Computer cooling device
By integrating the heat sink with the docking seat into a single unit, and combining a sealing ring and rubber strip, the problems of insufficient air cooling and water cooling leakage are solved, achieving efficient and reliable computer heat dissipation.
Patent Information
- Application Number
- CN202520028430.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-07
AI Technical Summary
In existing computer cooling systems, air cooling is insufficient, while water cooling is prone to leakage in pipe connections, posing a risk of short circuits and failing to effectively protect the CPU.
The heat sink and docking seat are integrally molded, and the circulation pipe and connector are integrally connected. The sealing performance is improved by sealing rings and rubber strips, forming an integrated cooling pipeline, eliminating the need for subsequent connections and allowing direct installation of the whole machine.
The improved sealing of the cooling pipes prevented coolant leakage, protected the internal electronic equipment of the computer, and ensured efficient heat dissipation.
Smart Images
Figure CN223743043U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to computer technical field, concretely is a computer heat abstractor. BACKGROUND
[0002] With the development of computer technology, the data that computer needs to handle at the same time also increases, which brings great calculation burden to CPU of computer, and easily leads to CPU temperature being too high, therefore, most of present stage computers will configure cooling fan for CPU.
[0003] However, the cooling effect of the air-cooled heat dissipation fan of the present stage cannot meet the demand of efficient heat dissipation, in order to make up the characteristic of the heat dissipation of air-cooled heat dissipation being insufficient, the water-cooled heat dissipation mode is adopted at present stage, but in the water-cooled heat dissipation mode of the present stage, the heat exchange seat on the side of CPU and the side of fan are connected through pipeline, but in order to guarantee softness, the pipeline of the present stage often adopts hose structure both sides to be connected with joint, and there is the risk of leakage, and the computer box is electronic intensive, and short circuit phenomenon is easily caused, in view of this, the above-mentioned problems are studied in depth, and the case is generated. SUMMARY
[0004] In view of the defects of the prior art, the utility model provides computer heat abstractor, and the prior art problem is solved.
[0005] In order to realize the above object, the utility model is realized through the following technical scheme: a computer heat abstractor, including fan frame, be provided with a pair of heat dissipation fan on the fan frame, be provided with heat dissipation storage groove on the fan frame, one side of heat dissipation storage groove is connected with a pair of circulating pipe, and the end of a pair of circulating pipe is connected with contact radiator;
[0006] The annular groove is formed in the contact radiator, the fixing ring plate is sleeved on the annular groove, two pairs of fixing plates are arranged at the four corners of the fixing ring plate, and two pairs of connecting holes are formed in the two pairs of fixing plates.
[0007] The contact radiator is a disc cavity structure, a heat dissipation contact surface is arranged on one side of the contact radiator, and the heat dissipation contact surface corresponds to the CPU of the computer.
[0008] One pair of docking seats is arranged on one side of the contact radiator, one pair of docking seats extends from one side of the contact radiator, one pair of circulating pipes is connected with one pair of docking seats, and one pair of circulating pipes is integrally connected with the heat dissipation storage groove.
[0009] The contact radiator and one pair of docking seats are integrally formed, and one pair of circulating pipes is integrally connected with one pair of docking seats and the heat dissipation storage groove.
[0010] Preferably, one side of the annular groove is provided with a rubber strip in annular structure, and the fixing ring plate is matched with the rubber strip.
[0011] Preferably, the heat-dissipating storage groove is provided with a pair of connecting heads, and the pair of connecting heads are connected with one end of a pair of circulating pipes.
[0012] Preferably, the pair of circulating pipes are soft rubber pipes, and two ends of the pair of circulating pipes are heat-fusion connected with the pair of butt joints and the pair of connecting heads and are externally provided with sealing rings.
[0013] Preferably, the contact heat-dissipating device is a plate in cylindrical structure, and the pair of butt joints are provided with a pair of circulating pumps.
[0014] Preferably, the heat-dissipating contact surface of the contact heat-dissipating device is in circular structure and has an area greater than that of the CPU.
[0015] Beneficial effects
[0016] The computer heat-dissipating device has the following beneficial effects: the computer heat-dissipating device adopts a conventional liquid cooling layout and is divided into a contact heat-dissipating device and a heat-dissipating storage groove, the heat-dissipating storage groove and the contact heat-dissipating device are connected through a circulating pipe to form a cooling pipeline, and then in order to improve the sealing property, the heat-dissipating storage groove and the connecting head are integrally formed, the contact heat-dissipating device and the butt joint are integrally formed, and the circulating pipe is integrally connected with the connecting head and the butt joint through not less than one connecting method, so that the sealing property is effectively improved, the whole machine is directly installed during installation, no subsequent connecting pipeline is needed, and the sealing effect is further ensured. BRIEF DESCRIPTION OF DRAWINGS
[0017] Fig. 1 Fig. 1 is a perspective structural schematic view of the computer heat-dissipating device.
[0018] Fig. 2 Fig. 2 is an exploded structural schematic view of the computer heat-dissipating device.
[0019] Fig. 3 Fig. 3 is a local enlarged structural schematic view of the computer heat-dissipating device.
[0020] In the drawing: 1, fan frame; 2, heat-dissipating fan; 3, heat-dissipating storage groove; 4, circulating pipe; 5, contact heat-dissipating device; 6, fixing ring plate; 7, fixing plate; 8, butt joint; 9, rubber strip; 10, connecting head; 11, sealing ring; 12, circulating pump. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0022] Please refer to Figs. 1-3 The utility model provides a kind of implementation scheme: in modern computer application process, with the improvement of computing power and the introduction of overclocking technology, the data required to be handled by CPU rises, thus causing the increase of CPU operating temperature in computer application process, and for this problem, current air cooling technology cannot effectively protect CPU, avoid operating temperature being too high, and therefore more and more users use water cooling heat dissipation, but a problem that cannot be avoided in water cooling heat dissipation process is the processing of pipe head connecting position, it is easy to produce cooling water leakage and damage computer electronic equipment if it cannot be sealed.
[0023] For the above problems, the application discloses a computer heat dissipation device, which comprises a fan frame 1, a pair of heat dissipation fans 2 are arranged on the fan frame 1, the fan frame 1 is installed on the heat dissipation opening of the case during use, and plays a fixing role, the fan frame 1 is provided with a heat dissipation storage groove 3, the heat dissipation storage groove 3 stores heat dissipation coolant, one side of the heat dissipation storage groove 3 is connected with a pair of circulating pipes 4, the end of the pair of circulating pipes 4 is connected with a contact radiator 5, the contact radiator 5 is in contact with the CPU of the computer, the circulating pipes 4 are used to control the circulation of the coolant between the heat dissipation storage groove 3 and the contact radiator 5, the heat generated by the CPU is taken away, and the coolant is cooled by the air generated by the pair of heat dissipation fans 2 after flowing back to the heat dissipation storage groove 3;
[0024] Further, the contact radiator 5 is provided with an annular groove, the annular groove is provided with a fixed ring plate 6, the four corners of the fixed ring plate 6 are provided with two pairs of fixed plates 7, the two pairs of fixed plates 7 are provided with two pairs of connecting holes, two pairs of screw holes are arranged on the position of the CPU mainboard and correspond to the two pairs of connecting holes, when the contact radiator 5 is installed, the fixed ring plate 6 is rotated to the correct position, the connecting holes on the fixed ring plate 6 correspond to the screw holes, and then the fixed ring plate 6 is fixed on the mainboard by the connecting action of the bolts, so that the contact radiator 5 moves relative to the CPU by the reverse pulling fixing action, the contact radiator 5 is a disc cavity structure, the inner cavity of the contact radiator 5 is communicated with the heat dissipation storage groove 3, the heat dissipation contact surface is arranged on one side of the contact radiator 5, and the heat dissipation contact surface is in contact with the CPU of the computer after the fixed ring plate 6 is fixed in place.
[0025] Further according to the description Figs. 1-3 It can be known that the contact radiator 5 is provided with a pair of butt joints 8 extending from one side of the contact radiator 5, the pair of butt joints 8 are connected with the pair of circulating pipes 4, the pair of circulating pipes 4 are integrally connected with the heat dissipation storage tank 3, the pair of butt joints 8 play a role of connecting the pair of circulating pipes 4, and the pair of butt joints 8 have excellent sealing effect due to being integrally formed with the contact radiator 5, and the pair of butt joints 8, the pair of circulating pipes 4 and the heat dissipation storage tank 3 jointly constitute the circulating pipe 4 path of the cooling liquid.
[0026] Further according to the description Figs. 1-3 It can be known that the contact radiator 5 is integrally formed with the pair of butt joints 8, the pair of circulating pipes 4 are integrally connected with the pair of butt joints 8 and the heat dissipation storage tank 3, in order to ensure the sealing property of the water cooling pipe position, not only the pair of butt joints 8 and the contact radiator 5 are integrally formed, but also the pair of circulating pipes 4 and the pair of butt joints 8 and the heat dissipation storage tank 3 are sealingly connected, so that the sealing effect is improved.
[0027] As a preferred scheme, further, the annular groove is provided with a rubber strip 9 of annular structure on one side, the fixing ring plate 6 is matched with the rubber strip 9, and when the fixing ring plate 6 is installed in place through the screw rod, the rubber strip 9 is clamped and connected with the fixing ring plate 6 to effectively fix the contact radiator 5.
[0028] As a preferred scheme, further, the heat dissipation storage tank 3 is provided with a pair of connecting heads 10 connected with one end of the pair of circulating pipes 4.
[0029] As a preferred scheme, further, the pair of circulating pipes 4 are soft rubber pipes, the two ends of the pair of circulating pipes 4 are heat fusion connected with the pair of butt joints 8 and the pair of connecting heads 10 and are externally provided with sealing rings 11, so that the sealing property of the circulating pipes 4, the butt joints 8 and the connecting heads 10 is improved.
[0030] As a preferred scheme, further, the contact radiator 5 is a plate of cylindrical structure, a pair of circulating pumps 12 are arranged on the pair of butt joints 8, and the circulating pumps 12 provide flow power of the cooling liquid.
[0031] As a preferred scheme, further, the heat dissipation contact surface of the contact radiator 5 is of circular structure and has an area greater than that of the CPU, so that the heat dissipation contact surface can completely cover the CPU.
[0032] In conclusion, the computer heat dissipation device, adopting a conventional liquid cooling layout, is divided into a contact heat radiator 5 and a heat dissipation storage tank 3, the heat dissipation storage tank 3 and the contact heat radiator 5 are connected through a circulating pipe 4 to form a cooling pipeline, and in order to improve the sealing performance, the heat dissipation storage tank 3 is integrally formed with a connecting head 10, the contact heat radiator 5 is integrally formed with a counter seat 8, and the circulating pipe 4 is integrally connected with the connecting head 10 and the counter seat 8 through not less than one connecting method, effectively improving the sealing performance, and when installed, the whole machine is directly installed without subsequent connecting pipeline, further ensuring the sealing effect.
[0033] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A computer heat dissipation device, comprising a fan frame (1), a pair of heat dissipation fans (2) are arranged on the fan frame (1), and a heat dissipation storage groove (3) is arranged on the fan frame (1), characterized in that, One side of the heat dissipation storage tank (3) is connected with a pair of circulating pipes (4), and the end of the pair of circulating pipes (4) is connected with a contact radiator (5); The contact radiator (5) is provided with an annular groove, and the annular groove is sleeved with a fixed ring plate (6). The fixed ring plate (6) is provided with two pairs of fixed plates (7) at four corners. Two pairs of the fixed plates (7) are provided with two pairs of connecting holes; The contact radiator (5) is a disc cavity structure, and one side of the contact radiator (5) is provided with a heat dissipation contact surface. The heat dissipation contact surface corresponds to the CPU of the computer; One side of the contact radiator (5) is provided with a pair of docking seats (8). One pair of the docking seats (8) extends from one side of the contact radiator (5). One pair of the docking seats (8) is connected with one pair of the circulating pipes (4). One pair of the circulating pipes (4) is integrally connected with the heat dissipation storage tank (3). The contact radiator (5) is integrally formed with the pair of docking seats (8). One pair of the circulating pipes (4) is integrally connected with the pair of docking seats (8) and the heat dissipation storage tank (3).
2. The computer heat dissipation device of claim 1, wherein, One side of the annular groove is provided with a rubber strip (9) with an annular structure. The fixed ring plate (6) is matched with the rubber strip (9).
3. The computer heat dissipation device of claim 2, wherein, The heat dissipation storage tank (3) is provided with a pair of connecting heads (10). One pair of the connecting heads (10) is connected with one end of one pair of the circulating pipes (4).
4. The computer heat dissipation device of claim 3, wherein, One pair of the circulating pipes (4) is a soft rubber pipe. The two ends of one pair of the circulating pipes (4) are heat meltingly connected with one pair of the docking seats (8) and one pair of the connecting heads (10), and are externally sleeved with sealing rings (11).
5. The computer heat dissipating device of claim 4, wherein, The contact radiator (5) is a plate with a cylindrical structure. One pair of the docking seats (8) is provided with a pair of circulating pumps (12).
6. The computer heat dissipating device of claim 5, wherein, The heat dissipation contact surface of the contact radiator (5) is a circular structure and has an area greater than that of the CPU.