Tool for detecting sealing performance of chip packaging

Abstract

The utility model discloses a tool for detecting the sealing performance of chip packaging, and belongs to the technical field of chip packaging. The device comprises a base, a support and a detection assembly, the support is a U-shaped block, a notch is formed in the support, the detection assembly comprises a fixed seat, the fixed seat is installed in the notch, a first blind hole is formed in the bottom of the fixed seat, an electric push rod is installed in the first blind hole, a detection box is installed at the moving end of the electric push rod, and a suction cup is installed in the detection box. Two second blind holes are formed in the top of the fixing base, air pumps are installed in the second blind holes, air inlet holes are formed in the bottom faces of the inner walls of the second blind holes, air inlet pipes are arranged in the air inlet holes, two through holes are formed in the detection box, the two air inlet pipes penetrate through the through holes to enter the detection box, and one air inlet pipe enters the suction cup. According to the utility model, the chip is fixed through the sucker, so that the chip is prevented from deviating in the detection process to influence the detection result, qualified and unqualified chips are sorted at the same time, and the problem that the chip packaging tightness is difficult to measure is solved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically a tooling for testing the sealing performance of chip packaging. Background Technology

[0002] In electronics, a chip is a miniaturized circuit (mainly including semiconductor devices, but also passive components), often fabricated on the surface of a semiconductor wafer. Integrated circuits fabricated on the surface of semiconductor chips are also called thin-film integrated circuits (TFT-ICs). Another type, thick-film ICs, are miniaturized circuits composed of independent semiconductor devices and passive components integrated onto a substrate or circuit board. Chip packaging is the outer casing used to mount semiconductor IC chips, serving to place, fix, seal, protect the chip, and enhance its electrothermal performance. The contacts on the chip are connected to the pins of the package casing by wires, and these pins are then connected to other devices via wires on the printed circuit board. Existing technology discloses a chip packaging sealing performance testing device (CN 219675376) that uses a gas cylinder to pressurize the inside of the chip with high-pressure gas. If the sealing is insufficient, leakage will occur, and a piece of paper installed around the chip will move under the gas pressure. The sealing performance is judged by the movement of the paper. However, this technology does not fix the chip in place, making it prone to displacement during testing and affecting the test results. Utility Model Content

[0003] The purpose of this invention is to provide a tooling for testing the sealing performance of chip packaging. The tooling uses a suction cup to fix the chip in place, preventing the chip from shifting during the testing process and affecting the test results. It also sorts out qualified and unqualified chips, thus solving the problem of difficulty in measuring the sealing performance of chip packaging.

[0004] This utility model is achieved through the following technical solution:

[0005] This utility model is a tooling for testing the sealing performance of chip packaging, including a base, a bracket and a testing component. The bracket is a U-shaped block with a slot on it.

[0006] The detection assembly includes a fixed base installed in a slot. A first blind hole is provided at the bottom of the fixed base, and an electric push rod is installed in the first blind hole. A detection box is installed on the moving end of the electric push rod, and a suction cup is installed in the detection box. Two second blind holes are provided at the top of the fixed base, and an air pump is installed in each of the second blind holes. An air inlet is provided on the bottom surface of the inner wall of the second blind hole, and an air inlet pipe is provided in the air inlet. Two through holes are provided on the detection box, and two air inlet pipes pass through the through holes to enter the detection box, and one air inlet pipe enters the suction cup.

[0007] Furthermore, three slots are provided on each of the four sides of the detection box, and a lightweight film is placed in the slot.

[0008] Furthermore, two horizontal slots are provided on the base, and a lead screw and slider mechanism is installed in each of the horizontal slots.

[0009] Furthermore, the moving end of the lead screw and slider mechanism is fixedly connected to the bottom of the bracket, and two storage slots are provided on the base.

[0010] Furthermore, another air inlet pipe is equipped with an air nozzle, through which gas is injected into the chip package.

[0011] This utility model has the following beneficial effects:

[0012] This utility model is equipped with a detection component. The detection box is raised and lowered by an electric push rod so that the suction cup comes into contact with the chip to be tested. An air pump extracts the air from the gap between the suction cup and the chip to be tested, so that the suction cup fixes the chip to be tested. Gas is injected into the chip encapsulation through an air nozzle. The lightweight film at the leakage point will be blown out by the leaked gas, thereby completing the sealing test.

[0013] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the tooling used for testing;

[0015] Figure 2 This is a structural diagram of the fuselage;

[0016] Figure 3 This is a cross-sectional structural diagram of the fixed component.

[0017] In the diagram: 1. Base; 2. Lead screw and slider mechanism; 3. Bracket; 4. Detection component; 101. Horizontal groove; 102. Storage groove; 301. Groove opening; 401. Fixing seat; 402. First blind hole; 403. Electric push rod; 404. Second blind hole; 405. Air pump; 406. Air inlet; 407. Air inlet pipe; 408. Detection box; 409. Through hole; 4010. Suction cup; 4011. Slot; 4012. Lightweight film. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-3 This utility model provides a technical solution: a tooling for testing the sealing performance of chip packaging. The base 1 has two horizontal grooves 101, and each horizontal groove 101 is equipped with a lead screw slider mechanism 2. The moving end of the lead screw slider mechanism 2 is fixedly connected to the bottom of the support 3. The support 3 is a U-shaped block with a slot 301. The base 1 has two storage slots 102.

[0021] In this embodiment, the detection component 4 is moved to the top of the chip to be tested by two lead screw slider mechanisms 2 installed on the base 1, and the qualified chips and unqualified chips after the sealing test are placed in two storage slots 102 respectively, thus completing the sorting of qualified chips and unqualified chips.

[0022] The detection component 4 includes a fixed base 401, which is installed in the slot 301. A first blind hole 402 is formed at the bottom of the fixed base 401, and an electric push rod 403 is installed inside the first blind hole 402. A detection box 408 is installed on the moving end of the electric push rod 403, and a suction cup 4010 is installed inside the detection box 408. Two second blind holes 404 are formed at the top of the fixed base 401, and an air pump 405 is installed in each of the second blind holes 404. The bottom surface of the inner wall of the second blind hole 404 is... An air inlet 406 is provided, and an air inlet pipe 407 is provided inside the air inlet 406. Two through holes 409 are provided on the detection box 408. The two air inlet pipes 407 pass through the through holes 409 and enter the detection box 408. One air inlet pipe 407 enters the suction cup 4010. Three slots 4011 are provided on each of the four sides of the detection box 408. A lightweight thin film 4012 is provided in the slots 4011. An air nozzle is provided on another air inlet pipe 407, and gas is injected into the chip encapsulation through the air nozzle.

[0023] In this embodiment, the test box 408 is lowered by the electric push rod 403, so that the suction cup 4010 installed in the test box 408 comes into contact with the chip to be tested. The air pump 405 extracts the air from the gap between the suction cup 4010 and the chip to be tested, so that the suction cup 4010 fixes the chip to be tested. Gas is injected into the chip package through the air nozzle installed on another air inlet pipe 407. If the chip package is not sealed, the lightweight thin film 4012 will be blown up by the leaked gas, thus completing the sealing test.

[0024] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A tooling for testing the hermeticity of chip packaging, characterized in that: Including support (3), the support (3) is U-shaped block, the support (3) is opened with notched (301) on it; It also includes detection assembly (4), the detection assembly (4) includes fixed seat (401), the fixed seat (401) is installed in notched (301), the first blind hole (402) is opened in the bottom of fixed seat (401), the electric push rod (403) is installed in the first blind hole (402), the detection box (408) is installed on the moving end of electric push rod (403), the suction disc (4010) is installed in the detection box (408), two second blind holes (404) are opened in the top of fixed seat (401), the air pump (405) is installed in the second blind hole (404), the air inlet (406) is opened in the bottom surface of the inner wall of second blind hole (404), the air inlet pipe (407) is arranged in the air inlet (406), two through holes (409) are opened in the detection box (408), two air inlet pipes (407) pass through the through hole (409) and enter the detection box (408), one air inlet pipe (407) enters the suction disc (4010).

2. The tool for detecting the sealing property of a chip package according to claim 1, wherein Three clamping grooves (4011) are opened in the four faces of detection box (408), the light film (4012) is arranged in the clamping groove (4011).

3. The tool for detecting the sealing property of a chip package according to claim 1, wherein It also includes base (1), two horizontal grooves (101) are opened in the base (1), the screw slide mechanism (2) is installed in the horizontal groove (101).

4. The tool for detecting the sealing property of a chip package according to claim 3, wherein The moving end of screw slide mechanism (2) is fixedly connected with the bottom of support (3), two storage grooves (102) are opened in the base (1).

5. The tool for detecting the sealing property of a chip package according to claim 1, wherein The other air inlet pipe (407) is provided with an air nozzle, and the chip package is injected with gas through the air nozzle.

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