Semiconductor mounting equipment based on carbon fiber cross beam

Abstract

The utility model discloses semiconductor mounting equipment based on a carbon fiber cross beam, which comprises a rack, a carbon fiber cross beam, a mounting head assembly, a chip feeding device, a substrate bearing platform and a visual inspection system, a gantry XY motion platform and a working platform are arranged above the rack, and the cross beam structure of the gantry XY motion platform is the carbon fiber cross beam. The carbon fiber cross beam comprises a center supporting structure and a carbon fiber body arranged around the center supporting structure. The mounting head assembly is arranged on a linear guide rail of the carbon fiber cross beam and can slide along the carbon fiber cross beam; the chip feeding device is arranged on the rack and used for providing a semiconductor chip to be mounted, and the substrate bearing platform is located on the rack below the carbon fiber cross beam and used for bearing a substrate of the semiconductor chip to be mounted; the visual detection system is arranged on the carbon fiber cross beam and moves synchronously with the mounting head assembly; according to the scheme, the mounting speed of the semiconductor mounting equipment is effectively improved, and the vibration of the mounting head can be effectively inhibited.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing equipment, concretely relates to a kind of semiconductor mounting equipment based on carbon fiber beam. BACKGROUND

[0002] In the semiconductor manufacturing process, semiconductor mounting equipment plays a vital role. It is responsible for accurately mounting semiconductor chips on the substrate, and its mounting accuracy directly affects the performance and quality of semiconductor products.

[0003] In the development of mounting machine to high-end, high-precision, gantry motion platform becomes the only option. Gantry XY motion platform replaces the laminated XY, because the beam of gantry both ends support replaces the cantilever structure of laminated platform, improves the stiffness of motion end, while reducing the Abbe error in the laminated structure of two motion systems of laminated, brings high precision. XY gantry motion platform, bring the dividend of high precision, but also bring cumbersome beam. The beam of equipment usually adopts metal material, although metal beam has certain strength and rigidity, but weight is larger, this can generate larger inertial force when equipment high-speed operation, lead to the response speed of equipment is limited, to obtain high dynamic precision, can only slow down, difficult to meet the increasing mounting speed and precision requirement.

[0004] In order to realize high speed, high precision this contradiction, try to have the following two schemes, but all cannot 100% solve this contradiction. The two schemes currently tried, although each has its merits, but cannot completely resolve this contradiction. The first scheme is to adopt two Y motor. The core idea of this scheme is to realize the lightweight of main motion (i.e. mounting action), to achieve the purpose of fast mounting. However, this scheme has significant drawbacks. On the one hand, the introduction of two Y structure will increase the motion load of X axis, and then have negative effects on the performance of X axis; On the other hand, two Y itself structure is complex, this complexity inevitably leads to precision loss, difficult to meet the requirements of high-precision mounting. The second scheme is to rotate the gantry by 90 degrees. In this way, when taking mounting main motion, beam does not need to participate in motion, and can realize fast and high-precision mounting in theory. But this scheme also brings new problems. The gantry structure after rotation will block the operator, making the operation process become inconvenient, and also greatly affects the observation of the operator on the running condition of the equipment. The sacrifice of machine friendliness makes this scheme difficult to be accepted in practical application.

[0005] Therefore, in order to improve the performance of semiconductor mounting equipment, the key components of the equipment need to be improved, and the material and structure optimization of beam is one of the important research directions. UTILITY MODEL CONTENT

[0006] Therefore, the semiconductor mounting equipment based on the carbon fiber cross beam is provided to overcome the defects in the prior art and solve the problems of limited mounting speed and precision caused by the problems of large weight and thermal deformation of the cross beam in the prior semiconductor mounting equipment.

[0007] In order to achieve the above-mentioned purposes, the utility model adopts the following technical scheme:

[0008] The semiconductor mounting equipment based on the carbon fiber cross beam comprises a rack, a carbon fiber cross beam, a mounting head assembly, a chip feeding device, a substrate bearing platform and a visual detection system.

[0009] The rack is provided with a gantry XY motion platform and a work platform above the rack, the cross beam structure of the gantry XY motion platform is a carbon fiber cross beam, and the carbon fiber cross beam comprises a center support structure and a carbon fiber body arranged around the center support structure.

[0010] The mounting head assembly is arranged on the linear guide rail of the carbon fiber cross beam and can slide along the carbon fiber cross beam.

[0011] The chip feeding device is arranged on the rack and is used for providing semiconductor chips to be mounted.

[0012] The substrate bearing platform is arranged on the rack below the carbon fiber cross beam and is used for bearing a substrate of the semiconductor chips to be mounted.

[0013] The visual detection system is arranged on the carbon fiber cross beam and moves synchronously with the mounting head assembly.

[0014] As a preferred scheme, the material and forming mode of the center support structure are any one of the following:

[0015] The center support structure is made of aluminum alloy through an extrusion forming process;

[0016] The center support structure is made of aluminum alloy through an extrusion forming process;

[0017] As a preferred scheme, the carbon fiber body is a high-strength carbon fiber cloth, and the carbon fiber cloth is wound in multiple layers and fixed on the periphery of the center support structure through a curing technology.

[0018] As a preferred scheme, the mounting head assembly comprises a mounting head body, a suction nozzle arranged on the mounting head body and a lifting driving mechanism used for driving the suction nozzle to move up and down, and the suction nozzle is used for adsorbing semiconductor chips.

[0019] As a preferred solution, the chip supply device comprises a tray and a material taking mechanism for transferring the chips from the tray to below the suction nozzle, and fixed support structures are arranged on both sides of the working platform, and the material taking mechanism is mounted on the fixed support structures.

[0020] As a preferred solution, the material taking structure comprises a driving assembly and a detection assembly, the driving assembly comprises a transverse driving motor and a longitudinal driving motor, and the detection assembly is used for detection during the material taking.

[0021] As a preferred solution, the material taking mechanism and the detection assembly are located above the tray, and the detection assembly and the driving assembly are both mounted on the fixed support structures.

[0022] As a preferred solution, the visual detection system comprises at least one industrial camera, which is used to acquire position information of the semiconductor chips and the substrate, so that the mounting head assembly can accurately mount the semiconductor chips on the substrate according to the position information.

[0023] The beneficial effects of the semiconductor mounting device are as follows: the carbon fiber cross beam is adopted, the weight is significantly lighter than that of a traditional metal cross beam, the inertia force generated during the operation of the device is small, the mounting head assembly can be started and stopped and moved more quickly, and thus the mounting speed of the semiconductor mounting device is effectively improved.

[0024] The fiber cloth is wrapped around the periphery and then solidified, which effectively eliminates the anisotropic weakness of the carbon fiber plate. High stiffness is obtained in the up-down, left-right and front-back directions of the cross beam. Compared with a single fiber plate, the problem of weak connection between layers is solved.

[0025] The carbon fiber cross beam has a low thermal expansion coefficient and is less affected by temperature changes, thereby reducing mounting errors caused by thermal deformation.

[0026] The carbon fiber cross beam is solidified by carbon fiber, resin and a center support structure, the carbon fiber has a large vibration damping, can effectively suppress the vibration of the mounting head, and can well isolate the vibration interference from other modules. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below, and it should be understood that the following drawings only show some embodiments of the present application, and should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor.

[0028] Figure 1 It is a kind of based on carbon fiber cross beam's semiconductor mounting device overall structure schematic diagram;

[0029] Figure 2 is a schematic view of a typical gantry XY motion platform structure

[0030] Figure 3 is a schematic view of the internal structure of a carbon fiber beam;

[0031] Figure 4 is a schematic view of an aluminum alloy cross section formed by extrusion;

[0032] Figure 5 is a schematic view of a foam aluminum structure;

[0033] The reference signs: 1. frame; 2. carbon fiber beam; 21. center support structure; 22. carbon fiber body; 3. mounting head assembly; 4. chip feeding device; 41. tray; 42. material taking mechanism; 5. substrate carrying platform; 6. visual inspection system; 7. gantry XY motion platform; 8. work platform; 9. fixed support structure. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0035] In the description of the embodiments of the present application, the terms "upper", "lower", "left", "right" and the like orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only used to distinguish in the description, and have no special meaning.

[0036] As Figure 2 is a schematic view of a typical gantry XY motion platform structure, the beam in the prior art is a metal beam 10, when the Y-axis motor 13 drives the metal beam 10 and the mounting assembly 11 to move along the track 13, due to the large weight and inertia of the beam, the movement speed along the Y direction should not be too fast, which will affect the mounting efficiency. In order to solve this problem, the metal improvement technical scheme is as follows.

[0037] To solve the above technical problems, according to some embodiments of the present application, referring to Figures 1 to 5 The carbon fiber beam based semiconductor mounting device in the embodiment includes a rack 1, a carbon fiber beam 2, a mounting head assembly 3, a chip supply device 4, a substrate bearing platform 5 and a visual detection system 6. The rack 1 is provided with a gantry XY motion platform 7 and a work platform 8 above. The beam structure of the gantry XY motion platform 7 is the carbon fiber beam 2. The carbon fiber beam 2 includes a center support structure 21 and a carbon fiber body 22 arranged around the center support structure 21. The mounting head assembly 3 is arranged on the linear guide rail of the carbon fiber beam 2 and can slide along the carbon fiber beam 2. The chip supply device 4 is arranged on the rack 1 to provide semiconductor chips to be mounted. The substrate bearing platform 5 is arranged on the rack 1 below the carbon fiber beam 2 to bear the substrate of the semiconductor chips to be mounted. The visual detection system 6 is arranged on the carbon fiber beam 2 and moves synchronously with the mounting head assembly 3.

[0038] In the embodiment, the material and forming method of the center support structure 21 are any of the following:

[0039] The center support structure 21 is made of aluminum alloy by extrusion forming process, as shown in Figure 3 and Figure 4 The cross-sectional shape can be various, which is not limited to the cross-sectional shape given in the utility model;

[0040] The reinforcing body with hollow honeycomb structure is formed by using foam aluminum, as shown in Figure 5 The foam honeycomb structure is not limited to the shape given in the utility model.

[0041] The center support structure 21 formed by the above two methods has a significantly reduced weight compared with the traditional metal beam, and generates small inertial force during the operation of the device, so that the mounting head assembly can be started and stopped and moved more quickly, thereby effectively improving the mounting speed of the semiconductor mounting device.

[0042] In the embodiment, the carbon fiber body 22 is a high-strength carbon fiber cloth. The carbon fiber cloth 22 is fixed around the center support structure by using curing technology. The fiber cloth is effectively cured after being wound around the periphery, which effectively eliminates the anisotropic weakness of the carbon fiber plate and improves the connection between the layers compared with the existing one-layer laminating technology. High stiffness is obtained in the up-down, left-right and front-back directions of the beam. Compared with a single fiber plate, the problem of weak connection between layers is solved.

[0043] In the embodiment, the mounting head assembly 3 includes a mounting head body, a suction nozzle arranged on the mounting head body and a lifting driving mechanism for driving the suction nozzle to move up and down. The suction nozzle is used for adsorbing semiconductor chips.

[0044] In the embodiment, the chip supply device 4 comprises a tray 41 and a taking mechanism 42 for transferring the chips from the tray to below the suction nozzle, fixed support structures 9 are arranged on both sides of the working platform 8, the taking mechanism 42 is installed on the fixed support structures 9, the taking mechanism 42 sends the taken chips to the corresponding positions of the placement head assembly 3, and then the suction nozzle of the placement head assembly 3 performs the suction work, and when the placement head assembly 3 performs the placement work, the supply assembly works, so that the working efficiency can be improved.

[0045] In the embodiment, the taking mechanism 42 comprises a driving assembly and a detection assembly, the driving assembly comprises a transverse driving motor and a longitudinal driving motor, and the detection assembly is used for detection in the taking process, so as to ensure the stable operation of the supply work.

[0046] In the embodiment, the taking mechanism and the detection assembly are located above the tray 41, and the detection assembly and the driving assembly are both installed on the fixed support structures 9.

[0047] In the embodiment, the visual detection system 6 comprises at least one industrial camera, the industrial camera is used for acquiring the position information of the semiconductor chips and the substrate, the information acquired by the visual system 6 controls the suction nozzle of the placement head assembly 3 to be able to rotate in angle and be aligned, so that the placement head assembly accurately places the semiconductor chips on the substrate according to the position information.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limited. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the purpose and scope of the present application, and all should be covered in the scope of the claims of the present application.

Claims

1. A carbon fiber beam based semiconductor mounting device, comprising a frame, a carbon fiber beam, a mounting head assembly, a chip supply device, a substrate bearing platform and a vision detection system, characterized in that, a gantry XY motion platform and a work platform are arranged above the frame, the beam structure of the gantry XY motion platform is a carbon fiber beam, the carbon fiber beam comprises a center support structure and a carbon fiber body arranged around the center support structure; a mounting head assembly is arranged on the linear guide rail of the carbon fiber beam, and the mounting head assembly can slide along the carbon fiber beam; a chip supply device is arranged on the frame to provide semiconductor chips to be mounted; a substrate bearing platform is arranged on the frame below the carbon fiber beam to bear the substrate of the semiconductor chips to be mounted; a vision detection system is arranged on the carbon fiber beam and moves synchronously with the mounting head assembly. The center support structure is made of aluminum alloy by extrusion molding process or is formed by foamed aluminum to form a reinforced body with a hollow honeycomb structure.

2. The carbon fiber beam based semiconductor pick-and-place apparatus of claim 1, wherein, The carbon fiber body is a high-strength carbon fiber cloth, and the carbon fiber cloth is wound in multiple layers and fixed on the periphery of the center support structure by curing technology. The mounting head assembly comprises a mounting head body, a suction nozzle arranged on the mounting head body, and a lifting driving mechanism for driving the suction nozzle to move up and down, and the suction nozzle is used for adsorbing semiconductor chips. The chip supply device comprises a tray and a material taking mechanism for transferring chips from the tray to below the suction nozzle, and fixed support structures are arranged on both sides of the work platform, and the material taking mechanism is installed on the fixed support structures.

3. The carbon fiber beam based semiconductor pick-and-place apparatus of claim 1, wherein, The material taking structure comprises a driving assembly and a detection assembly, the driving assembly comprises a transverse driving motor and a longitudinal driving motor, and the detection assembly is used for detection during material taking.

4. The carbon fiber beam based semiconductor pick-and-place apparatus of claim 1, wherein, The material taking mechanism and the detection assembly are located above the tray, and the detection assembly and the driving assembly are installed on the fixed support structures.

5. The carbon fiber beam based semiconductor pick-and-place apparatus of claim 1, wherein, The vision detection system comprises at least one industrial camera, and the industrial camera is used to acquire position information of the semiconductor chips and the substrate, so that the mounting head assembly accurately mounts the semiconductor chips on the substrate according to the position information.

6. A carbon fiber beam based semiconductor pick and place apparatus according to claim 5, wherein, ​ 7. A carbon fiber beam based semiconductor pick and place apparatus according to claim 6, wherein, ​ 8. The carbon fiber beam based semiconductor pick-and-place apparatus of claim 1, wherein, ​

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