Heat dissipation structure of pen-type electronic device
The heat dissipation structure, which combines heat pipes and heat transfer plates, solves the problem of uneven heat dissipation inside laptops, achieving efficient heat dissipation and adaptability.
Patent Information
- Application Number
- CN202422574788.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-10-24
AI Technical Summary
The existing internal cooling structure of laptops cannot efficiently dissipate heat from all heat-generating components at the same time, and the limited space results in poor heat dissipation.
The heat dissipation structure adopts a combination of heat pipes and heat transfer plates. The heat pipes are connected to the first and second heat transfer plates at intervals. The heat transfer plates directly contact the heat-generating components and conduct heat to the heat sink. Combined with a fan, the heat sink is cooled by air, and the heat sink is cooled by the fan.
It achieves uniform heat dissipation for all heat-generating components, improves heat dissipation efficiency, adapts to the heat dissipation needs of different computer models, and enhances practicality.
Smart Images
Figure CN223743040U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a radiator technical field, especially a notebook computer's heat dissipation structure. BACKGROUND
[0002] A large number of integrated circuits are used in computer components, and it is well known that high temperature is the enemy of integrated circuits. High temperature not only causes the system to run unstably and shortens the service life, and even some components can be burned. The heat causing high temperature does not come from outside the computer, but from the inside of the integrated circuit. The role of the radiator is to absorb these heat and then dissipate to the case or outside the case, so as to ensure the normal temperature of the computer components.
[0003] In the prior art, fins and fans are mostly used as heat dissipation components. When working, the heat of the heat generating components in the computer integrated circuit is transferred to the fins, and the circulating air driven by the fan is contacted to transfer the heat to the air, thereby reducing the temperature of the heat generating components. On the one hand, when the fan works, the circulating air can only take away the heat from the fins, and cannot directly dissipate heat to the heat generating components, thereby reducing the heat dissipation effect and speed. On the other hand, in the integrated circuit of the computer, there are usually multiple heat generating components, such as CPU, GPU, optical drive, etc. And in the computer, especially in the limited installation space of the notebook computer, a simple structure that can simultaneously and efficiently dissipate heat from each heat generating component is particularly important. SUMMARY
[0004] The utility model provides a notebook computer's heat dissipation structure to solve the problem in the prior art.
[0005] The technical scheme of the utility model is:
[0006] A notebook computer's heat dissipation structure, characterized in that it comprises a radiator, a heat pipe connected to the radiator, a second heat transfer plate connected to the end of the heat pipe away from the radiator, and a plurality of first heat transfer plates connected to the heat pipe between the radiator and the second heat transfer plate.
[0007] Further, a plurality of heat pipes are connected to the radiator, at least one of the heat pipes has a second heat transfer plate connected to the end thereof away from the radiator, and a plurality of first heat transfer plates are connected to the plurality of heat pipes, and each first heat transfer plate is arranged at intervals.
[0008] Further, the surface area of each first heat transfer plate is greater than the area overlapping with the heat pipe.
[0009] Further, the second heat transfer plate is provided with a thermal interface, the thermal interface extends upward to form a connecting part near one end of the heat conduction pipe, the top end of the connecting part extends to form a welding surface near the heat conduction pipe, and the thermal interface is parallel to the welding surface.
[0010] Further, the upper surface of the connecting part and the welding surface is a first bending part, and a plurality of reinforcing ribs are arranged at the first bending part.
[0011] Further, the lower surface of the connecting part and the welding surface is a second bending part, and a plurality of reinforcing ribs are arranged at the second bending part.
[0012] Further, a welding positioning hole is arranged on each of the thermal interfaces.
[0013] Further, a plurality of fasteners are arranged on each of the first heat transfer plates.
[0014] Further, an avoiding space is arranged between the plurality of heat conduction pipes.
[0015] Further, the first heat transfer plate and the second heat transfer plate are heat transfer aluminum plates.
[0016] The beneficial technical effects of the present application are as follows:
[0017] Compared with the prior art, the heat conduction pipe is connected to the radiator, the first heat transfer plate and the second heat transfer plate are connected to the heat conduction pipe at intervals, the heat of the heat generating components on the computer mainboard is conducted to the heat conduction pipe through the first heat transfer plate or the second heat transfer plate, the heat conduction pipe conducts the heat to the radiator, and the fan further cools the radiator, so that the heat of each heat generating component is evenly dissipated, and the heat dissipation efficiency is high.
[0018] Further, since the first heat transfer plate and the second heat transfer plate are connected to the heat conduction pipe at intervals, the heat dissipation structure of the present application can simultaneously dissipate heat of the heat generating components in different areas on the computer mainboard, and the position and size of the first heat transfer plate and the second heat transfer plate can be set according to the position and size of the heat generating components on the computer mainboard, so that the present application can be applied to different types of computers, and has high practicability. BRIEF DESCRIPTION OF DRAWINGS
[0019] Fig. 1 is a schematic diagram of the present application as a whole;
[0020] Fig. 2 is a schematic diagram of the present application acting on a heat generating component;
[0021] Fig. 3 is a schematic diagram of the second heat transfer plate of the present application. DETAILED DESCRIPTION
[0022] In order to enable the technical means of the utility model to be understood more clearly, and can be implemented according to the content of the specification, the specific implementation of the utility model is further described in detail below, the following examples are used to illustrate the utility model, but not to limit the scope of the utility model.
[0023] As Figs. 1-3 The utility model provides a notebook computer's heat dissipation structure mainly for the heat dissipation of the inside of notebook computer, which is composed of a radiator 100, a heat pipe 200, a first heat transfer plate 300 and a second heat transfer plate 400.
[0024] The radiator 100 of the utility model is a fin.
[0025] As preferred, a fan (not shown) is further arranged on the fin.
[0026] The radiator 100 is welded with a plurality of heat pipes 200 on the surface, and the length direction of the heat pipes 200 is arranged away from the radiator 100. The number or shape of the heat pipes 200 can be selected according to the actual use scene, and there is no particular limitation. In the utility model, two heat pipes 200 are welded on the radiator 100, and the two heat pipes 200 are arranged in the same direction. Both of the two heat pipes 200 are long and curved, and an avoiding space is arranged between the two heat pipes 200 to facilitate the flexible placement of the heat pipes 200 according to the placement position of each part inside the notebook computer. The heat pipe is a good heat transfer element, one end of which receives the heat source as the evaporation end, and the other end as the condensation end. It fully utilizes the heat conduction principle and the rapid heat transfer property of phase change medium to quickly transfer the heat of the heating component 000 to the heat source outside.
[0027] A plurality of first heat transfer plates 300 are commonly welded on one side of the two heat pipes 200 facing the heating component 000. The number of the first heat transfer plates 300 can be selected according to the number of the heating components on the mainboard of the notebook computer, and there is no particular limitation. In the utility model, two first heat transfer plates 300 are commonly welded on the two heat pipes 200, and the two first heat transfer plates 300 are arranged at intervals. Each first heat transfer plate 300 can be connected to the heating components at different positions on the mainboard of the notebook computer, or each heat transfer plate 300 can be connected to different heating components in the same area on the mainboard.
[0028] The first heat transfer plate 300 in the utility model is a flat plate structure, which is used to directly contact with the heating component 000 to transfer the heat of the heating component to the heat pipe 200, and then the heat pipe 200 conducts the heat to the radiator 100. The fan can dissipate heat from the radiator 100, thereby realizing the cooling of the heating component 000.
[0029] In addition, in order to fully contact with the surface of the heat generating component, avoid the temperature difference of different positions of the heat generating component, and the problem of uneven heat dissipation, the surface area of each first heat transfer plate 300 is greater than the area of the two heat conducting pipes 200. The specific size can be set according to the actual number and area of the heat generating component.
[0030] As preferred, in actual use, the main heat generating component on the mainboard can be placed at the overlapping position of the first heat transfer plate 300 and the heat conducting plate 200, and the secondary heat generating component beside the main heat generating component can be placed in other areas of the first heat transfer plate 300.
[0031] As preferred, each first heat transfer plate 300 is provided with a plurality of fasteners 301. In the utility model, each first heat transfer plate 300 is provided with a fastener 301 at the four corners, and the fastener 301 is used to connect with the computer mainboard to fix the first heat transfer plate 300. The fastener 301 of the utility model is a screw piece.
[0032] Each first heat transfer plate 300 in the utility model is a heat transfer aluminum plate.
[0033] In order to fully consider the simultaneous heat dissipation of each heat generating component in different areas of the notebook computer mainboard, one heat conducting pipe 200, or two heat conducting pipes 200 are further connected with the second heat transfer plate 400 at the top end away from the heat sink 100.
[0034] The second heat transfer plate 400 is also a heat transfer aluminum plate, which has the same function as the first heat transfer plate 300, that is, transferring the heat of the heat generating component to the heat conducting pipe 200. It is provided with a heat contact surface 401, which extends upward to form a connecting part 402 at one end close to the heat conducting pipe 200, and the top end of the connecting part 402 extends to form a welding surface 403 close to the heat conducting pipe 200. The heat contact surface 401, the connecting part 402 and the welding surface 403 are all flat, and the heat contact surface 401 is parallel to the welding surface 403. The welding surface 403 is used for welding with the heat conducting pipe 200, and the heat contact surface 401 is used for contacting with the surface of the heat generating component.
[0035] As preferred, the upper surface of the connecting part 402 is a first bending part, and two reinforcing ribs 404 are symmetrically and spaced apart at the first bending part. The lower surface of the welding surface 403 is a second bending part, and two reinforcing ribs 404 are symmetrically and spaced apart at the second bending part. The reinforcing ribs 404 increase the bending strength of the second heat transfer plate 400, so that it is not easy to deform and lift, thereby ensuring good contact with the surface of the heat generating component, and finally improving the heat transfer efficiency.
[0036] As preferred, to ensure that the welding surface 403 does not shift when welded with the heat pipe 200, two welding positioning holes 405 are further arranged on the thermal contact surface 401. The welding positioning holes 405 are used to connect with a welding fixture to realize accurate welding of the second heat transfer plate 400 with the heat pipe 200.
[0037] The second heat transfer plate 400 is preferably used to transfer heat of secondary heat generating components, and the surface area thereof can be set according to the size of the contacted heat generating components.
[0038] The above description is only preferred embodiments of the present application, and is not used to limit the present application. It should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the present application.
Claims
1. A heat dissipation structure for a notebook computer, comprising: The heat sink (100) is connected with a heat pipe (200), the end of the heat pipe (200) away from the heat sink (100) is connected with a second heat transfer plate (400), and a plurality of first heat transfer plates (300) are connected on the heat pipe (200) between the heat sink (100) and the second heat transfer plate (400); The second heat transfer plate (400) is provided with a thermal contact surface (401), the thermal contact surface (401) extends upward to form a connecting part (402) at one end close to the heat pipe (200), the top end of the connecting part (402) extends to form a welding surface (403) close to the heat pipe (200), and the thermal contact surface (401) is parallel to the welding surface (403); each thermal contact surface (401) is provided with a welding positioning hole (405).
2. The heat dissipating structure according to claim 1, wherein The heat sink (100) is connected with a plurality of heat pipes (200), at least one heat pipe (200) is connected with a second heat transfer plate (400) at the end away from the heat sink (100), a plurality of first heat transfer plates (300) are connected on the plurality of heat pipes (200), and each first heat transfer plate (300) is arranged at intervals.
3. The heat dissipation structure for a notebook computer according to claim 1 or 2, wherein The surface area of each first heat transfer plate (300) is greater than the area of the first heat transfer plate (300) overlapping with the heat pipe (200).
4. The heat dissipation structure for a notebook computer according to claim 1 or 2, wherein The upper surface of the joint edge between the thermal contact surface (401) and the connecting part (402) is a first bending part, and a plurality of reinforcing ribs (404) are arranged at the first bending part.
5. The heat dissipation structure for a notebook computer according to claim 4, wherein The lower surface of the joint edge between the connecting part (402) and the welding surface (403) is a second bending part, and a plurality of reinforcing ribs (404) are arranged at the second bending part.
6. The heat dissipation structure for a notebook computer according to claim 1 or 2, wherein Each first heat transfer plate (300) is provided with a plurality of fasteners (301).
7. The heat dissipation structure for a notebook computer according to claim 2, wherein An avoiding space is arranged between the plurality of heat pipes (200).
8. The heat dissipation structure for a notebook computer according to claim 1 or 2, wherein The first heat transfer plate (300) and the second heat transfer plate (400) are heat transfer aluminum plates.