Optical module

Abstract

The utility model provides an optical module, one side of an optical receiving chip is provided with a first signal bonding pad, a second signal bonding pad and a third signal bonding pad, the first signal bonding pad is used for connecting the optical receiving chip, the first signal bonding pad is connected with one end of a first high-frequency signal line, and the third signal bonding pad is connected with the other end of the first high-frequency signal line. The second signal bonding pad is connected with one end of the second high-frequency signal line, and the other side of the optical receiving chip is provided with a fourth signal bonding pad which is connected with the other end of the second high-frequency signal line. The digital signal processing chip is connected with the second signal bonding pad, and the distance between the fourth signal bonding pad and the light receiving chip is different from the distance between the third signal bonding pad and the light receiving chip. Therefore, the circuit board can be compatible with the transimpedance amplifier chip arranged outside the digital signal processing chip and the transimpedance amplifier chip arranged inside the digital signal processing chip.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, optical modules are tools for converting optical signals and electrical signals, and are one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is continuously improved. CONTENT OF THE UTILITY MODEL

[0003] The present disclosure provides an optical module, which realizes that a transimpedance amplifier chip is placed outside a digital signal processing chip and the transimpedance amplifier chip is placed inside the digital signal processing chip on a circuit board.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] a circuit board;

[0006] an optical receiving chip located on the circuit board, configured to receive an optical signal and convert the optical signal into an electrical signal;

[0007] a digital signal processing chip located on the circuit board, configured to process the electrical signal;

[0008] wherein one side of the optical receiving chip is provided with:

[0009] a first signal pad connected with one end of a first high-frequency signal line;

[0010] a second signal pad connected with one end of a second high-frequency signal line;

[0011] a third signal pad connected with the other end of the first high-frequency signal line;

[0012] the other side of the optical receiving chip is provided with:

[0013] a fourth signal pad connected with the other end of the second high-frequency signal line; the distance between the fourth signal pad and the third signal pad and the optical receiving chip is different;

[0014] the digital signal processing chip is connected with the second signal pad.

[0015] The technical scheme has the following beneficial effects: the optical module provided by the present disclosure comprises a circuit board, an optical receiving chip and a digital signal processing chip, the optical receiving chip and the digital signal processing chip are located on the circuit board, the optical receiving chip is used for receiving an optical signal and converting the optical signal into an electrical signal, and the digital signal processing chip is used for processing the electrical signal. A first signal pad, a second signal pad and a third signal pad are arranged on one side of the optical receiving chip, the first signal pad is used for connecting the optical receiving chip, one end of a first high-frequency signal line is connected to the first signal pad, and the other end of the first high-frequency signal line is connected to the third signal pad, so that the first signal pad and the third signal pad are connected through the first high-frequency signal line. The second signal pad is connected to one end of a second high-frequency signal line, and a fourth signal pad is arranged on the other side of the optical receiving chip, the fourth signal pad is connected to the other end of the second high-frequency signal line, so that the second signal pad and the fourth signal pad are connected through the second high-frequency signal line. The digital signal processing chip can be connected to the second signal pad, so that the electrical signal can be transmitted to the digital signal processing chip through the second signal pad. The digital signal processing chip can be connected to the first signal pad, so that the electrical signal can be transmitted to the digital signal processing chip through the first signal pad. The distance between the fourth signal pad and the optical receiving chip is different from the distance between the third signal pad and the optical receiving chip, and a transimpedance amplifier chip can be installed between the fourth signal pad and the optical receiving chip, so that the electrical signal of the optical receiving chip can be transmitted to the digital signal processing chip through the first high-frequency signal line and the first signal pad, or can be transmitted to the digital signal processing chip through the second high-frequency signal line and the second signal pad, thereby making the circuit board compatible with the transimpedance amplifier chip being arranged outside the digital signal processing chip or the transimpedance amplifier chip being arranged inside the digital signal processing chip.

[0016] In some embodiments, an optical module is provided, and the digital signal processing chip comprises:

[0017] a first input end connected to the first signal pad, so that the first input end receives the electrical signal transmitted by the first signal pad;

[0018] a second input end connected to the second signal pad, so that the second input end receives the electrical signal transmitted by the second signal pad.

[0019] The technical scheme has the following beneficial effects: the digital signal processing chip comprises a first input end and a second input end, the first input end is connected to the first signal pad, so that the first input end receives the electrical signal transmitted by the first signal pad; and the second input end is connected to the second signal pad, so that the second input end receives the electrical signal transmitted by the second signal pad. The digital signal processing chip can process the electrical signal input by the first input end or the second input end.

[0020] In some embodiments, a light module is provided, wherein the positive electrode and the negative electrode of the light receiving chip are located on a side of the light receiving chip close to the digital signal processing chip, and the positive electrode and the negative electrode are connected to the third signal pad respectively.

[0021] The above technical solution has the following beneficial effects: the positive electrode and the negative electrode of the light receiving chip are located on a side of the light receiving chip close to the digital signal processing chip, and the positive electrode and the negative electrode are connected to the third signal pad respectively, so that the light receiving chip is connected to the third signal pad by wire bonding, thereby shortening the wire bonding distance between the light receiving chip and the third signal pad.

[0022] In some embodiments, a light module is provided, wherein the transimpedance amplifier chip is mounted between the light receiving chip and the fourth signal pad, the positive electrode and the negative electrode of the light receiving chip are located on a side of the light receiving chip close to the transimpedance amplifier chip, and the positive electrode and the negative electrode are connected to the transimpedance amplifier chip respectively.

[0023] The above technical solution has the following beneficial effects: the transimpedance amplifier chip is mounted between the light receiving chip and the fourth signal pad, the positive electrode and the negative electrode of the light receiving chip are located on a side of the light receiving chip close to the transimpedance amplifier chip, and the positive electrode and the negative electrode are connected to the transimpedance amplifier chip respectively, so that the light receiving chip is connected to the transimpedance amplifier chip by wire bonding, thereby shortening the wire bonding distance between the light receiving chip and the transimpedance amplifier chip.

[0024] In some embodiments, a light module is provided, wherein a laser chip is mounted on the circuit board, and the laser chip is arranged side by side with the light receiving chip; one side of the laser chip is provided with:

[0025] a fifth signal pad for connecting the laser chip, and connected to one end of the third high-frequency signal line;

[0026] a sixth signal pad connected to the other end of the third high-frequency signal line;

[0027] The digital signal processing chip is connected to the sixth signal pad.

[0028] The technical scheme has the following beneficial effects: the laser chip is mounted on the circuit board, the laser chip and the light receiving chip are arranged side by side, and the distance between the laser chip and the light receiving chip and the digital signal processing chip is approximately equal. One side of the laser chip is provided with a fifth signal pad, the fifth signal pad is used for connecting the laser chip, one end of the third high-frequency signal line is connected with the fifth signal pad, so that the laser chip can be connected with the third high-frequency signal line. The sixth signal pad is connected with the other end of the third high-frequency signal line, so that the fifth signal pad and the sixth signal pad are connected through the third high-frequency signal line. The digital signal processing chip is connected with the sixth signal pad, so that the digital signal processing chip is connected with the laser chip.

[0029] In some embodiments, an optical module is provided, and the transimpedance amplifier chip includes:

[0030] A seventh signal pad is located on one side of the transimpedance amplifier chip close to the light receiving chip, and is used for connecting the light receiving chip;

[0031] An eighth signal pad is located on one side of the transimpedance amplifier chip close to the fourth signal pad, and is used for connecting the fourth signal pad.

[0032] The technical scheme has the following beneficial effects: the transimpedance amplifier chip includes the seventh signal pad and the eighth signal pad, the seventh signal pad is used for connecting the light receiving chip, so that the light receiving chip and the transimpedance amplifier chip can be connected by wire. The eighth signal pad is used for connecting the fourth signal pad, so that the transimpedance amplifier chip and the fourth signal pad can be connected by wire. The seventh signal pad is located on one side of the transimpedance amplifier chip close to the light receiving chip, so as to shorten the wire distance between the light receiving chip and the transimpedance amplifier chip. The eighth signal pad is located on one side of the transimpedance amplifier chip close to the fourth signal pad, so as to shorten the wire distance between the transimpedance amplifier chip and the fourth signal pad.

[0033] In some embodiments, an optical module is provided, and the first high-frequency signal line includes:

[0034] A first sub-high-frequency signal line is located on the surface of the circuit board, one end is used for connecting the fourth signal pad, and the other end is connected with a first electrode of a capacitor;

[0035] A second sub-high-frequency signal line is located in the interior of the circuit board, one end is connected with a second electrode of the capacitor, and the other end is connected with the second signal pad.

[0036] The technical scheme has the following beneficial effects: the first high-frequency signal line comprises a first sub high-frequency signal line and a second sub high-frequency signal line, one end of the first sub high-frequency signal line is used for connecting the fourth signal pad, so that the fourth signal pad can be connected with the first high-frequency signal line. The first sub high-frequency signal line is located on the surface of the circuit board, so as to facilitate the connection between the fourth signal pad and the first high-frequency signal line. The other end of the first sub high-frequency signal line is connected with the first electrode of the capacitor, and one end of the second sub high-frequency signal line is connected with the second electrode of the capacitor, so as to reduce the noise and interference of the high-frequency signal in transmission. The second sub high-frequency signal line is located in the interior of the circuit board, so as to reduce the influence of external electromagnetic interference on the electrical signal. The other end of the second sub high-frequency signal line is connected with the second signal pad, so that the first high-frequency signal line is connected with the second signal pad.

[0037] In some embodiments, a light module is provided, further comprising:

[0038] A light receiving component is arranged on the laser chip and the light receiving chip, and is used for transmitting and receiving optical signals.

[0039] The technical scheme has the following beneficial effects: the light receiving component is arranged on the laser chip and the light receiving chip, and is used for transmitting and receiving optical signals, so that the light module has the functions of transmitting and receiving. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0041] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided.

[0042] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided.

[0043] Figure 3 A structure diagram of a light module according to some embodiments is provided.

[0044] Figure 4 An exploded view of a light module according to some embodiments is provided.

[0045] Figure 5 An exploded view of the internal structure of a light module according to some embodiments is provided.

[0046] Figure 6A partial sectional view of an internal structure of an optical module according to some embodiments

[0047] Figure 7a A principle of an optical module according to some embodiments Figure 1

[0048] Figure 7b A principle of an optical module according to some embodiments Figure 2

[0049] Figure 8 A partial sectional view of an internal structure of an optical module according to some embodiments Figure 1

[0050] Figure 9 A partial sectional view of an internal structure of an optical module according to some embodiments Figure 2

[0051] Figure 10 A partial sectional view of an internal structure of an optical module according to some embodiments Figure 3

[0052] Figure 11 A partial sectional view of an internal structure of an optical module according to some embodiments Figure 4 DETAILED DESCRIPTION

[0053] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0054] Unless otherwise required by context, the term "comprises" in the specification and claims is to be interpreted as open, inclusive language, i.e., "comprises, but is not limited to"; the terms "first", "second", etc. are not to be interpreted as indicating relative importance or a limit on the number of items; the term "plurality" means two or more; the term "connected" is to be interpreted broadly, e.g., "connected" can be direct or indirect connection, and can be fixed or detachable connection, or integral, and can be direct or indirect connection through an intermediate medium; the use of the term "adapted to" or "configured to" means open and inclusive language that does not exclude additional tasks or steps; the terms "parallel", "perpendicular", "same", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include acceptable error ranges in practice, and also include differences based on the same design concept but due to manufacturing reasons. ​​​​​​

[0055] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light, and the transmission of information is carried out by using the propagation speed of light. The light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in an optical information transmission device, and realize long-distance transmission of the optical signal. At the same time, the cost of optical information transmission devices such as optical fibers is lower than that of electrical information transmission devices such as copper wires. Therefore, optical communication technology can realize high-speed, long-distance and low-cost information transmission.

[0056] Information processing devices usually include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc. Optical information transmission devices usually include optical fibers and optical waveguides, etc. The signals that information processing devices can recognize and process are electrical signals, while optical communication technology uses optical signals for transmission, which requires optical modules to convert optical signals and electrical signals.

[0057] The optical module can realize the mutual conversion of optical signals and electrical signals between the information processing device and the optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network unit; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network unit; a second electrical signal from the optical network unit is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0058] Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module is referred to as an electrical port.

[0059] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided. As shown in Figure 1 The optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, an optical module 200, an optical fiber 101 and a network cable 103. The optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device.

[0060] In some embodiments, one end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0061] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0062] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0063] The host computer 100 includes a housing accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that the host computer 100 and the optical module 200 establish a one-way or two-way electrical signal connection.

[0064] The host computer 100 further includes an external electrical interface that can access an electrical signal network. In some embodiments, the external electrical interface includes a universal serial bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103, so that the host computer 100 and the network cable 103 establish a one-way or two-way electrical signal connection.

[0065] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0066] In some embodiments, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and the fourth electrical signal is transmitted to the local information processing device 2000.

[0067] In some embodiments, the optical module is a tool for converting optical signals and electrical signals, and in the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding or decoding mode of the information changes.

[0068] The host computer 100 includes an optical network terminal, an optical line terminal (OLT), an optical network device (ONT), or a data center server, etc.

[0069] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 arranged in the accommodation cavity, and a cage 106 arranged on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106;

[0070] In some embodiments, the cage 106 is provided with a heat sink 107, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.

[0071] In some embodiments, the cage 106 is internally provided with an electrical connector configured to access the electrical port of the optical module 200.

[0072] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.

[0073] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish an electrical signal connection.

[0074] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0075] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0076] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0077] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, optical transceiver component 900, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0078] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0079] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0080] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0081] likeFigure 3 and Figure 4 As shown in FIG. 3, in some embodiments, the light module includes a circuit board 300 disposed in the housing, the circuit board 300 including circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding functions, etc. The electronic components may, for example, include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may, for example, include Microcontroller Units (MCUs), laser drive chips, Transimpedance Amplifiers (TIAs), Limiting Amplifiers (LAs), Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0082] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively hard material, can also realize a bearing function, such as the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0083] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently; or can be used in cooperation with the rigid circuit board.

[0084] In some embodiments, the circuit board further includes a gold finger formed on the surface of the end thereof, the gold finger being composed of a plurality of pins independent of each other.

[0085] In some embodiments, the gold finger is disposed on the surface of one side of the circuit board 300 (for example, the upper surface as shown in FIG. 3); in some embodiments, the gold finger is disposed on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins to adapt to occasions requiring a large number of pins. Figure 4

[0086] In some embodiments, the gold finger of the circuit board extends from the electrical port and is inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold finger is in conduction with the electrical connector in the cage 106. The gold finger is configured to establish electrical connection with the host computer and can realize electrical connection functions such as power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, and data signal transmission.

[0087] ​In some embodiments, the light module 200 further comprises an unlocking component 600 located outside the shell thereof. The unlocking component 600 is configured to achieve the fixed connection between the light module 200 and the host computer, or to release the fixed connection between the light module 200 and the host computer.

[0088] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and comprises a clamping component matched with the cage 106 of the host computer 100. When the light module 200 is inserted into the cage 106, the light module 200 is fixed in the cage 106 by the clamping component of the unlocking component 600; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the light module 200 and the host computer, so that the light module 200 can be pulled out of the cage 106.

[0089] In some embodiments, the light module 200 further comprises a light transceiver component 900 located inside the shell. The light transceiver component 900 can be placed on the circuit board 300. The light transceiver component 900 has both transmitting and receiving functions to achieve the transmission and reception of optical signals.

[0090] Figure 5 An exploded view of the internal structure of a light module according to some embodiments. Figure 6 A partial sectional view of the internal structure of a light module according to some embodiments. Figure 6 An assembly sectional view of the circuit board 300 and the DSP chip 301. As shown in Figure 5 and Figure 6 In some embodiments, the circuit board 300 can be provided with an optical chip 302. The optical chip 302 can be a laser chip 3021 and / or a light receiving chip 3022, and the laser chip 3021 and the light receiving chip 3022 can be arranged side by side on the circuit board 300.

[0091] Since the optical chip 302 is attached to the circuit board 300, the light emitting surface or the light entering surface is located at the top surface of the optical chip 302, so that the light beam emitted by the laser chip is perpendicular to the circuit board 300, and the light beam received by the light receiving chip is also perpendicular to the circuit board 300; while the optical fiber 101 connected to the light module is parallel to the circuit board 300, the transmission direction of the light beam emitted by the laser chip and the external light beam transmitted to the light receiving chip needs to be changed, so the light transceiver component 900 can be used to change the light beam emitted by the laser chip, so that the light beam emitted by the laser chip is reflected by the lens assembly, and the reflected light beam is parallel to the circuit board 300, to facilitate the coupling of the reflected light beam into the optical fiber; the received light beam transmitted by the external optical fiber is reflected by the lens assembly, and the reflected light beam is perpendicular to the circuit board 300, to facilitate the reception by the light receiving chip.

[0092] In some embodiments, the circuit board 300 can be provided with a DSP chip 301, and the DSP chip 301 is used for processing of electrical signals.

[0093] The laser chip 3021 and the light receiving chip 3022 are arranged side by side, so that the distance between the laser chip 3021 and the light receiving chip 3022 and the DSP chip 301 is approximately equal.

[0094] The DSP chip 301 can have a TIA function, that is, the TIA is placed in the DSP chip 301. The electrical signal of the light receiving chip 3022 is directly transmitted to the DSP chip 301 for processing.

[0095] The DSP chip 301 can have no TIA function, that is, the TIA is placed outside the DSP chip 301. The circuit board 300 is provided with a TIA chip 303. The electrical signal of the light receiving chip 3022 is amplified by the TIA chip 303, and the amplified electrical signal is transmitted to the DSP chip 301 for processing.

[0096] In some embodiments, the light receiving chip is mounted on the circuit board, one side of the light receiving chip is provided with a first signal pad, a second signal pad and a third signal pad, the first signal pad and the third signal pad are connected by a first high-frequency signal line, the other side of the light receiving chip is provided with a fourth signal pad, the fourth signal pad and the second signal pad are connected by a second high-frequency signal line, the digital signal processing chip can be connected with the second signal pad, and the digital signal processing chip can be connected with the first signal pad, so that the electrical signal of the light receiving chip can be transmitted to the digital signal processing chip through the first high-frequency signal line and the first signal pad, or can be transmitted to the digital signal processing chip through the second high-frequency signal line and the second signal pad, and thus the circuit board can be compatible with the TIA placed outside the DSP chip 301 and the TIA placed in the DSP chip 301.

[0097] In some embodiments, the DSP chip 301 can have a TIA function.

[0098] The DSP chip 301 includes a first input end 3011. The first input end 3011 can be used for connecting the light receiving chip 3022, so that the light receiving chip 3022 can be connected with the first input end 3011 of the DSP chip 301. The first input end 3011 can be connected with a TIA functional module inside the DSP chip 301, so that the electrical signal transmitted through the first input end 3011 can be processed by the TIA functional module.

[0099] In some embodiments, the DSP chip 301 can have no TIA function.

[0100] The DSP chip 301 comprises a second input end 3012, which can be used to connect the TIA chip 303, so that the TIA chip 303 can be connected with the second input end 3012 of the DSP chip 301. The DSP chip 301 processes the electrical signal transmitted by the first input end 3011 or the second input end 3012.

[0101] In some embodiments, the DSP chip 301 can have or not have the TIA function. For example, the DSP chip 301 is internally provided with a register, and the register is provided with a flag bit, which is used to indicate whether the DSP chip 301 has the TIA function. If the flag bit is a first value, the DSP chip 301 has the TIA function; if the flag bit is a second value, the DSP chip 301 does not have the TIA function. Therefore, the DSP chip 301 can have or not have the TIA function by changing the flag bit.

[0102] The DSP chip 301 comprises a first input end 3011 and a second input end 3012. The first input end 3011 can be used to connect the light receiving chip 3022, so that the light receiving chip 3022 can be connected with the first input end 3011 of the DSP chip 301. The first input end 3011 can be connected with a TIA functional module inside the DSP chip 301, so that the electrical signal transmitted by the first input end 3011 can be processed by the TIA functional module. The second input end 3012 can be used to connect the TIA chip 303, so that the TIA chip 303 can be connected with the second input end 3012 of the DSP chip 301. The DSP chip 301 processes the electrical signal transmitted by the first input end 3011 or the second input end 3012.

[0103] The light receiving chip 3022 is connected with the first input end 3011 of the DSP chip 301, so that the DSP chip 301 processes the electrical signal input by the first input end 3011. Alternatively, the TIA chip 303 is mounted on the circuit board 300, and the TIA chip 303 is connected with the light receiving chip 3022 and the second input end 3012 of the DSP chip 301, so that the DSP chip 301 processes the electrical signal input by the second input end 3012. The DSP chip 301 can process the electrical signal input by the first input end 3011 or the electrical signal input by the second input end 3012, so that the circuit board can be compatible with the transimpedance amplifier chip placed outside the digital signal processing chip and the transimpedance amplifier chip placed inside the digital signal processing chip.

[0104] In some embodiments, the DSP chip 301 and the circuit board 300 can be connected by wire bonding. For example, the DSP chip 301 comprises a first pin and a second pin, which are respectively wire-bonded with the signal pads of the circuit board 300.

[0105] In some embodiments, the DSP chip 301 can be connected to the circuit board 300 by soldering balls. For example, the lower surface of the DSP chip 301 can be provided with first soldering balls 3011a and second soldering balls 3012a, which are respectively soldered to the signal pads of the circuit board 300. The present disclosure takes the lower surface of the DSP chip 301 provided with the first soldering balls 3011a and the second soldering balls 3012a as an example to introduce the relationship between the DSP chip 301 and other structural components.

[0106] In some embodiments, the DSP chip 301 can include a first processing unit and a second processing unit. The first processing unit can receive the electrical signal transmitted by the light receiving chip 3022 to the DSP chip 301 and processed by the TIA functional module of the DSP chip 301. The second processing unit can receive the electrical signal processed by the TIA chip 303.

[0107] In some embodiments, the DSP chip 301 can include a processing unit that can receive the electrical signal processed by the TIA functional module of the DSP chip 301 and the electrical signal processed by the TIA chip 303.

[0108] In some embodiments, the DSP chip 301 can have a driving function. After receiving the signal at the gold finger, the signal is processed by the DSP chip 301, and the processed signal is transmitted to the laser chip 3021 to be converted into an optical signal. The optical signal emitted by the laser chip 3021 is coupled into the optical fiber through the lens assembly of the optical transceiver component 900 for transmission.

[0109] In some embodiments, the DSP chip 301 can not have a driving function, and the circuit board 300 is provided with a light matching chip, which is a laser driving chip. After receiving the signal at the gold finger, the signal is processed by the DSP chip 301, and the processed signal is transmitted to the laser driving chip via a signal line connecting the DSP chip 301 and the laser driving chip, and then transmitted to the laser chip 3021 to be converted into an optical signal. The optical signal emitted by the laser chip 3021 is coupled into the optical fiber through the lens assembly of the optical transceiver component 900 for transmission.

[0110] Figure 7a Principle of an optical module according to some embodiments Figure 1 . Principle of an optical module according to some embodiments Figure 7b . Principle of an optical module according to some embodiments Figure 2 . Partial internal structure of an optical module according to some embodiments Figure 8 . Partial internal structure of an optical module according to some embodiments Figure 1 . Partial internal structure of an optical module according to some embodiments Figure 8 . Partial internal structure of an optical module according to some embodiments Figure 7a and Figure 7bAs shown, in some embodiments, the circuit board 300 can include an upper surface layer 310. The upper surface layer 310 can be provided with a first mounting area 311, a second mounting area 312, a third mounting area 313, and a fourth mounting area 314. The DSP chip 301 can be mounted on the first mounting area 311 so that the DSP chip 301 can be connected to the first mounting area 311. The light receiving chip 3022 can be mounted on the second mounting area 312 so that the light receiving chip 3022 can be connected to the second mounting area 312. The third mounting area 313 can be used for mounting the TIA chip 303. The laser chip 3021 can be mounted on the fourth mounting area 314 so that the laser chip 3021 can be connected to the fourth mounting area 314.

[0111] In some embodiments, the second mounting area 312 and the fourth mounting area 314 can be arranged side by side along the width direction of the circuit board 300, so that the light receiving chip 3022 and the laser chip 3021 can be arranged side by side along the width direction of the circuit board 300.

[0112] In some embodiments, the second mounting area 312 can be located between the first mounting area 311 and the third mounting area 313, so that when the TIA chip 303 is mounted on the circuit board 300, the light receiving chip 3022 can be located between the TIA chip 303 and the DSP chip 301, so that the light receiving chip 3022 can be connected to the digital signal processing chip 301 or can be connected to the TIA chip 303.

[0113] In some embodiments, the first mounting area 311 can be provided with a first signal pad 353, and the first signal pad 353 can be connected to the first input end 3011 of the DSP chip 301, so that the first input end 3011 can receive the electrical signal transmitted by the first signal pad 353. For example, the first signal pad 353 can be soldered to the first solder ball 3011a of the DSP chip 301.

[0114] In some embodiments, the first mounting area 311 can be provided with a second signal pad 354, and the second signal pad 354 can be connected to the second input end 3012 of the DSP chip 301, so that the second input end 3012 can receive the electrical signal transmitted by the second signal pad 354. For example, the second signal pad 354 can be soldered to the second solder ball 3012a of the DSP chip 301.

[0115] In some embodiments, a third signal pad 352 can be arranged between the first mounting area 311 and the second mounting area 312. The third signal pad 352 can be connected with one end of a first high-frequency signal line 362, and the other end of the first high-frequency signal line 362 can be connected with a first signal pad 353, so that the third signal pad 352 and the first signal pad 353 can be connected through the first high-frequency signal line 362, and then the third signal pad 352 is connected with the DSP chip 301. The third signal pad 352 can be used to connect the optical receiving chip 3022, so that the optical receiving chip 3022 can be connected with the first input end 3011 of the DSP chip 301.

[0116] The first signal pad 353, the second signal pad 354 and the third signal pad 352 are all located on one side of the optical receiving chip 3022. A fourth signal pad 308 is arranged on the other side of the optical receiving chip 3022, and the fourth signal pad 308 is used to connect the trans-impedance amplifier chip 303. The distance between the fourth signal pad 308 and the optical receiving chip 3022 is different from the distance between the third signal pad 352 and the optical receiving chip 3022, and the trans-impedance amplifier chip 303 can be mounted between the fourth signal pad 308 and the optical receiving chip 3022, so that the electrical signal of the optical receiving chip 3022 can be transmitted to the digital signal processing chip through the first high-frequency signal line and the first signal pad, or can be transmitted to the digital signal processing chip through the second high-frequency signal line and the second signal pad, and then the circuit board can be compatible with the trans-impedance amplifier chip placed outside the digital signal processing chip and the trans-impedance amplifier chip placed inside the digital signal processing chip. When the trans-impedance amplifier chip 303 is mounted between the fourth signal pad 308 and the optical receiving chip 3022, the trans-impedance amplifier chip 303 can be connected with the fourth signal pad 308 and the optical receiving chip 3022 by wire.

[0117] In some embodiments, the circuit board 300 can be provided with a second high-frequency signal line 363, one end of the second high-frequency signal line 363 can be located in the third mounting area 313 away from the second mounting area 312, and used to connect the fourth signal pad 308; the other end of the second high-frequency signal line 363 can be connected with the second signal pad 354 of the first mounting area 311, so that the second high-frequency signal line 363 can be connected with the second input end 3012 of the DSP chip 301.

[0118] The second high-frequency signal line 363 can include a first sub-high-frequency signal line 3631. The first sub-high-frequency signal line 3631 can be located on the surface of the circuit board 300, so as to facilitate the connection between the TIA chip 303 and the second high-frequency signal line 363. The first sub-high-frequency signal line 3631 can be located on the side of the third mounting area 313 away from the second mounting area 312. One end of the first sub-high-frequency signal line 3631 can be connected with the fourth signal pad 308.

[0119] The second high-frequency signal line 363 can include a second sub-high-frequency signal line 3632. One end of the second sub-high-frequency signal line 3632 can be connected with the other end of the first sub-high-frequency signal line 3631, and the other end of the second sub-high-frequency signal line 3632 can be connected with the second signal pad 354.

[0120] In some embodiments, the second sub-high-frequency signal line 3632 can be located on the surface of the circuit board 300, i.e., the second sub-high-frequency signal line 3632 can be located on the upper surface layer 310.

[0121] In some embodiments, the second sub-high-frequency signal line 3632 can be located inside the circuit board 300, i.e., the second sub-high-frequency signal line 3632 can be located on the middle layer 320, which can effectively reduce the influence of external electromagnetic interference on electrical signals.

[0122] In some embodiments, the first sub-high-frequency signal line 3631 and the second sub-high-frequency signal line 3632 can be connected through the capacitor 304, which can reduce noise and interference of high-frequency signals in transmission. For example, the first electrode of the capacitor 304 is connected with one end of the first sub-high-frequency signal line 3631, and the second electrode of the capacitor 304 is connected with one end of the second sub-high-frequency signal line 3632.

[0123] If the second sub-high-frequency signal line 3632 is located on the middle layer 320, the second electrode of the capacitor 304 is connected with one end of the second sub-high-frequency signal line 3632 through the second via hole 371. If the second sub-high-frequency signal line 3632 is located on the upper surface layer 310, the second electrode of the capacitor 304 is directly connected with one end of the second sub-high-frequency signal line 3632.

[0124] In some embodiments, the fifth signal pad 351 can be arranged between the first mounting area 311 and the fourth mounting area 314, and the fifth signal pad 351 is used to connect the laser chip 3021, so that the laser chip 3021 can be connected with the fifth signal pad 351.

[0125] In some embodiments, the first mounting area 311 can be provided with a sixth signal pad 355, and the sixth signal pad 355 and the fifth signal pad 351 can be connected through the third high-frequency signal line 361, so that the laser chip 3021 can be connected with the sixth signal pad 355. The sixth signal pad 355 is connected with the DSP chip 301, so that the DSP chip 301 is connected with the first mounting area 311, and then the laser chip 3021 can be connected with the DSP chip 301.

[0126] Figure 9 A partial view of an internal structure of a light module according to some embodiments Figure 2 . Figure 9is a partial view of the middle layer of the circuit board. As shown in Figure 9 The middle layer 320 can be provided with a second sub-high-frequency signal line 3632, one end of the second sub-high-frequency signal line 3632 being connected with the second electrode of the capacitor 304 through a second via hole 371, so that the one end of the second sub-high-frequency signal line 3632 is connected with the first sub-high-frequency signal line 3631. The other end of the second sub-high-frequency signal line 3632 is connected with the second signal pad 354 of the upper layer 310 through a first via hole 372, so that the other end of the second sub-high-frequency signal line 3632 is connected with the DSP chip 301.

[0127] Figure 10 is a partial view of the internal structure of an optical module provided according to some embodiments Figure 3 . Figure 11 is a partial view of the internal structure of an optical module provided according to some embodiments Figure 4 . As shown in Figure 10 and Figure 11 The first mounting area 311 is mounted with the DSP chip 301, the fourth mounting area 314 is mounted with the laser chip 3021, the laser chip 3021 is wire-bonded with the fifth signal pad 351, the fifth signal pad 351 is connected with the sixth signal pad 355 through the third high-frequency signal line 361, and the sixth signal pad 355 is soldered with the DSP chip 301, so that the laser chip 3021 is connected with the DSP chip 301.

[0128] As shown in Figure 10 and Figure 11 The light-receiving chip 3022 can include a positive electrode 3221 and a negative electrode 3222, and the positive electrode 3221 and the negative electrode 3222 are wire-bonded with the third signal pad 352 respectively, so that the light-receiving chip 3022 is connected with the third signal pad 352.

[0129] As shown in Figure 8 and Figure 10 In some embodiments, the third mounting area 313 is not mounted with the TIA chip 303, and the second mounting area 312 is mounted with the light-receiving chip 3022, and the positive electrode 3221 and the negative electrode 3222 of the light-receiving chip 3022 are located on the side of the light-receiving chip 3022 close to the DSP chip 301. The positive electrode 3221 and the negative electrode 3222 are wire-bonded with the third signal pad 352 respectively, the third signal pad 352 is connected with the first signal pad 353 through the first high-frequency signal line 362, and the first signal pad 353 is soldered with the first solder ball 3011a, so that the light-receiving chip 3022 is connected with the first solder ball 3011a of the DSP chip 301.

[0130] As shown in Figure 11As shown, the TIA chip 301 may include a seventh signal pad 3031 and an eighth signal pad 3032. The seventh signal pad 3031 can be wire-connected to the optical receiver chip 3022, so that the optical receiver chip 3022 and the TIA chip 301 can be wire-connected. The eighth signal pad 3032 can be wire-connected to the second high-frequency signal line 363, so that the TIA chip 301 and the second high-frequency signal line 363 can be wire-connected.

[0131] like Figure 11 As shown, in some embodiments, a TIA chip 303 is mounted in the third mounting area 313, and an optical receiver chip 3022 is mounted in the second mounting area 312. The seventh signal pad 3031 of the TIA chip 303 can be located on the side of the TIA chip 303 closer to the optical receiver chip 3022, which can shorten the wire bonding distance between the optical receiver chip 3022 and the TIA chip 303. The eighth signal pad 3032 of the TIA chip 303 can be located on the side of the TIA chip 303 closer to the fourth signal pad 308, which can shorten the wire bonding distance between the TIA chip 303 and the fourth signal pad 308, and also avoid wire bonding crossing between the two.

[0132] Figure 7b , Figure 9 and Figure 11 As shown, the positive electrode 3221 and negative electrode 3222 of the optical receiver chip 3022 are wire-connected to the seventh signal pad 3031 of the TIA chip 301. The eighth signal pad 3032 of the TIA chip 301 is wire-connected to one end of the first sub-high frequency signal line 3631. The other end of the first sub-high frequency signal line 3631 is connected to the first electrode of the capacitor 304. The second electrode of the capacitor 304 is connected to one end of the second sub-high frequency signal line 3632. The other end of the second sub-high frequency signal line 3632 is soldered to the second solder ball 3012a of the DSP chip 301, so that the optical receiver chip 3022 is connected to the second solder ball 3012a of the DSP chip 301.

[0133] In some embodiments, the positive electrode 3221 and the negative electrode 3222 of the optical receiver chip 3022 may be located on the side of the optical receiver chip 3022 closer to the DSP chip 301.

[0134] In some embodiments, the positive electrode 3221 and the negative electrode 3222 of the optical receiver chip 3022 can be located on the side of the optical receiver chip 3022 close to the TIA chip 303, so that the optical receiver chip 3022 and the TIA chip 303 are wire-connected, thereby shortening the wire-connection distance between the optical receiver chip 3022 and the TIA chip 303 and thus improving the bandwidth.

[0135] The optical module only includes one optical receiving chip, i.e., the optical receiving chip only receives one optical signal, the optical receiving chip 3022 is located between the TIA chip 303 and the DSP chip 301, and the transmission channel of the TIA chip 303 does not change.

[0136] The optical module includes a plurality of optical receiving chips 3022, each of which receives one optical signal, the optical receiving chip 3022 is located between the TIA chip 303 and the DSP chip 301, and the optical receiving chip assembly composed of the plurality of optical receiving chips 3022 is rotated by 180°, so that the positive electrode 3221 and the negative electrode 3222 of the optical receiving chip 3022 can be located on the side close to the TIA chip 303 in the optical receiving chip 3022, and the wire bonding distance between the optical receiving chip 3022 and the TIA chip 303 is shortened, thereby improving the bandwidth.

[0137] Compared with the TIA chip 303 located between the optical receiving chip 3022 and the DSP chip 301, the optical receiving chip 3022 is located between the TIA chip 303 and the DSP chip 301, the optical receiving chip assembly composed of the plurality of optical receiving chips 3022 is rotated by 180°, and the plurality of transmission channels of the TIA chip 303 change. For example, the transmission channels of the TIA chip 303 change from 1, 2, 4, 4 from top to bottom to 4, 3, 2, 1 from top to bottom.

[0138] In some embodiments, the DSP chip 301 can use an xbar (Crossbar switch, crossbar switch) to realize switching of the transmission channel, so that the transmission channel of the second input end of the DSP chip 301 corresponds to the transmission channel of the TIA chip 303.

[0139] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module characterized by comprising: The application relates to a circuit board, a light receiving chip, a digital signal processing chip and a laser chip. The light receiving chip is arranged on the circuit board and used for receiving an optical signal and converting the optical signal into an electrical signal. The digital signal processing chip is arranged on the circuit board and used for processing the electrical signal. One side of the light receiving chip is provided with a first signal pad connected with one end of a first high-frequency signal line, a second signal pad connected with one end of a second high-frequency signal line and a third signal pad connected with the other end of the first high-frequency signal line. The other side of the light receiving chip is provided with a fourth signal pad connected with the other end of the second high-frequency signal line, wherein the distance between the fourth signal pad and the light receiving chip is different from the distance between the third signal pad and the light receiving chip. The digital signal processing chip is connected with the second signal pad. The digital signal processing chip comprises a first input end connected with the first signal pad so that the first input end receives the electrical signal transmitted by the first signal pad and a second input end connected with the second signal pad so that the second input end receives the electrical signal transmitted by the second signal pad. The positive electrode and the negative electrode of the light receiving chip are arranged on the side of the light receiving chip close to the digital signal processing chip, and the positive electrode and the negative electrode are respectively connected with the third signal pad. A transimpedance amplifier chip is arranged between the light receiving chip and the fourth signal pad, and the positive electrode and the negative electrode of the light receiving chip are arranged on the side of the light receiving chip close to the transimpedance amplifier chip, and the positive electrode and the negative electrode are respectively connected with the transimpedance amplifier chip. The laser chip is arranged on the circuit board, and the laser chip is arranged in parallel with the light receiving chip. The laser chip is provided with a fifth signal pad connected with one end of a third high-frequency signal line and a sixth signal pad connected with the other end of the third high-frequency signal line.

2. The optical module according to claim 1, characterized by The digital signal processing chip is connected with the sixth signal pad. The transimpedance amplifier chip comprises a seventh signal pad arranged on the side of the transimpedance amplifier chip close to the light receiving chip and used for connecting the light receiving chip and an eighth signal pad arranged on the side of the transimpedance amplifier chip close to the fourth signal pad and used for connecting the fourth signal pad. The second high-frequency signal line comprises a first sub-high-frequency signal line arranged on the surface of the circuit board, one end of the first sub-high-frequency signal line being used for connecting the fourth signal pad and the other end of the first sub-high-frequency signal line being connected with a first electrode of a capacitor and a second sub-high-frequency signal line arranged in the circuit board, one end of the second sub-high-frequency signal line being connected with a second electrode of the capacitor and the other end of the second sub-high-frequency signal line being connected with the second signal pad.

3. The optical module according to claim 1, characterized by The application further relates to a light receiving component arranged on the laser chip and the light receiving chip and used for realizing the emission and reception of the optical signal.

4. The optical module according to claim 1, characterized by ​ 5. The optical module of claim 1, wherein, ​ ​ ​ ​ 6. The optical module according to claim 4, characterized by ​ ​ ​ 7. The optical module of claim 1, wherein, ​ ​ ​ 8. The optical module of claim 5, wherein, ​ ​

Images