Novel EMI differential mode inductor structure

Abstract

The utility model discloses a novel electro-magnetic interference (EMI) differential mode inductor structure which comprises a silicon steel iron core structure, a plastic shell structure, an enameled wire structure, a magnetic rubber gasket air gap structure, an insulating plate structure and an adhesive structure. Inductance saturation is prevented by adding a magnetic rubber gasket air gap structure, and the anti-EMI interference effect of the inductor is improved by supplementing a magnetic circuit; the silicon steel iron core has conductivity, the plastic shell is used for isolating direct contact between the silicon steel iron core and the enameled wire, and it is ensured that the inductor is not short-circuited while current passes through the inductor; and secondly, fixing the inductor on the insulating plate by using an adhesive.

Description

Technical Field

[0001] The technical problem to be solved by this utility model is to reduce EMI electromagnetic interference in the low and medium frequency range and improve product compatibility. This technology belongs to the field of electromagnetic interference technology. Background Technology

[0002] Since the beginning of the information age in the 20th century, the market share of electronic products has been increasing, and their applications have become more and more widespread. Against this backdrop, the demand for electronic components has also been expanding. At the same time, due to the increase in electronic products, various electromagnetic waves have also affected the use of electronic components. Therefore, inductors with filtering effects have been developed.

[0003] Currently, the commonly used methods for differential-mode inductors in the field of low-to-mid frequency EMI electromagnetic interference technology are as follows:

[0004] 1. Employing a low-frequency reactor structure reduces electromagnetic interference in the mid-to-low frequency range. The disadvantages of this method are: larger product size, occupying more PCB board space, and higher cost.

[0005] 2. A differential-mode inductor structure with an iron powder core is used to reduce electromagnetic interference. The drawback of this method is that its anti-interference effect is poor in the low-to-mid frequency range; it is mainly effective in the high-frequency range.

[0006] 3. A differential-mode inductor structure with a ferrite core is used to reduce electromagnetic interference. The disadvantages of this method are poor anti-interference performance in the low-to-mid frequency range, primarily targeting the high-frequency range; secondly, it has a low maximum current requirement.

[0007] Therefore, in response to the increasing demand for electronic products in the market, electromagnetic interference technology needs further breakthroughs and improvements. Utility Model Content

[0008] The purpose of this invention is to provide a novel EMI differential mode inductor structure to solve the problems mentioned in the background.

[0009] The objective of this utility model is achieved through the following technical solution:

[0010] A novel EMI differential mode inductor structure includes a silicon steel core structure (1), a magnetic rubber pad air gap structure (2), an enameled wire structure (3), a plastic shell structure (4), an adhesive structure (5), and an insulating board structure (6). The novel EMI differential mode inductor structure uses a silicon steel core structure (1) with a magnetic rubber pad air gap structure (2) assembled at the core gap.

[0011] The novel EMI differential mode inductor core adopts a silicon steel core structure (1), and a magnetic rubber pad air gap structure (2) is assembled at the core gap and a plastic shell structure (4) is used to wrap the silicon steel core structure (1) inside.

[0012] The novel EMI differential mode inductor core adopts a silicon steel core structure (1), a magnetic rubber pad air gap structure (2) is assembled at the core gap, and a plastic shell structure (4) is used to wrap the silicon steel core structure (1) inside; the enameled wire structure (3) is wound on the plastic shell structure (4).

[0013] The novel EMI differential mode inductor structure core adopts a silicon steel core structure (1), a magnetic rubber pad air gap structure (2) is assembled at the core gap, and a plastic shell structure (4) is used to wrap the silicon steel core structure (1) inside; an enameled wire structure (3) is wound on the plastic shell structure (4); the wire end of the enameled wire structure (3) passes through the insulating board structure (6) to connect the bottom of the inductor to the insulating board structure (6), and an adhesive structure (5) is used to fix the insulating board structure (6) to the bottom of the inductor.

[0014] To achieve the above objectives, the EMI differential mode inductor structure of this utility model has excellent low-frequency anti-EMI interference characteristics through the silicon steel core, and adds a magnetic rubber gasket air gap structure to prevent inductor saturation and supplement the magnetic circuit to improve the inductor's anti-EMI interference effect; the silicon steel core itself is conductive, and the plastic shell is used to isolate the silicon steel core from direct contact with the enameled wire, ensuring that the inductor itself does not short-circuit while current is passing through; secondly, an adhesive is used to fix the inductor to the insulating board.

[0015] Beneficial effects of this utility model

[0016] This utility model discloses a novel EMI differential mode inductor structure, comprising a silicon steel core structure (1), a magnetic rubber pad air gap structure (2), an enameled wire structure (3), a plastic shell structure (4), an adhesive structure (5), and an insulating board structure (6). It offers significant advantages for use in low-to-mid-frequency EMI electromagnetic interference applications: 1. This novel EMI differential mode inductor structure is small in size, effectively increasing PCB space utilization; 2. Compared to traditional reactors, it effectively reduces costs; 3. This structure targets a wider frequency range; 4. The magnetic circuit supplementation through the magnetic rubber pad provides a more effective anti-EMI interference effect. Attached Figure Description

[0017] The present invention will be further described with reference to the accompanying drawings, but the content of the drawings does not constitute any limitation on the present invention.

[0018] Figure 1 This is a schematic diagram illustrating the structural analysis of a novel EMI differential mode inductor according to this utility model.

[0019] exist Figure 1 This includes:

[0020] Silicon steel core structure (1), magnetic rubber pad air gap structure (2), enameled wire structure (3), plastic shell structure (4), adhesive structure (5), insulating board structure (6). Detailed Implementation

[0021] The present invention will be further described in conjunction with the following embodiments. Example

[0022] See Figure 1 This embodiment utilizes the excellent low-frequency EMI interference resistance of the silicon steel core, and uses a magnetic rubber pad air gap structure to prevent inductor saturation and supplement the magnetic circuit to improve the inductor's EMI interference resistance. The silicon steel core itself is conductive, and a plastic shell is used to isolate the silicon steel core from direct contact with the enameled wire, ensuring that the inductor itself does not short-circuit while current is flowing through it. Secondly, an adhesive is used to fix the inductor to the insulating board.

[0023] This novel EMI differential mode inductor structure is small in size, which can effectively increase PCB space utilization; compared with traditional reactors, it can effectively reduce costs; this structure targets a wider frequency range; and the magnetic circuit supplemented by magnetic rubber pads provides a more advantageous anti-EMI interference effect.

[0024] Finally, the claims of this utility model patent should be explained. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A novel EMI differential mode inductor structure comprising a silicon steel core structure (1), a magnetic gasket air gap structure (2), an enameled wire structure (3), a plastic housing structure (4), an adhesive structure (5) and an insulating board structure (6), characterized in that: The new EMI differential mode inductor structure magnetic core adopts silicon steel core structure (1) to assemble magnetic glue gasket air gap structure (2) at the gap of the magnetic core.

2. A novel EMI differential mode inductor structure according to claim 1, characterized in that: The magnetic core adopts silicon steel core structure (1), assembles magnetic glue gasket air gap structure (2) at the gap of the magnetic core, and adopts plastic shell structure (4) to wrap the silicon steel core structure (1) inside.

3. The novel EMI differential mode inductor structure of claim 1, wherein: The magnetic core adopts silicon steel core structure (1), assembles magnetic glue gasket air gap structure (2) at the gap of the magnetic core, and adopts plastic shell structure (4) to wrap the silicon steel core structure (1) inside; the enameled wire structure (3) is wound on the plastic shell structure (4).

4. The novel EMI differential mode inductor structure of claim 1, wherein: The magnetic core adopts silicon steel core structure (1), assembles magnetic glue gasket air gap structure (2) at the gap of the magnetic core, and adopts plastic shell structure (4) to wrap the silicon steel core structure (1) inside; the enameled wire structure (3) is wound on the plastic shell structure (4); the enameled wire structure (3) is passed through the insulating plate structure (6) to connect the inductor bottom and the insulating plate structure (6), and the adhesive structure (5) is used to fix the insulating plate structure (6) on the inductor bottom.

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