Electron gun destressing equipment and vacuum cavity applied to electron gun destressing equipment

Abstract

The utility model discloses electron gun destressing equipment and a vacuum cavity applied to the electron gun destressing equipment. The electron gun destressing equipment comprises the vacuum cavity, a vacuumizing device and a hydrogen circulation system, and an electron gun is arranged in the vacuum cavity; the vacuumizing device is connected with the vacuum cavity and used for keeping the vacuum environment of the vacuum cavity. And the hydrogen circulation system is arranged at the bottom of the vacuum cavity, is connected with the vacuum cavity and is used for ensuring hydrogen circulation between the vacuum cavity and the outside under the condition that the lamp filament of the electron gun is electrified.

Description

Technical Field

[0001] This application relates to the field of X-ray tube technology, and in particular to an electron gun stress relief device and a vacuum cavity used in the electron gun stress relief device. Background Technology

[0002] An X-ray tube is a high-power vacuum electron tube that typically operates under high voltage conditions. Therefore, the various components within an X-ray tube require high-standard manufacturing. The cathode electron gun, as one of the core components of an X-ray tube, provides the electron beam. Furthermore, the structural stability and service life of the cathode electron gun directly determine the X-ray tube's emission performance, overall stability, and lifespan. In practice, to achieve structural stability in an X-ray tube, stress-relief procedures are necessary for the cathode electron gun to prevent structural deformation caused by welding stress during its fabrication.

[0003] To address the aforementioned problems, existing technologies have proposed some solutions. For example, one existing solution involves placing the electron gun in a vacuum chamber with a vacuum level better than 3 × 10⁻⁶. -3 Under the condition of Pa, the filament power supply is turned on, and the filament current is applied to the rated value, so that the filament temperature is controlled at 2500±100K and maintained for 10 minutes. After the filament is shaped, flash tempering is performed, the filament current is increased, and the filament temperature reaches 2650±100K and is maintained for 10 seconds. This performs stress relief operation on the electron gun.

[0004] However, the above solutions have certain shortcomings. For example, in a vacuum environment, impurity gases evaporated from the electron gun filament at high temperatures can adhere to the focusing electrode and other parts, causing localized oxidation of the electron gun. This not only affects the appearance of the electron gun but also its lifespan. Furthermore, in a vacuum environment, the high-temperature filament cools down slowly, typically requiring 2-5 hours to reach room temperature, severely limiting working efficiency.

[0005] There is currently no effective solution to the technical problem in the existing technology that, under vacuum conditions, impurity gases evaporated from the electron gun filament at high temperatures can adhere to the focusing electrode and other parts, causing localized oxidation of the electron gun. Utility Model Content

[0006] This invention provides an electron gun stress relief device and a vacuum chamber for use in the electron gun stress relief device, so as to at least solve the technical problem in the prior art that, under vacuum environment, impurity gases evaporated at high temperature from the electron gun filament will adhere to the focusing electrode and other parts, thereby causing local oxidation of the electron gun.

[0007] According to one aspect of this application, an electron gun stress relief device is provided, comprising: a vacuum chamber, a vacuum pumping device, and a hydrogen circulation system, wherein the electron gun is disposed inside the vacuum chamber; the vacuum pumping device is connected to the vacuum chamber to maintain a vacuum environment in the vacuum chamber; and the hydrogen circulation system is disposed at the bottom of the vacuum chamber and connected to the vacuum chamber to ensure hydrogen circulation between the vacuum chamber and the outside when the filament of the electron gun is energized.

[0008] Optionally, the hydrogen circulation system includes: a hydrogen inlet passage, and an inlet valve is provided at the bottom of the vacuum chamber, wherein the hydrogen inlet passage is connected to the interior of the vacuum chamber through the inlet valve and is used to introduce hydrogen into the vacuum chamber.

[0009] Optionally, the hydrogen circulation system includes: a hydrogen outlet passage, and an outlet valve is provided at the bottom of the vacuum chamber, wherein the hydrogen outlet passage is connected to the interior of the vacuum chamber through the outlet valve and is used to discharge hydrogen from the vacuum chamber to the outside.

[0010] Optionally, it also includes a flow meter, which is connected to the hydrogen outlet passage for monitoring the flow rate of hydrogen.

[0011] Optionally, a vacuum valve is also provided at the bottom of the vacuum chamber, through which the vacuum pumping device is connected to the interior of the vacuum chamber.

[0012] Optionally, it also includes a temperature sensor, wherein the temperature sensor is disposed outside the vacuum chamber and corresponds to the position of the filament inside the vacuum chamber, for measuring the temperature of the filament.

[0013] Optionally, it also includes a power supply, wherein the filament is connected to the power supply via wires.

[0014] According to another aspect of this application, a vacuum cavity for use in an electron gun stress relief device is provided, comprising: a vacuum cavity body and a base plate assembly, wherein the vacuum cavity body includes a first cavity and a second cavity, the first cavity body is vertically disposed relative to the base plate assembly and detachably connected to the base plate assembly; the second cavity body is horizontally disposed relative to the base plate assembly and connected to the top end of the first cavity body; and the second cavity body is provided with a window.

[0015] Optionally, the window includes: glass and a connector, the second cavity is provided with a first opening, wherein the outer edge of the first opening extends outward with a first fixing part, and the glass is detachably connected to the first fixing part through the connector.

[0016] Optionally, the window may further include a sealing assembly disposed between the connector and the first fixing part.

[0017] Optionally, the sealing assembly includes: a first washer and a second washer, wherein the first washer is disposed between the first fixing portion and the glass; and the second washer is disposed between the glass and the connector.

[0018] Optionally, the base plate assembly includes: a base plate, and a second opening is provided at the bottom of the first cavity, wherein a second fixing part extends outward from the outer edge of the second opening, and the base plate and the second fixing part are detachably connected.

[0019] Optionally, the base plate assembly includes a third washer disposed between the base plate and the second fixing part.

[0020] This application provides an electron gun stress relief device. The device includes a vacuum chamber, a vacuum pumping unit, and a hydrogen circulation system. The electron gun is disposed inside the vacuum chamber. The vacuum pumping unit is connected to the vacuum chamber to maintain a vacuum environment. The hydrogen circulation system is located at the bottom of the vacuum chamber and connected to it, ensuring hydrogen circulation between the vacuum chamber and the outside environment when the electron gun filament is energized.

[0021] Because the vacuum chamber of this application is connected to a vacuum pumping device, the filament of the electron gun located inside the vacuum chamber can complete the stress relief process under high temperature and energization, thereby eliminating the welding stress generated during the filament welding process and achieving further shaping of the filament.

[0022] Furthermore, since this application also provides a hydrogen circulation system at the bottom of the vacuum chamber, when the electron gun filament is energized and at high temperature (i.e., during the stress relief process of the filament), the circulating hydrogen can remove impurities and dust attached to the filament, thereby significantly improving the cleanliness of the electron gun and avoiding localized oxidation of the electron gun.

[0023] This achieves the technical effect of relieving stress on the electron gun filament, improving the cleanliness of the electron gun, and preventing localized oxidation. It also solves the technical problem in existing technologies where, in a vacuum environment, impurity gases evaporated from the electron gun filament at high temperatures adhere to the focusing electrode and other parts, causing localized oxidation of the electron gun.

[0024] The above and other objects, advantages and features of this invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this application in conjunction with the accompanying drawings. Attached Figure Description

[0025] The following sections will describe some specific embodiments of this application in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0026] Figure 1 This is a schematic diagram of the structure of an electron gun stress relief device according to an embodiment of this application;

[0027] Figure 2 This is a cross-sectional view of the internal structure of an electron gun stress relief device according to an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the bottom of the vacuum chamber of an electron gun stress relief device according to an embodiment of this application;

[0029] Figure 4 This is a flowchart of a method for stress-relieving and flash-stretching a filament according to an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the structure of a vacuum cavity according to another embodiment of this application. Detailed Implementation

[0031] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0033] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate for the embodiments of the utility model described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0034] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0035] Figure 1 This is a structural schematic diagram of an electron gun stress relief device according to an embodiment of this application. Figure 2 This is a cross-sectional view of the internal structure of an electron gun stress relief device according to an embodiment of this application. (Reference) Figure 1 and Figure 2 As shown, an electron gun stress relief device includes: a vacuum chamber 10, a vacuum pumping device 20, and a hydrogen circulation system 30, wherein the electron gun is disposed inside the vacuum chamber 10; the vacuum pumping device 20 is connected to the vacuum chamber 10 to maintain the vacuum environment of the vacuum chamber 10; and the hydrogen circulation system 30 is disposed at the bottom of the vacuum chamber 10 and connected to the vacuum chamber 10 to ensure hydrogen circulation between the vacuum chamber 10 and the outside when the filament of the electron gun is energized.

[0036] As described in the background section, in a vacuum environment, the impurity gases evaporated from the electron gun filament at high temperatures can adhere to the focusing electrode and other parts, causing localized oxidation of the electron gun. This not only affects the appearance of the electron gun but also its service life.

[0037] In view of this, this application provides an electron gun stress relief device. The electron gun stress relief device includes a vacuum chamber 10, a vacuum pumping device 20, and a hydrogen circulation system 30. The electron gun is disposed inside the vacuum chamber 10. The vacuum pumping device 20 is connected to the vacuum chamber 10, so that when the vacuum pumping device 20 is operating, a vacuum pumping operation can be performed inside the vacuum chamber 10 to maintain a vacuum environment inside the vacuum chamber 10. Furthermore, a hydrogen circulation system 30 is also provided at the bottom of the vacuum chamber 10, wherein the hydrogen circulation system 30 can introduce hydrogen into the vacuum chamber 10 and also expel hydrogen from the vacuum chamber 10.

[0038] First, the vacuum chamber 10 is evacuated using the vacuum pumping device 20, maintaining a vacuum environment inside the chamber. Then, when the vacuum level in the vacuum chamber 10 reaches a preset threshold (e.g., 1 Pa), the filament of the electron gun is energized. While the filament is energized, the high-temperature environment within the vacuum chamber 10 is used to relieve stress on the filament. Simultaneously, during this stress-relieving process, hydrogen is continuously introduced into the vacuum chamber 10 using the hydrogen circulation system 30, and hydrogen is continuously expelled from the vacuum chamber 10 using the same system, ensuring hydrogen circulation between the vacuum chamber 10 and the outside environment.

[0039] Therefore, since the vacuum chamber 10 of this application is connected to the vacuum pumping device 20, the filament of the electron gun disposed inside the vacuum chamber 10 can complete the stress relief process under high temperature when energized, thereby eliminating the welding stress generated during the filament welding process.

[0040] Furthermore, since this application also provides a hydrogen circulation system 30 at the bottom of the vacuum chamber 10, when the electron gun filament is energized and at high temperature (i.e., during the stress relief process of the filament), the circulating hydrogen can remove the impurities and dust attached around the filament, thereby significantly improving the cleanliness of the electron gun and avoiding local oxidation of the electron gun.

[0041] This achieves the technical effect of relieving stress on the electron gun filament, improving the cleanliness of the electron gun, and preventing localized oxidation. It also solves the technical problem in existing technologies where impurity gases evaporated from the electron gun filament at high temperatures in a vacuum environment adhere to the focusing electrode and other parts, causing localized oxidation of the electron gun.

[0042] Furthermore, since the filament of an electron gun is typically made of a flexible spiral of fine tungsten wire, the resulting filament structure is not entirely stable. To address this issue, this application achieves filament sizing under high temperature by energizing the filament.

[0043] Preferably, the vacuum pump 20 can be a vacuum pump. Furthermore, the vacuum chamber 10 can be made of materials such as stainless steel, copper, or titanium, or other metals with good mechanical properties.

[0044] Optionally, the hydrogen circulation system 30 includes a hydrogen inlet passage 310 and an inlet valve at the bottom of the vacuum chamber 10. The hydrogen inlet passage 310 is connected to the interior of the vacuum chamber 10 through the inlet valve and is used to introduce hydrogen into the vacuum chamber 10.

[0045] Specifically, Figure 3This is a schematic diagram of the bottom of a vacuum chamber 10 according to an embodiment of this application. (See reference) Figure 1 and Figure 3 As shown, the hydrogen circulation system 30 includes a hydrogen inlet passage 310. An inlet valve is provided at the bottom of the vacuum chamber 10.

[0046] Thus, with the vacuum environment inside the vacuum chamber 10 (i.e., the vacuum chamber 10 has been evacuated using the vacuum pumping device 20), the inlet valve and the hydrogen inlet passage 310 are opened, and hydrogen is introduced into the vacuum chamber 10 through the hydrogen inlet passage 310, thereby ensuring that the filament completes the stress relief process in the hydrogen atmosphere.

[0047] Optionally, the hydrogen circulation system 30 includes a hydrogen outlet passage 320 and an outlet valve at the bottom of the vacuum chamber 10. The hydrogen outlet passage 320 is connected to the interior of the vacuum chamber 10 through the outlet valve and is used to discharge hydrogen from the vacuum chamber 10 to the outside.

[0048] Specifically, refer to Figure 1 and Figure 3 As shown, the hydrogen circulation system 30 includes a hydrogen outlet passage 320. An outlet valve is provided at the bottom of the vacuum chamber 10.

[0049] Thus, with the vacuum environment inside the vacuum chamber 10 (i.e., the vacuum chamber 10 has been evacuated using the vacuum pumping device 20), the gas outlet valve and the hydrogen gas outlet passage 320 are opened, and the hydrogen gas inside the vacuum chamber 10 is discharged using the hydrogen gas outlet passage 320.

[0050] That is, during the process of energizing the filament of the electron gun, the interior of the vacuum chamber 10 is not only a vacuum environment, but also, under the action of the hydrogen inlet passage 310 and the hydrogen outlet passage 320, it can ensure the circulation of hydrogen between the inside and outside of the vacuum chamber 10. This allows the flowing hydrogen to carry the impurities evaporated at high temperature to the outside of the vacuum chamber 10, thereby avoiding the technical effect of local oxidation of the filament of the electron gun.

[0051] Optionally, it also includes a flow meter 50, wherein the flow meter 50 is connected to the hydrogen outlet passage 320 for monitoring the flow rate of hydrogen.

[0052] Specifically, refer to Figure 1 As shown, the electron gun stress relief device also includes a flow meter 50. The flow meter 50 is connected to the hydrogen outlet passage 320 and is used to monitor the hydrogen flow rate.

[0053] It is worth noting that before energizing the electron gun filament, a hydrogen purity test must be performed. Specifically, the vacuum chamber 10 is first evacuated using a vacuum pump 20. Once the vacuum level inside the chamber 10 reaches a preset threshold (e.g., 1 Pa), the vacuum pump 20 is turned off, and the hydrogen circulation system 30 is turned on. The hydrogen flow rate is then monitored using a flow meter located in the hydrogen outlet passage 320 (i.e., hydrogen purity test). Only after the hydrogen purity test is passed is the electron gun filament energized.

[0054] Thus, by setting a flow meter 50 at the hydrogen outlet passage 320 and performing a hydrogen purity test on the inside of the vacuum chamber 10 beforehand, the technical effect of ensuring that the impurities attached around the filament are completely evaporated is achieved.

[0055] Optionally, a vacuum valve 130 is also provided at the bottom of the vacuum chamber 10, wherein the vacuum pumping device 20 is connected to the interior of the vacuum chamber 10 through the vacuum valve 130.

[0056] Specifically, refer to Figure 1 and Figure 3 As shown, a vacuum valve 130 is also provided at the bottom of the vacuum chamber 10. The vacuum pumping device 20 is connected to the interior of the vacuum chamber 10 through the vacuum valve 130. Thus, the vacuum pumping device 20 can expel the air from the vacuum chamber 10 and ensure a vacuum environment inside the vacuum chamber 10.

[0057] Optionally, it also includes a temperature sensor 60, wherein the temperature sensor 60 is disposed outside the vacuum chamber 10 and corresponds to the position of the filament inside the vacuum chamber 10, for measuring the temperature of the filament.

[0058] Specifically, refer to Figure 1 As shown, the electron gun stress relief device also includes a temperature sensor 60. The temperature sensor 60 is located outside the vacuum chamber 10 and corresponds to the position of the filament within the vacuum chamber 10, and is used to measure the temperature of the filament within the vacuum chamber 10.

[0059] In other words, when the filament is energized, the temperature sensor 60 can measure the filament temperature. Based on this temperature, the operator can adjust the current applied to both ends of the filament until the filament temperature reaches a preset threshold. This allows for better stress relief of the filament and also enables filament shaping.

[0060] Optionally, it also includes a power supply 70, wherein the filament is connected to the power supply 70 via a wire 80.

[0061] Specifically, refer to Figure 1 and Figure 2As shown, the electron gun stress relief device also includes a power supply 70. The filament inside the vacuum chamber 10 is connected to the power supply 70 via a wire 80.

[0062] Furthermore, in this embodiment, since there are multiple filaments inside the electron gun, there can be, for example, multiple wires 80, and each wire 80 is connected to a unique filament. For example, a wire is connected to the common end of the filament, a wire is connected to the large filament end, a wire is connected to the small filament end, and a wire is also connected to the process filament end. Therefore, because multiple wires 80 are provided in this application, the technical effect of stress relief and flash tempering of multiple filaments inside the electron gun can be achieved in a single stress relief process.

[0063] In addition, it is worth noting that both the hydrogen circulation system 30 and the vacuum pumping device 20 are connected to the host computer 90, so that the operator can control the opening and closing of the hydrogen circulation system 30 and the vacuum pumping device 20 through the host computer 90.

[0064] also, Figure 4 This is a flowchart illustrating a method for stress-relieving and flash-blending a filament according to embodiments of this application. (Reference) Figure 4 As shown, the method includes:

[0065] S410: Place the electron gun on the ceramic bracket 430 and connect the connecting wires 80 to the filament common end, the large filament end, the small filament end, and the process filament end;

[0066] S420: Fix the vacuum chamber 140 to the base plate assembly 150 and tighten the fixing bolts 153-158 to form the vacuum chamber 10;

[0067] S430: The temperature sensor 60 is placed outside the vacuum chamber 10 and corresponds to the filament inside the vacuum chamber 10;

[0068] S440: Click "vacuum" on the host computer 90 operation interface, so that the vacuum pumping device 20 performs a vacuum pumping operation on the vacuum chamber 10. When the vacuum degree in the vacuum chamber 10 reaches the preset threshold of 1Pa, the vacuum pumping device 20 is turned off, and the inlet valve and outlet valve are opened on the host computer 90 operation interface, so as to ensure the hydrogen circulation between the vacuum chamber 10 and the outside by using the hydrogen inlet passage 310 and the hydrogen outlet passage 320.

[0069] S450: After the hydrogen purity test is passed, turn on the power supply 70 and use the wire 80 to energize the filament, thereby relieving the stress on the filament. Adjust the current at both ends of the filament until the temperature of the filament reaches the preset threshold of 2600℃ and maintain it for 10 minutes.

[0070] S460: Further, the filament is flash-spun, and the current at both ends of the filament is adjusted until the filament temperature reaches the expected value of 2900°C and is held for 10 seconds;

[0071] S470: Turn off the power at 70°C and keep it off for 10 minutes to allow the electron gun to cool down rapidly;

[0072] S480: Close hydrogen inlet passage 310 and hydrogen outlet passage 320;

[0073] S490: Turn on the vacuum pumping device 20. After the vacuum level in the vacuum chamber 10 is better than 1 Pa, turn off the vacuum pumping device 20 to remove the hydrogen gas in the vacuum chamber 10 and avoid safety hazards.

[0074] According to another embodiment provided in this application, a vacuum chamber 10 for use in an electron gun stress relief device is also provided, comprising: a vacuum chamber 140 and a base plate assembly 150, wherein the vacuum chamber 140 includes a first chamber 141 and a second chamber 142, the first chamber 141 is vertically disposed relative to the base plate assembly 150 and is detachably connected to the base plate assembly 150; the second chamber 142 is horizontally disposed relative to the base plate assembly 150 and is connected to the top end of the first chamber 141; and the second chamber 142 is provided with a window 143.

[0075] Specifically, Figure 5 This is a schematic diagram of the structure of a vacuum cavity 10 according to another embodiment of this application. (Reference) Figure 5 As shown, the vacuum chamber 10 includes a vacuum chamber body 140 and a base plate assembly 150. The vacuum chamber body 140 includes a first cavity 141 and a second cavity 142. The first cavity 141 is vertically disposed relative to the base plate assembly 150 and is detachably connected to it. The second cavity 142 is horizontally disposed relative to the base plate assembly 150 and is connected to the top end of the first cavity 141. The first cavity 141 and the second cavity are in communication with each other.

[0076] Furthermore, the second cavity 142 is also provided with a viewing window 143, so that during the filament stress relief process in the vacuum cavity 10, the filament inside the vacuum cavity 10 can be seen through the window 143. This allows the operator to make timely adjustments based on changes in the filament.

[0077] Optionally, the window 143 includes a glass 1431 and a connector 1432, and the second cavity 142 is provided with a first opening 1421, wherein a first fixing part 1422 extends outward from the outer edge of the first opening 1421, and the glass 1431 is detachably connected to the first fixing part 1422 through the connector 1432.

[0078] Specifically, window 143 includes glass 1431 and connector 1431, and second cavity 142 is provided with a first opening 1421. A first fixing part 1422 extends outward from the outer edge of the first opening 1421, and wherein the connector 1432 may be, for example, a stainless steel flange, and a fixing nut is provided on the first fixing part 1422, for example, so that the connector 1432 is detachably connected to the second cavity 142 by the fixing nut.

[0079] Thus, by using the connector 1432 and the first fixing part 1422 to fix the glass 1431 at the position of the first opening 1421, the technical effect of making it easy for the operator to observe the changes in the filament inside the vacuum chamber 140 while ensuring the airtightness of the vacuum chamber 140 can be achieved.

[0080] Optionally, the window 143 further includes a sealing assembly 1433 disposed between the connector 1432 and the first fixing portion 1422. Further optionally, the sealing assembly 1433 includes a first washer 1434 and a second washer 1435, wherein the first washer 1434 is disposed between the first fixing portion 1422 and the glass 1431; and the second washer 1435 is disposed between the glass 1431 and the connector 1432.

[0081] Specifically, refer to Figure 5 As shown, a sealing assembly 1433 is also provided between the connector 1432 and the first fixing part 1422, wherein the sealing assembly 1433 is used to ensure the airtightness of the window 143. Furthermore, the sealing assembly 1433 includes a first washer 1434 and a second washer 1435. The first washer 1434 is disposed between the first fixing part 1422 and the glass 1431; the second washer 1435 is disposed between the glass 1431 and the connector 1432.

[0082] The first washer 1434 can be, for example, a rubber washer, and the second washer 1435 can be, for example, a polytetrafluoroethylene (PTFE) washer. Thus, by providing a rubber washer between the first fixing part 1422 and the glass 1431, and a PTFE washer between the glass 1431 and the connector 1432, the technical effect of ensuring the sealing of the window 143 can be achieved.

[0083] Optionally, the base plate assembly 150 includes a base plate 151, and a second opening 1411 is provided at the bottom of the first cavity 141, wherein a second fixing part 1412 extends outward from the outer edge of the second opening 1411, and the base plate 151 and the second fixing part 1412 are detachably connected. Further optionally, the base plate assembly 150 includes a third washer 152 disposed between the base plate 151 and the second fixing part 1412.

[0084] Specifically, refer to Figure 5As shown, the base plate assembly 150 includes a base plate 151, and a second opening 1411 is provided at the bottom of the first cavity 141. A second fixing part 1412 extends outward from the outer edge of the second opening 1411, and the base plate 151 is detachably connected to the second fixing part 1412. Furthermore, a third washer 152 is provided between the base plate 151 and the second fixing part 1412, wherein the third washer 152 can be, for example, an O-ring, thereby achieving the technical effect of ensuring the sealing effect at the position of the base plate 151.

[0085] The advantages of this application are:

[0086] 1. The hydrogen gas in the vacuum chamber 10 is capable of deoxidizing the various components of the electron gun and improving the service life of the electron gun;

[0087] 2. High stability evaporates impurities and dust adhering to the filament surface, unlike vacuum stress relief, preventing high-temperature evaporated impurities from adhering to the focusing electrode or other components, thus preventing arcing.

[0088] 3. The rapid cooling rate in a hydrogen atmosphere can improve stress relief efficiency;

[0089] 4. The vacuum chamber 10 is a bent quartz bell jar, which has higher structural strength and higher safety when hydrogen is introduced compared to ordinary quartz bell jars, and has a visible glass 1431 for convenient temperature monitoring.

[0090] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0091] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0092] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0093] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electron gun de-stressing apparatus characterized by, The application relates to a vacuum cavity (10), a vacuum pumping device (20) and a hydrogen circulation system (30), wherein the interior of the vacuum cavity (10) is provided with an electron gun (40); the vacuum pumping device (20) is connected with the vacuum cavity (10) and used for maintaining a vacuum environment of the vacuum cavity (10); and the hydrogen circulation system (30) is arranged at the bottom of the vacuum cavity (10) and connected with the vacuum cavity (10) and used for ensuring hydrogen circulation between the vacuum cavity (10) and the outside when a filament (410) of the electron gun (40) is powered. The hydrogen circulation system (30) comprises a hydrogen inlet passage (310), the bottom of the vacuum cavity (10) is provided with an inlet valve, wherein 2. The electron gun destressing apparatus of claim 1, wherein the hydrogen inlet passage (310) is communicated with the interior of the vacuum cavity (10) through the inlet valve and used for introducing hydrogen into the vacuum cavity (10), wherein the hydrogen circulation system (30) comprises a hydrogen outlet passage (320), the bottom of the vacuum cavity (10) is provided with an outlet valve, wherein the hydrogen outlet passage (320) is communicated with the interior of the vacuum cavity (10) through the outlet valve and used for discharging hydrogen in the vacuum cavity (10) to the outside. Further comprising:

3. The electron gun destressing apparatus of claim 2, wherein a flow meter (50), wherein the flow meter (50) is connected with the hydrogen outlet passage (320) and used for monitoring the flow of the hydrogen. The bottom of the vacuum cavity (10) is further provided with a vacuum valve (130), wherein 4. The electron gun destressing apparatus of claim 3, wherein the vacuum pumping device (20) is communicated with the interior of the vacuum cavity (10) through the vacuum valve (130). Further comprising:

5. The electron gun destressing apparatus of claim 1, wherein a temperature sensor (60), wherein the temperature sensor (60) is arranged outside the vacuum cavity (10) and corresponds to the position of the filament in the vacuum cavity (10) and used for measuring the temperature of the filament (410). Further comprising:

6. The electron gun destressing apparatus of claim 1, wherein a power supply (70), wherein the filament (410) is connected with the power supply (70) through an electric wire (80). The application relates to a vacuum cavity (10), a vacuum pumping device (20) and a hydrogen circulation system (30), wherein 7. A vacuum chamber (10) for use in an electron gun destressing apparatus, characterized in that the interior of the vacuum cavity (10) is provided with an electron gun (40); the vacuum pumping device (20) is connected with the vacuum cavity (10) and used for maintaining a vacuum environment of the vacuum cavity (10); and the hydrogen circulation system (30) is arranged at the bottom of the vacuum cavity (10) and connected with the vacuum cavity (10) and used for ensuring hydrogen circulation between the vacuum cavity (10) and the outside when a filament (410) of the electron gun (40) is powered. The hydrogen circulation system (30) comprises a hydrogen inlet passage (310), the bottom of the vacuum cavity (10) is provided with an inlet valve, wherein the hydrogen inlet passage (310) is communicated with the interior of the vacuum cavity (10) through the inlet valve and used for introducing hydrogen into the vacuum cavity (10), wherein 8. Vacuum chamber (10) for use in a stress removal apparatus for electron guns according to claim 7, characterized in that the hydrogen circulation system (30) comprises a hydrogen outlet passage (320), the bottom of the vacuum cavity (10) is provided with an outlet valve, wherein the hydrogen outlet passage (320) is communicated with the interior of the vacuum cavity (10) through the outlet valve and used for discharging hydrogen in the vacuum cavity (10) to the outside. Further comprising: a flow meter (50), wherein the flow meter (50) is connected with the hydrogen outlet passage (320) and used for monitoring the flow of the hydrogen. The bottom of the vacuum cavity (10) is further provided with a vacuum valve (130), wherein the vacuum pumping device (20) is communicated with the interior of the vacuum cavity (10) through the vacuum valve (130). Further comprising: a temperature sensor (60), wherein the temperature sensor (60) is arranged outside the vacuum cavity (10) and corresponds to the position of the filament in the vacuum cavity (10) and used for measuring the temperature of the filament (410). Further comprising: a power supply (70), wherein the filament (410) is connected with the power supply (70) through an electric wire (80). The application relates to a vacuum cavity (10), a vacuum pumping device (20) and a hydrogen circulation system (30), wherein the interior of the vacuum cavity (10) is provided with an electron gun (40); the vacuum pumping device (20) is connected with the vacuum cavity (10) and used for maintaining a vacuum environment of the vacuum cavity (10); and the hydrogen circulation system (30) is arranged at the bottom of the vacuum cavity (10) and connected with the vacuum cavity (10) and used for ensuring hydrogen circulation between the vacuum cavity (10) and the outside when a filament (410) of the electron gun (40) is powered. The hydrogen circulation system (30) comprises a hydrogen inlet passage (310), the bottom of the vacuum cavity (10) is provided with an inlet valve, wherein the hydrogen inlet passage (310) is communicated with the interior of the vacuum cavity (10) through the inlet valve and used for introducing hydrogen into the vacuum cavity (10), wherein the hydrogen circulation system (30) comprises a hydrogen outlet passage (320), the bottom of the vacuum cavity (10) is provided with an outlet valve, wherein the hydrogen outlet passage (320) is communicated with the interior of the vacuum cavity (10) through the outlet valve and used for discharging hydrogen in the vacuum cavity (10) to the outside. Further comprising: a flow meter (50), wherein the flow meter (50) is connected with the hydrogen outlet passage (320) and used for monitoring the flow of the hydrogen. The bottom of the vacuum cavity (10) is further provided with a vacuum valve (130), wherein the vacuum pumping device (20) is communicated with the interior of the vacuum cavity (10) through the vacuum valve (130). Further comprising: a temperature sensor (60), wherein the temperature sensor (60) is arranged outside the vacuum cavity (10) and corresponds to the position of the filament in the vacuum cavity (10) and used for measuring the temperature of the filament (410). Further comprising: a power supply (70), wherein the filament (410) is connected with the power supply (70) through an electric wire (80).

9. Vacuum chamber (10) for use in a stress removal apparatus for electron guns according to claim 8, characterized in that The window (143) further comprises a sealing assembly (1433) disposed between the connecting piece (1432) and the first fixed part (1422).

10. Vacuum chamber (10) for use in a stress removal apparatus for electron guns according to claim 9, characterized in that The sealing assembly (1433) comprises a first gasket (1434) and a second gasket (1435), wherein The first gasket (1434) is disposed between the first fixed part (1422) and the glass (1431); and The second gasket (1435) is disposed between the glass (1431) and the connecting piece (1432), wherein The bottom plate assembly (150) comprises a bottom plate (151), and a bottom of the first cavity (141) is provided with a second opening (1411), wherein An outer edge of the second opening (1411) extends outwardly with a second fixed part (1412), and the bottom plate (151) is detachably connected with the second fixed part (1412), wherein The bottom plate assembly (150) comprises a third gasket (152) disposed between the bottom plate (151) and the second fixed part (1412).

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