MOS tube packaging body and electronic equipment

Abstract

The utility model discloses an MOS tube packaging body and an electronic device. The MOS tube packaging body comprises a housing, a base island, a first pin, a second pin, a third pin, a fourth pin and a bonding pad. The first pin, the second pin and the third pin are arranged on the same side of the shell, and the fourth pin is arranged on the other side of the shell; the fourth pin is connected with the second pin; the base island is arranged on the fourth pin and the second pin and is connected with the fourth pin and the second pin; the shell covers the first pin, the second pin, the third pin and the fourth pin, and the first pin, the second pin, the third pin and the fourth pin extend out of the shell; the bonding pad is arranged at the bottom of the base island and partially extends out of the shell. According to the utility model, the bonding pad is arranged at the bottom of the base island, and the top and the bottom of the MOS tube packaging body realize heat dissipation, thereby achieving the purpose of three-dimensional heat dissipation, improving the heat dissipation effect of the MOS tube packaging body, and further improving the reliability of the MOS tube packaging body.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit packaging technical field especially relates to a MOS tube package and electronic equipment. BACKGROUND

[0002] With the continuous progress of semiconductor manufacturing process, the performance of MOS tube has been significantly improved, such as lower on-resistance, faster switching speed, etc. The performance improvement of MOS tube makes MOS tube widely used in more fields, thereby promoting the growth of market demand, for example, plays an important role in new energy vehicles, battery management system, motor controller and other key components.

[0003] The existing MOS tube package usually adopts SOT223 package, and the SOT223 package is usually connected with the printed circuit board through the pin, and then the heat is conducted to the air through the printed circuit board to reduce the temperature of the chip. However, the SOT223 package adopts the pin to connect with the printed circuit board, and the heat is dissipated through the printed circuit board, which has poor effect.

[0004] Therefore, the prior art still needs to be improved and developed. UTILITY MODEL CONTENT

[0005] In view of the above problems of the prior art, the utility model aims at providing a MOS tube package and electronic equipment to solve the problem that the SOT223 package adopts the pin to connect with the printed circuit board, and the heat is dissipated through the printed circuit board, which has poor effect.

[0006] The technical scheme of the utility model is as follows:

[0007] In the first aspect, the utility model provides a MOS tube package, which comprises a shell, a base island, a first pin, a second pin, a third pin, a fourth pin and a pad.

[0008] The first pin, the second pin and the third pin are arranged on the same side of the shell, and the fourth pin is arranged on the other side of the shell.

[0009] The fourth pin is connected with the second pin, and the base island is arranged on and connected with the fourth pin and the second pin.

[0010] The shell covers the first pin, the second pin, the third pin and the fourth pin, and the first pin, the second pin, the third pin and the fourth pin extend out of the shell.

[0011] The pad is arranged at the bottom of the base island and partially extends out of the shell.

[0012] The further setting of the utility model discloses, the soldering pad is integrally formed with the base island.

[0013] The further setting of the utility model discloses, the soldering pad is rectangular soldering pad.

[0014] The further setting of the utility model discloses still includes: fifth pin and sixth pin;The fifth pin with sixth pin same side setting and located the two sides of fourth pin.

[0015] A MOS tube package body, it includes: shell, base island, first pin, second pin, third pin and soldering pad;

[0016] The first pin with the second pin sets up at the same side of the shell, and the third pin sets up at the other side of the shell;

[0017] The base island sets up on the third pin and is connected with the third pin;

[0018] The shell is covered to the first pin, the second pin and the third pin, and the first pin, the second pin and the third pin extend out of the shell;

[0019] The soldering pad sets up at the base island bottom and partially extends out of the shell.

[0020] Secondly, the utility model also provides an electronic equipment, it includes: printed circuit board, first MOS tube and as described above MOS tube package body;

[0021] The first MOS tube sets up on the base island, the source of the first MOS tube is connected the first pin, the gate of the first MOS tube is connected the third pin, and the drain of the first MOS tube is connected the second pin with the fourth pin;

[0022] The first pin, the second pin, the third pin and the fourth pin are connected with the printed circuit board;

[0023] The soldering pad is connected with the printed circuit board.

[0024] An electronic equipment, it includes: printed circuit board, first MOS tube and as described above MOS tube package body, the first MOS tube sets up on the base island;The source of the first MOS tube is connected the first pin, and the gate of the first MOS tube is connected the second pin, and the drain of the first MOS tube is connected third pin;The first pin, the second pin and the third pin are connected with the printed circuit board;The soldering pad is connected with the printed circuit board.

[0025] An electronic device comprises a printed circuit board, a first MOS tube, a second MOS tube and a MOS tube package as described above;

[0026] The first MOS tube and the second MOS tube are arranged on the base island; the source of the first MOS tube is connected with the first pin, and the gate of the first MOS tube is connected with the sixth pin; the source of the second MOS tube is connected with the third pin, and the gate of the second MOS tube is connected with the fifth pin; the drains of the first MOS tube and the second MOS tube are connected with the second pin and the fourth pin;

[0027] The first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin are connected with the printed circuit board;

[0028] The pad is connected with the printed circuit board.

[0029] The further setting of the utility model still includes conductive glue layer, conductive glue layer is arranged between first MOS tube and base island and is arranged between second MOS tube and base island.

[0030] The further setting of the utility model still includes metal band, metal band is connected between source of first MOS tube and first pin, and is connected between source of second MOS tube and third pin.

[0031] The further setting of the utility model still includes bonding wire, bonding wire is connected between gate of first MOS tube and fourth pin, and is connected between gate of second MOS tube and sixth pin.

[0032] The further setting of the utility model, metal band includes aluminium band and copper band.

[0033] The utility model provides a MOS tube package and electronic equipment, MOS tube package includes: shell, base island, first pin, second pin, third pin, fourth pin and pad. The first pin, the second pin with the third pin set same side at the shell, the fourth pin sets another side at the shell, the fourth pin with the second pin is connected, the base island sets on the fourth pin with the second pin and with the fourth pin with the second pin is connected, the shell cladding is in the first pin, the second pin, the third pin with the fourth pin, and the first pin, the second pin, the third pin with the fourth pin is protruding the shell, the pad sets in the base island bottom and part protrudes the shell, the utility model discloses a pad is arranged at the bottom of base island, like this, the first pin, the second pin, the third pin, the fourth pin can export the heat to the air through the printed circuit board, realizes the top heat dissipation of MOS tube package, and the pad can export the heat to the air through the printed circuit board, realizes the bottom heat dissipation of MOS tube package, and then realizes three -dimensional heat dissipation, improves the heat dissipation effect of MOS tube package. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawing needed to be used in the embodiment or prior art description, obviously, the drawing in the following description only some embodiments of the utility model, for ordinary people in the art, under the premise of not paying creative labor, still can obtain other drawings according to the structure shown in these drawings.

[0035] Figure 1 It is the front structure schematic diagram of MOS tube package in an embodiment of the utility model.

[0036] Figure 2 It is the back structure schematic diagram of MOS tube package in an embodiment of the utility model.

[0037] Figure 3 It is the lead frame diagram of MOS tube package in an embodiment of the utility model.

[0038] Figure 4 It is the lead frame diagram of MOS tube package in an embodiment of the utility model.

[0039] Figure 5 It is the front structure schematic diagram of MOS tube package in an embodiment of the utility model.

[0040] Figure 6 It is the back structure schematic diagram of MOS tube package in an embodiment of the utility model.

[0041] Figure 7 is a lead frame diagram of the MOS tube packaging body in an embodiment of the utility model.

[0042] Figure 8 is a wire bonding diagram of the MOS tube packaging body in an embodiment of the utility model.

[0043] Figure 9 is an internal structure schematic diagram of the MOS tube packaging body in an embodiment of the utility model.

[0044] Figure 10 is a front layout schematic diagram of the printed circuit board in an embodiment of the utility model.

[0045] Figure 11 is a back layout schematic diagram of the printed circuit board in an embodiment of the utility model.

[0046] Figure 12 is a wire bonding diagram of the MOS tube packaging body in an embodiment of the utility model.

[0047] Figure 13 is a wire bonding diagram of the MOS tube packaging body in an embodiment of the utility model.

[0048] The marks in the drawings: 100, printed circuit board;110, first MOS tube;120, second MOS tube;130, MOS tube packaging body;131, shell;132, base island;133, first pin;134, second pin;135, third pin;136, fourth pin;137, fifth pin;138, sixth pin;139, seventh pin;140, eighth pin;141, pad;150, conductive adhesive layer;160, metal strip;170, bonding lead;180, copper foil. DETAILED DESCRIPTION

[0049] The utility model provides a MOS tube packaging body and electronic equipment, for the purpose, technical scheme and effect of the utility model are more clear, explicit, the following refers to the drawing and raises the example to the utility model further detailed explanation. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0050] In the embodiment and the patent application scope, unless the article has special limitation in the text, "a", "one", "said" and "the" can also include plural forms.If the description of "first", "second" and the like is involved in the embodiment of the utility model, the description of "first", "second" and the like is only used for the description purpose, and can not be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one feature.

[0051] It should be further understood that the word "comprise" used in the specification of the present application means that the features, integers, steps, operations, elements and / or components described in the specification exist, but does not exclude the existence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. It should be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements can exist. In addition, "connected" or "coupled" as used herein can include wireless connection or wireless coupling. The word "and / or" as used herein includes all or any combination of one or more of the associated listed items.

[0052] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present application belongs. It should also be understood that terms such as those defined in a general dictionary should be understood to have meanings consistent with those in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as such.

[0053] In addition, the technical solutions among various embodiments can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor is it within the protection scope required by the present application.

[0054] In some embodiments, as shown in Figure 1 -3 and Figure 10 With Figure 11 As shown in the accompanying drawings, the present application provides an electronic device, which comprises: a printed circuit board 100, a first MOS tube and a MOS tube package 130.

[0055] In some embodiments, as shown in Figures 1 to 3As shown, the MOS tube package 130 comprises a shell 131, a base island 132, a first pin 133, a second pin 134, a third pin 135, a fourth pin 136 and a soldering pad 141. The first pin 133, the second pin 134 and the third pin 135 are arranged on the same side of the shell 131, and the fourth pin 136 is arranged on the other side of the shell 131; the fourth pin 136 is connected with the second pin 134, so the second pin 134 and the fourth pin 136 are equivalent to one pin; the base island 132 is arranged on and connected with the fourth pin 136 and the second pin 134; the shell 131 covers the first pin 133, the second pin 134, the third pin 135 and the fourth pin 136, and the first pin 133, the second pin 134, the third pin 135 and the fourth pin 136 extend out of the shell 131; the soldering pad 141 is arranged at the bottom of the base island 132 and partially extends out of the shell 131.

[0056] The first MOS tube is arranged on the base island 132, the source of the first MOS tube is connected with the first pin 133, the gate of the first MOS tube is connected with the third pin 135, and the drain of the first MOS tube is connected with the second pin 134 and the fourth pin 136; the first pin 133, the second pin 134, the third pin 135 and the fourth pin 136 are connected with the printed circuit board 100; and the soldering pad 141 is connected with the printed circuit board 100.

[0057] Specifically, please refer to the following description of the first embodiment of the application. Figure 10 The MOS tube package 130 is connected with the printed circuit board 100 through the first pin 133, the second pin 134, the third pin 135, the fourth pin 136 and the soldering pad 141. Figure 11The MOS tube package 130 has a first pin 133, a second pin 134, a third pin 135, and a fourth pin 136. The base island 132 can be placed with one MOS tube, i.e., the first MOS tube. The first pin 133, the second pin 134, and the third pin 135 pass through the shell 131 and are connected to the printed circuit board 100. The heat generated by the first MOS tube during operation can be conducted from the top of the MOS tube package 130 to the air through the copper foil 180 on the printed circuit board 100. The pad 141 is located at the bottom of the base island 132 and is connected to the printed circuit board 100. The printed circuit board 100 is provided with a via hole at a position corresponding to the pad 141. The heat generated by the MOS tube during operation can be conducted to the copper foil 180 on the back surface of the printed circuit board 100 through the pad 141, and then conducted to the air through the via hole of the printed circuit board 100, thereby achieving vertical downward heat conduction, relative pin heat dissipation, shortening the heat conduction path, and spreading the heat generated by the MOS tube to the air through the printed circuit board 100 in the shortest distance. In this way, the top and bottom of the MOS tube package 130 achieve heat dissipation, achieving the purpose of three-dimensional heat dissipation, thereby improving the heat dissipation effect of the MOS tube package 130, better reducing the temperature of the MOS tube chip, and further improving the reliability of the SOT223 MOS tube package.

[0058] In some embodiments, as shown in FIG. 1B, the pad 141 is integrally formed with the base island 132. In this embodiment, the pad 141 is a metal pad, and the pad 141 and the base island 132 can be integrally formed. That is, the base island 132 sinks to expose the shell 131 at the bottom, and can be connected to the printed circuit board 100 through soldering, thereby achieving vertical downward heat conduction. Figure 2

[0059] In some embodiments, as shown in FIG. 1B, the pad 141 is integrally formed with the base island 132. In this embodiment, the pad 141 is a metal pad, and the pad 141 and the base island 132 can be integrally formed. That is, the base island 132 sinks to expose the shell 131 at the bottom, and can be connected to the printed circuit board 100 through soldering, thereby achieving vertical downward heat conduction. Figure 2

[0060] In some embodiments, as shown in FIG. 1B, the pad 141 is integrally formed with the base island 132. In this embodiment, the pad 141 is a metal pad, and the pad 141 and the base island 132 can be integrally formed. That is, the base island 132 sinks to expose the shell 131 at the bottom, and can be connected to the printed circuit board 100 through soldering, thereby achieving vertical downward heat conduction. Figure 5 Figure 6 In some embodiments, as shown in FIG. 1B, the pad 141 is integrally formed with the base island 132. In this embodiment, the pad 141 is a metal pad, and the pad 141 and the base island 132 can be integrally formed. That is, the base island 132 sinks to expose the shell 131 at the bottom, and can be connected to the printed circuit board 100 through soldering, thereby achieving vertical downward heat conduction.

[0061] In this embodiment, the MOS tube package 130 further has a fifth pin 137 and a sixth pin 138. In this way, two MOS tubes can be arranged on the base island 132. One MOS tube is connected to the first pin 133 at the source and to the sixth pin 138 at the gate, and the other MOS tube is connected to the third pin 135 at the source and to the fifth pin 137 at the gate.​​​

[0062] As Figure 4 shown, the utility model provides a MOS tube package body, it includes: shell, base island 132, first pin 133, second pin 134, third pin 135 and pad, first pin 133 with second pin 134 set in the same side of shell, third pin 135 sets up in the other side of shell, base island 132 sets up on third pin and is connected with third pin, the shell cladding in first pin, second pin with third pin, and first pin, second pin with third pin extends the shell, the pad sets up in base island bottom and partially extends shell. Figure 1 The difference between the embodiment and Figure 1 the second pin of the embodiment is that the second pin is removed, so that the gap between the first pin 133 and the second pin 134 in Figure 4 the embodiment is increased.

[0063] Based on Figure 4 the MOS tube package body in the embodiment, the utility model further provides an embodiment of electronic equipment, which comprises a printed circuit board, a first MOS tube and Figure 4 the MOS tube package body in the embodiment, the first MOS tube is arranged on the base island, the source electrode of the first MOS tube is connected to the first pin 133 of the MOS tube package body, the gate electrode of the first MOS tube is connected to the second pin 134 of the MOS tube package body, the drain electrode of the first MOS tube is connected to the third pin 135 of the MOS tube package body, the first pin, the second pin and the third pin are connected to the printed circuit board, and the pad is connected to the printed circuit board.

[0064] In some embodiments, as Figures 5 to 11 shown, the utility model further provides an electronic equipment, which comprises a printed circuit board 100, a first MOS tube 110, a second MOS tube 120 and a MOS tube package body 130 as described above.

[0065] The MOS tube package body 130 comprises a shell 131, a base island 132, a first pin 133, a second pin 134, a third pin 135, a fourth pin 136, a fifth pin 137, a sixth pin 138 and a pad 141.

[0066] The first pin 133, the second pin 134 and the third pin 135 are arranged on the same side of the shell 131, and the fourth pin 136 is arranged on the other side of the shell 131; the fourth pin 136 is connected with the second pin 134; the base island 132 is arranged on and connected with the fourth pin 136 and the second pin 134; the fifth pin 137 and the sixth pin 138 are arranged on the same side and located on both sides of the fourth pin 136; the shell 131 covers the first pin 133, the second pin 134, the third pin 135, the fourth pin 136, the fifth pin 137 and the sixth pin 138, and the first pin 133, the second pin 134, the third pin 135, the fourth pin 136, the fifth pin 137 and the sixth pin 138 extend out of the shell 131; the pad 141 is arranged at the bottom of the base island 132 and partially extends out of the shell 131.

[0067] The first MOS tube 110 and the second MOS tube 120 are arranged on the base island 132; the source of the first MOS tube 110 is connected with the first pin 133, and the gate of the first MOS tube 110 is connected with the sixth pin 138; the source of the second MOS tube 120 is connected with the third pin 135, and the gate of the second MOS tube 120 is connected with the fifth pin 137; the drains of the first MOS tube 110 and the second MOS tube 120 are connected with the second pin 134 and the fourth pin 136; the first pin 133, the second pin 134, the third pin 135, the fourth pin 136, the fifth pin 137 and the sixth pin 138 are connected with the printed circuit board 100; and the pad 141 is connected with the printed circuit board 100.

[0068] Specifically, the first MOS tube 110 and the second MOS tube 120 are arranged on the base island 132; the source of the first MOS tube 110 is connected with the first pin 133, and the gate of the first MOS tube 110 is connected with the sixth pin 138; the source of the second MOS tube 120 is connected with the third pin 135, and the gate of the second MOS tube 120 is connected with the fifth pin 137; and the drains of the first MOS tube 110 and the second MOS tube 120 are connected with the second pin 134 and the fourth pin 136. In this way, the MOS tube package 130 can package two MOS tubes.

[0069] The first pin 133, the second pin 134, the third pin 135, the fourth pin 136, the fifth pin 137 and the sixth pin 138 extend out of the shell 131 and are connected with the printed circuit board 100, so that the heat generated by the MOS tube can be transferred out through the pins from the top of the MOS tube package 130. The pad 141 is arranged at the bottom of the base island 132, so that the heat generated by the MOS tube can be transferred to the printed circuit board 100 through the pad 141 at the bottom of the MOS tube package 130, and then dissipated to the air through the copper foil 180 on the printed circuit board 100. Therefore, the top and bottom of the MOS tube package 130 are cooled, achieving the purpose of three-dimensional cooling, so as to improve the cooling effect of the MOS tube package 130, better reduce the temperature of the MOS tube chip, and further improve the reliability of the MOS tube package 130.

[0070] In some embodiments, as shown in FIG. 1, the MOS tube package 130 further includes a conductive glue layer 150 arranged between the first MOS tube 110 and the base island 132 and between the second MOS tube 120 and the base island 132. Specifically, the first MOS tube 110 and the second MOS tube 120 are connected with the base island 132 through the conductive glue layer 150, so as to reduce the packaging impedance. Figure 9

[0071] In some embodiments, as shown in FIG. 1, the MOS tube package 130 further includes a metal strip 160 connected between the source of the first MOS tube 110 and the first pin 133, and between the source of the second MOS tube 120 and the third pin 135. Figure 8 Specifically, because the drain and the source of the MOS tube carry large current (the peak current of some MOS tubes can exceed 100A), the first pin 133 and the third pin 135 are widened and lengthened to bond the metal strip 160 of larger size, so as to reduce the packaging impedance.

[0072] In some embodiments, the metal strip 160 can be, but is not limited to, an aluminum strip and a copper strip. In some embodiments, the first MOS tube 110 and the first pin 133, and the second MOS tube 120 and the third pin 135 can also be connected by a bonding bridge, such as a copper bridge.

[0073] In some embodiments, as shown in FIG. 1, the MOS tube package 130 further includes a metal strip 160 connected between the source of the first MOS tube 110 and the first pin 133, and between the source of the second MOS tube 120 and the third pin 135.

[0074] Figure 8 Figure 9 ​​​As shown, the MOS transistor package 130 also includes a bonding wire 170, which is connected between the gate of the first MOS transistor 110 and the fourth pin 136, and between the gate of the second MOS transistor 120 and the sixth pin 138.

[0075] Specifically, since the gate current of the first MOSFET 110 and the gate current of the second MOSFET 120 are relatively small, the first MOSFET 110 and the sixth pin 138, and the second MOSFET 120 and the fifth pin 137 can be connected by bonding wires, for example, gold wire, silver wire, copper wire, aluminum wire or alloy wire can be used for connection.

[0076] In some embodiments, such as Figure 12 As shown, the MOS transistor package 130 also includes a seventh pin 139 and an eighth pin 140. The seventh pin 139 and the eighth pin 140 are located on the same side of the first pin 133. The gate of the first MOS transistor 110 is connected to the seventh pin 139, and the gate of the second MOS transistor 120 is connected to the eighth pin 140. This increases the flexibility of gate wiring of the MOS transistor.

[0077] like Figure 13 As shown, in order to facilitate the connection of the fourth pin 136 to a larger copper foil 180 area for heat dissipation, the fifth pin 137 and the sixth pin 138 can be removed.

[0078] It should be noted that the first MOSFET 110 can be a PMOS transistor or an NMOS transistor, and the second MOSFET 120 can be a PMOS transistor or an NMOS transistor.

[0079] In summary, the MOS transistor package and electronic device provided by this utility model have the following beneficial effects:

[0080] A MOS transistor package can encapsulate two MOS transistors;

[0081] The top and bottom of the MOSFET package are both heat-dissipating, achieving three-dimensional heat dissipation. This improves the heat dissipation effect of the MOSFET package, better reduces the temperature of the MOSFET chip, and thus improves the reliability of the MOSFET package.

[0082] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A MOSFET package, comprising: The MOS tube package comprises: a housing, an island, a first pin, a second pin, a third pin, a fourth pin and a pad; the first pin, the second pin and the third pin are arranged on the same side of the housing, and the fourth pin is arranged on the other side of the housing; the fourth pin is connected with the second pin, and the island is arranged on and connected with the fourth pin and the second pin; the housing covers the first pin, the second pin, the third pin and the fourth pin, and the first pin, the second pin, the third pin and the fourth pin extend out of the housing; the pad is arranged at the bottom of the island and partially extends out of the housing.

2. The MOS transistor package of claim 1, wherein, The pad is integrally formed with the island.

3. The MOS transistor package of claim 1, wherein, The pad is a rectangular pad.

4. The MOS transistor package of claim 1, wherein, Further comprising: a fifth pin and a sixth pin; the fifth pin and the sixth pin are arranged on the same side and located on both sides of the fourth pin.

5. A MOSFET package, comprising: The MOS tube package comprises: a housing, an island, a first pin, a second pin, a third pin and a pad; the first pin and the second pin are arranged on the same side of the housing, and the third pin is arranged on the other side of the housing; the island is arranged on and connected with the third pin; the housing covers the first pin, the second pin and the third pin, and the first pin, the second pin and the third pin extend out of the housing; the pad is arranged at the bottom of the island and partially extends out of the housing.

6. An electronic device, comprising: The MOS tube package comprises: a printed circuit board, a first MOS tube and the MOS tube package according to any one of claims 1-3; the first MOS tube is arranged on the island, the source of the first MOS tube is connected with the first pin, the gate of the first MOS tube is connected with the third pin, and the drain of the first MOS tube is connected with the second pin and the fourth pin; the first pin, the second pin, the third pin and the fourth pin are connected with the printed circuit board; the pad is connected with the printed circuit board.

7. An electronic device, comprising: The MOS tube package comprises: a printed circuit board, a first MOS tube and the MOS tube package according to claim 5, the first MOS tube is arranged on the island; the source of the first MOS tube is connected with the first pin, the gate of the first MOS tube is connected with the second pin, and the drain of the first MOS tube is connected with the third pin; the first pin, the second pin and the third pin are connected with the printed circuit board; and the pad is connected with the printed circuit board.

8. An electronic device, comprising: The MOS tube package comprises: a printed circuit board, a first MOS tube, a second MOS tube and the MOS tube package according to claim 4; the first MOS tube and the second MOS tube are arranged on the island; the source of the first MOS tube is connected with the first pin, and the gate of the first MOS tube is connected with the sixth pin; the source of the second MOS tube is connected with the third pin, and the gate of the second MOS tube is connected with the fifth pin; and the drains of the first MOS tube and the second MOS tube are connected with the second pin and the fourth pin. The first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin are connected with the printed circuit board; The pad is connected with the printed circuit board.

9. The electronic device of claim 8, wherein, Further comprising a conductive adhesive layer, which is arranged between the first MOS tube and the base island and between the second MOS tube and the base island.

10. The electronic device of claim 8, wherein, Further comprising a metal strip, which is connected between the source of the first MOS tube and the first pin, and connected between the source of the second MOS tube and the third pin; the metal strip comprises an aluminum strip and a copper strip; Further comprising a bonding wire, which is connected between the gate of the first MOS tube and the fourth pin, and connected between the gate of the second MOS tube and the sixth pin.

Images