Automatic feeding and discharging device for semiconductor wafers

Abstract

The utility model relates to the field of semiconductor processing, and discloses a semiconductor wafer automatic loading and unloading device, which comprises a lifting mechanism and an equidistant adjusting mechanism, the lifting mechanism comprises a mounting seat, track strips are vertically and symmetrically arranged on the surface of the mounting seat, a sliding seat is slidably mounted on the surfaces of the two track strips, and the equidistant adjusting mechanism is arranged on the sliding seat. A lifting air cylinder used for controlling the sliding seat is vertically mounted on the inner side of the mounting seat, a rotating telescopic mechanism is mounted at the top of the lifting mechanism and comprises a rotating seat fixed to the upper surface of the sliding seat, a cross beam is transversely arranged on the upper surface of the rotating seat, and a telescopic rod is slidably mounted on the upper surface of the cross beam; and the equidistant adjusting mechanism is mounted at the end part of the telescopic rod, comprises a turntable arranged below the end part of the telescopic rod, and can be used for adjusting the orientation after the wafer is adsorbed so as to adapt to a complicated loading and unloading environment, and can be used for rotating the wafer at a certain angle after the wafer is adsorbed so as to adapt to accurate loading and unloading of non-full-round materials.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, concretely to a kind of semiconductor wafer automatic feeding and discharging device. BACKGROUND

[0002] Semiconductor wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. After high-purity polysilicon is dissolved and incorporated into silicon crystal seed, it is slowly pulled out to form cylindrical monocrystalline silicon. After silicon crystal bar is ground, polished and sliced, silicon wafer is formed, that is, wafer. In the grinding, polishing and other processing processes, wafer needs to be transferred one by one. In order to improve production efficiency, automatic feeding and discharging of wafer is commonly used in the prior art. Wafer is a smooth disc structure, so suction is usually used in automatic feeding and discharging.

[0003] The size of wafer varies with its use environment. Common sizes include 6 inches (φ152.4mm), 8 inches (φ203.2mm) and 12 inches (φ304.8mm). The size difference is large. In order to better suction wafer, 3 or 4 suction heads are commonly used in the feeding and discharging structure. The position of suction head is a fixed structure, which cannot adapt to wafer feeding and discharging of different sizes and needs to be re-adjusted according to different production sizes. The feeding mode of suction needs to keep the upper part of working area empty, which limits the feeding and discharging. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides a kind of semiconductor wafer automatic feeding and discharging device, solve the problem of quick adjustment of suction head position and guarantee suction intensity.

[0005] To achieve the above purpose, the utility model is realized by the following technical scheme: a kind of semiconductor wafer automatic feeding and discharging device, including lifting mechanism and equidistance adjusting mechanism, the lifting mechanism includes mounting seat, the surface of mounting seat is vertically symmetrical and is provided with rail strip, two the surface of rail strip is slidably installed with slide base, the inner side of mounting seat is vertically installed with lifting cylinder for controlling slide base;

[0006] The rotating telescopic mechanism is installed at the top of the lifting mechanism, the rotating telescopic mechanism includes rotating seat fixed on the upper surface of slide base, the upper surface of rotating seat is transversely provided with crossbeam, the upper surface of crossbeam is slidably installed with telescopic rod, and the equidistance adjusting mechanism is installed at the end of telescopic rod.

[0007] The equidistance adjusting mechanism includes rotating disc placed below the end of telescopic rod, rotating shaft is arranged on the center of the upper surface of rotating disc, the rotating shaft rotates at the end of telescopic rod, limit plate A is arranged at the top of rotating shaft, and the bottom surface of limit plate is movably attached to the upper surface of telescopic rod.

[0008] The lower surface of the equidistance adjusting mechanism is uniformly slidably installed with three material suction mechanisms, and the equidistance adjusting mechanism is used for synchronously adjusting the positions of the three material suction mechanisms.

[0009] The front end of the rotating disc is further provided with a material clamping mechanism, and the material clamping mechanism is used for clamping the wafer from the side.

[0010] Further, the upper side of the surface of the rotating disc is uniformly provided with a tooth groove, the upper surface of the telescopic rod is provided with a driving motor, the output end of the driving motor is installed with a driving gear, and the driving gear is engaged with the tooth groove.

[0011] Further, the outer side of the lower surface of the rotating disc is provided with three protruding plates, the center of the lower surface of the rotating disc is provided with a protruding block, two track rods are arranged in parallel between a single protruding plate and the protruding block, a sliding block is slidably installed between the two track rods in the same group, three track grooves are formed in the surface of the rotating disc, and the track grooves are arranged between the two track rods.

[0012] The lower surface of the protruding block is provided with a stand column, the bottom of the stand column is provided with a limiting plate B, a sliding sleeve is slidably installed on the surface of the stand column, and a connecting rod is hingedly connected between the sliding sleeve and the three sliding blocks.

[0013] The stand column is further installed with a driving member for driving the three sliding blocks to synchronously slide.

[0014] Further, the surface of the stand column is symmetrically provided with an open slot.

[0015] The driving member comprises a threaded rod, the threaded rod is rotatably installed in the interior of the stand column and the rotating shaft, a knob is arranged at the end of the threaded rod, the knob is arranged above the limiting plate A, an inner sleeve is arranged in the inner side of the sliding sleeve, the connecting part between the sliding sleeve and the inner sleeve penetrates the open slot, and the inner sleeve is screwed on the threaded rod.

[0016] Further, the material suction mechanism comprises a butt joint cylinder fixed on the lower surface of the sliding block, a suction head is installed at the bottom of the butt joint cylinder, a hose is connected to the top of the butt joint cylinder, and the hose penetrates the track groove.

[0017] Further, the material clamping mechanism comprises a lower clamping plate fixedly welded on the outer side of the bottom of the frontmost protruding plate, the lower clamping plate and the protruding plate are in an L-shaped structure, and a through slot is formed in the surface of the protruding plate.

[0018] Further, an extension rod is rotatably penetrated in the inner side of the through slot, the rotation direction of the extension rod is circumferential rotation in the vertical plane, a movable clamping plate is arranged at the front end of the extension rod, and the movable clamping plate is arranged above the lower clamping plate.

[0019] Further, the extension rod rear end is provided with a U-shaped groove, the upper surface of the rotating disc is fixed with a control cylinder, a I-shaped clamp head is installed at the output end of the control cylinder, the I-shaped clamp head is arranged below the rotating disc, and the I-shaped clamp head is clamped on the U-shaped groove.

[0020] The utility model provides a kind of semiconductor wafer automatic feeding and discharging device. It has the following beneficial effects:

[0021] 1, the utility model can adjust the orientation of wafer after adsorption, to adapt to complex feeding and discharging environment, and can rotate wafer by a certain angle after adsorption, to adjust the angle of non-circular material, ensure the precision of feeding and discharging.

[0022] 2, the utility model uses three suction mechanisms that can be adjusted synchronously to adsorb wafer, and can adjust the position of three suction heads according to production demand, to ensure that wafer is evenly stressed during feeding and discharging, prevent falling off, suitable for production of different size wafers, only need to ensure that the corresponding position of rotating disc and wafer center during debugging, improve the convenience of equipment debugging.

[0023] 3, the utility model is provided with clamping mechanism that can clamp wafer at the front end of device, when there is obstacle above feeding area and cannot be adsorbed and fed, wafer can be clamped and fed by the clamping mechanism at the front end, improve the practicability of device, and wafer can be fine-tuned by clamping mechanism, to ensure the accuracy of wafer position after feeding and discharging. DRAWINGS

[0024] Figure 1 It is the installation three-dimensional structure schematic view of the utility model;

[0025] Figure 2 It is the front view structure schematic view of the utility model;

[0026] Figure 3 It is the equidistance adjusting mechanism installation structure schematic view of the utility model;

[0027] Figure 4 It is the suction mechanism installation three-dimensional structure schematic view of the utility model;

[0028] Figure 5 It is the Figure 4 perspective structure schematic view of the utility model;

[0029] Figure 6 It is the movable clamp plate installation three-dimensional structure schematic view of the utility model;

[0030] Figure 7 It is the Figure 2 A zone enlarged structure schematic view of the utility model.

[0031] Wherein, 1, lifting mechanism; 101, mounting seat; 102, track strip; 103, lifting cylinder; 104, sliding seat; 2, rotary telescopic mechanism; 201, rotary seat; 202, crossbeam; 203, telescopic rod; 204, drive motor; 205, drive gear; 3, equidistance adjustment mechanism; 301, rotary disc; 302, rotary shaft; 303, limit plate A; 304, track slot; 305, gear slot; 306, convex plate; 3061, through slot; 307, convex block; 308, track rod; 309, sliding block; 310, stand; 3101, open slot; 311, limit plate B; 312, sliding sleeve; 3121, inner sleeve; 313, connecting rod; 314, threaded rod; 315, knob; 4, suction mechanism; 401, butt joint barrel; 402, suction head; 403, hose; 5, clamping mechanism; 501, lower clamping plate; 502, movable clamping plate; 503, extension rod; 504, U-shaped slot; 505, control cylinder; 506, I-shaped clamp. DETAILED DESCRIPTION

[0032] The technical solutions of the present application will be described clearly and completely below with reference to the drawings of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] Embodiment 1:

[0034] Please refer to Figure 1 , Figure 2 and Figure 7As shown in the figure, a kind of semiconductor wafer automatic loading and unloading device, including lifting mechanism 1 and equidistance adjusting mechanism 3, lifting mechanism 1 includes mounting seat 101, mounting seat 101 can be fixed on the ground also can be fixed on the worktable that can move horizontally according to use, to realize the movement of XY axis with telescopic rod 203, mounting seat 101 surface vertical symmetry is provided with rail strip 102, two rail strips 102 surface slidingly installed with sliding seat 104, the inner side of mounting seat 101 is vertically installed with the lifting cylinder 103 for controlling sliding seat 104, the height of sliding seat 104 is controlled by lifting cylinder 103, in turn control the height of the end adsorption wafer, lifting mechanism 1 top is installed with rotary telescopic mechanism 2, rotary telescopic mechanism 2 includes rotary seat 201 fixed on the upper surface of sliding seat 104, rotary seat 201 is built-in motor to drive crossbeam 202 to carry out angular rotation, rotary seat 201 upper surface transversely is provided with crossbeam 202, the upper surface of crossbeam 202 is slidingly installed with telescopic rod 203, the rear end of crossbeam 202 is provided with motor, the built-in belt is driven by the motor, and the rear end of telescopic rod 203 is installed on the belt, at this time, when the belt rotates, it can drive telescopic rod 203 to stretch forward and backward, in turn drive the wafer to be adsorbed to carry out multidirectional adjustment, realize complex loading and unloading.

[0035] Please refer to Figure 3 And Figure 4 As shown in the figure, equidistance adjusting mechanism 3 is installed at the end of telescopic rod 203, equidistance adjusting mechanism 3 includes rotary disc 301 placed below the end of telescopic rod 203, rotary shaft 302 is arranged at the center of the upper surface of rotary disc 301, rotary shaft 302 rotates and penetrates the end of telescopic rod 203, limit plate A 303 is arranged at the top of rotary shaft 302, the bottom surface of limit plate A 303 is movably attached to the upper surface of telescopic rod 203, limit plate A 303 prevents equidistance adjusting mechanism 3 from falling, so that the whole can only rotate, three suction mechanisms 4 are slidingly installed on the lower surface of equidistance adjusting mechanism 3, equidistance adjusting mechanism 3 is used for synchronously adjusting the positions of three suction mechanisms 4, three suction points can ensure that the wafer is stressed evenly, and clamp mechanism 5 is further arranged at the front end of rotary disc 301, clamp mechanism 5 is used for clamping the wafer from the side.

[0036] Please refer to Figure 1 And Figure 4 As shown in the figure, rotary disc 301 surface upper side is evenly provided with gear slot 305, driving motor 204 is arranged on the upper surface of telescopic rod 203, driving gear 205 is installed on the output end of driving motor 204, driving gear 205 is engaged with gear slot 305, driving motor 204 is driven to rotate driving gear 205 in turn to drive rotary disc 301 to rotate, to adjust the angle of the wafer after being adsorbed, when it is necessary to adjust the position of non-circular wafer, the orientation angle of wafer can be controlled by rotating rotary disc 301, to ensure the precision during loading and unloading.

[0037] The lower surface of the rotating disc 301 is provided with three protruding plates 306, the center of the lower surface of the rotating disc 301 is provided with a protruding block 307, two track rods 308 are arranged in parallel between a single protruding plate 306 and the protruding block 307, a sliding block 309 is slidingly installed between the two track rods 308 of the same group, so that the sliding block 309 can only slide along the track rod 308, three track grooves 304 are formed on the surface of the rotating disc 301, the track grooves 304 are arranged between the two track rods 308, a stand column 310 is arranged on the lower surface of the protruding block 307, a limiting plate B 311 is arranged at the bottom of the stand column 310, a sliding sleeve 312 is slidingly installed on the surface of the stand column 310, a connecting rod 313 is respectively hinged between the sliding sleeve 312 and the three sliding blocks 309, a driving member for driving the three sliding blocks 309 to slide synchronously is further installed on the stand column 310, the position of the sliding sleeve 312 is controlled to control the distance between the three sliding blocks 309 and the center of the rotating disc 301, so that the forces of the three suction points are uniform, and whether the product model is replaced or the suction head 402 is replaced, the center of the rotating disc 301 is only required to be consistent with the center of the wafer, and re-adjustment is not required.

[0038] Please refer to Figure 5 As shown in the figure, the surface of the stand column 310 is symmetrically provided with an open slot 3101, the driving member includes a threaded rod 314, the threaded rod 314 is rotatably installed in the interior of the stand column 310 and the rotating shaft 302, a knob 315 is arranged at the end of the threaded rod 314, the knob 315 is arranged above the limiting plate A 303, so as to quickly adjust the position of the material suction mechanism 4, the knob 315 can also be replaced by a servo motor to realize automatic control, an inner sleeve 3121 is arranged on the inner side of the sliding sleeve 312, the inner sleeve 3121 penetrates the open slot 3101 at the connection position of the inner sleeve 3121 and the sliding sleeve 312, the inner sleeve 3121 and the sliding sleeve 312 have two connection positions, the inner sleeve 3121 is screwed on the threaded rod 314, when the threaded rod 314 rotates, the sliding sleeve 312 can be driven to move axially, and then the positions of the three material suction mechanisms 4 are synchronously adjusted.

[0039] In order to facilitate installation, the inner sleeve 3121 and the sliding sleeve 312 can adopt a two-piece structure, and are fixed by two bolts which can penetrate the open slot 3101, so as to ensure that the inner sleeve 3121 and the sliding sleeve 312 can move synchronously.

[0040] Please refer to Figure 5 As shown in the figure, the material suction mechanism 4 includes a butt joint cylinder 401 fixed on the lower surface of the sliding block 309, the butt joint cylinder 401 is provided with a suction head 402 at the bottom, the suction head 402 is made of soft material, so as to prevent the wafer from being scratched, the butt joint cylinder 401 is connected with a hose 403 at the top, the hose 403 penetrates the track groove 304, the other end of the hose 403 is installed on a compression pump, and the suction force of the suction head 402 is controlled.

[0041] Embodiment 2:

[0042] Please refer toFigure 3 And Figure 6 As shown in FIGS. 1 and 2, the clamping mechanism 5 includes a lower clamping plate 501 fixedly welded on the outer side of the bottom of the frontmost convex plate 306, the lower clamping plate 501 is thin and can be inserted under the wafer, the lower clamping plate 501 and the convex plate 306 form an L-shaped structure, so that the lower clamping plate 501 is integrated with the turntable 301 and can move together, a through groove 3061 is formed on the surface of the convex plate 306, the through groove 3061 is vertically formed, an extension rod 503 is rotatably penetrated into the inner side of the through groove 3061, the rotation direction of the extension rod 503 is circumferential rotation in the vertical plane, a movable clamping plate 502 is arranged at the front end of the extension rod 503, the movable clamping plate 502 is arranged above the lower clamping plate 501, the distance between the end of the movable clamping plate 502 and the lower clamping plate 501 is controlled by rotating the movable clamping plate 502 (rotating with the extension rod 503), when it is needed to clamp the wafer from the side, the distance between the movable clamping plate 502 and the lower clamping plate 501 is controlled, and the movable clamping plate 502 and the lower clamping plate 501 are arranged above and below the wafer respectively, at this time, the wafer is clamped by adjusting the angle of the movable clamping plate 502.

[0043] As shown in FIGS. 1 and 2, the extension rod 503 is provided with a U-shaped groove 504 at the rear end, a control cylinder 505 is fixedly arranged on the upper surface of the turntable 301, a I-shaped chuck 506 is arranged on the output end of the control cylinder 505, the I-shaped chuck 506 is a cylindrical structure with large ends and a small middle, so that the extension rod 503 is clamped in the central recess of the I-shaped chuck 506, at this time, the up-down movement of the I-shaped chuck 506 can drive the extension rod 503 to swing in the angle, and then control the angle of the movable clamping plate 502 at the front end, the I-shaped chuck 506 is arranged below the turntable 301, the I-shaped chuck 506 is clamped on the U-shaped groove 504 and gap-fitted with the U-shaped groove 504.

[0044] It should be noted that, in combination with Figure 1 Figure 2 And Figure 7 As shown in FIGS. 1 and 2, the extension rod 503 is provided with a U-shaped groove 504 at the rear end, a control cylinder 505 is fixedly arranged on the upper surface of the turntable 301, a I-shaped chuck 506 is arranged on the output end of the control cylinder 505, the I-shaped chuck 506 is a cylindrical structure with large ends and a small middle, so that the extension rod 503 is clamped in the central recess of the I-shaped chuck 506, at this time, the up-down movement of the I-shaped chuck 506 can drive the extension rod 503 to swing in the angle, and then control the angle of the movable clamping plate 502 at the front end, the I-shaped chuck 506 is arranged below the turntable 301, the I-shaped chuck 506 is clamped on the U-shaped groove 504 and gap-fitted with the U-shaped groove 504.

[0045] In addition, the maximum rotation angle of the turntable 301 is 360°, and then it needs to be reversely rotated to reset, so as to avoid the winding phenomenon of the hose 403.

[0046] Embodiment 3:

[0047] As shown in FIGS. 1 and 2, the extension rod 503 is provided with a U-shaped groove 504 at the rear end, a control cylinder 505 is fixedly arranged on the upper surface of the turntable 301, a I-shaped chuck 506 is arranged on the output end of the control cylinder 505, the I-shaped chuck 506 is a cylindrical structure with large ends and a small middle, so that the extension rod 503 is clamped in the central recess of the I-shaped chuck 506, at this time, the up-down movement of the I-shaped chuck 506 can drive the extension rod 503 to swing in the angle, and then control the angle of the movable clamping plate 502 at the front end, the I-shaped chuck 506 is arranged below the turntable 301, the I-shaped chuck 506 is clamped on the U-shaped groove 504 and gap-fitted with the U-shaped groove 504. Figure 1 And Figure 4 As shown in FIGS. 1 and 2, the extension rod 503 is provided with a U-shaped groove 504 at the rear end, a control cylinder 505 is fixedly arranged on the upper surface of the turntable 301, a I-shaped chuck 506 is arranged on the output end of the control cylinder 505, the I-shaped chuck 506 is a cylindrical structure with large ends and a small middle, so that the extension rod 503 is clamped in the central recess of the I-shaped chuck 506, at this time, the up-down movement of the I-shaped chuck 506 can drive the extension rod 503 to swing in the angle, and then control the angle of the movable clamping plate 502 at the front end, the I-shaped chuck 506 is arranged below the turntable 301, the I-shaped chuck 506 is clamped on the U-shaped groove 504 and gap-fitted with the U-shaped groove 504.

[0048] In actual use, the utility model discloses a rotating seat 201 in the telescopic mechanism 2 is driven to carry out angular rotation with crossbeam 202, thereby realizing the different angle adjustment of wafer. The rotating seat 201 is built-in servo motor, and the model is YASKAWASGMSH-20ACA-YR11, can provide the highest 2000rpm rotation speed to guarantee flexible rotation angle adjustment. In actual debugging process, the control system adopts PLC (Siemens S7-1200) to carry out angle control to rotating seat, can rotate wafer to the specific angle required, adapts to the processing demand of various non-circular materials.

[0049] In order to ensure the stability and precision of adjustment, the crossbeam 202 and telescopic rod 203 are connected through precision guide rail, and the guide rail material is aluminum alloy 6061-T6, adopts linear bearing to reduce friction and deviation, thereby ensuring the precision of wafer in the adjustment process. The control error of the adjustment process can be controlled within ±0.01 °, thereby greatly improving the feeding precision in production, and reducing wafer breakage rate.

[0050] Example 4:

[0051] This embodiment mainly surrounds beneficial effect 2 and is described in detail, and the working principle of three synchronous adjustment suction mechanisms is further explained and expanded.

[0052] The utility model discloses three suction mechanisms 4 synchronously adsorbing wafers, and the suction mechanism includes the butt joint cylinder 401, the suction head 402 and the hose 403. The material of the suction head 402 is silicon rubber (hardness 50A), which can prevent scratching the wafer. At the same time, the positions of the three suction heads can be changed by adjusting the sleeve 312 and the inner sleeve 3121 to ensure the uniformity of the suction points. The equidistance adjustment between the three suction mechanisms can be realized by driving the threaded rod 314 by the servo motor (model Panasonic A5 series).

[0053] Specifically, when the relative positions of the three suction heads need to be adjusted, the sleeve 312 can slide on the column 310 by rotating the screw rod 314, thereby changing the distance of the slider 309 relative to the center of the turntable 301. At this time, the control accuracy of the servo motor is 0.001mm, which ensures that the suction force of each suction head on the wafer is consistent during the wafer feeding process. The control of suction force is monitored by pressure sensor, and the sensor model is Honeywell FSS-SMT series, which can be accurate to ±0.5N to ensure that the wafer does not slip during handling.

[0054] In order to adapt to different sizes of wafer, the distance range of the three material suction mechanisms can be adjusted to 150mm to 310mm, which can cover the feeding and discharging requirements of common 6-inch, 8-inch and 12-inch wafers. During debugging, only the center of the turntable 301 needs to be aligned with the center of the wafer, without additional mechanical adjustment, which greatly improves the convenience of equipment debugging.

[0055] Embodiment 5:

[0056] This embodiment is directed to the working principle of the material clamping mechanism in beneficial effect 3, and provides specific data and material description.

[0057] When there is an obstacle above the feeding area, the wafer cannot be fed by suction, the utility model discloses a clamping mechanism 5 arranged at the front end of the turntable 301 for clamping and feeding the wafer. The clamping mechanism includes a lower clamping plate 501, a movable clamping plate 502 and an extension rod 503. When clamping the wafer, the cylinder 505 (model SMC MGPM40-50Z) is controlled to drive the I-shaped clamp head 506 to move up and down, the I-shaped clamp head 506 is clamped in the U-shaped groove 504 of the extension rod 503, and the movable clamping plate 502 is driven to swing in angle.

[0058] The material of the movable clamping plate 502 is selected from carbon fiber reinforced composite material, which has high strength and wear resistance, and is light in weight, so as to reduce the damage to the wafer. The lower clamping plate 501 is thin, with a thickness of 2mm, which can be easily inserted into the lower part of the wafer. During the clamping process, the clamping pressure between the movable clamping plate 502 and the lower clamping plate 501 is controlled by the pressure regulating valve installed on the control cylinder 505, and the maximum clamping pressure can reach 50N, so as to prevent the wafer from being broken or sliding during the clamping process.

[0059] In summary, the utility model greatly enhances the practicability of the device by combining the suction and clamping methods, so that it can cope with complex production environment, and further improves the efficiency and precision of wafer feeding and discharging.

[0060] Working principle: when in use, the installation seat 101 keeps the whole device fixed, or the installation seat 101 can be fixed on a transversely movable workbench, and the three hoses 403 are connected to the compression pump respectively, the upward movement of the sliding seat 104 is controlled through the track strip 102, the rotation is controlled through the rotating seat 201, and the extension and contraction of the telescopic rod 203 are controlled through the cross beam 202, so as to realize movement in different directions.

[0061] The position of the suction mechanism 4 is adjusted according to the size of different wafers, at this time, the rotating knob 315 at the top is rotated to drive the threaded rod 314 to rotate, and then the inner sleeve 3121 is moved, since the inner sleeve 3121 is fixed with the sliding sleeve 312, the sliding sleeve 312 is moved up and down, at this time, the three sliding blocks 309 are simultaneously moved by the connecting rod 313, the distance between the three sliding blocks 309 and the center of the rotating disc 301 is adjusted, the distance of the three suction mechanisms 4 is adjusted, so that the three suction mechanisms 4 are consistent with the center of the rotating disc 301, when in use, the wafer is adsorbed by the suction head 402 to ensure that the suction point of the wafer is uniformly stressed, and the wafer can be moved in multiple directions by the above-mentioned mechanism to realize feeding and discharging, and at the same time, the driving gear 205 is driven to rotate by the driving motor 204, then the equidistance adjusting mechanism 3 is driven to rotate as a whole by the meshing of the driving gear 205 and the gear slot 305, so as to adjust the angle of the adsorbed wafer.

[0062] The clamping mechanism 5 is arranged at the front end of the rotating disc 301, the height of the I-shaped clamp 506 is controlled by the control cylinder 505, the extension rod 503 is driven to rotate by the cooperation of the I-shaped clamp 506 and the U-shaped slot 504, then the angle of the movable clamping plate 502 and the lower clamping plate 501 is adjusted, and the clamping work of the wafer is realized.

[0063] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer automatic loading and unloading device, comprising a lifting mechanism (1) and an equidistance adjustment mechanism (3), characterized in that: The lifting mechanism (1) includes a mounting seat (101), the mounting seat (101) is vertically symmetrical with track strips (102), two track strips (102) are vertically symmetrical with sliding seats (104), the mounting seat (101) is vertically installed with lifting cylinders (103) for controlling sliding seats (104) on the inner side of the mounting seat (101); The lifting mechanism (1) is installed with a rotating telescopic mechanism (2) on the top, the rotating telescopic mechanism (2) includes a rotating seat (201) fixed on the upper surface of the sliding seat (104), the rotating seat (201) is transversely provided with a cross beam (202) on the upper surface, the cross beam (202) is slidably installed with a telescopic rod (203) on the upper surface, and the equidistance adjusting mechanism (3) is installed at the end of the telescopic rod (203); The equidistance adjusting mechanism (3) includes a rotating disc (301) placed below the end of the telescopic rod (203), the rotating disc (301) is provided with a rotating shaft (302) on the upper surface, the rotating shaft (302) is rotatable on the end of the telescopic rod (203), and the rotating shaft (302) is provided with a limiting plate A (303) on the top, and the limiting plate A (303) is movably attached to the upper surface of the telescopic rod (203); Three material suction mechanisms (4) are slidably installed on the lower surface of the equidistance adjusting mechanism (3), and the equidistance adjusting mechanism (3) is used for synchronously adjusting the positions of the three material suction mechanisms (4); The rotating disc (301) is further provided with a material clamping mechanism (5) at the front end, and the material clamping mechanism (5) is used for clamping the wafer from the side.

2. The automatic loading and unloading device for semiconductor wafers according to claim 1, characterized in that: Teeth grooves (305) are uniformly formed on the upper surface of the rotating disc (301), a driving motor (204) is arranged on the upper surface of the telescopic rod (203), a driving gear (205) is installed on the output end of the driving motor (204), and the driving gear (205) is meshed with the teeth grooves (305).

3. The automatic loading and unloading device for semiconductor wafers according to claim 1, characterized in that: Three convex plates (306) are arranged on the outer side of the lower surface of the rotating disc (301), a convex block (307) is arranged on the center of the lower surface of the rotating disc (301), two track rods (308) are arranged in parallel between each convex plate (306) and the convex block (307), a sliding block (309) is slidably installed between the two track rods (308) in the same group, three track grooves (304) are formed on the surface of the rotating disc (301), and the track grooves (304) are arranged between the two track rods (308); A stand column (310) is arranged on the lower surface of the convex block (307), a limiting plate B (311) is arranged on the bottom of the stand column (310), a sliding sleeve (312) is slidably installed on the surface of the stand column (310), and a connecting rod (313) is hinged between the sliding sleeve (312) and the three sliding blocks (309) respectively; A driving member is further installed on the stand column (310) and used for driving the three sliding blocks (309) to slide synchronously.

4. The automatic loading and unloading device for semiconductor wafers according to claim 3, characterized in that: Open grooves (3101) are symmetrically formed on the surface of the stand column (310). The driving member comprises a threaded rod (314) which is rotatably penetrated through the inside of the column (310) and the rotating shaft (302), the threaded rod (314) is provided with a knob (315) at the end, the knob (315) is placed above the limiting plate A (303), the inside of the sliding sleeve (312) is provided with an inner sleeve (3121), the connecting part of the inner sleeve (3121) and the sliding sleeve (312) is penetrated through an open slot (3101), and the inner sleeve (3121) is screwed on the threaded rod (314).

5. The automatic loading and unloading device for semiconductor wafers according to claim 1, characterized in that: The suction mechanism (4) comprises a butt joint cylinder (401) fixed on the lower surface of the sliding block (309), the butt joint cylinder (401) is provided with a suction head (402) at the bottom, and the top of the butt joint cylinder (401) is connected with a hose (403) which is penetrated through the track groove (304).

6. The automatic loading and unloading device for semiconductor wafers according to claim 3, characterized in that: The material clamping mechanism (5) comprises a lower clamping plate (501) fixedly welded on the bottom of the outer side of the frontmost convex plate (306), the lower clamping plate (501) and the convex plate (306) are in L-shaped structure, and the surface of the convex plate (306) is provided with a through groove (3061).

7. The automatic loading and unloading device for semiconductor wafers according to claim 6, characterized in that: A rotating extension rod (503) is rotatably penetrated through the inside of the through groove (3061), the rotating direction of the extension rod (503) is circumferential rotation in the vertical plane, the front end of the extension rod (503) is provided with a movable clamping plate (502), and the movable clamping plate (502) is placed above the lower clamping plate (501).

8. The automatic loading and unloading device for semiconductor wafers according to claim 7, characterized in that: A U-shaped groove (504) is formed at the rear end of the extension rod (503), the upper surface of the rotating disc (301) is fixedly provided with a control air cylinder (505) at the front side, the output end of the control air cylinder (505) is provided with a I-shaped clamp (506), the I-shaped clamp (506) is placed below the rotating disc (301), and the I-shaped clamp (506) is clamped on the U-shaped groove (504).

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