Ejector pin mechanism capable of assisting wafer positioning
By designing a pusher mechanism that allows the wafer to slide at an angle, the problem of wafer offset during the lifting and lowering of the pusher and stage is solved, achieving scratch-free high-precision positioning.
Patent Information
- Application Number
- CN202423161251.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In chemical vapor deposition equipment, wafers are prone to shifting during the lifting and lowering of the ejector pins and stage, which can cause coating scratches and affect placement accuracy.
Design a ejector pin mechanism with a height difference at the top of the ejector pin to tilt the wafer, with the end closer to the slit valve of the reaction chamber higher than the end further away from the slit valve. Combined with a transmission rod and a lifting mechanism, ensure that the wafer slides smoothly into the slot.
The tilted design avoids scratching the coating on the wafer surface, improving wafer positioning accuracy and placement precision.
Smart Images
Figure CN223743638U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a top pin mechanism capable of assisting wafer positioning. BACKGROUND
[0002] In the field of semiconductor manufacturing, wafers as a kind of extremely critical basic material, in the production process of chip, integrated circuit and various electronic devices, is in the core position. In the wafer film deposition operation process of chemical vapor deposition equipment, the wafer handling robot in the load lock chamber needs to transfer the wafer between the wafer buffer device in the reaction chamber and the load lock chamber by means of the wafer fork.
[0003] As shown in Figure 8 and Figure 9 , the existing wafer fork B includes a first clamping part B1, a second clamping part B2 and a main body B3, the first clamping part 101, the second clamping part 102 and the main body 103 together form a clamping groove for placing the wafer A, when the wafer needs to be taken out from the wafer buffer device, the relative position of the wafer and the wafer fork is ensured by optical fiber positioning, as shown in Figure 9 , so that the wafer can be positioned and placed in the clamping groove, thereby ensuring that the relative position of the wafer and the wafer buffer device is maintained during the transfer of the wafer from the wafer buffer device to the reaction chamber, and ensuring that the wafer can be uniformly coated.
[0004] After the wafer is transferred into the reaction chamber, the wafer is lifted from the wafer fork by the top pin, then the wafer fork is withdrawn from the reaction chamber, and the wafer is placed on the support table of the stage by the descending top pin; when the wafer needs to be taken out from the reaction chamber, the wafer is lifted from the support table by the top pin, the wafer fork enters the reaction chamber immediately, and the wafer is placed on the wafer fork by the descending top pin, so that the wafer can be transferred with the wafer fork.
[0005] During the lifting operation of the top pin and the stage, the wafer will accumulate a certain amount of offset. In order to ensure that the wafer can be positioned and placed in the clamping groove when the wafer is taken out from the reaction chamber, a slope B4 is usually provided on the second clamping part B2, so that the wafer A slides into the clamping groove through the slope B4. However, in actual application, due to the light weight of the wafer, sometimes one end of the wafer A will be placed on the slope B4 of the second clamping part B2 and cannot slide down smoothly, resulting in that the wafer which has completed coating cannot be completely placed in the clamping groove, affecting the placement accuracy of the wafer returning to the wafer buffer device, and easily scratching the coating on the surface of the wafer. SUMMARY
[0006] The utility model provides a kind of top pin mechanism capable of assisting wafer positioning to overcome the positioning problem existing when the wafer is taken out, avoid the coating on the surface of the wafer to be scratched.
[0007] In order to achieve the above purpose, the technical scheme of the utility model is as follows:
[0008] A top pin mechanism capable of assisting wafer positioning, comprising: at least three top pins capable of supporting a wafer, the top pins having a height difference at the top, so that the wafer supported by the top pins is inclined relative to the wafer fork, and the wafer supported by the top pins is higher near one end of the slit valve of the reaction chamber than the other end.
[0009] Further comprising a transmission rod and a top pin mounting member, the top pin mounting member is fixed on the transmission rod, and the transmission rod is connected to the lifting mechanism.
[0010] Further, the top pin mounting member is provided with mounting grooves, and the top pins are arranged on the mounting grooves, the depths of the mounting grooves are different, so that the heights of the top of the top pins arranged on the mounting grooves are different.
[0011] Further, the top pin mounting member is provided with four mounting grooves, and the two mounting grooves near one end of the slit valve of the reaction chamber are symmetrically arranged with the two mounting grooves away from the other end of the slit valve of the reaction chamber.
[0012] Further, one of the mounting grooves away from the other end of the slit valve of the reaction chamber is provided with an adjusting mechanism capable of adjusting the height of the top of the top pin.
[0013] Further, the top pin comprises a connecting portion and a supporting rod arranged on the connecting portion, and the end of the connecting portion away from the supporting rod is arranged in the mounting groove.
[0014] The adjusting mechanism comprises a groove and a leveling screw, the groove is arranged in the mounting groove, the leveling screw is arranged on the top pin mounting member and located in the groove, and the head of the leveling screw abuts against the bottom of the connecting portion.
[0015] Further, the connecting portion is provided with a first waist hole, and the first waist hole extends along the length direction of the connecting portion.
[0016] Further, the connecting portion is provided with a second waist hole, and the extension direction of the second waist hole is the same as that of the first waist hole.
[0017] The leveling screw further comprises a guide column, the guide column is located at the end of the head away from the screw portion, the guide column is inserted into the second waist hole, and the top of the guide column is provided with a one-way groove or a cross groove.
[0018] Further, the height difference of the top of the plurality of top pins makes the angle of the wafer supported by the top pins relative to the wafer fork be 1.1°-1.3°.
[0019] Further, the top pin mounting member is provided with an avoiding groove, and the avoiding groove is used for avoiding the wafer fork.
[0020] Beneficial effects: the utility model provides a kind of top pin mechanism that can assist wafer positioning, by setting the top needle with certain height difference, the wafer supported on the top needle presents the inclined state, and the end close to the slit valve of reaction chamber is higher than the end away from the slit valve of reaction chamber, compared with horizontal state, the inclined wafer is more easily to slide relative to the inclined plane of second clamping portion, so that wafer can be accurately positioned and placed in the card slot during the process that wafer fork takes wafer from reaction chamber outward, to avoid the scratch of wafer surface coating. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, below will be to the drawings needed to be used in the embodiment or prior art description a simple introduction, obviously, the drawings in the following description is some embodiments of the utility model, for those skilled in the art, without creative labor, according to these drawings, other drawings can also be obtained.
[0022] Figure 1 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment Figure 1 ;
[0023] Figure 2 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment Figure 2 ;
[0024] Figure 3 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment
[0025] Figure 4 The top view of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment
[0026] Figure 5 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment Figure 3 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment
[0027] Figure 6 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment
[0028] Figure 7 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment
[0029] Figure 8 The structure diagram of the top pin mechanism for assisting wafer positioning disclosed by the utility model is set in chemical vapor deposition equipment
[0030] Figure 9The utility model discloses a kind of cooperation schematic diagram of wafer fork and wafer.
[0031] In the drawing:
[0032] 1, ejector pin;11, connecting part;12, support rod;13, first waist hole;14, second waist hole;
[0033] 2, ejector pin mounting part;21, mounting groove;22, avoiding groove;
[0034] 3, recess;
[0035] 4, leveling bolt;41, screw rod part;42, head;43, guide column;
[0036] 5, transmission rod;
[0037] A, wafer;B, wafer fork;B1, first clamping portion;B2, second clamping portion;B3, main body;C, wafer transfer robot;D, reaction chamber cavity;E, load lock chamber cavity;F, valve port. DETAILED DESCRIPTION
[0038] To make the purpose, technical scheme and advantages of the embodiments of the utility model more clear, the technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
[0039] The embodiment provides a kind of ejector pin mechanism capable of assisting wafer positioning, as shown in Figure 3 And Figure 4 It includes at least three ejector pins 1 that can support wafer, multiple top of the ejector pin 1 exists height difference, make the wafer A supported on the ejector pin 1 be inclined relative to wafer fork B, and the wafer A supported on the ejector pin 1 is higher near the one end of reaction chamber slit valve than the one end away from reaction chamber slit valve;
[0040] As shown in Figure 1 And Figure 2 Load lock chamber cavity E and reaction chamber cavity D are adjacent, wafer transfer robot C in load lock chamber cavity E drives wafer fork B to move, to drive wafer fork B to transfer wafer A, wafer fork B enters and exits reaction chamber through the valve port F of the slit valve of reaction chamber;
[0041] As shown in Figure 3As shown, the device further comprises a transmission rod 5 and a needle mounting member 2, the needle mounting member 2 is fixed on the transmission rod 5 by bolts, and the transmission rod 5 is connected to the lifting mechanism, so that the lifting mechanism can drive the needle 1 to lift through the transmission rod 5;
[0042] The transmission rod 5 is located at one end of the needle mounting member 2, so that the transmission rod 5 and the needle mounting member 2 form a cantilever structure, thereby reducing the space occupation and facilitating the layout of other components in the reaction chamber. The shape of the needle mounting member 2 is preferably C-shaped or ring-shaped to reduce the obstruction of the needle mounting member 2 to the heating equipment arranged at the lower part of the reaction chamber. In this embodiment, the needle mounting member 2 is C-shaped, and the transmission rod 5 is located at one end of the C-shaped structure to form a cantilever structure.
[0043] The needle mechanism provided in this embodiment can assist in positioning the wafer. By arranging the needle 1 with a certain height difference at the top, the wafer A supported by the needle 1 is in an inclined state, and the end close to the slit valve of the reaction chamber is higher than the end away from the slit valve of the reaction chamber. Compared with the horizontal state, the inclined wafer A is more likely to slide off the inclined surface B4 of the second clamping part B2, so that the wafer A can be accurately positioned and placed in the clamping groove during the process of the wafer fork taking the wafer out of the reaction chamber, thereby avoiding scratching the surface of the wafer.
[0044] In specific embodiments, the needle mounting member 2 is provided with a mounting groove 21, the needle 1 is arranged on the mounting groove 21, and the depth of the mounting groove 21 is different, so that the height of the top of the needle 1 arranged on the mounting groove 21 is different. The needle 1 is of the same size, and the height of the needle 1 is adjusted by increasing the gasket. In this embodiment, the depth of the mounting groove 21 is different, so that the height of the top of the needle 1 arranged on the mounting groove 21 is different, and the structure is more stable.
[0045] In specific embodiments, the needle mounting member 2 is provided with four mounting grooves 21, two of which are symmetrically arranged near the end of the slit valve of the reaction chamber, and the other two are symmetrically arranged away from the end of the slit valve of the reaction chamber, so that the inclination angle of the wafer A is more controllable.
[0046] In specific embodiments, one of the mounting grooves 21 away from the end of the slit valve of the reaction chamber is provided with an adjusting mechanism capable of adjusting the height of the top of the needle 1, so as to improve the stability of the wafer A supported by the needle 1.
[0047] In specific embodiments, as shown in Figure 5 and Figure 6 The needle 1 is made of metal, and the needle 1 comprises a connecting part 11 and a supporting rod 12 arranged on the connecting part 11, and the end of the connecting part 11 away from the supporting rod 12 is arranged in the mounting groove 21;
[0048] The adjusting mechanism comprises a groove 3 arranged in the mounting groove 21 and a leveling bolt 4 arranged on the needle mounting piece 2 and located in the groove 3, the head 43 of the leveling bolt 4 abuts against the bottom of the connecting part 11, and the leveling bolt 4 is loosened to move the head 43 upward to force the elastic deformation of the connecting part 11, thereby adjusting the height of the top of the supporting rod 12;
[0049] Before formal production, the needle 1 needs to be adjusted by the adjusting mechanism, the wafer A is placed on the needle 1, the height of the three needles 1 is fixed, the operator can press the wafer A by hand, and the height of the remaining needle 1 is adjusted by the adjusting mechanism until the wafer A does not shake or does not produce abnormal noise (the wafer A is relatively thin, and obvious noise will be produced when the wafer A collides with the needle A).
[0050] In specific embodiments, as shown in Figure 6 The connecting part 11 is provided with a first waist hole 13 extending along the length direction of the connecting part 11, and the connecting part 11 is threadedly connected with the needle mounting piece 2 through a bolt arranged in the first waist hole 13, so that the needle 1 can be adjusted in position in the radial direction relative to the wafer A.
[0051] In specific embodiments, as shown in Figure 6 The connecting part 11 is provided with a second waist hole 14, and the extension direction of the second waist hole 14 is the same as that of the first waist hole 13.
[0052] As shown in Figure 7 The leveling bolt 4 further comprises a guide column 43 located at one end of the head 42 away from the screw rod part 41, the guide column 43 is inserted into the second waist hole 14, and a T-shaped groove or a cross-shaped groove is arranged at the top of the guide column 43 to facilitate the operator to rotate the leveling bolt 4 from above with a screwdriver.
[0053] The connecting part 11 is threadedly connected with the needle mounting piece 2 through a bolt arranged in the second waist hole 14, and the guide column 43 plays an auxiliary positioning role, so that the needle 1 can be adjusted in position in the radial direction relative to the wafer A.
[0054] In specific embodiments, the height difference of the top of the plurality of needles 1 causes the wafer A supported on the needle 1 to be inclined at an angle of 1.1°-1.3° relative to the wafer fork B, and in this angle range, the wafer A can be stably supported on the needle 1 and smoothly slide relative to the inclined surface B4 when the needle 1 is lifted.
[0055] In specific embodiments, as shown in Figure 3As shown, the top pin mounting member 2 is provided with a avoiding slot 22 for avoiding the wafer taking fork B, so as to facilitate the arrangement of the wafer carrying robot C.
[0056] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A poppet mechanism capable of assisting wafer positioning, characterized by, The utility model relates to a kind of wafer support mechanism, including: At least three top pins (1) capable of supporting wafer, the height difference exists in the top of multiple top pins (1), the wafer (A) supported on the top pin (1) is inclined relative to wafer fork (B), and the wafer (A) supported on the top pin (1) is higher near the one end of reaction chamber slit valve than the one end away from reaction chamber slit valve; Further including transmission rod (5) and top pin mounting piece (2), the top pin mounting piece (2) is fixed on transmission rod (5), and the transmission rod (5) is connected lifting mechanism.
2. The poppin mechanism capable of assisting wafer positioning according to claim 1, wherein, The top pin mounting piece (2) is provided with mounting groove (21), the top pin (1) is arranged on mounting groove (21), and the depth of mounting groove (21) is different, so that the height of the top of top pin (1) provided on mounting groove (21) is different.
3. The poppet mechanism capable of assisting wafer positioning according to claim 2, wherein, The top pin mounting piece (2) is provided with four mounting grooves (21), and two mounting grooves (21) near the one end of reaction chamber slit valve are symmetrically arranged with two mounting grooves (21) away from the one end of reaction chamber slit valve.
4. The poppet mechanism capable of assisting wafer positioning according to claim 3, wherein, One of the mounting grooves (21) away from the one end of reaction chamber slit valve is provided with adjusting mechanism capable of adjusting the height of the top of top pin (1).
5. The poppet mechanism capable of assisting wafer positioning according to claim 4, wherein, The top pin (1) includes connecting portion (11) and support rod (12) arranged on connecting portion (11), and the one end of connecting portion (11) away from support rod (12) is arranged in mounting groove (21); The adjusting mechanism includes groove (3) and leveling bolt (4), the groove (3) is arranged in mounting groove (21), the leveling bolt (4) is arranged on top pin mounting piece (2) and located in the groove (3), and the head (42) of the leveling bolt (4) abuts against the bottom of connecting portion (11).
6. The poppet mechanism capable of assisting wafer positioning according to claim 5, wherein, The connecting portion (11) is provided with first waist hole (13), and the first waist hole (13) extends along the length direction of connecting portion (11).
7. The poppet mechanism capable of assisting wafer positioning according to claim 6, wherein, The connecting portion (11) is provided with second waist hole (14), and the extension direction of second waist hole (14) is the same as that of first waist hole (13). The leveling bolt (4) further includes guide column (43), the guide column (43) is located at the one end of head (42) away from screw rod portion (41), the guide column (43) is inserted into second waist hole (14), and the top of guide column (43) is provided with a T-shaped slot or a cross-shaped slot.
8. The poppet mechanism capable of assisting wafer positioning according to claim 1, wherein, The height difference of the top of multiple top pins (1) makes the angle of the wafer (A) supported on the top pin (1) relative to wafer fork (B) be 1.1°-1.3°.
9. The poppet mechanism capable of assisting wafer positioning according to claim 2, wherein, The top pin mounting piece (2) is provided with avoiding groove (22), and the avoiding groove (22) is used for avoiding wafer fork (B).