24).

5. The wafer heating apparatus of claim 4, wherein The needle hole is arranged at the positioning column (221).

6. The wafer heating apparatus of claim 1, wherein The drive mechanism further includes a sliding block mounting plate (35), and the sliding block mounting plate (35) is fixedly connected to the screw rod nut (32).

7. The wafer heating apparatus of claim 6, wherein The drive mechanism further includes a guide assembly (36), and the guide assembly (36) is arranged between the sliding block mounting plate (35) and the mounting frame (1).

8. The wafer heating apparatus of claim 7, wherein The mounting frame (1) includes a bottom plate (11), a guide rail mounting plate (12), and a power mounting plate (13). The bottom plate (11) is used to connect the bottom of the reaction chamber. The power mounting plate (13) is arranged on the side of the bottom plate (11) away from the bottom of the reaction chamber, and the power mounting plate (13) is used to mount the rotating power source (34). The guide rail mounting plate (12) is arranged between the bottom plate (11) and the power mounting plate (13), and the guide rail mounting plate (12) is fixedly connected to the bottom plate (11) and the power mounting plate (13). One end of the lead screw (31) is rotatably connected to the bottom plate (11), and the other end is connected to the transmission mechanism (33). The lead screw (31) is located on the side of the guide rail mounting plate (12) facing the rotary power source (34); The sliding block mounting plate (35) comprises a first mounting plate (351) and a second mounting plate (352). One end of the first mounting plate (351) is fixedly connected to the lead screw nut (32), and the other end is fixedly connected to the second mounting plate (352) after passing through the clearance hole provided on the guide rail mounting plate (12). The second mounting plate (352) is located on the side of the guide rail mounting plate (12) away from the lead screw nut (32). In the direction perpendicular to the movement direction of the lead screw nut (32), both ends of the second mounting plate (352) extend out of the first mounting plate (351) to become free ends (3521). The guide assembly (36) is two groups. Both groups of the guide assembly (36) are located between the free end (3521) and the guide rail mounting plate (12) and are respectively located on both sides of the first mounting plate (351).

9. The wafer heating apparatus of claim 6, wherein The base (2) is connected with the bellows assembly (5), and the bellows assembly (5) is connected with the sliding block mounting plate (35).

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