Encapsulation structure of integrated inductor, preparation mold and heat dissipation box body

Abstract

The utility model discloses an integrated inductor potting structure, preparation mould and heat dissipation box, the integrated inductor potting structure includes coil, magnetic core, metal sheet and heat conduction colloid, the magnetic core is respectively provided the coil along the both sides of length direction, the metal sheet is provided between the heat conduction colloid and coil, the heat conduction colloid is provided with the heat conduction colloid, the heat conduction colloid is provided with the heat conduction colloid, the heat conduction colloid is provided with the heat conduction colloid, and the heat conduction colloid is provided with the heat conduction colloid. The heat-conducting colloid surrounds the coil, the magnetic core and the metal sheet; according to the embodiment, the heat-conducting colloid is subjected to injection molding through the preparation mold and wraps the coil, the magnetic core and the metal sheet; the heat dissipation box body is used for guiding out heat of the encapsulation structure of the integrated inductor and comprises a box body, a containing cavity used for containing the encapsulation structure of the integrated inductor is formed in the box body, a water channel cavity is formed in the bottom of the containing cavity, and cooling liquid circulates in the water channel cavity. According to the utility model, the problem of poor heat dissipation performance in the encapsulation structure of the existing inductor is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to inductance heat dissipation technical field especially relates to a kind of integrated inductance's potting structure, preparation mould and heat sink box. BACKGROUND

[0002] In the packaging and use process of electronic device, it is an important factor to improve its reliability and performance to ensure good heat dissipation performance, in prior art, inductance is designed to be installed and used at customer end, inductance includes coil and magnetic core, inductance is placed into heat sink box to be used after potting, however, in actual use process, inductance is directly placed into heat sink box to be potting molded, the position precision of inductance cannot be ensured, leading to insufficient inductance position precision, uneven heat dissipation performance, inductance temperature cannot be effectively reduced, coil / magnetic core performance is prone to decline. SUMMARY

[0003] The utility model mainly aims at providing a kind of integrated inductance's potting structure and preparation mould, to solve the problem of poor heat dissipation performance in the potting structure of existing inductance.

[0004] To achieve the above object, the utility model provides a kind of integrated inductance's potting structure, comprising: coil, magnetic core, metal sheet and heat-conducting colloid, the magnetic core is respectively arranged at the two sides of the coil along length direction, the metal sheet is arranged between the heat-conducting colloid and the coil, and the heat-conducting colloid is surrounded outside the coil, magnetic core and metal sheet.

[0005] Optionally, the metal sheet is arranged at the bottom of the coil and magnetic core, and the shape of the metal sheet is adapted to the shape of the bottom of the coil and magnetic core.

[0006] Optionally, the metal sheet is aluminum sheet.

[0007] Optionally, the heat-conducting colloid is made of potting adhesive and ceramic powder.

[0008] Optionally, the heat-conducting colloid is U-shaped opening structure, and the inner side surface of the heat-conducting colloid is respectively attached to three sides of the coil.

[0009] Optionally, the mounting hole is provided on the coil, and the positioning member is arranged in the mounting hole.

[0010] To achieve the above object, the utility model further provides a kind of preparation mould, for assembling the potting structure of integrated inductance described in any one of the above, comprising bottom plate, multiple cavity plates and multiple side stop plates, multiple side stop plates are located between two adjacent side stop plates, multiple side stop plates, multiple cavity plates and bottom plate are collectively enclosed into an injection molding cavity.

[0011] Optionally, the plurality of cavity plates are provided with connecting holes and also include positioning elements, wherein the connecting holes are connected to the mounting holes through the positioning elements.

[0012] Optionally, the cavity plate, side baffle, and bottom plate are all provided with screw holes and also include connecting bolts. The cavity plate is fixedly connected to the adjacent side baffle by the connecting bolts, and the bottom plate is fixedly connected to the side baffle and the cavity plate by the connecting bolts.

[0013] To achieve the above objectives, this utility model also proposes a heat dissipation enclosure for dissipating the heat of the potting structure of the integrated inductor described in any of the above claims, comprising an enclosure body having a receiving cavity for accommodating the potting structure of the integrated inductor, the bottom of the receiving cavity being provided with a water channel cavity, and coolant flowing within the water channel cavity.

[0014] The beneficial effects of this invention are as follows: It solves the problem of poor heat dissipation performance in the existing potting structure of inductors. By adding a metal sheet between the coil and the thermally conductive colloid, the heat of the coil and magnetic core can be concentrated and absorbed by the metal sheet, and then transferred to the thermally conductive colloid through the metal sheet, and then discharged through the heat dissipation box. This shortens the heat conduction path of the coil and magnetic core, improves the heat dissipation efficiency of the inductor, reduces the operating temperature of the coil and magnetic core, and thus extends the service life of the coil and magnetic core. Adding ceramic powder to the thermally conductive colloid increases the thermal conductivity of the thermally conductive colloid and enhances its heat conduction capability. By using a mold to bond the metal sheet to the magnetic core and coil, the positional accuracy of the inductor is ensured, and displacement or deformation of the inductor during the potting process is avoided, further improving the heat conduction efficiency and enhancing the reliability and durability of the product. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 An exploded view of the potting structure of the integrated inductor of this utility model;

[0017] Figure 2 This is a schematic diagram of the potting structure of the integrated inductor of this utility model;

[0018] Figure 3 A schematic diagram of the encapsulation structure for the integrated inductor of this utility model;

[0019] Figure 4This is a schematic diagram of the structure of a mold for preparing the present invention;

[0020] Figure 5 This is a schematic diagram of the structure of a heat dissipation box according to the present invention;

[0021] Label Explanation:

[0022] 1. Coil; 11. Mounting hole; 12. Positioning element;

[0023] 2. Magnetic core;

[0024] 3. Metal sheet;

[0025] 4. Thermally conductive colloid;

[0026] 5. Mold preparation; 51. Base plate; 52. Cavity plate; 53. Side baffle; 54. Injection cavity; 55. Connecting hole; 56. Screw hole;

[0027] 6. Box body; 61. Receiving cavity; 62. Water channel cavity; 63. Fixing hole;

[0028] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0031] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0032] One embodiment of this utility model proposes a potting structure for an integrated inductor, referring to... Figure 1 , Figure 2 It includes: a coil 1, a magnetic core 2, a metal sheet 3, and a thermally conductive colloid 4. The magnetic core 2 is respectively disposed on both sides of the coil 1 along its length direction. The metal sheet 3 is disposed between the thermally conductive colloid 4 and the coil 1. The thermally conductive colloid 4 surrounds the coil 1, the magnetic core 2, and the metal sheet 3.

[0033] This embodiment solves the problem of poor heat dissipation performance in the existing potting structure of inductors. The coil 1 has retaining plates on both sides, and two magnetic cores 2 are provided. The two magnetic cores 2 are respectively positioned on both sides of the coil 1 and fixed to the retaining plates to prevent displacement or loosening of the magnetic cores 2 during potting, ensuring the stability and reliability of the inductor. By adding a metal sheet 3 between the coil 1 and the thermally conductive colloid 4, the metal sheet 3, which has good thermal conductivity, adheres to the coil 1 and magnetic cores 2, allowing the heat from the coil 1 and magnetic cores 2 to be concentratedly absorbed by the metal sheet 3 and transferred to the thermally conductive colloid through the metal sheet 3. 4. The heat is then discharged through the heat sink, shortening the heat conduction path of coil 1 and magnetic core 2, improving the heat dissipation efficiency of the inductor, reducing the operating temperature of coil 1 and magnetic core 2, and thus extending the service life of coil 1 and magnetic core 2. Ceramic powder is added to the thermally conductive colloid 4, increasing the thermal conductivity of the thermally conductive colloid 4 and enhancing its heat conduction capability. The metal sheet 3 is bonded to the magnetic core 2 and coil 1 through the preparation mold 5, ensuring the positional accuracy of the inductor and preventing displacement or deformation of the inductor during the potting process, further improving the heat conduction efficiency and enhancing the reliability and durability of the product.

[0034] Furthermore, the metal sheet 3 is disposed at the bottom of the coil 1 and the magnetic core 2, and the shape of the metal sheet 3 is adapted to the shape of the bottom of the coil 1 and the magnetic core 2. In this embodiment, the shape of the metal sheet 3 is adapted to the shape of the bottom of the coil 1 and the magnetic core 2 and fits against the bottom of the coil 1 and the magnetic core 2, ensuring that the heat of the coil 1 and the magnetic core 2 can be transferred from the coil 1 and the magnetic core 2 to the metal sheet 3. The adapted shape reduces the contact thermal resistance between the metal sheet 3 and the coil 1 and the magnetic core 2, improves the heat conduction efficiency, avoids heat accumulation caused by shape mismatch, and reduces the operating temperature of the coil 1 and the magnetic core 2.

[0035] Furthermore, the metal sheet 3 is an aluminum sheet. In this embodiment, the metal sheet 3 is preferably an aluminum sheet. Since aluminum has better thermal conductivity than many other common metals, and its density is relatively low, resulting in lower cost, using an aluminum sheet as the metal sheet 3 can reduce the overall weight of the encapsulation structure of the integrated inductor, thus helping to reduce the product's weight and cost. Furthermore, aluminum has good plasticity and ductility, making it easy to process into various shapes and sizes, easily adapting to the shapes of the coil 1 and the bottom of the magnetic core 2, ensuring a tight fit and efficient heat conduction. In addition, aluminum has good corrosion resistance, maintaining stable performance in humid and corrosive environments, which helps to extend the inductor's service life. It should be noted that in other embodiments, metal sheets 3 such as copper sheets or iron sheets can be used.

[0036] Furthermore, the thermally conductive colloid 4 is made of potting compound and ceramic powder. In this embodiment, since ceramic powder has high thermal conductivity, as well as certain mechanical strength and chemical stability, adding ceramic powder to the potting compound in a certain proportion and mixing it evenly can form a thermally conductive colloid 4 with better thermal conductivity. This improves the thermal conductivity of the thermally conductive colloid 4, increases heat transfer efficiency, and enhances its mechanical strength, allowing it to better resist deformation and damage under external forces. This helps extend the service life of the thermally conductive colloid 4.

[0037] Furthermore, the thermally conductive colloid 4 has a U-shaped opening structure, and its inner surface is respectively attached to three sides of the coil 1. In this embodiment, the thermally conductive colloid 4 has a U-shaped opening structure, meaning that its inner surface is attached to three sides of the coil 1, making the coil 1 less prone to displacement and loosening, improving the stability of the inductor structure, reducing the contact thermal resistance between the coil 1 and the thermally conductive colloid 4, and allowing the heat from the coil 1 to be transferred to the thermally conductive colloid 4.

[0038] Furthermore, the coil 1 is provided with a mounting hole 11, and a positioning element 12 is provided inside the mounting hole 11. In this embodiment, the coil 1 is provided with a mounting hole 11, which is aligned with the connection hole 55 of the preparation mold 5. When the coil 1, magnetic core 2, and other structures are placed into the preparation mold 5 for preparation, the mounting hole 11 and the connection hole 55 of the preparation mold 5 are aligned, and the positioning element 12 is used for positioning, so that the coil 1, magnetic core 2, and other structures will not be displaced during the preparation process, thus ensuring the accuracy of the preparation.

[0039] This utility model also provides a preparation mold 5 for assembling the potting structure of the integrated inductor described in any of the above claims, referring to... Figure 3 , Figure 4 The mold includes a base plate 51, multiple cavity plates 52, and multiple side baffles 53. The side baffles 53 are located between adjacent side baffles 53, and together with the base plate 51, they form an injection cavity 54. Specifically, in this embodiment, the mold 5 is used to prepare the encapsulation structure of an integrated inductor. When encapsulation is required, the operator first assembles the base plate 51, multiple cavity plates 52, and multiple side baffles 53 into a mold of the desired shape. The magnetic core 2, inductor, and metal sheet 3 are placed inside the injection cavity 54. Molten thermally conductive colloid 4 is then injected into the injection cavity 54, allowing it to cool and become the encapsulated structure of the integrated inductor. The mold is then opened, and the finished inductor encapsulation structure is removed. This detachable mold structure allows for the preparation of encapsulation structures for inductors of different models and sizes, providing high flexibility and adaptability.

[0040] Furthermore, the cavity plates 52 are provided with connecting holes 55 and also include positioning elements 12. The connecting holes 55 are connected to the mounting holes 11 through the positioning elements 12. In this embodiment, the cavity plates 52 are provided with connecting holes 55, which are used to align with the mounting holes 11 and fix the coil 1 in the injection cavity 54 through the positioning elements 12, preventing the coil 1 from shifting or deforming during the potting process, and ensuring the stability and reliability of the mold.

[0041] Furthermore, the cavity plate 52, side baffles 53, and bottom plate 51 are all provided with screw holes 56 and connecting bolts. The cavity plate 52 is fixedly connected to the adjacent side baffles 53 by connecting bolts, and the bottom plate 51 is fixedly connected to the side baffles 53 and the cavity plate 52 by connecting bolts. In this embodiment, the cavity plate 52, side baffles 53, and bottom plate 51 are fixed and disassembled by connecting bolts. When mold closing is required, the side baffles 53, cavity plate 52, and bottom plate 51 are positioned and fixed one by one by connecting bolts to form a preparation mold 5 with an injection cavity 54. When the preparation is completed and demolding and cleaning are required, the connecting bolts are removed, and the preparation mold 5 can be disassembled into individual plates.

[0042] This utility model also provides a heat dissipation enclosure for dissipating heat from the potting structure of the integrated inductor described in any of the above claims, see reference. Figure 5 The enclosure includes a housing body 6, which has a cavity 61 for accommodating a potting structure for accommodating an integrated inductor. The bottom of the cavity 61 is provided with a water channel cavity 62, in which coolant flows. In this embodiment, the housing body 6 has a receiving cavity 61 for accommodating the potting structure of the integrated inductor. The shape of the receiving cavity 61 matches the potting structure of the integrated inductor to ensure that the potting structure can fit tightly inside the receiving cavity 61, reducing the obstruction of heat transfer. Fixing holes 63 are provided on the four sides of the receiving cavity 61. The positions of the fixing holes 63 and the mounting holes 11 correspond to each other. When the potting structure of the integrated inductor is placed into the receiving cavity 61, the fixing holes 63 and the mounting holes 11 are fixedly connected by the positioning member 12, thereby firmly fixing the potting structure of the integrated inductor in the heat dissipation box and preventing the potting structure of the integrated inductor from shifting inside the receiving cavity 61. A water channel cavity 62 is provided at the bottom of the receiving cavity 61. The water channel cavity 62 is connected to the external coolant circulation system. That is, coolant flows in the water channel cavity 62. The coolant continuously absorbs heat and carries it away during the circulation process, thereby carrying away the heat of the coil 1 and achieving the purpose of heat dissipation.

[0043] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. An encapsulation structure of an integrated inductor, characterized by, The application relates to a coil, a magnetic core, a metal sheet and a heat-conducting glue body, the magnetic core is arranged on both sides of the coil along the length direction respectively, the metal sheet is arranged between the heat-conducting glue body and the coil, and the heat-conducting glue body surrounds the outside of the coil, the magnetic core and the metal sheet. A mounting hole is arranged on the coil, and a positioning piece is arranged in the mounting hole. The metal sheet is arranged at the bottom of the coil and the magnetic core, and the shape of the metal sheet is matched with the shape of the bottom of the coil and the magnetic core.

2. The potted structure of an integrated inductor according to claim 1, wherein The metal sheet is an aluminum sheet.

3. The potted structure of an integrated inductor according to claim 1, wherein The heat-conducting glue body is made of pouring glue and ceramic powder.

4. The potted structure of an integrated inductor according to claim 1, wherein The heat-conducting glue body is of U-shaped opening structure, and the inner side of the heat-conducting glue body is matched with three sides of the coil.

5. The potted structure of an integrated inductor according to claim 1, wherein The application relates to a bottom plate, a plurality of cavity plates and a plurality of side plates, the plurality of side plates are arranged between two adjacent side plates, the plurality of side plates, the plurality of cavity plates and the bottom plate jointly form an injection cavity.

6. A mold for assembling a potting structure of the integrated inductor according to any one of claims 1 to 5, characterized by, A connecting hole is arranged on the cavity plate, and the connecting hole is connected with the mounting hole through a positioning piece.

7. The production mold according to claim 6, wherein Screw holes are arranged on the cavity plate, the side plate and the bottom plate, and connecting bolts are further arranged, the cavity plate and the adjacent side plate are fixedly connected through the connecting bolts, and the bottom plate, the side plate and the cavity plate are fixedly connected through the connecting bolts.

8. The production mold according to claim 6, wherein The application relates to a box body which is formed with a containing cavity for containing a pouring structure of an integrated inductor, a water channel cavity is arranged at the bottom of the containing cavity, and cooling liquid flows through the water channel cavity.

9. A heat sink housing for conducting heat away from the potting structure of the integrated inductor of any one of claims 1-5, characterized in that, ​

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