Single-sided board contact type IC card strip

Abstract

The utility model relates to the technical field of IC card strips, and discloses a single-sided board contact type IC card strip which comprises an attaching layer, a protective layer is fixedly connected to the bottom of the attaching layer, the protective layer and the attaching layer are physically adsorbed, a silk-screen layer is fixedly connected to the bottom of the protective layer, a solder mask layer is arranged at the bottom of the silk-screen layer in a silk-screen printing mode, and the solder mask layer and the attaching layer are bonded together. The thickness of the solder mask layer is about 0.02-0.05 mm, a circuit wiring layer is arranged at the bottom of the solder mask layer, a chip module contact pin connecting area is reserved between the solder mask layer and the circuit wiring layer due to the fact that the solder mask layer isolates a wire of the circuit wiring layer, a grounding layer is fixedly connected to the bottom of the circuit wiring layer, and a chip module contact pin connecting area is reserved between the grounding layer and the circuit wiring layer. And a substrate layer is arranged at the bottom of the grounding layer. According to the utility model, through the grounding layer and the solder mask layer, stable and reliable signals are guaranteed, defects of a multi-layer board technology are reduced, the fault rate is reduced, the service life is prolonged, the replacement cost of a user is reduced, and the use universality and reliability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to IC card strip technical field especially relates to a single panel contact type IC card strip. BACKGROUND

[0002] IC card strip is a vital component in smart card system, plays a key role in today's digital life. As the storage and transmission carrier of information, it can safely and efficiently save various data such as user's identity, financial account information, consumption record and various permission data, and accurately and quickly complete data reading and updating operation when interacting with the corresponding read-write device, widely used in financial transactions, public transportation, access control security, medical care and many other fields, greatly improves the informatization management level and service efficiency of various industries, brings unprecedented convenient experience to people's life and work, has become an indispensable part of modern society.

[0003] Traditional IC card strip is usually composed of multiple layers. Its basic part is the substrate layer, which is usually made of materials with good insulation and certain mechanical strength, such as polyvinyl chloride (PVC) or polyethylene terephthalate (PET), which builds a stable support structure for the whole strip and ensures the stable placement of other components; the circuit layer is located above the substrate layer, which uses printing or etching technology to carefully arrange metal wires. These wires build a complex circuit network, which is responsible for signal transmission and realizes data communication between the chip and external devices; the chip module as the core integrates advanced integrated circuit chips and contact pins for connecting external devices. The chip integrates rich functional modules, which can perform complex operations, storage and encryption processing on data to meet diversified application requirements; to protect the internal precision circuit and chip from external environmental interference, a protective layer is provided to effectively resist moisture, static electricity, oxidation and daily physical wear and tear; in some designs, there is also a grounding layer to shield electromagnetic interference, optimize signal transmission quality, and a solder mask layer to prevent circuit short circuit and ensure the stability of line connection; in addition, the silk screen layer will mark the relevant information of the product, such as model, manufacturer, etc., for easy identification and management.

[0004] The traditional IC card strip adopts a multi-layer board design for pursuing higher integration and performance, and the accurate alignment and connection process between the multi-layer circuits are difficult. This complexity has many influences. In the production and manufacturing link, the complex structure requires high-precision equipment and fine process, which leads to a substantial increase in production cost, a prolonged production cycle and a serious constraint on production efficiency. For product quality and stability, too many structure levels and complex connection methods significantly increase the probability of product failure, such as frequent occurrence of poor contact between layers, circuit short circuit or open circuit and other problems, which not only increases the difficulty and cost of after-sales maintenance, but also leads to the failure of the entire IC card strip function once a failure occurs, seriously affecting user experience, and even in critical application scenarios such as financial transactions, causing transaction interruption, data loss and other serious consequences, endangering user rights and interests and normal operation of the system. Practical new type content

[0005] In order to make up for the above shortcomings, the utility model provides a single panel contact type IC card strip, aiming at improving the problem that the traditional IC card strip requires high-precision equipment and fine process, leading to a substantial increase in production cost, a prolonged production cycle and a serious constraint on production efficiency.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: a single panel contact type IC card strip, comprising a laminating layer, the laminating layer bottom is fixedly connected with the protection layer, the protection layer and the laminating layer are physically adsorbed, the protection layer bottom is fixedly connected with the silk screen printing layer, the silk screen printing layer bottom silk screen printing has the solder resist layer, the solder resist layer thickness is about 0.02-00.05 millimeter.

[0007] Further, the solder resist layer bottom is provided with a circuit wiring layer, and the solder resist layer isolates the conductive wire of the circuit wiring layer.

[0008] Further, a chip module contact pin connection area is reserved between the solder resist layer and the circuit wiring layer.

[0009] Further, the circuit wiring layer bottom is fixedly connected with the grounding layer, and the grounding layer bottom is provided with a substrate layer.

[0010] Further, the grounding layer and the substrate layer are bonded, and the grounding layer is about 0.05-0.1 millimeter.

[0011] The utility model has the following beneficial effects:

[0012] In the utility model, first, the grounding layer and the solder resist layer ensure stable and reliable signals, the silk screen printing layer facilitates identification and management, the protection layer and the laminating layer ensure durability and facilitate installation, effectively reduce the multi-layer board process drawbacks, reduce the failure rate, prolong the service life, reduce the user replacement cost, improve the use universality and reliability. Attached Figure Description

[0013] Fig. 1 This is a perspective view of a single-sided contact IC card strip proposed in this utility model;

[0014] Fig. 2 This is a schematic diagram of the bonding layer structure of a single-sided contact IC card strip proposed in this utility model;

[0015] Fig. 3 This is a schematic diagram of the base layer structure of a single-sided contact IC card strip proposed in this utility model.

[0016] Legend:

[0017] 1. Adhesive layer; 2. Protective layer; 3. Silkscreen layer; 4. Solder resist layer; 5. Circuit wiring layer; 6. Grounding layer; 7. Base layer. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Reference Figs. 1-3 This utility model provides an embodiment of a single-sided contact IC card strip, including an adhesive layer 1, a protective layer 2 fixedly connected to the bottom of the adhesive layer 1, the protective layer 2 and the adhesive layer 1 being physically adsorbed, a silkscreen layer 3 fixedly connected to the bottom of the protective layer 2, a solder resist layer 4 silkscreened on the bottom of the silkscreen layer 3, the thickness of the solder resist layer 4 being approximately 0.02-0.05 mm, a circuit wiring layer 5 disposed at the bottom of the solder resist layer 4, the solder resist layer 4 isolating the wires of the circuit wiring layer 5, a chip module contact pin connection area is reserved between the solder resist layer 4 and the circuit wiring layer 5, a ground layer 6 fixedly connected to the bottom of the circuit wiring layer 5, a base layer 7 disposed at the bottom of the ground layer 6, the ground layer 6 and the base layer 7 being bonded together, the ground layer 6 being approximately 0.05-0.1 mm thick.

[0020] Specifically, when the IC card strip is inserted into the corresponding card reader reading and writing device, the IC chip in the chip module connected by the circuit wiring layer 5 is activated immediately, and the processed data is transmitted back to the reading and writing device through the data line of the circuit wiring layer 5. At the same time, the grounding layer 6 effectively blocks external electromagnetic interference, ensuring that the electrical signal transmitted by the circuit wiring layer 5 is stable and reliable, thereby ensuring the accuracy and stability of data transmission. The solder mask layer 4 prevents the wires of the circuit wiring layer 5 from interfering with signal transmission due to oxidation or short circuit, and the isolation wire ensures the electrical insulation between the wires, ensuring the electrical connection between the chip and the circuit wiring layer 5. The identification information on the silk screen layer 3 helps users to identify and manage the IC card strip. The protective layer 2 and the bonding layer 1 respectively bear the functions of protecting the internal structure from physical damage and facilitating the bonding and installation with other components, enabling the IC card strip to work smoothly in various use environments, meeting the needs of data storage and interaction in various application scenarios such as electronic payment, identity recognition, access control system, and transportation ticketing, ensuring its stable performance in different scenarios, providing protection for safe transmission and effective storage of data, improving its universality and reliability, ensuring its stable performance in various applications, meeting the diverse actual use requirements, reducing the long production cycle and potential production errors caused by the complexity of multi-layer board process, reducing the failure rate caused by physical damage, improving the service life and reliability of the product, and reducing the frequency and cost of replacing the card strip for users.

[0021] Working principle: First, when the IC card strip is inserted into the corresponding card reader reading and writing device, the IC chip in the chip module connected by the circuit wiring layer 5 is activated. During operation, the instructions from the reading and writing device are transmitted to the chip through the contact pin, and the chip performs corresponding data processing operations according to the instructions, and transmits the data back to the reading and writing device through the data line in the circuit wiring layer 5. At the same time, the grounding layer 6 can effectively shield external electromagnetic interference and guide the interference signal into the ground, ensuring the stability and reliability of the electrical signal transmitted in the circuit wiring layer 5, and providing a stable reference potential for the electrical performance of the circuit wiring layer 5, ensuring the accuracy and stability of data transmission. The solder mask layer 4 prevents the wires of the circuit wiring layer 5 from affecting signal transmission due to oxidation, short circuit, etc. Through the isolation wire, the electrical insulation between the wires is ensured, and the electrical connection between the chip and the circuit wiring layer 5 is ensured only in the reserved chip module contact pin connection area, ensuring the normal operation of the entire circuit system. The identification information on the silk screen layer 3 facilitates the user to identify and manage the IC card strip. The protective layer 2 and the bonding layer 1 protect the internal structure from physical damage and facilitate the bonding and installation with other components, enabling the IC card strip to work normally and stably in different use environments, meeting the needs of data storage and interaction in various application scenarios such as electronic payment, identity recognition, access control system, and transportation ticketing.

[0022] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A single-sided contact IC card strip comprising a laminating layer (1), characterized in that: The bottom of the fit layer (1) is fixedly connected with a protective layer (2), the protective layer (2) is physically adsorbed with the fit layer (1), the bottom of the protective layer (2) is fixedly connected with a silk screen printing layer (3), the bottom of the silk screen printing layer (3) is screen printed with a solder resist layer (4), the thickness of the solder resist layer (4) is about 0.02-0.05mm.

2. The single-faced contact IC card strip according to claim 1, wherein: The bottom of the solder resist layer (4) is provided with a circuit wiring layer (5), the solder resist layer (4) is isolated from the lead wire of the circuit wiring layer (5).

3. A single-sided contact IC card strip according to claim 2, wherein: The solder resist layer (4) and the circuit wiring layer (5) are reserved for chip module contact pin connection area.

4. The single-sided board contact IC card strip according to claim 3, wherein: The bottom of the circuit wiring layer (5) is fixedly connected with a grounding layer (6), and the bottom of the grounding layer (6) is provided with a substrate layer (7).

5. The single-sided board contact IC card strip according to claim 4, wherein: The grounding layer (6) is bonded with the substrate layer (7), and the thickness of the grounding layer (6) is about 0.05-0.1mm.

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