Fanless efficient heat dissipation industrial personal computer case

Abstract

The utility model discloses a fanless efficient heat dissipation industrial personal computer case which comprises a base, a shell installed on the base, heat dissipation fins arranged on the top of the shell, a main board installed on the top of the base, a heating component electrically connected to the main board, a lower heat conduction piece connected to the heating component in an abutting mode, an upper heat conduction piece arranged above the lower heat conduction piece and a lower heat conduction piece arranged above the upper heat conduction piece. The top of the upper heat conduction piece abuts against the lower end face of the shell, a groove is formed in the bottom of the upper heat conduction piece, the top of the lower heat conduction piece is located in the groove, the side wall of the groove is in close contact with the outer wall of the lower heat conduction piece, the upper heat conduction piece is allowed to move up and down, and a spring is arranged between the upper heat conduction piece and the lower heat conduction piece and located in the groove. According to the utility model, the dust-free and low-noise effects are realized by adopting the shell with the holeless design, heat is absorbed by the lower heat conduction piece and is transmitted to the shell through the upper heat conduction piece, heat dissipation is assisted by the heat dissipation fins, and the heat dissipation effect of a heating component is improved.

Description

Technical Field

[0001] This utility model relates to the field of fanless industrial computer technology, specifically a fanless high-efficiency heat dissipation industrial computer chassis. Background Technology

[0002] Industrial control computers (ICPCs) are a general term for tools that use a bus architecture to monitor and control production processes, electromechanical equipment, and technological tools. ICPCs possess essential computer attributes and characteristics, such as a CPU, hard drive, memory, peripherals and interfaces, as well as an operating system, control network and protocols, computing power, and a user-friendly human-machine interface. The products and technologies of the industrial control industry are highly specialized, belonging to the intermediate product category, providing reliable, embedded, and intelligent industrial computers for other industries.

[0003] Chinese patent document "CN222514717U, an industrial control computer with easy heat dissipation" describes a conical exhaust duct fixedly connected to the lower end of the casing. Inside the conical exhaust duct are fan blades fixedly connected to the output shaft of a drive motor. By starting the drive motor, the fan blades are rotated, causing the heat generated inside the device to be drawn away through the fan blades in the conical exhaust duct and discharged from the heat dissipation holes at the top. During the discharge process, as the air inside the device is drawn out, external cold air is drawn in through the air inlets on both sides, thereby achieving rapid heat dissipation of the industrial control computer during operation. Through the rotation of the exhaust fan, the heat generated inside the device is quickly discharged from the top of the device, and external cold air is drawn in from both sides, enabling the industrial control computer to dissipate heat quickly.

[0004] However, during the air intake process, dust can enter the chassis through the air intake vents. Long-term accumulation of dust can lead to poor heat dissipation, making the industrial computer prone to overheating during operation. In addition, the fan will produce a lot of noise when it is running, which will have a certain impact on the operating environment and user experience of the equipment. Utility Model Content

[0005] The purpose of this invention is to provide a fanless, high-efficiency heat dissipation industrial control chassis to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A fanless, high-efficiency heat dissipation industrial control chassis includes a base, on which an outer shell is mounted. The top of the outer shell has heat dissipation fins. A motherboard is mounted on the top of the base. A heat-generating component is electrically connected to the motherboard. A lower heat-conducting component abuts against the heat-generating component. An upper heat-conducting component is located above the lower heat-conducting component. The top of the upper heat-conducting component abuts against the lower end face of the outer shell. A groove is provided at the bottom of the upper heat-conducting component. One end of the lower heat-conducting component is located within the groove. The sidewall of the groove maintains close contact with the outer wall of the lower heat-conducting component and allows the upper heat-conducting component to move up and down. A spring is provided between the upper and lower heat-conducting components. The spring is located inside the groove, with one end abutting against the top of the lower heat-conducting component and the other end abutting against the bottom of the upper heat-conducting component.

[0008] Furthermore, a positioning groove is provided at the center of the top of the lower heat-conducting component, and a positioning post is provided at the bottom of the upper heat-conducting component that can be inserted into the positioning groove, with the spring sleeved on the outside of the positioning post.

[0009] Furthermore, a positioning component is also installed on the motherboard. The positioning component has a clearance hole at its center and a limiting support component at each of the four corners of the clearance hole. The outer wall of the upper heat-conducting component is adapted to the inner wall of the limiting support component.

[0010] Furthermore, an clearance space is provided between each pair of adjacent limiting supports.

[0011] Furthermore, a protruding block is provided on the outer wall of the upper heat-conducting component, and the lower end face of the protruding block abuts against the upper end face of the limiting support component.

[0012] Furthermore, an S-shaped water pipe is embedded in the top of the outer casing, with the two ends of the water pipe connected to the water inlet and water outlet on the top of the outer casing, respectively.

[0013] Furthermore, a bottom shell is installed at the bottom of the base, and a backup power supply is installed inside the bottom shell.

[0014] The beneficial effects of this utility model are:

[0015] This utility model is a fanless unit with a sealed, hole-free casing, which can achieve a dust-free and noise-free effect. The heat generated by the heat-generating components is absorbed by the lower heat-conducting component and transferred to the upper heat-conducting component through the side wall of the groove. The heat is then conducted to the casing through the upper heat-conducting component and finally dissipated to the external environment through the heat dissipation fins on the top of the casing, thereby achieving a highly efficient heat dissipation effect.

[0016] By incorporating a spring between the upper and lower heat-conducting components, the spring provides an upward thrust to the upper heat-conducting component and a downward thrust to the lower heat-conducting component, ensuring good contact between the lower heat-conducting component and the heat-generating element, and between the upper heat-conducting component and the outer casing, thereby improving the stability of heat conduction.

[0017] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0018] Figure 1 : Overall structural diagram of this utility model.

[0019] Figure 2 : Top sectional view of the cover of this utility model.

[0020] Figure 3 : Internal structure diagram of this utility model.

[0021] Figure 4 : A cross-sectional view of the connection between the upper heat-conducting component and the lower heat-conducting component of this utility model.

[0022] Reference numerals: 1. Base; 2. Outer shell; 3. Heat dissipation fins; 4. Main board; 5. Lower heat conduction component; 6. Upper heat conduction component; 7. Spring; 11. Bottom shell; 21. Water pipe; 22. Water inlet; 23. Water outlet; 41. Heating element; 42. Positioning component; 43. Clearance hole; 44. Limiting support component; 45. Clearance space; 51. Positioning groove; 61. Positioning post; 62. Groove; 63. Protrusion. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] Please refer to Figure 1-4 ;

[0025] A fanless, high-efficiency heat dissipation industrial control chassis includes a base 1, on which a shell 2 is mounted. The shell 2 has a sealed, non-porous design to prevent dust from entering. Heat dissipation fins 3 are provided on the top of the shell 2, increasing its surface area and allowing more heat to come into contact with the surrounding air, thus improving heat dissipation efficiency. A motherboard 4 is mounted on the top of the base 1, and a heat-generating component 41 is electrically connected to the motherboard 4. The heat-generating component 41 refers to the CPU inside the industrial control computer. The CPU generates a significant amount of heat during operation. A lower heat conductor 5 is attached to the upper part of the housing 2, and thermal grease is applied between them to fill any tiny gaps and improve heat conduction efficiency. An upper heat conductor 6 is located above the lower heat conductor 5, with its top abutting against the lower end face of the housing 2. A groove 62 is provided at the bottom of the upper heat conductor 6, and the top of the lower heat conductor 5 is located within the groove 62. The sidewall of the groove 62 maintains close contact with the outer wall of the lower heat conductor 5, allowing the upper heat conductor 6 to move up and down. Preferably, the housing 2, the upper heat conductor 6, and the lower heat conductor 5 are all made of aluminum alloy, which has good thermal conductivity. During operation, the lower heat conductor 5 absorbs the heat generated by the heat-generating component 41 and transfers it to the upper heat conductor 6 through the sidewall of the groove 62. The upper heat conductor 6 then conducts the heat to the housing 2, and finally dissipates it into the external environment through the heat dissipation fins 3 on the top of the housing 2, thus achieving efficient heat dissipation. A spring 7 is provided between the upper heat-conducting component 6 and the lower heat-conducting component 5. The spring 7 is located inside the groove 62. One end of the spring 7 abuts against the top of the lower heat-conducting component 5, and the other end abuts against the bottom of the upper heat-conducting component 6. The spring 7 provides an upward thrust to the upper heat-conducting component 6 and a downward thrust to the lower heat-conducting component 5, ensuring good contact between the lower heat-conducting component 5 and the heating element 41, and between the upper heat-conducting component 6 and the outer shell 2, thereby improving the stability of heat conduction.

[0026] In this embodiment, a positioning groove 51 is provided at the center of the top of the lower heat-conducting component 5, and a positioning post 61 that can be inserted into the positioning groove 51 is provided at the bottom of the upper heat-conducting component 6. The spring 7 is sleeved on the outside of the positioning post 61. Through the cooperation between the positioning post 61 and the positioning groove 51, the position of the spring 7 is fixed. The spring 7 always remains in the center during compression or extension, ensuring that the spring 7 can apply a pushing force to the center of the lower heat-conducting component 5 and the heating element 41, as well as the center of the upper heat-conducting component 6 and the outer shell 2, and avoid tilting that would lead to a deterioration in the heat conduction effect.

[0027] In this embodiment, a positioning component 42 is also installed on the motherboard 4. The center of the positioning component 42 is provided with a clearance hole 43. The CPU is located inside the clearance hole 43. Each of the four corners of the clearance hole 43 is provided with an upwardly extending limiting support component 44. The outer wall of the upper heat conduction component 6 is adapted to the inner wall of the four limiting support components 44 respectively. The limiting support component 44 can restrict the movement of the upper heat conduction component 6 in the horizontal direction, thereby avoiding the outer shell 2 from abutting against the upper heat conduction component 6 when the outer shell 2 is installed. Because the displacement of the outer shell 2 will cause the upper heat conduction component 6 and the lower heat conduction component 5 to move together, and cannot be aligned with the heat-generating component 41, resulting in poor heat dissipation.

[0028] In this embodiment, a clearance 45 is provided between each pair of adjacent limiting support members 44, so that when replacing thermal grease, the lower thermal conductive member 5 can be directly taken out and put in through the clearance 45. At the same time, the thermal grease can be applied directly through the clearance 45 without removing the positioning member 42, which greatly simplifies the maintenance process.

[0029] In this embodiment, a protruding block 63 is provided on the outer wall of the upper heat conductor 6. The lower end face of the protruding block 63 abuts against the upper end face of the limiting support 44. The protruding block 63 can limit the downward movement distance of the upper heat conductor 6, thereby avoiding the loss of elasticity due to the long-term compression of the spring 7, which would cause the upper heat conductor 6 to directly abut against the lower heat conductor 5 and simultaneously squeeze the heating element 41.

[0030] In this embodiment, an S-shaped water pipe 21 is embedded in the top of the outer shell 2. The two ends of the water pipe 21 are connected to the water inlet 22 and the water outlet 23 at the front end of the outer shell 2, respectively. Cold water flows into the water pipe 21 from the water inlet 22 and flows out from the water outlet 23, thereby keeping the top of the outer shell 2 at a low temperature and further improving the heat dissipation effect.

[0031] In this embodiment, a bottom shell 11 is installed at the bottom of the base 1. The bottom shell 11 is used to install a backup power supply. When the external power supply fails, the backup power supply can quickly take over the power supply task, providing the device with sufficient time to complete data saving or safe shutdown operations, thus avoiding data loss or hardware damage caused by sudden power outages.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0033] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A fanless high-efficiency heat dissipation industrial computer case, comprising a base (1), a shell (2) is installed on the base (1), and a heat dissipation fin (3) is arranged on the top of the shell (2), characterized in that, The top of the base (1) is provided with a mainboard (4), and the mainboard (4) is electrically connected with a heating component (41); the heating component (41) is abutted by a lower heat conducting piece (5); an upper heat conducting piece (6) is arranged above the lower heat conducting piece (5); the top of the upper heat conducting piece (6) is abutted by the lower end surface of the shell (2); the bottom of the upper heat conducting piece (6) is provided with a groove (62); the top of the lower heat conducting piece (5) is located in the groove (62); the side wall of the groove (62) is in close contact with the outer wall of the lower heat conducting piece (5) and allows the upper heat conducting piece (6) to move up and down; a spring (7) is arranged between the upper heat conducting piece (6) and the lower heat conducting piece (5); the spring (7) is located in the groove (62); one end of the spring (7) is abutted by the top of the lower heat conducting piece (5), and the other end of the spring (7) is abutted by the bottom of the upper heat conducting piece (6).

2. The fanless high-efficiency heat dissipation industrial computer case according to claim 1, wherein, A positioning groove (51) is arranged at the center of the top of the lower heat conducting piece (5); the bottom of the upper heat conducting piece (6) is provided with a positioning column (61) which can be inserted into the positioning groove (51); and the spring (7) is sleeved outside the positioning column (61).

3. The fanless high-efficiency heat dissipation industrial computer case according to claim 1, wherein, The mainboard (4) is further provided with a positioning piece (42); the center of the positioning piece (42) is provided with an avoiding hole (43); four corners of the avoiding hole (43) are provided with upward extending limiting support pieces (44); and the outer wall of the upper heat conducting piece (6) is respectively matched with the inner wall of the four limiting support pieces (44).

4. The fanless high-efficiency heat dissipation industrial computer case according to claim 3, characterized in that, An avoiding space (45) is arranged between every two adjacent limiting support pieces (44).

5. The fanless high-efficiency heat dissipation industrial computer case according to claim 3, characterized in that, The outer wall of the upper heat conducting piece (6) is provided with a protruding block (63); and the lower end surface of the protruding block (63) is abutted by the upper end surface of the limiting support piece (44).

6. The fanless high-efficiency heat dissipation industrial computer case according to claim 1, wherein, An S-shaped water pipe (21) is inlaid in the top of the shell (2); and the two ends of the water pipe (21) are respectively communicated with a water inlet (22) and a water outlet (23) at the front end of the shell (2).

7. The fanless high-efficiency heat dissipation industrial computer case according to claim 1, wherein, The bottom of the base (1) is provided with a bottom shell (11); and the bottom shell (11) is used for installing a backup power supply.

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