Ejector pin lifting mechanism

Abstract

The utility model discloses an ejector pin lifting mechanism which comprises a base, at least three ejector pins, an ejector pin supporting piece and a lifting driver. The base is provided with ejector pin guide parts with the number corresponding to that of the ejector pins, and the ejector pins penetrate through the base and are guided by the ejector pin guide parts to ascend and descend. The ejector pin supporting piece ascends, and at least three ejector pins are lifted up; the ejector pin supporting piece descends, and at least three ejector pins descend under the action of gravity; the lifting driver drives the ejector pin supporting piece to ascend and descend. The ejector pin is supported through the ejector pin supporting piece under the guiding effect of the ejector pin guiding component, the ejector pin descends through gravity, the ejector pin is not restrained by the ejector pin supporting piece in the direction perpendicular to the lifting direction of the ejector pin, and therefore debugging of the position degree of the ejector pin is reduced during installation and debugging, and the debugging efficiency is improved. The mutual influence between the position error of the ejector pin and the perpendicularity error of the ejector pin is avoided, and the difficulty of installation and debugging is greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a thimble lifting mechanism. BACKGROUND

[0002] In the semiconductor process, the silicon wafer needs to be transported into and out of the reaction chamber. The general steps are roughly as follows: (1) the thimbles inside the pedestal are raised to make the top end of the thimbles higher than the upper surface of the pedestal by a certain distance; (2) the mechanical hand holds the silicon wafer from the back and transfers it to the upper surface of the pedestal, and then the mechanical hand falls, and the silicon wafer is held by the thimbles (usually ≥ 3 thimbles) that have been raised; (3) the thimbles fall, and the silicon wafer falls on the upper surface of the pedestal to perform the corresponding process; (4) after the process is completed, the thimbles are raised, and the silicon wafer is lifted by the thimbles to a certain distance away from the pedestal, and the mechanical hand holds the silicon wafer and takes it away. The above four steps are repeated to achieve the purpose of continuous processing of the silicon wafer. The existing thimbles and thimble support members are rigidly connected. During the installation of the entire mechanism, the level of the thimble support member, the perpendicularity of the thimbles, and the position degree of the multiple thimbles need to be ensured at the same time. Therefore, the assembly difficulty of the entire mechanism is increased. SUMMARY

[0003] The utility model provides a thimble lifting mechanism to solve the above technical problem.

[0004] In order to achieve the above purpose, the technical scheme of the utility model is as follows:

[0005] A thimble lifting mechanism, comprising: a pedestal, at least three thimbles, a thimble support member, and a lifting driver; the pedestal is provided with a number of thimble guide components corresponding to the number of thimbles, the thimbles pass through the pedestal, and the thimbles are lifted under the guidance of the thimble guide components; the thimble support member is raised to lift the at least three thimbles; the thimble support member is lowered, and the at least three thimbles are lowered under the action of gravity; and the lifting driver drives the thimble support member to lift.

[0006] Preferably, the thimble guide component is a needle-punching hole opened in the pedestal, and the thimbles pass through the needle-punching hole.

[0007] Preferably, the thimble guide component further comprises a limiting assembly, which limits the position of the thimbles to make the top end of the thimbles fall into the needle-punching hole.

[0008] Preferably, the limiting assembly comprises a bushing, which is fixedly arranged in the needle-punching hole and coaxially arranged with the needle-punching hole; the thimble comprises an upper segment and a lower segment from top to bottom, the lower segment passes through the inner hole of the bushing, the inner hole of the bushing guides the lower segment, the diameter of the upper segment is greater than the diameter of the lower segment and less than or equal to the outer diameter of the bushing; and the upper segment abuts against the upper end surface of the bushing to limit the position of the thimbles.

[0009] Preferably, the bushing is gap-fitted with the needle-punching hole, the pedestal is fixedly provided with a supporting member, the supporting member holds the lower end surface of the bushing to limit the position of the bushing.

[0010] Preferably, the supporting member is a screw, the screw is screwed into a threaded hole of the base, and a nut of the screw is pressed on the lower end surface of the bushing.

[0011] Preferably, the thimble and the bushing are made of ceramic material.

[0012] Preferably, the base is a heater, and the heater comprises a hollow shaft, a base, a heating pipe and an upper cover; the base is fixedly sleeved on a top end of the hollow shaft, the upper cover is installed on the base, a heating pipe installation cavity is formed between the base and the upper cover, and the heating pipe is coiled in the heating pipe installation cavity through the hollow shaft.

[0013] Preferably, a plurality of positioning columns corresponding to the number of thimbles are fixedly arranged on the base, a plurality of positioning holes corresponding to the positioning columns are arranged on the upper cover, and the positioning columns are inserted into the corresponding positioning holes and do not protrude out of the positioning holes.

[0014] Preferably, the needle hole is arranged at the positioning column.

[0015] Beneficial effects:

[0016] The thimble lifting mechanism disclosed in the application supports the thimble through the thimble supporting member and under the guidance of the thimble guide component, realizes the lowering of the thimble by using gravity, makes the thimble not be constrained by the thimble supporting member in the direction perpendicular to the lifting of the thimble, and thus reduces the position degree adjustment of the thimble during installation and debugging, avoids the mutual influence between the position degree error of the thimble and the perpendicularity error of the thimble, and greatly reduces the difficulty of installation and debugging. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0018] Figure 1 Structure diagram of the thimble lifting mechanism disclosed in the present application Figure 1 ;

[0019] Figure 2 Structure diagram of the thimble lifting mechanism disclosed in the present application Figure 2 ;

[0020] Figure 3 Front view of the thimble lifting mechanism disclosed in the present application

[0021] Figure 4 Right view of the thimble lifting mechanism disclosed in the present application

[0022] Figure 5 for Figure 3 a sectional view along A-A in Fig.

[0023] Figure 6 for Figure 3 a sectional view along B-B in Fig.

[0024] Figure 7 for Figure 5 a partial enlarged view of C in Fig.

[0025] Figure 8 for Figure 6 a partial enlarged view of D in Fig.

[0026] 1, base; 11, hollow shaft; 12, base; 121, positioning column; 13, heating pipe; 14, upper cover; 2, ejector pin; 3, ejector pin support; 4, lifting driver; 51, bushing; 52, support. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the scope of protection of the utility model.

[0028] A ejector pin lifting mechanism, in combination with Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, it comprises: a base 1, at least three needles 2, a needle support 3 and a lifting driver 4; the base 1 is used for carrying a wafer, the base 1 is provided with needle guide components corresponding in number to the number of needles 2, the at least three needles 2 pass through the base 1, the needles 2 are lifted under the guidance of the needle guide components and are used for supporting the wafer lifting; the needle support 3 is lifted, and the at least three needles 2 are lifted; the needle support 3 is lowered, and the at least three needles 2 are lowered under the action of gravity; the lifting driver 4 drives the needle support 3 to lift. The needle 2 and the needle support 3 are separate parts, which ensure that the needle 2 is not constrained by the needle support 3 in the direction perpendicular to the lifting of the needle 2. The lifting driver 4 drives the needle support 3 to lift, and the upper surface of the needle support 3 abuts against the bottom end of the needle 2 and then lifts the needle 2 under the guidance of the needle guide components, which are used for supporting the wafer lifting; the lifting driver 4 drives the needle support 3 to lower, and the needle 2 is lowered under the action of gravity, thereby placing the wafer on the base 1; in the direction perpendicular to the lifting of the needle 2, the bottom end of the needle 2 is no longer rigidly connected with the needle support 3, so that the needle 2 is not constrained by the needle support 3. During installation and debugging, only the upper surface of the needle support 3 needs to be adjusted to be horizontal and the needle 2 needs to be adjusted to be vertical, without the need of adjusting the position of the needle 2 installed on the needle support 3, thereby avoiding the mutual influence between the position error of the needle 2 and the perpendicularity error of the needle 2 and greatly reducing the difficulty of installation and debugging.

[0029] Specifically, the top end and the bottom end of the needle 2 are flat or arc surfaces.

[0030] Preferably, the needle guide components are needle-penetrating holes opened in the base 1, the needle 2 penetrates through the needle-penetrating holes, and the needle 2 is guided through the needle-penetrating holes.

[0031] Preferably, the needle guide components further comprise a limiting assembly, which limits the position of the needle 2 to drop so that the top end of the needle 2 falls into the needle-penetrating hole. The limiting assembly not only prevents the needle 2 from falling out of the needle-penetrating hole, but also makes the top end of the needle 2 fall into the needle-penetrating hole, thereby ensuring that the wafer is placed on the base 1.

[0032] Preferably, the base 1 is a heater, so that the wafer placed on the base 1 is heated through heat conduction to perform a deposition process.

[0033] Preferably, in combination with Figure 1 , Figure 2 , Figure 5 and Figure 6As shown, the heater comprises: a hollow shaft 11, a base 12, a heating pipe 13 and an upper cover 14; the base 12 is fixedly sleeved at the top end of the hollow shaft 11, the upper cover 14 is installed on the base 12, a heating pipe installation cavity is formed between the base 12 and the upper cover 14, and the heating pipe 13 is coiled in the heating pipe installation cavity through the hollow shaft 11. The heating pipe 13 generates heat which is uniformly heated to the wafer after heat conduction of the upper cover 14.

[0034] Preferably, in combination with Figure 2 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, a plurality of positioning columns 121 corresponding to the number of the top pins 2 are fixedly arranged on the base 12, and a plurality of positioning holes corresponding to the positioning columns 121 are arranged on the upper cover 14, the positioning columns 121 are inserted into the corresponding positioning holes and do not pass through the positioning holes. The cooperation of the positioning columns 121 and the positioning holes can position the upper cover 14 and ensure the reliable contact between the wafer and the upper cover 14, so as to ensure that the heat is uniformly heated to the wafer after heat conduction of the upper cover 14.

[0035] Preferably, the needle penetrating hole is arranged at the positioning column 121. Compared with the alignment mode of arranging through holes on the base 12 and the upper cover 14, the size precision and perpendicularity of the needle penetrating hole can be ensured by arranging the needle penetrating hole on the positioning column 121 at one time.

[0036] Preferably, the limiting assembly comprises a bushing 51, the bushing 51 is fixedly arranged in the needle penetrating hole and coaxially arranged with the needle penetrating hole; the top pin 2 comprises an upper segment and a lower segment from top to bottom, the lower segment passes through the inner hole of the bushing 51, the inner hole of the bushing 51 guides the lower segment, the diameter of the upper segment is greater than that of the lower segment and less than or equal to the outer diameter of the bushing 51; the upper segment abuts against the upper end surface of the bushing 51 to limit the position of the top pin 2. The position and perpendicularity of the top pin 2 are ensured by the cooperation of the bushing 51 and the needle penetrating hole, the top pin 2 vertically rises after being lifted by the top pin supporting piece 3, so as to reliably support the wafer. Moreover, the bushing 51 is easy to process, the precision can be ensured by processing, and the difficulty of installation and debugging is reduced.

[0037] Preferably, the top pin 2 and the bushing 51 are made of ceramic material, so as to improve the heat resistance and corrosion resistance of the two.

[0038] Preferably, the bushing 51 is gap-fitted with the needle penetrating hole, the base 1 is fixedly provided with a supporting piece 52, the supporting piece 52 supports the lower end surface of the bushing 51 to limit the position of the bushing 51, so as to ensure that the bushing 51 can reliably limit the position of the top pin 2.

[0039] Preferably, the supporting piece 52 is a screw, the screw is screwed into the threaded hole of the base 1, and the nut of the screw is pressed on the lower end surface of the bushing 51. The mode of supporting the lower end surface of the bushing 51 by the nut of the screw can facilitate the replacement of the bushing 51 and the top pin 2.

[0040] Specifically, the needle support 3 is "C" shaped, and the hollow shaft 11 passes through the middle of the needle support 3, so that the needle support 3 can hold the needle 2 and does not interfere with the heater.

[0041] Specifically, the lifting driver 4 is a prior art, which is not described here.

[0042] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A needle lifting mechanism characterized by, The application relates to a base (1), at least three needles (2), a needle support (3) and a lifting driver (4); the base (1) is provided with needle guide components corresponding in number to the number of the needles (2), the needles (2) pass through the base (1) and are lifted under the guidance of the needle guide components; the needle support (3) is lifted to lift the at least three needles (2); the needle support (3) is lowered, and the at least three needles (2) are lowered under the action of gravity; and the lifting driver (4) drives the needle support (3) to lift and lower. The needle guide components are needle passing holes opened in the base (1), and the needles (2) pass through the needle passing holes.

2. A needle lifting mechanism according to claim 1, wherein The needle guide components further comprise a limiting assembly which limits the position of the needles (2) to make the top ends of the needles (2) fall into the needle passing holes.

3. A needle lifting mechanism according to claim 2, wherein The limiting assembly comprises a bushing (51) fixed in the needle passing hole and coaxially arranged with the needle passing hole; the needle (2) comprises an upper section and a lower section from top to bottom; the lower section passes through the inner hole of the bushing (51), the inner hole of the bushing (51) guides the lower section, the diameter of the upper section is larger than that of the lower section and is less than or equal to the outer diameter of the bushing (51); and the upper section abuts against the upper end surface of the bushing (51) to limit the position of the needle (2) to lower.

4. A needle lifting mechanism according to claim 3, wherein The bushing (51) is gap-fitted with the needle passing hole, the base (1) is fixed with a supporting piece (52) which supports the lower end surface of the bushing (51) to limit the position of the bushing (51).

5. A needle lifting mechanism according to claim 4, wherein The supporting piece (52) is a screw which is screwed into the threaded hole of the base (1), and the nut of the screw is pressed on the lower end surface of the bushing (51).

6. A needle lifting mechanism according to claim 5, wherein The needle (2) and the bushing (51) are made of ceramic.

7. The ejector lifter mechanism according to any one of claims 3-6, wherein, The base (1) is a heater which comprises a hollow shaft (11), a base (12), a heating pipe (13) and an upper cover (14); the base (12) is fixedly sleeved at the top end of the hollow shaft (11), the upper cover (14) is mounted on the base (12), a heating pipe mounting cavity is formed between the base (12) and the upper cover (14), and the heating pipe (13) passes through the hollow shaft (11) and is coiled in the heating pipe mounting cavity.

8. A needle lifting mechanism according to claim 2, wherein The base (12) is fixed with positioning columns (121) corresponding in number to the number of the needles (2), the upper cover (14) is provided with positioning holes corresponding to the positioning columns (121) one by one, and the positioning columns (121) are inserted into the corresponding positioning holes and do not pass out of the positioning holes.

9. A needle lifting mechanism according to claim 8, wherein The needle passing holes are opened at the positioning columns (121).

10. A needle lifting mechanism according to claim 9, wherein ​

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