Wafer temporary storage device

Abstract

The utility model provides a wafer temporary storage device, which comprises a supporting structure and a plurality of groups of positioning devices arranged on the supporting structure at intervals along the vertical direction, the positioning device comprises two groups of adjusting mechanisms which are symmetrically arranged on the two sides of the supporting structure, and a supporting structure which is arranged on the outer sides of the adjusting mechanisms and is used for supporting the wafer; the supporting structure is provided with an adjusting area for the wafer to move on the horizontal plane, and the two sets of adjusting mechanisms support local areas on the two opposite sides of the wafer so as to drive the wafer to move in the adjusting area to be centered. According to the wafer temporary storage device disclosed by the invention, centering of a plurality of wafers is realized, and the process waiting time is shortened.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer temporary storage device. Background Technology

[0002] During wafer manufacturing, wafers need to be transferred between different devices. Transfer devices must adjust the wafer position using mechanical alignment mechanisms to ensure its positioning accuracy in subsequent processes. However, most existing wafer transfer devices use a single-layer alignment structure, requiring wafers to be processed one by one, making it impossible to process multiple wafers simultaneously. This increases process waiting time and reduces production efficiency.

[0003] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background technology section of this application. Utility Model Content

[0004] The purpose of this invention is to disclose a wafer temporary storage device to solve many defects in the existing wafer transfer devices, especially to realize the alignment of multiple wafers and reduce process waiting time.

[0005] To achieve the above objectives, this utility model provides a wafer temporary storage device, comprising: a support structure, and a plurality of positioning devices arranged vertically at intervals on the support structure;

[0006] The positioning device includes: two sets of adjustment mechanisms symmetrically arranged on both sides of the support structure, and a support structure arranged outside the adjustment mechanisms to support the wafer;

[0007] The support structure is configured to provide an adjustment area for the wafer to move in the horizontal plane. Two sets of adjustment mechanisms support local areas on opposite sides of the wafer to drive the wafer to move in the adjustment area for centering.

[0008] As a further improvement of this utility model, the adjustment mechanism includes: a movable block that supports a local area of ​​the wafer, and a driving unit that drives the movable block to move in a horizontal direction.

[0009] As a further improvement of this utility model, the support structure includes: positioning blocks arranged longitudinally on both sides of the movable block, the positioning blocks being recessed to form positioning grooves that support the wafer, and the adjustment area being composed of a plurality of the positioning grooves.

[0010] As a further improvement of this utility model, the movable block is recessed to form an adjustment groove that supports a local area of ​​the wafer, and the adjustment groove is constructed to have an arc-shaped groove wall that abuts against the edge of the local area of ​​the wafer.

[0011] As a further improvement of this utility model, the arc-shaped groove wall is provided to form a plurality of first positioning posts protruding inward along the horizontal direction, and the top of the first positioning posts is constructed with an inwardly inclined guide surface.

[0012] As a further improvement of this utility model, the positioning groove protrudes inward along the horizontal direction to form a plurality of second positioning posts, and the top of the second positioning posts is constructed with an inwardly inclined guide surface.

[0013] As a further improvement of this utility model, the positioning block is configured with a guide groove extending in the horizontal direction on the side facing the movable block, and the movable block is provided with a slider extending into the guide groove protruding towards the positioning block.

[0014] As a further improvement of this utility model, the movable block is constructed with a horizontally extending groove on the side facing the positioning block, and the positioning block is provided with a guide block extending into the groove.

[0015] As a further improvement of this utility model, the support structure includes: a base plate, and two support plates arranged vertically on the base plate and facing each other in the transverse direction;

[0016] Both the driving unit and the positioning block are disposed on the support plate, and the driving unit drives the movable block to move horizontally relative to the positioning block.

[0017] As a further improvement of this utility model, the positioning device further includes a sensor for monitoring the wafer access status.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the positioning device can realize the centering of the wafer, and each group of positioning devices can be adjusted independently, which can perform centering on multiple wafers at the same time. Multiple groups of positioning devices can temporarily store multiple wafers at the same time, so as to realize multi-wafer operation, avoid affecting the wafer transfer process, and reduce wafer handling time, thereby reducing process waiting time and improving production efficiency. Attached Figure Description

[0019] Figure 1 This is an overall schematic diagram of the wafer temporary storage device disclosed in this utility model;

[0020] Figure 2 A top view of the adjustment mechanism and support structure without supporting the wafer;

[0021] Figure 3A top view schematic diagram of the adjusting mechanism and the supporting structure for supporting the wafer.

[0022] Figure 4 A schematic diagram of the connection between the positioning block and the movable block.

[0023] Figure 5 For Figure 4 An enlarged view shown as circle A in Detailed implementation manners

[0024] The present utility model will be described in detail below in conjunction with the various implementation manners shown in the drawings. It should be noted, however, that these implementation manners do not limit the present utility model. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these implementation manners shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1 to 5 A specific implementation manner of a wafer temporary storage device 100 disclosed.

[0026] Refer to Figures 1 to 3 As shown, in this implementation manner, the wafer temporary storage device 100 includes: a support structure 10, and a plurality of groups of positioning devices 20 arranged at intervals along the vertical direction (such as the direction shown by the Z-axis in Figure 1 ). The positioning device 20 includes: two groups of adjusting mechanisms 21 symmetrically arranged on both sides of the support structure 10, and a holding structure 22 arranged outside the adjusting mechanism 21 to support the wafer 300. The holding structure 22 is configured with an adjustment area 220 for the wafer 300 to displace in the horizontal plane. The two groups of adjusting mechanisms 21 support partial areas 301 on opposite sides of the wafer 300 to drive the wafer 300 to displace in the adjustment area 220 for centering.

[0027] During the process of centering the wafer 300 by the wafer temporary storage device 100 disclosed in the present application, an external manipulator (not shown) places the wafer 300 on the holding structure 22. The wafer 300 is supported by the holding structure 22, and the partial areas 301 on opposite sides of the wafer 300 are respectively supported by the two groups of adjusting mechanisms 21. At this time, the wafer 300 placed on the holding structure 22 may not be in the central position. The two groups of adjusting mechanisms 21 are started simultaneously, and apply forces to the partial area 301a and the partial area 301b in the horizontal direction respectively. Since the two groups of adjusting mechanisms 21 are symmetrically arranged, the acting directions of the two groups of adjusting mechanisms 21 point to the preset central position (not shown) of the wafer temporary storage device 100. Under the drive of the adjusting mechanism 21, the wafer 300 moves in the horizontal plane along the adjustment area 220. The holding structure 22 ensures that the wafer 300 remains stable during the movement, avoiding tilting or deviation. When the center of the wafer 300 coincides with the preset central position, the adjusting mechanism 21 stops driving to achieve centering of the wafer 300.

[0028] The wafer storage device 100 disclosed in this application can center wafers 300 through positioning devices 20. Each positioning device 20 can be adjusted independently, and together with the adjustment area 220, it can adapt to centering wafers 300 of different sizes (such as 6-inch, 8-inch, 10-inch, etc.), meeting the centering requirements of wafers 300 of different sizes, and can center multiple wafers 300 simultaneously. By arranging multiple positioning devices 20 vertically at intervals, multiple wafers 300 can be temporarily stored simultaneously in a limited space, thereby improving space utilization. This allows for multi-wafer 300 operation while avoiding impact on the wafer 300 transfer process and reducing wafer 300 handling time, thus reducing process waiting time. Furthermore, multiple positioning devices 20 can work independently. For example, one positioning device 20 can center the wafer 300, while another positioning device 20 can temporarily store the wafer 300 to improve production efficiency. Each positioning device 20 is equipped with an independent adjustment mechanism 21 and a support structure 22, which can accurately center the wafer 300 individually to avoid mutual interference.

[0029] In some examples, the parameter Figure 2 and Figure 3 As shown, the adjustment mechanism 21 includes: a movable block 211, which supports a local area 301 of the wafer 300, and a drive unit 212 (e.g., a needle cylinder) that drives the movable block 211 to move horizontally. The movable block 211 supports the local area 301 of the wafer 300, providing stable support for the wafer 300 and preventing it from tilting or slipping during adjustment. The drive unit 212 drives the movable block 211 to move horizontally, thereby pushing the wafer 300 to move within the horizontal plane. The drive unit 212 can precisely control the moving speed and distance of the movable block 211, ensuring that the wafer 300 can move smoothly and accurately to a preset center position.

[0030] In some examples, the parameter Figure 2 and Figure 3As shown, the positioning device 20 also includes a sensor 23 for monitoring the storage and retrieval status of the wafer 300. The sensor 23 is disposed on the support structure 10. The sensor 23 can monitor in real time whether the wafer 300 is placed on the holding structure 22 or the movable block 211, ensuring the accurate positioning of the wafer 300. When the robot arm places the wafer 300 into or removes it from the positioning device 20, the sensor 23 can detect the presence or absence of the wafer 300, confirming whether the storage and retrieval operation is complete. Furthermore, the adjustment mechanism 21 can work in conjunction with the sensor 23. When the sensor 23 detects that the robot arm has placed the wafer 300 on the holding structure 22 or the movable block 211, the adjustment mechanism 21 will perform a centering operation on the wafer 300 to achieve automated centering and temporary storage of the wafer 300, improving production efficiency and reducing process waiting time. In some examples, the sensor 23 may be configured as a photoelectric sensor; this application does not limit this.

[0031] In some examples, by adjusting the position of the movable block 211, the adjustment mechanism 21 can adapt to wafers of different sizes (such as 6-inch, 8-inch, etc.). For example, during the alignment process of a 6-inch or 8-inch wafer 300, the wafer storage device 100 drives two movable blocks 211 to move towards each other. After shortening the distance between the two movable blocks 211, an external robotic arm (not shown) places the wafer 300 on the movable blocks 211. The two movable blocks 211 support the local areas 301 on opposite sides of the wafer 300. Then, the two drive units 212 drive the two movable blocks 211 to push the wafer 300 towards the center simultaneously. When the center of the wafer 300 coincides with the preset center position, the drive unit 212 stops driving to achieve the alignment of the wafer 300. By shortening the distance between the two movable blocks 211, small-sized wafers 300 (such as 6-inch or 8-inch wafers) can be stably supported, preventing wafer 300 from shifting or tilting due to excessive gap. By adjusting the position of the movable blocks 211, wafers 300 of different sizes can be quickly adapted, improving the versatility and flexibility of the wafer temporary storage device 100.

[0032] In some examples, during the alignment of a 10-inch wafer 300, the wafer storage device 100 uses an external robotic arm (not shown) to place the wafer 300 onto a support structure 22. The support structure 22 supports the wafer 300, and two drive units 212 simultaneously drive two movable blocks 211 to push the wafer 300 towards the center. When the center of the wafer 300 coincides with a preset center position, the drive units 212 stop driving, thus achieving alignment of the wafer 300. Large-size wafers 300 (e.g., 10-inch) are directly supported by the support structure 22, ensuring stability during adjustment and preventing interference due to the initial close proximity of the movable blocks 211. Furthermore, the support structure 22 provides a larger support area for large-size wafers 300, ensuring stability during adjustment and preventing tilting or shifting.

[0033] In some examples, the parameter Figures 2 to 4 As shown, the support structure 22 includes: along the longitudinal direction (e.g. Figure 1 Positioning blocks 221 (in the direction shown by the Y-axis) are arranged on both sides of the movable block 211. Each positioning block 221 has recessed positioning grooves 222 to support the wafer 300. Multiple positioning grooves 222 together constitute the adjustment area 220. The positioning blocks 221 are longitudinally arranged on both sides of the movable block 211 to provide support for the wafer 300. The positioning grooves 222 are recessed in the positioning blocks 221 to support a portion (not shown) of the wafer 300. The adjustment area 220, composed of multiple positioning grooves 222, allows the wafer 300 to move horizontally, facilitating alignment. By having multiple positioning grooves 222 jointly support a portion of the wafer 300, the wafer 300 remains stable during temporary storage and alignment, preventing tilting or slippage. The positioning blocks 221 reduce contact with the surface of the wafer 300 through the positioning grooves 222, reducing the risk of damage and contamination to the wafer 300 surface. The positioning slot 222 can guide the wafer 300 to move in the horizontal plane, ensuring that the wafer is displaced in the correct direction during the adjustment process, so that the wafer 300 can move smoothly and accurately to the preset center position, thereby improving the alignment accuracy.

[0034] In some examples, the parameter Figures 2 to 4As shown, the movable block 211 has a recessed adjustment groove 2111 forming a local area 301 supporting the wafer 300. The adjustment groove 2111 is constructed with an arc-shaped groove wall 2112 that abuts against the edge of the local area 301 of the wafer 300. The adjustment groove 2111 is recessed in the movable block 211 to support the local area 301 of the wafer 300, ensuring that the wafer 300 remains stable during temporary storage and alignment, preventing tilting or slippage. The movable block 211 reduces contact with the wafer surface 300 through the adjustment groove 2111, reducing the risk of damage and contamination to the wafer surface. The edge of the adjustment groove 2111 is constructed to be arc-shaped, matching the circular edge of the wafer 300, to abut against the edge of the local area 301 of the wafer 300 during alignment, guiding the wafer 300 to move smoothly in the horizontal plane, ensuring the accuracy of the alignment process. By adjusting the groove 2111 and the arc-shaped groove wall 2112, the wafer 300 can be moved smoothly and accurately to the center position, improving the centering accuracy.

[0035] In some examples, the parameter Figure 2 and Figure 4 As shown, the arc-shaped groove wall 2112 protrudes inward along the horizontal direction to form multiple first positioning posts 2113. The top of each first positioning post 2113 is constructed with an inwardly inclined guide surface 2114. The first positioning posts 2113 protrude inward along the horizontal direction on the arc-shaped groove wall 2112 to hold the edge of a local area 301 of the wafer 300 during alignment, thereby limiting the displacement of the wafer 300 in the horizontal plane and ensuring that the wafer 300 maintains accurate positioning during adjustment. Through the combined action of multiple first positioning posts 2113, the wafer 300 can move more accurately to the center position, improving alignment accuracy. The guide surface 2114 is configured as an inwardly inclined slope to provide a smooth transition to the edge of the wafer 300, guide the wafer 300 smoothly into the adjustment slot 2111, and reduce the resistance when the wafer 300 enters the adjustment slot 2111, ensuring that the robot can easily and accurately place the wafer 300 in place and avoid collisions or jamming of the wafer 300 during placement.

[0036] In some examples, the parameter Figure 2 and Figure 4As shown, the positioning groove 222 protrudes inward along the horizontal direction to form a plurality of second positioning posts 2221, and the top of the second positioning posts 2221 is constructed with an inwardly inclined guide surface 2222. The second positioning posts 2221 protrude inward along the horizontal direction on the arc-shaped groove wall 2112 to limit the displacement of the wafer 300 in the horizontal plane and ensure that the wafer 300 maintains accurate positioning during adjustment. The guide surface 2222 is configured as an inwardly inclined slope to provide a smooth transition to the edge of the wafer 300, guide the wafer smoothly into the positioning groove 222, and reduce the resistance when the wafer 300 enters the positioning groove 222, ensuring that the robot can easily and accurately place the wafer 300 in place and avoid collisions or jamming of the wafer 300 during placement.

[0037] In some examples, the parameter Figure 4 and Figure 5 As shown, the positioning block 221 has a horizontally extending guide groove 2211 on the side facing the movable block 211. A slider 2115 protrudes from the movable block 211 towards the positioning block 221, extending into the guide groove 2211. The guide groove 2211 extends horizontally on the side of the positioning block 221 facing the movable block 211, providing a sliding track for the slider 2115. The slider 2115 protrudes from the side of the movable block 211 facing the positioning block 221 and extends into the guide groove 2211, sliding within it. The slider 2115 slides within the guide groove 2211, ensuring that the movable block 211 remains stable when moving horizontally, preventing wobbling or deviation. Furthermore, the guide groove 2211 restricts the vertical displacement of the slider 2115, ensuring that the movable block 211 does not tilt or wobble during movement.

[0038] In some examples, the movable block 211 has a horizontally extending groove (not shown) on the side facing the positioning block 221, and the positioning block 221 has a guide block (not shown) protruding from the movable block 211 into the groove. The groove extends horizontally on the side of the movable block 211 facing the positioning block 221, providing a sliding track for the guide block. The guide block protrudes from the side of the positioning block 221 facing the movable block 211, extends into the groove, and slides along the groove. The sliding of the guide block within the groove ensures that the movable block 211 moves smoothly in the horizontal direction, avoiding wobbling or deviation. The groove and guide block ensure the accuracy of the horizontal movement of the movable block 211, thereby improving the alignment accuracy of the wafer 300. The groove restricts the vertical displacement of the guide block, ensuring that the movable block 211 does not tilt or wobble during movement.

[0039] In some examples, the parameter Figure 1 As shown, the support structure 10 includes: a base plate 11, and a component vertically disposed on the base plate 11 and along the transverse direction (e.g., ...). Figure 1Two support plates 12 are arranged opposite each other (in the direction shown by the X-axis). Multiple positioning devices 20 are arranged vertically at intervals on the support plates 12. Sensors 23, drive units 212, and positioning blocks 221 are all arranged on the support plates 12. The drive unit 212 drives the movable block 211 to move horizontally relative to the positioning block 221. The support plates 12 are used to install and fix multiple positioning devices 20 and their components (such as drive units 212, positioning blocks 221, etc.). The support plates 12 are vertically arranged on the base plate 11 to form a rigid frame, enhancing the overall stability of the wafer temporary storage device 100. The multiple positioning devices 20 are arranged vertically at intervals on the support plates 12 to ensure that the wafer 300 remains stable during temporary storage and alignment. Furthermore, the two support plates 12 are arranged opposite each other to ensure that the positioning devices 20 are symmetrically distributed, thereby ensuring that the wafer 300 is subjected to uniform force during adjustment and improving alignment accuracy. The drive unit 212 and the positioning block 221 are both arranged on the support plates 12 to ensure accurate positioning and reliable operation. The moving block 211 is driven by the driving unit 212 to move horizontally relative to the positioning block 221, ensuring that the wafer 300 can move smoothly and accurately to the center position.

[0040] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0042] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer staging device, comprising: The application relates to a wafer positioning device, comprising: a support structure and a plurality of positioning devices vertically spaced apart on the support structure; the positioning device comprises two sets of adjusting mechanisms symmetrically arranged on both sides of the support structure and a supporting structure arranged outside the adjusting mechanisms to support a wafer; the supporting structure is configured to have an adjusting area for horizontal displacement of the wafer, and two sets of the adjusting mechanisms support partial areas on opposite sides of the wafer to drive the wafer to displace in the adjusting area for centering.

2. The wafer temporary storage device according to claim 1, wherein The adjusting mechanism comprises a movable block supporting a partial area of the wafer and a driving unit driving the movable block to move in the horizontal direction.

3. The wafer temporary storage device according to claim 2, wherein The supporting structure comprises positioning blocks arranged on both sides of the movable block in the longitudinal direction, and the positioning blocks are recessed to form positioning grooves supporting the wafer, and the positioning grooves together form the adjusting area.

4. The wafer temporary storage device according to claim 2, wherein The movable block is recessed to form an adjusting groove supporting a partial area of the wafer, and the adjusting groove is configured to have an arc-shaped groove wall abutting against the edge of the partial area of the wafer.

5. The wafer staging device of claim 4, wherein, The arc-shaped groove wall is convexly formed in the horizontal direction to form a plurality of first positioning columns, and the top of the first positioning column is configured to have an inwardly inclined guide surface.

6. The wafer temporary storage device according to claim 3, wherein The positioning groove is convexly formed in the horizontal direction to form a plurality of second positioning columns, and the top of the second positioning column is configured to have an inwardly inclined guide surface.

7. The wafer temporary storage device according to claim 3, wherein The side of the positioning block facing the movable block is configured to have a guide groove extending in the horizontal direction, and the movable block is convexly formed to have a sliding block extending into the guide groove.

8. The wafer temporary storage device according to claim 3, wherein The side of the positioning block facing the movable block is configured to have a sliding groove extending in the horizontal direction, and the movable block is convexly formed to have a guide block extending into the sliding groove.

9. The wafer temporary storage device according to claim 3, wherein The support structure comprises a bottom plate and two support plates vertically arranged on the bottom plate and arranged opposite to each other in the transverse direction. The driving unit and the positioning block are arranged on the support plate, and the driving unit drives the movable block to move in the horizontal direction relative to the positioning block.

10. The wafer temporary storage device according to any one of claims 1 to 9, characterized by, The positioning device further comprises a sensor for monitoring the wafer access state.

Images