Multi-view visual detection device for chip bonding wire detection
By using a three-phase inspection camera and a movable laser cutter in a multi-view vision inspection device, the limitations of traditional inspection methods in terms of viewing angle and flexibility are solved, and efficient and comprehensive automated processing of wire bonding inspection is achieved.
Patent Information
- Application Number
- CN202423228507.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-26
AI Technical Summary
Traditional single-view visual inspection methods cannot fully capture the fine details of the weld wire, and the fixed-position cutting laser device limits the flexibility and breadth of the inspection.
Design a multi-view visual inspection device that uses a three-phase inspection camera to perform multi-dimensional inspection from different angles and is equipped with a movable laser cutter that can automatically remove defective products.
It improves the accuracy and comprehensiveness of wire bonding inspection, simplifies the handling process of defective products, enhances inspection efficiency and equipment flexibility, and ensures the heat dissipation of the laser cutter and the reliability of inspection.
Smart Images
Figure CN223742333U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to welding visual technology field more specifically, relate to a kind of multi-view visual inspection device for chip wire bonding detection. BACKGROUND
[0002] With the development of electronic technology, the application of semiconductor devices is more and more widely, and the quality of its core components chip directly affects the performance and reliability of the final product, in the chip manufacturing process, wire bonding is the key step to connect the internal circuit of chip and external pin, the quality of wire bonding is directly related to the electrical performance and service life of chip, so the detection of wire bonding quality becomes particularly important.
[0003] The traditional single-view visual inspection method may not capture all the subtle details of the wire due to limited viewing angle, resulting in incomplete detection results, and in the traditional detection method, the cutting laser device is often in a fixed position, which limits the flexibility and universality of its application to some extent, however, with the progress of technology, now mobile laser device can be used, once the three-camera system identifies defective products, the laser device can accurately locate and cut out the problem components, such design not only enhances the efficiency of the detection process, but also simplifies the subsequent test procedure, making it more convenient to reject unqualified products, therefore, it is necessary to design a multi-view visual inspection device for chip wire bonding detection in view of the shortcomings of the prior art. SUMMARY
[0004] In order to overcome the above-mentioned shortcomings of the prior art, the utility model provides a multi-view visual inspection device for chip wire bonding detection, which can fully cover all the details of the wire by collecting multi-view images of chip wire bonding, reducing the missed detection and false detection.
[0005] The technical scheme is a multi-view visual detection device for chip wire bonding detection, comprising a rack, a feeding assembly and a discharging assembly. The rack is the assembly carrier of the detection device and is specifically composed of a machine table main body and a bottom support. The feeding assembly is arranged on the left side of the machine table of the rack and is used for conveniently feeding and discharging the chip to be detected. The discharging assembly is arranged on the right side of the machine table of the rack and is used for discharging the detected chip. Further comprising: a chip sliding rail installed on the machine table of the rack and located between the feeding assembly and the discharging assembly; a chip placement plate slidingly arranged on the chip sliding rail and used for placing the chip to be detected; an electric sliding rail one installed on the machine table of the rack close to the feeding assembly; a mounting bracket slidingly installed on the electric sliding rail one; three-phase detection cameras, three in number and respectively installed on the mounting bracket, used for multi-dimensional detection of the chip; and a moving cutting piece arranged on the side of the rack close to the discharging assembly, used for cutting off the defective product detected by the detection camera, so that the defective product can be easily excluded during subsequent lighting detection.
[0006] Further, the three-phase detection camera comprises: a detection camera one vertically installed on the bottom of the mounting bracket, the detection direction of the detection camera one being perpendicular to the conveying direction of the chip sliding rail, the detection camera one being a forward detection camera; a detection camera two obliquely installed on the side of the mounting bracket away from the feeding assembly, the detection direction of the detection camera two being toward the direction of the chip sliding rail transmission; and a detection camera three obliquely installed on the side of the mounting bracket away from the electric sliding rail one, the detection camera three being obliquely toward the detection point of the chip sliding rail. The detection camera two and the detection camera three are additional cameras of the forward camera of the detection camera one, realizing three-phase detection of the chip placed on the chip placement plate and improving the detection precision.
[0007] Further, the detection camera one, the detection camera two and the detection camera three are detachably installed on the mounting bracket, the detection angle and distance of the detection camera one, the detection camera two and the detection camera three being adjustable according to actual detection needs, and the three-phase detection camera being convenient to disassemble and maintain, improving the use flexibility of the detection device.
[0008] Further, the mobile cutting member comprises: a second electric sliding rail installed on the machine table of the machine frame near the feeding assembly; a protective plate slidably installed on the second electric sliding rail; and a laser cutter installed inside the protective plate, wherein a laser emission port of the laser cutter vertically faces the chip placement plate on the chip sliding rail, the three-phase detection camera is electrically connected with the laser cutter through an internal controller, and when the three-phase detection camera detects a defective product of the chip soldering wire, the laser cutter is controlled to cut off the defective product in a time-delay manner, thereby excluding the defective product in advance and simplifying subsequent test procedures.
[0009] Further, the protective plate of the laser cutter is provided with a plurality of side openings for heat dissipation, so that the laser cutter is protected and has good heat dissipation effect during work, and the service life of the laser cutter is prolonged.
[0010] Further, the chip sliding rail is provided with a connecting rod on one side near the feeding assembly, and a dust removal fan is installed on the connecting rod, wherein an air outlet of the dust removal fan faces the chip placement plate, and the dust removal fan is used for blowing and dust removal of the chip before detection, so as to reduce the influence of small dust in the air on the chip and the detection and judgment of the subsequent three-phase detection camera.
[0011] The utility model has the advantages of: 1, the utility model can detect the chip soldering wire from different angles through the configuration (detection camera one, detection camera two and detection camera three) of three-phase detection camera, the accuracy and comprehensiveness of detection are improved significantly, and the detection ability of complex structure soldering wire is enhanced.
[0012] 2, the utility model can control the mobile cutting member through three-phase detection camera, can control the laser cutter to cut off the defective product when detecting the defective product, thereby easily excluding the defective product in subsequent lighting detection and simplifying test procedures, and the production efficiency is improved.
[0013] 3, the protective plate of the laser cutter of the utility model is provided with a plurality of heat dissipation openings, the dust removal fan is installed on one side of the chip sliding rail near the feeding assembly, the influence of small dust in the air on the chip is effectively reduced through blowing and dust removal, and the detection and judgment results of the subsequent three-phase detection camera are more accurate and reliable. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a three-dimensional structure schematic view of the utility model.
[0015] Figure 2 It is a position relation drawing of the machine frame, chip sliding rail and chip placement plate and the like components of the utility model.
[0016] Figure 3 The utility model discloses the connection relation diagram of detecting camera one, detecting camera two and detecting camera three.
[0017] Figure 4 The utility model discloses the stereoscopic structure schematic diagram of electric sliding rail no. 2, protection board and laser cutting ware.
[0018] Figure 5 The utility model discloses the schematic diagram of cooperation relation of chip sliding rail, chip placement board and dust fan.
[0019] In the above drawing: 1: rack, 2: feeding assembly, 3: discharging assembly, 4: chip sliding rail, 5: chip placement board, 6: electric sliding rail one, 7: mounting frame, 8: detecting camera one, 9: detecting camera two, 10: detecting camera three, 11: electric sliding rail no. 2, 12: protection board, 13: laser cutting ware, 14: connecting rod, 15: dust fan. DETAILED DESCRIPTION
[0020] The technical scheme in the embodiments of the utility model will be apparently and completely described in combination with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the range of protection of the utility model.
[0021] A multi-view visual detection device for chip wire bonding detection, as shown in Figures 1-4 The utility model discloses a multi-view visual detection device for chip wire bonding detection, as shown in the drawing, including the rack 1, feeding assembly 2 and discharging assembly 3, the rack 1 is the assembly carrier of this detection device, and the rack 1 is specifically composed of the machine table main body and the bottom support, and the feeding assembly 2 is arranged on the left side of the machine table of the rack 1, and the feeding assembly 2 is used to conveniently feed and load the chip to be detected, and the discharging assembly 3 is arranged on the right side of the machine table of the rack 1, and the discharging assembly 3 is used to discharge the chip after detection, further including: chip sliding rail 4 is installed on the machine table of the rack 1, and the chip sliding rail 4 is located between the feeding assembly 2 and the discharging assembly 3, chip placement board 5 is slidably arranged on the chip sliding rail 4 and is used to place the chip to be detected, electric sliding rail one 6 is installed on the machine table of the rack 1 close to the feeding assembly 2, mounting frame 7 is slidably installed on the electric sliding rail one 6, three-phase detecting camera is provided with three and is installed on the mounting frame 7 respectively, and the three-phase detecting camera is used to satisfy the multidimensional detection of the chip, and the mobile cutting piece is arranged on the side close to the discharging assembly 3 of the rack 1, and the discharging assembly 3 is used to cut off the defective product detected by the detecting camera, and when subsequent lighting detection is carried out, the defective product can be easily eliminated.
[0022] As shown in Figures 1-3As shown, the three-phase detection camera includes: a detection camera one 8 vertically mounted on the bottom of the mounting frame 7, the detection direction of the detection camera one 8 is perpendicular to the conveying direction of the chip slide rail 4, and the detection camera one 8 is a forward detection camera; a detection camera two 9 obliquely mounted on the side of the mounting frame 7 away from the feeding assembly 2, the detection direction of the detection camera two 9 is towards the direction of transmission of the chip slide rail 4; and a detection camera three 10 obliquely mounted on the side of the mounting frame 7 away from the electric slide rail one 6, the detection camera three 10 is obliquely towards the detection point of the chip slide rail 4, the detection camera two 9 and the detection camera three 10 are added cameras of the forward camera of the detection camera one 8, three-phase detection of the chip placed on the chip placement plate 5 is realized, and the detection accuracy is improved; the detection camera one 8, the detection camera two 9 and the detection camera three 10 are all detachably mounted on the mounting frame 7, the detection angle and distance of the detection camera one 8, the detection camera two 9 and the detection camera three 10 can be adjusted according to actual detection needs, and meanwhile, the three-phase detection camera can be conveniently disassembled and maintained, and the use flexibility of the device is improved.
[0023] As shown in Figure 2 and Figure 4 As shown, the mobile cutting member includes: an electric slide rail two 11 mounted on the machine table of the rack 1 close to the feeding assembly 3; a protective plate 12 slidably mounted on the electric slide rail two 11; and a laser cutter 13 mounted inside the protective plate 12, the laser emission port of the laser cutter 13 is vertically towards the chip placement plate 5 on the chip slide rail 4, the three-phase detection camera is electrically connected with the laser cutter 13 through the built-in controller, when the three-phase detection camera detects a defective product of the chip soldering wire, the laser cutter 13 is controlled to cut off the defective product after a delay, so as to exclude the defective product in advance and thus simplify the subsequent test procedure; a plurality of side surfaces of the protective plate 12 where the laser cutter 13 is located are all provided with heat dissipation openings, the protective plate 12 protects the laser cutter 13 while making the laser cutter 13 maintain good heat dissipation effect during work, and the service life of the laser cutter 13 is improved.
[0024] As shown in Figure 2 and Figure 5 As shown, a connecting rod 14 is mounted on the side of the chip slide rail 4 close to the feeding assembly 2, and a dust removal fan 15 is mounted on the connecting rod 14, the air outlet of the dust removal fan 15 is towards the chip placement plate 5, and the dust removal fan 15 is used for blowing and dust removal of the chip before detection, so as to reduce the falling of small dust in the air into the chip and affect the detection and judgment of the subsequent three-phase detection camera.
[0025] When the chip welding wire is detected by using the detection device, first, the chip to be detected is placed on the chip placement plate 5 on the chip slide rail 4 by the feeding assembly 2, in the process, the dust removal fan 15 installed on the connecting rod 14 blows the chip to be detected to reduce the influence of small dust in the air on the surface of the chip and ensure the accuracy of subsequent detection, then the chip placement plate 5 slides along the chip slide rail 4 to the detection area, at this time, the three-phase detection camera installed on the mounting frame 7 starts to work, wherein the detection camera one 8 is perpendicular to the conveying direction of the chip slide rail 4, providing detection data of the front view, and the detection camera two 9 and the detection camera three 10 are installed at different inclined angles respectively, providing detection information of the side view, the three cameras work together to realize multi-dimensional and all-around detection of the chip welding wire, effectively improving the detection accuracy and reliability, once the three-phase detection camera detects the defective product, the built-in controller will respond immediately, and the mobile cutting part near the discharging assembly 3 is started through the electrical signal control, specifically, the protective plate 12 installed on the electric slide rail two 11 drives the laser cutter 13 to move to the specified position, then the laser cutter 13 starts to cut the defective product accurately, effectively avoiding the defective product entering the subsequent production process, simplifying the final product test procedure, in the whole operation process, the protective plate 12 where the laser cutter 13 is designed with multiple heat dissipation openings, ensuring good heat dissipation effect when the equipment runs for a long time, prolonging the service life of the laser cutter 13, finally, the chip after detection and necessary treatment is smoothly removed from the detection device by the discharging assembly 3, completing the whole detection process.
[0026] It should be understood that the embodiments are only used to illustrate the present application and not used to limit the scope of the present application. In addition, it should be understood that after reading the content taught by the present application, those skilled in the art can make various changes or modifications to the present application, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
Claims
1. A multi-view visual inspection device for chip wire bonding inspection, comprising a rack (1), a feeding assembly (2) and a discharging assembly (3), the feeding assembly (2) is arranged on one side of the left part of the machine table of the rack (1), the feeding assembly (2) is used for conveniently feeding and discharging the chip to be detected, the discharging assembly (3) is arranged on one side of the right part of the machine table of the rack (1), and the discharging assembly (3) is used for discharging the chip after detection; characterized in that further It comprises: a chip sliding rail (4) installed on the machine table of the rack (1), the chip sliding rail (4) is located between the feeding assembly (2) and the discharging assembly (3); a chip placement plate (5) slidingly arranged on the chip sliding rail (4); an electric sliding rail (6) installed on the machine table of the rack (1) close to the feeding assembly (2); a mounting bracket (7) slidingly installed on the electric sliding rail (6); three-phase detection camera, provided with three and respectively installed on the mounting bracket (7), the three-phase detection camera is used to satisfy the multi-dimensional detection of the chip; a moving cutting part arranged on one side of the rack (1) close to the discharging assembly (3), the discharging assembly (3) is used for cutting off the defective products detected by the detection camera.
2. The multi-view vision inspection apparatus for inspecting a wire bonding of a chip according to claim 1, characterized by The three-phase detection camera comprises: a detection camera (8) vertically installed on the bottom of the mounting bracket (7), the detection direction of the detection camera (8) is perpendicular to the conveying direction of the chip sliding rail (4), and the detection camera (8) is a forward detection camera; a detection camera (9) obliquely installed on one side of the mounting bracket (7) away from the feeding assembly (2), the detection direction of the detection camera (9) is toward the direction of the transmission of the chip sliding rail (4); a detection camera (10) obliquely installed on one side of the mounting bracket (7) away from the electric sliding rail (6), and the detection camera (10) is obliquely toward the detection point of the chip sliding rail (4).
3. The multi-view vision inspection apparatus for inspecting a wire bonding of a chip according to claim 2, characterized by The detection camera (8), the detection camera (9) and the detection camera (10) are all detachably installed on the mounting bracket (7), and the detection angles and distances of the detection camera (8), the detection camera (9) and the detection camera (10) can be adjusted according to actual detection needs.
4. The multi-view vision inspection apparatus for inspecting a wire bonding of a chip according to claim 3, wherein The moving cutting part comprises: an electric sliding rail (11) installed on the machine table of the rack (1) close to the discharging assembly (3); a protective plate (12) slidingly installed on the electric sliding rail (11); a laser cutting device (13) installed in the protective plate (12), a laser emission port of the laser cutting device (13) vertically faces the chip placement plate (5) on the chip sliding rail (4), and the three-phase detection camera is electrically connected with the laser cutting device (13) through a built-in controller.
5. The multi-view vision inspection apparatus for inspecting a wire bonding of a chip according to claim 4, wherein A plurality of side surfaces of the protective plate (12) where the laser cutting device (13) is located are provided with heat dissipation openings.
6. The multi-view vision inspection apparatus for inspecting a wire bonding of a chip according to claim 5, wherein A connecting rod (14) is installed on one side of the chip sliding rail (4) close to the feeding assembly (2), a dust removal fan (15) is installed on the connecting rod (14), and an air outlet of the dust removal fan (15) faces the chip placement plate (5).