Connector for serial communication interface, electronic device and display device

Abstract

The utility model relates to a connector for a serial communication interface, electronic equipment and a display device. The electronic equipment comprises a first serial communication interface, wherein the first serial communication interface comprises a first power supply pin and a first serial data pin; the first power supply pin is connected with a power supply; the first serial data pin is used for being connected with a serial communication driving module, the first serial data pin and the first power supply pin are arranged in a staggered mode, and the first serial data pin and the first power supply pin are arranged in a spaced mode in the direction parallel to the side edge where the first serial data pin is located.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a connector for serial communication interface, electronic equipment and display device. BACKGROUND

[0002] With the development of smart mobile devices, the processor frequency of mobile devices is constantly increasing, and the amount of data to be transmitted is also increasing. The traditional data interface has been unable to meet the requirements of high performance and low power consumption.

[0003] MIPI (Mobile Industry Processor Interface) is a serial interface standard for mobile devices developed by the MIPI Alliance. It is a high-performance, low-power, and low-cost serial communication interface that promotes the establishment of mobile application processor interface specifications. The MIPI protocol specification defines the following interface protocols: DSI: defines a high-speed serial interface between the processor and the display screen, used to connect the display screen and the processor, providing high-bandwidth serial data transmission, mainly used for mobile devices such as mobile phones and tablets. CSl: defines a high-speed serial interface between the processor and the camera, used to connect the camera and the processor, supporting high-bandwidth data transmission, commonly used in mobile device cameras. I3C: used for low-speed control and communication, replacing the traditional I2C interface, providing higher bandwidth and lower power consumption. D-PHY: defines the physical layer of data transmission, mainly used for DSI and CSI interfaces.

[0004] MIPI can be used to connect processors and peripheral devices such as cameras, displays, etc. In mobile devices, ESD (Electrical Over Stress) and EOS (Electrical Over Stress) are important considerations because they can negatively affect the performance and stability of the device.

[0005] During the reliability and electrical inspection of mobile devices, it was found that hot plug would cause black screen or screen with mottling and other functional defects. CONTENT OF THE UTILITY MODEL

[0006] The present application provides a connector for serial communication interface, electronic equipment and display device to solve the problem of hot plug causing black screen or screen with mottling and other functional defects.

[0007] In a first aspect, an electronic device is provided, comprising: a first serial communication interface, the first serial communication interface comprising: a first power pin and a first serial data pin. The first power pin is configured to be connected to a power supply; and the first serial data pin is configured to be connected to a serial communication driving module. The first serial data pin is arranged apart from the first power pin, and the first serial data pin and the first power pin are arranged in parallel with respect to a side on which the first serial data pin is arranged.

[0008] In some embodiments, the first power pin and the first serial data pin are arranged on the same side, or the first power pin and the first serial data pin are arranged on opposite sides, respectively.

[0009] In some embodiments, the first serial communication interface comprises a plurality of first power pins and a plurality of first serial data pins. The plurality of first power pins are arranged on the same side or distributed on opposite sides, and the plurality of first serial data pins are arranged on the same side or distributed on opposite sides.

[0010] In some embodiments, the first serial data pin and the first power pin are arranged apart by at least three pins in a direction parallel to the side on which the first serial data pin is arranged.

[0011] In some embodiments, the first serial communication interface further comprises: a first logic voltage pin configured to transmit a working voltage to the serial communication driving module; and a discharge capacitor connected to the first logic voltage pin, the discharge capacitor having a capacitance greater than or equal to 4.7uf.

[0012] In some embodiments, the discharge capacitor has a capacitance of 4.7uf, 9.4uf, or 10uf.

[0013] In some embodiments, the first serial communication interface further comprises: a first logic voltage pin configured to transmit a working voltage to the serial communication driving module; and a transient voltage suppression diode connected to the first logic voltage pin, the transient voltage suppression diode having a rated reverse off voltage less than or equal to 2.5V and greater than 1.8V.

[0014] In a second aspect, a connector is provided. The first end of the connector is configured to be connected with a first serial communication interface of an electronic device, and the second end of the connector is configured to be connected with a serial communication driving module. The first end of the connector comprises a second power pin and a second serial data pin. The second power pin is configured to be connected with a first power pin of the first serial communication interface, and the second serial data pin is configured to be connected with a first serial data pin of the first serial communication interface to transmit data of the electronic device to the serial communication driving module. The second serial data pin is arranged apart from the second power pin, and the second serial data pin and the second power pin are arranged apart from each other along a direction parallel to a side on which the second serial data pin is arranged.

[0015] In some embodiments, the second power pin and the second serial data pin are arranged on the same side, or the second power pin and the second serial data pin are arranged on opposite sides, respectively.

[0016] In some embodiments, the first end of the connector comprises a plurality of second power pins and a plurality of second serial data pins. The plurality of second power pins are arranged on the same side or distributed on opposite sides, and the plurality of second serial data pins are arranged on the same side or distributed on opposite sides.

[0017] In some embodiments, the second serial data pin and the second power pin are arranged apart from each other by at least three pins along a direction parallel to the side on which the second serial data pin is arranged.

[0018] In some embodiments, the second end of the connector comprises a serial data binding pin connected with the second serial data pin, and the serial data binding pin is further configured to be connected with the serial communication driving module. The serial data binding pin comprises a plurality of sub-binding pins, and the ends of the plurality of sub-binding pins configured to be connected with the second serial data pin are in one body.

[0019] In some embodiments, the serial data binding pin comprises two sub-binding pins.

[0020] In a third aspect, a display device is provided. The display device comprises a serial communication driving module and a display screen. The serial communication driving module is configured to receive display data from an electronic device through the connector described above. The display screen is configured to display the display data received by the serial communication driving module.

[0021] In some embodiments, the display screen comprises a display area and a non-display area arranged at the periphery of the display area. The serial communication driving module is arranged in the non-display area, and the non-display area is further provided with a display data transmission line. The display device further comprises a second serial communication interface in communication connection with the second end of the connector. The display data transmission line is configured to connect the second serial communication interface and the serial communication driving module. The line width of the display data transmission line is greater than or equal to 65 um. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0023] Figure 1 Pin distribution diagram of serial communication interface of electronic device in some embodiments of the present application;

[0024] Figure 2 Pin distribution diagram of serial communication interface of electronic device in related art;

[0025] Figure 3 Working principle diagram of connector in some embodiments of the present application;

[0026] Figure 4 Characteristic curve of transient suppression diode in some embodiments of the present application;

[0027] Figure 5 Local structure diagram at serial data binding pin in some embodiments of the present application;

[0028] Figure 6 Block diagram of electronic device in some embodiments of the present application. DETAILED DESCRIPTION

[0029] The technical solutions of the present application will be described in detail below with reference to the drawings of the embodiments of the present application. Obviously, the following described embodiments are some of the embodiments of the present application rather than all the embodiments, and are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application. Based on the described embodiments of the present application, all other embodiments that can be obtained by those skilled in the art without creative effort belong to the protection scope of the present application.

[0030] Unless otherwise defined, all technical and scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application; the use of the terms "first", "second" and the like in the present application is intended to modify a referenced object and does not imply either a chronological or an ordinal relationship among the objects to which it is applied; and the use of the terms "prime", "secondary" and the like in the present application is intended to modify the name of a referenced object and does not imply either a chronological or an ordinal relationship among the objects to which it is applied. In the present application, "a plurality" means two or more unless otherwise specified.

[0031] MIPI (Mobile Industry Processor Interface) is a serial interface standard for mobile devices, used to connect processors and peripheral devices such as cameras, displays, etc. In mobile devices, ESD and EOS are important considerations, as they can negatively impact device performance and stability.

[0032] Mobile devices can be a complete module including a processor and peripheral devices, such as smartphones, computers, wearable devices, etc., that is, the peripheral devices are integrated on the mobile device. It can be understood that the peripheral device can also be a standalone device, not integrated on the mobile device.

[0033] During the reliability and electrical inspection of the mobile device, it was found that hot plugging would cause functional malfunctions such as black screen or screen tearing. Hot plugging refers to plugging the connector while the mobile device is powered on to achieve connection or disconnection of the processor and the peripheral device.

[0034] Through testing, it was found that hot plugging would cause black screen or screen tearing due to ESD damage to the MIPI connection line or EOS or ESD damage to the MIPI drive module. The test results show that the weaker the EOS capability, the more frequent the hot plugging malfunctions. The peripheral device can be configured with a MIPI drive module. The MIPI connection line can include a transmission line on the peripheral device for transmitting MIPI data.

[0035] After research, it was found that the black screen or screen tearing caused by hot plugging is related to the EOS capability of MIPI. The MIPI EOS capability refers to the surge voltage at which the test equipment configured with the MIPI interface appears NG (black screen).

[0036] Table 1 is the EOS capability of the MIPI drive module in three test devices

[0037]

[0038] In Table 1, for each type of test device, the MIPI EOS capability of 10 test devices of this type can be tested respectively. For example, 10V NG 9pcs means that 9 test devices 1 have black screen under 10V surge voltage, 15V NG 1pcs means that 1 test device 1 has black screen under 15V surge voltage; 20V NG 6pcs means that 6 test devices 2 have black screen under 20V surge voltage, 25V NG 3pcs means that 3 test devices 2 have black screen under 20V surge voltage, 35V NG 1pcs means that 1 test device 2 has black screen under 35V surge voltage; 25V NG 2pcs means that 2 test devices 3 have black screen under 25V surge voltage, 30V NG 7pcs means that 7 test devices 3 have black screen under 30V surge voltage, 40V NG 1pcs means that 1 test device 3 has black screen under 40V surge voltage.

[0039] It can be seen that the EOS capability of test device 1 is the weakest.

[0040] The hot plug test of the three test devices in Table 1 can reproduce no obvious defects, and the frequency is shown in Table 2, which can match the MIPI EOS capability.

[0041] Table 2 is the no obvious defect of the three test devices in Table 2

[0042]

[0043]

[0044] In Table 2, 30 test devices 1, 30 test devices 2 and 30 test devices 3 are tested for 20 times of hot plug test, and the test devices 1, test devices 2 and test devices 3 have no obvious defect. For example, the test device 1 with serial number #1 has no obvious defect in 20 times of hot plug test, and the test device 2 with serial number #3 has 4 times of NG in 20 times of hot plug test. Among them, NG means black screen, abnormal display means screen, and OK means good display.

[0045] In Table 2, the average number of times of no obvious defect of 30 test devices 1 in 20 times of hot plug test is 9.7 times, the average number of times of no obvious defect of 30 test devices 2 in 20 times of hot plug test is 13.6 times, and the average number of times of no obvious defect of 30 test devices 3 in 20 times of hot plug test is 17.5 times.

[0046] It can be seen that the frequency of no obvious defect of test device in hot plug test matches the EOS capability.

[0047] Figure 2The pin distribution diagram of the MIPI communication interface in the related art is shown. It is found through research and analysis that the MIPI serial data pins D0P, D0N, D1P, D1N, D2P, D2N, D3P, D3N, CLKP, and CLK N are opposite to the high-voltage power supply pins LEDA 18V (including LED_K1 and LED_K2), VSP 5.5V, and VSN-5.5V. When the mobile device is hot-plugged with power, there is a possibility that the MIPI serial data pins may come into contact with high voltage, which may cause damage to the MIPI drive module.

[0048] According to the above analysis, the three test devices in the above table are tested, and the power supply pins LEDA 18V, VSP 5.5V, and VSN-5.5V are directly contacted with the MIPI serial data pins.

[0049] Table 3 is the no-observable adverse effect level of direct contact between the power supply pins and the MIPI serial data pins

[0050]

[0051]

[0052] In Table 3, LEDA-MIPI indicates that the power supply pin LEDA is directly contacted with the MIPI data pin, VSP-MIPI indicates that the power supply pin VSP is directly contacted with the MIPI data pin, and VSN-MIPI indicates that the power supply pin VSN is directly contacted with the MIPI data pin. IOVCC-MIPI indicates that the power supply pin VSN is directly contacted with the MIPI data pin, which is a reference test example, indicating that the low-voltage power supply pin is directly contacted with the MIPI data pin.

[0053] It can be seen that the no-observable adverse effect level of direct contact between the high-voltage power supply pins and the MIPI data pins in Table 3 matches the no-observable adverse effect level caused by hot plugging in Table 2.

[0054] The solution of the MIPI serial communication interface ESD generally includes designing protective measures and using standard-compliant devices to protect the equipment from ESD damage. In the related art, a special ESD protection chip is added to the connection line of the MIPI serial communication interface, which can effectively absorb and suppress electrostatic discharge and prevent it from entering the sensitive circuit. These measures can help improve the ESD performance of the MIPI I serial communication interface and ensure the stability and reliability of the equipment.

[0055] But in the MIPI serial communication interface design, impedance matching is very important. By keeping the impedance matching between the signal line and the receiving end, signal reflection and crosstalk can be reduced, ensuring the stability and reliability of signal transmission. However, in the MIPI line, ESD protection chips are added, impedance matching is difficult to achieve, and the current mobile device MIPI D-PHY signal includes 4 lane data signals D0~D3 and 1 lane clock signal CLK, each lane is a bidirectional serial communication channel, a total of 10 signal lines. ESD protection chips need to be added to these 10 signal lines, which requires a large area, and in some mobile device module designs, the device area is very limited, and it is basically impossible to meet the design requirements.

[0056] Based on this, an electronic device is provided in the embodiments of the present application. By improving the serial communication interface, the serial data pin is not directly opposite the power pin, or the serial data pin is away from the high-voltage power pin on both sides of the side it is on. Therefore, even if hot plugging occurs, the serial data pin will not come into contact with high-voltage signals, reducing the risk of damage to the connection line or serial communication drive module of the serial communication interface caused by hot plugging. Therefore, the EOS and ESD protection capabilities of the serial communication interface of the electronic device can be improved without breaking the impedance continuity of the serial communication interface and without adding additional devices.

[0057] The electronic device in the embodiments of the present application can be, but is not limited to, a smart phone, a tablet computer, a wearable device, a desktop computer, and a laptop computer.

[0058] The technical solutions of the embodiments of the present application will be described in detail below with reference to the drawings and specific embodiments, taking the MIPI serial communication interface as an example. It can be understood that the technical solutions of the embodiments of the present application are also applicable to other serial communication interfaces.

[0059] According to some embodiments of the present application, an electronic device is provided, which includes a first MIPI serial communication interface. The first MIPI serial communication interface includes a first power pin and a first serial data pin. The first power pin is used to connect with a power supply. The first serial data pin is used to connect with a serial communication drive module, the first serial data pin is staggered with the first power pin, and the first serial data pin and the first power pin are spaced apart in a direction parallel to the side on which the first serial data pin is located.

[0060] Thus, by arranging the first serial connection pin and the first power pin to be spaced apart in a direction parallel to the side on which the first serial data pin is located, the first serial connection pin and the first power pin can be arranged not to be directly opposite each other, or the left and right sides of the first serial data pin can be arranged to be away from the first power pin. Thus, even if hot plugging occurs, the first serial data pin will not be in contact with a high-voltage signal, and the risk of damage to the connection line of the serial communication interface or the serial communication driving module caused by hot plugging can be reduced.

[0061] The first serial communication interface can include one or more first power pins, and the first serial communication interface can include one or more first serial data pins, depending on the peripheral device connected to the electronic device by the first serial communication interface.

[0062] In some embodiments, the electronic device can provide a working power signal to the peripheral device. In this case, the electronic device can transmit a power signal to the peripheral device connected to the electronic device through the first power pin. Referring to Figure 1 As shown, taking a liquid crystal display as an example, the first power pin can include a power pin LEDA 18V for providing a backlight power signal to the liquid crystal display, and the first power pin can further include a power pin VSP 5.5V and a power pin VSN-5.5V for providing a power signal required for pixel operation to the liquid crystal display. Taking an organic light-emitting diode display as an example, the first power pin can include a power pin VSP 5.5V and a power pin VSN-5.5V for providing a power signal required for pixel operation to the organic light-emitting diode display.

[0063] In some embodiments, the electronic device transmits data to the peripheral device through the first serial data pin, including that the peripheral device can send data to the electronic device through the first serial data pin, and the electronic device can also send data to the peripheral device through the first serial data pin. Taking a display as an example, the electronic device can send display data to the display through the first serial data pin, so that the display data can be displayed on the display. The peripheral device connected to the electronic device through the first serial communication interface is not limited to including a display, for example, it can also include a camera, in which case the electronic device can receive image data collected by the camera through the first serial data pin, and further, the electronic device can send processed image data to the display through the first serial data pin for display.

[0064] In some embodiments, the peripheral device can configure a serial communication driving module, i.e., a MIPI driving module.

[0065] The peripheral devices can be independent devices or integrated on the electronic device, and are in communication connection with the processor of the electronic device through the first serial communication interface. Taking a display screen and a camera as examples, the display screen and the camera can be independent devices separately arranged or integrated on the electronic device and in communication connection with the processor of the electronic device through the first serial communication interface for data transmission.

[0066] In Figure 1 In an illustrative example, the first serial data pins include MIPI_D0_P, MIPI_D0_N, MIPI_D1_P, MIPI_D1_N, MIPI_D2_P, MIPI_D2_N, MIPI_D3_P, MIPI_D3_N, MIPI_CLK_P, and MIPI_CLK_N.

[0067] In a direction parallel to the side edge where the first serial data pins are located, the first serial data pins and the first power pins are arranged at intervals, which means that each first serial data pin is not arranged directly opposite to any first power pin, and each first serial data pin is not arranged adjacent to any first power pin on both sides of the side edge where the first serial data pin is located.

[0068] In some embodiments, in a direction parallel to the side edge where the first serial data pins are located, the first serial data pins are spaced apart from the first power pins by at least three pins, so as to ensure that the MIPI connection line or the MIPI driving module is not in contact with a high-voltage signal even if hot plugging occurs, thereby improving the risk of damage to the MIPI connection line or the MIPI driving module caused by hot plugging.

[0069] In some embodiments, the first power pins and the first serial data pins can be located on the same side edge of the first serial communication interface, or the first power pins and the first serial data pins are located on opposite two side edges of the first serial communication interface. The positional relationship between the first power pins and the first serial data pins can be reasonably arranged according to actual needs, as long as each first serial data pin is not arranged directly opposite to any first power pin, and each first serial data pin is not arranged adjacent to any first power pin on both sides of the side edge where the first serial data pin is located.

[0070] In some embodiments, the first serial communication interface includes a plurality of first power pins and a plurality of first serial data pins. The plurality of first power pins are located on the same side edge or distributed on opposite two side edges, and the plurality of first serial data pins are located on the same side edge or distributed on opposite two side edges. The positional relationship between the first power pins and the first serial data pins can be reasonably arranged according to actual needs, as long as each first serial data pin is not arranged directly opposite to any first power pin, and each first serial data pin is not arranged adjacent to any first power pin on both sides of the side edge where the first serial data pin is located.

[0071] In an example embodiment, the plurality of first power pins can be distributed on opposite sides of the first serial communication interface, and the plurality of first serial data pins can be distributed on the opposite sides of the first serial communication interface, so that the plurality of first power pins can be arranged in close proximity, and the plurality of first serial data pins can be arranged in close proximity, and each first serial data pin and any first power pin can be spaced apart in a direction parallel to the side on which the first serial data pin is located.

[0072] In Figure 1 In the example shown, first power pin LED_K2 and VSN are distributed on one side, and first power pin LED_K1 and first power pin VSP are distributed on the opposite side. First serial data pins MIPI_D0_P, MIPI_D0_N, MIPI_D3_P, MIPI_D3_N are distributed on the one side, and first serial data pins MIPI_D1_P, MIPI_D1_N, MIPI_D2_P, MIPI_D2_N, MIPI_CLK_P, MIPI_CLK_N are distributed on the opposite side. And on the one side, first serial data pin MIPI_D0_P and first power pin VSN are spaced apart by 9 pins, which is the minimum spacing distance between a first serial data pin and a first power pin. On the opposite side, first serial data pin MIPI_D2_P and first power pin VSP are spaced apart by 8 pins, which is the minimum spacing distance between a first serial data pin and a first power pin. For the first serial data pins and the first power pins located on the opposite sides respectively, first serial data pin MIPI_D2_P and first power pin VSN are spaced apart by 7 pins, which is the minimum spacing distance between a first serial data pin and a first power pin. As can be seen, each first serial data pin and any first power pin have a sufficiently large spacing distance in a direction parallel to the side on which the first serial data pin is located, which can ensure that the MIPI connection line or the MIPI driving module will not contact the high-voltage signal even if hot plugging occurs.

[0073] It can be understood that the arrangement of the plurality of first power pins and the plurality of first serial data pins distributed on the opposite two sides is not limited to Figure 1 the example shown.

[0074] In an example embodiment, the plurality of first power pins can be distributed on the same side of the first serial communication interface, and the plurality of first serial data pins can be distributed on the same side of the first serial communication interface. In this case, the first power pins and the first serial data pins can be distributed on the same side or distributed on opposite sides respectively.

[0075] It can be understood that a plurality of first serial data pins can also be arranged on the same side of the first serial communication interface, and a plurality of first power pins can be arranged on the opposite two sides. Alternatively, a plurality of first power pins can be arranged on the same side of the first serial communication interface, and a plurality of first serial data pins can be arranged on the opposite two sides.

[0076] According to some embodiments of the present application, the first serial communication interface of the electronic device further comprises a first logic voltage pin IOVCC and a discharge capacitor Cap, the first logic voltage pin IOVCC being used to transmit a working voltage to the serial communication driving module; the discharge capacitor Cap is connected with the first logic voltage pin IOVCC, and the capacitance of the discharge capacitor is greater than or equal to 4.7uf. By increasing the discharge capacitor on the logic voltage, the voltage of the EOS peak can be reduced, thereby reducing the risk of the MIPI driving module being damaged.

[0077] The capacitance of the discharge capacitor Cap may, for example, but not limited to, be 4.7uf, 9.4uf or 10uf. One end of the discharge capacitor Cap is connected with the first logic voltage pin IOVCC, and the other end can be grounded.

[0078] For example, if the original capacitance of the discharge capacitor Cap on the first logic voltage pin IOVCC is 2.2uf, and it is increased to 4.7uf, the surge capacity of the MIPI can be increased by 2-4V; when the capacitance is increased to 2*4.7uf, the surge capacity of the MIPI can be increased by 4-6V. According to the heat Q=I^2*R*t, the position with the largest resistance on the wire generates the most heat, so the position with the narrowest wire is easy to burn out, and the longer the position with the narrowest wire is, the larger the local resistance is, and it is more likely to burn out. When the capacitance of the discharge capacitor Cap on the first logic voltage pin IOVCC is increased, the charge energy that the capacitor as an energy storage element can store is greater, and by using the capacitor as a buffer, the current size transmitted to the MIPI driving module and the MIPI connection wire can be reduced, thereby playing a protection role.

[0079] As shown in FIG. 1, the MIPI serial data pin releases the EOS energy through the discharge capacitor Cap, and the MIPI serial data pin can also release the EOS energy through the MIPI driving module. Figure 3 As shown in FIG. 1, the MIPI serial data pin releases the EOS energy through the discharge capacitor Cap, and the MIPI serial data pin can also release the EOS energy through the MIPI driving module.

[0080] Table 4 shows the increase of the MIPI EOS capacity by increasing the discharge capacitor on the first logic voltage pin

[0081]

[0082] Referring to Table 4, the capacitance of the discharge capacitor Cap of the test device 1 in the comparative scheme is 2.2uf, 8V OK 10V NG 10pcs indicating that 10 of the test devices 1 all show good at the surge voltage of 8V and all show no abnormality at the surge voltage of 10V. The capacitance of the discharge capacitor Cap of the test device 1 in the test scheme 1 is 4.7uf, 10 of the test devices 1 are tested, wherein 10V OK 12V NG 3pcs indicates that 3 of the test devices 1 all show good at the surge voltage of 10V and all show no abnormality at the surge voltage of 12V; 12V OK 14V NG 8pcs indicates that 8 of the test devices 1 all show good at the surge voltage of 12V and all show no abnormality at the surge voltage of 14V. The capacitance of the discharge capacitor Cap of the test device 1 in the test scheme 2 is 2*4.7uf, 10 of the test devices 1 are tested, wherein 14V OK 16V NG 5pcs indicates that 5 of the test devices 1 all show good at the surge voltage of 14V and all show no abnormality at the surge voltage of 16V; 12V OK 14V NG 5pcs indicates that 5 of the test devices 1 all show good at the surge voltage of 12V and all show no abnormality at the surge voltage of 14V.

[0083] It can be seen that the test scheme 1 improves the surge capacity by 2-4V by increasing the capacitance of the discharge capacitor Cap to 4.7uf, and the test scheme 2 improves the surge capacity by 4-6V by increasing the capacitance of the discharge capacitor Cap to 2*4.7uf.

[0084] According to some embodiments of the present application, the first serial communication interface of the electronic device further includes a transient voltage suppression diode TVS connected with the first logic voltage pin IOVCC, and the rated reverse off voltage of the transient voltage suppression diode TVS is less than or equal to 2.5V and greater than 1.8V.

[0085] As Figure 4As shown, the principle of transient suppression diode TVS tube on the first logic voltage pin IOVCC to improve the MIPI EOS / ESD capability: under the action of surge voltage, the voltage between the two poles of the TVS rises from the rated reverse off voltage Vrwm to the breakdown voltage VBR, and is broken down, and with the occurrence of breakdown current, the current flowing through the TVS will reach the peak pulse current IPP, and at the same time the voltage across it is clamped to below the predetermined maximum clamping voltage VC, thereby protecting the MIPI circuit associated with it. The smaller the clamping voltage, the stronger the protection capability. When the working voltage specification of the transient suppression diode TVS tube on the first logic voltage pin IOVCC is reduced from 3.3V to below 2.5V, the Vrwm / VBR / VC voltages are all smaller, and the TVS tube will start EOS protection at a lower voltage, thereby further protecting the MIPI circuit from damage from external EOS. At the same time, the rated reverse off voltage of the transient suppression diode is set to be greater than 1.8V, so as to ensure that the voltage required for the MIPI drive module to work is provided.

[0086] In some embodiments, by increasing the capacitance of the discharge capacitor Cap on the first logic voltage pin IOVCC to 4.7uf, and at the same time increasing the working voltage of the TVS tube on the first logic voltage pin IOVCC to 2.5V, the HBM EOS capability of the MIPI signal can be improved to 1kV or more, as shown in Table 5 below.

[0087] Referring to Table 5 below, the capacitance of the discharge capacitor Cap of the test device 1 in the comparative scheme is 2.2uf, the working voltage of the transient suppression diode TVS is 3.3V, HBM 2.5kV NG 1 / 10pcs means that 1 of the 10 test devices 1 has no obvious failure under the HBM surge voltage of 2.5kV; HBM 3kV NG 3 / 10pcs means that 3 of the 10 test devices 1 have no obvious failure under the HBM surge voltage of 3kV; HBM 3.5kV NG 4 / 10pcs means that 4 of the 10 test devices 1 have no obvious failure under the HBM surge voltage of 3.5kV. The capacitance of the discharge capacitor Cap of the test device 1 in the test scheme is 4.7uf, the working voltage of the transient suppression diode TVS is 2.5V, HBM 3kV OK 8 / 8pcs means that 8 of the test devices 1 have no obvious failure under the HBM surge voltage of 3kV. Among them, HBM is a human body discharge mode (Human Body Mode) test mode, which simulates the electrostatic discharge phenomenon produced by the human body when contacting electronic components to evaluate the tolerance of electronic components to electrostatic discharge. This test method is mainly used to evaluate the reliability and durability of electronic components under human body electrostatic discharge.

[0088] Table 5 is to increase the discharge capacitance on the first logic voltage pin and the working voltage of the TVS tube to improve the MIPI EOS capability

[0089]

[0090] It can be understood that by increasing the discharge capacitance Cap on the first logic voltage pin IOVCC to greater than or equal to 4.7uf, and at the same time increasing the working voltage of the TVS tube on the first logic voltage pin IOVCC to less than or equal to 2.5V and greater than 1.8V, the EOS capability of the MIPI signal can be improved.

[0091] As shown in Figure 3 According to some embodiments of the present application, a connector 200 is also provided, the first end of the connector 200 is used to connect with the first serial communication interface of the electronic device, and the second end is used to connect with the serial communication driving module (i.e. the MIPI driving module). The first end of the connector includes a second power pin and a second serial data pin. The second power pin is used to connect with the first power pin of the first serial communication interface, and the second serial data pin is used to connect with the first serial data pin of the first serial communication interface, so as to transmit the data of the electronic device to the serial communication driving module.

[0092] The second serial data pin is staggered with the second power pin, and the second serial connection pin and the second power pin are spaced apart in a direction parallel to the side on which the second serial data pin is located.

[0093] Therefore, by arranging the second serial connection pin and the second power pin to be spaced apart in a direction parallel to the side on which the second serial data pin is located, the second serial connection pin and the second power pin can be arranged not to be directly opposite each other, or the second serial data pin can be arranged to be away from the second power pin on both sides of the side on which it is located. Therefore, even if hot plugging occurs, the second serial data pin will not be in contact with high-voltage signals, thereby reducing the risk of damage to the connection line of the serial communication interface or the serial communication driving module caused by hot plugging.

[0094] The processor of the electronic device is in communication connection with the peripheral device through the first serial communication interface, and the first serial communication interface is in communication connection with the peripheral device through the connector.

[0095] The first end of the connector can include one or more second power pins, and the first end of the connector can include one or more second serial data pins, depending on the peripheral device connected to the second end of the connector.

[0096] Since the first end of the connector is connected with the first serial communication interface of the electronic device, the pin distribution of the first end of the connector is consistent with the pin distribution of the first serial communication interface.Figure 1 For example, the second serial data pins also include MIPI_D0_P, MIPI_D0_N, MIPI_D1_P, MIPI_D1_N, MIPI_D2_P, MIPI_D2_N, MIPI_D3_P, MIPI_D3_N, MIPI_CLK_P, and MIPI_CLK_N.

[0097] In some embodiments, the second serial data pins and the second power supply pins are spaced apart in a direction parallel to the side edge on which the second serial data pins are located. This means that each of the second serial data pins is not directly opposite any of the second power supply pins, and each of the second serial data pins is not adjacent to any of the second power supply pins on both sides of the side edge on which the second serial data pin is located.

[0098] In some embodiments, the second serial data pins and the second power supply pins are spaced apart by at least three pins in a direction parallel to the side edge on which the second serial data pins are located. This ensures that the MIPI connection line or the MIPI driving module does not come into contact with a high-voltage signal even if hot plugging occurs, thereby improving the risk of damage to the MIPI connection line or the MIPI driving module caused by hot plugging.

[0099] In some embodiments, the second power supply pins and the second serial data pins are located on the same side edge, or the second power supply pins and the second serial data pins are located on opposite side edges. The positional relationship between the second power supply pins and the second serial data pins can be reasonably arranged according to actual needs, as long as each of the second serial data pins is not directly opposite any of the second power supply pins, and each of the second serial data pins is not adjacent to any of the second power supply pins on both sides of the side edge on which the second serial data pin is located.

[0100] In some embodiments, the first end of the connector includes a plurality of second power supply pins and a plurality of second serial data pins. The plurality of second power supply pins are located on the same side edge or distributed on opposite side edges, and the plurality of second serial data pins are located on the same side edge or distributed on opposite side edges. The positional relationship between the second power supply pins and the second serial data pins can be reasonably arranged according to actual needs, as long as each of the second serial data pins is not directly opposite any of the second power supply pins, and each of the second serial data pins is not adjacent to any of the second power supply pins on both sides of the side edge on which the second serial data pin is located.

[0101] In one example embodiment, the plurality of second power pins can be distributed on opposite sides of the first end of the connector, and the plurality of first serial data pins can also be distributed on the opposite sides of the first end of the connector, so that the plurality of second power pins can be arranged in close proximity, and the plurality of second serial data pins can be arranged in close proximity, and each second serial data pin and any second power pin can be spaced apart along a direction parallel to the side on which the second serial data pin is located.

[0102] With continued reference to Figure 1 In the illustrated example, the second power pins LEDA and VSN are distributed on one side, and the second power pin LED_K1 and VSP are distributed on the opposite side. The second serial data pins MIPI_D0_P, MIPI_D0_N, MIPI_D3_P, MIPI_D3_N are distributed on the one side, and MIPI_D1_P, MIPI_D1_N, MIPI_D2_P, MIPI_D2_N, MIPI_CLK_P, MIPI_CLK_N are distributed on the opposite side. And on the one side, the second serial data pin MIPI_D0_P is spaced apart from the second power pin VSN by 9 pins, which is the minimum spacing distance between the second serial data pin and the second power pin. On the opposite side, the second serial data pin MIPI_D2_P is spaced apart from the second power pin VSP by 8 pins, which is the minimum spacing distance between the second serial data pin and the second power pin. For the second serial data pins and the second power pins located on the opposite sides respectively, the second serial data pin MIPI_D2_P is spaced apart from the second power pin VSN by 7 pins, which is the minimum spacing distance between the second serial data pin and the second power pin. It can be seen that each second serial data pin and any second power pin have a sufficiently large spacing distance along a direction parallel to the side on which the second serial data pin is located, so that the MIPI connection line or the MIPI driving module will not contact the high-voltage signal even if hot plugging occurs.

[0103] It can be understood that the arrangement of the plurality of second power pins and the plurality of second serial data pins distributed on the opposite sides is not limited to Figure 1 In the illustrated example.

[0104] In one example embodiment, the plurality of second power pins can be distributed on the same side of the first end of the connector, and the plurality of first serial data pins can also be distributed on the same side of the first end of the connector. In this case, the second power pins and the second serial data pins can be distributed on the same side or distributed on opposite sides respectively.

[0105] It can be understood that a plurality of second serial data pins can also be arranged on the same side of the first end of the connector, and a plurality of second power pins can be arranged on the opposite two sides. Alternatively, a plurality of second power pins can be arranged on the same side of the second serial communication interface, and a plurality of second serial data pins can be arranged on the opposite two sides.

[0106] Referring to Figure 3 As shown, according to some embodiments of the present application, the second end of the connector comprises a serial data binding pin (i.e., a MIPI binding pin) connected with the second serial data pin, and the serial data binding pin is also used to connect with a serial communication driving module (i.e., a MIPI driving module). As shown, Figure 5 As shown, the serial data binding pin 20 comprises a plurality of sub-binding pins 21, and one end of the plurality of sub-binding pins 21 for connecting with the second serial data pin is in an integral structure. The binding impedance of a single pin is large, which is a weak link. Changing the single-pin design of the serial data binding pin to a multi-pin design can improve the burnout defect of the serial data binding pin.

[0107] In some embodiments, the serial data binding pin 20 may, for example but not limited to, comprise two sub-binding pins 21.

[0108] According to some embodiments of the present application, a display device is provided, comprising a serial communication driving module and a display screen. The serial communication driving module is configured to receive display data from an electronic device through the connector in the above-mentioned embodiments; and the display screen is configured to display the display data received by the serial communication driving module.

[0109] Thus, the connector in the above-mentioned embodiments improves the pin distribution, so that the serial data pin and the power pin are not directly opposite, or the serial data pin is not adjacent to the power pin on both sides of the side where it is located, so that even if hot plugging occurs, the serial data pin will not be in contact with the high-voltage signal, and the risk of damage to the connection line of the serial communication interface or the serial communication driving module caused by hot plugging is improved. By using the above-mentioned connector, the problem of display device caused by hot plugging can be improved, and the display effect of the display device is ensured.

[0110] The display screen may, for example but not limited to, be a liquid crystal display screen, an organic light-emitting diode display screen, etc.

[0111] In some embodiments, the display screen comprises a display area and a non-display area located at the periphery of the display area, and the serial communication driving module is arranged in the non-display area. As shown, Figure 5 As shown, the non-display area is also provided with a display data transmission line 10.

[0112] The display device further comprises a second serial communication interface, in combination with Figure 3 andFigure 5 As shown, the display data transmission line is used to connect the second serial communication interface (corresponding to the MIPI binding pin position) and the serial communication driving module (i.e. the MIPI driving module). The second end of the connector 200 is connected to the second serial communication interface, and the display device receives display data from the electronic device through the connector 200, the display data is transmitted to the serial communication driving module via the display data transmission line 10, and the serial communication driving module drives the display screen to display the received display data.

[0113] In some embodiments of the present application, the line width of the display data transmission line 10 is greater than or equal to 65um.

[0114] When the ESD / EOS resistance of the serial communication driving module is strong, the damage caused by EOS may be present on the display data transmission line of the display screen. The EOS-caused damage is on the display data transmission line of the fan-shaped area, and the damage position is at the narrowest part 37um of the display data transmission line. The narrower the line, the more likely it is to burn out. In the embodiments of the present application, by setting the line width of the display data transmission line to be greater than or equal to 65um, the display data transmission line burnout is significantly improved.

[0115] According to some embodiments of the present application, an electronic device is also provided, which includes a processor and a display device in the above-mentioned embodiments, and the display device is in communication connection with the processor through the connector in the embodiments of the present application. The image data processed by the processor can be transmitted to the display device through the connector for display.

[0116] Referring to Figure 6 A block diagram of an electronic device 600 that can be used as the electronic device of the present disclosure will now be described, which is an example of a hardware device that can be applied to various aspects of the present disclosure. The electronic device can be different types of computer devices, such as a laptop computer, a desktop computer, a workstation, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as a personal digital processor, a cellular phone, a smart phone, a wearable device, and other similar computing devices. The components shown herein, their connections, and relationships, and their functions, are meant only as examples, and are not meant to limit implementations of the present disclosure described and / or claimed in this document.

[0117] Figure 6 A block diagram of an electronic device according to embodiments of the present disclosure is shown. As shown in Figure 6 The electronic device 600 can include at least one processor 601, a working memory 602, an I / O device 604, a display device 605, a storage device 606, and a communication interface 607 that can communicate with each other through a system bus 603.

[0118] The processor 601 can be a single processing unit or a plurality of processing units, all of which can include single or multiple computing units or multiple cores. The processor 601 can be implemented as one or more microprocessors, microcomputers, microcontrollers, digital signal processors, central processing units, state machines, logic circuitries, and / or any devices that manipulate signals based on operational instructions. The processor 601 can be configured to retrieve and execute computer-readable instructions stored in the working memory 602, the storage 606, or any other computer-readable medium, such as the program code of an operating system 602a, the program code of an application 602b, and the like.

[0119] The working memory 602 and the storage 606 are examples of computer- readable storage media for storing instructions that are executed by the processor 601 to implement the various functionalities described previously. The working memory 602 can include both volatile memory and nonvolatile memory (e.g., RAM, ROM, etc.). In addition, the storage 606 can include a hard disk drive, a solid state drive, removable media, including external and removable drives, memory cards, flash memory, floppy disks, optical disks (e.g., CD, DVD), storage arrays, network-attached storage, storage area networks, and the like. Both the working memory 602 and the storage 606 can be collectively referred to herein as the memory or the computer-readable storage medium, and can be non-transitory media capable of storing the computer-readable, processor-executable program instructions as computer program code that can be executed by the processor 601 as a particular machine configured to implement the operations and functionalities described in the examples herein.

[0120] The I / O devices 604 can include input devices and / or output devices, which can be any type of devices that input information to and / or output information from the electronic device 600, and can include, but are not limited to, a mouse, a keyboard, a touchscreen, a trackpad, a trackball, a joystick, a microphone, and / or a remote control. The output devices can be any type of devices that present information, and can include, but are not limited to, including video / audio output terminals, a vibrator, and / or a printer.

[0121] The communication interface 607 allows the electronic device 600 to exchange information / data with other devices over computer networks, such as the Internet, and / or various telecommunication networks, and can include, but is not limited to, a modem, a network card, an infrared communication device, a wireless communication transceiver and / or chipset, such as a Bluetooth™ device, an 802.11 device, a Wi-Fi device, a WiMax device, a cellular communication device, and / or the like.

[0122] In some embodiments, portions or all of the computer program can be loaded onto and / or installed on the electronic device 600 via the storage 606 and / or the communication interface 607.

[0123] Various implementations of the systems and techniques described above can be realized in digital electronic circuitry, integrated circuitry, specially designed application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include implementation in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.

[0124] Program code for carrying out methods of the present disclosure can be written in any combination of one or more programming languages. The program code can be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the program code, when executed by the processor or controller, produces a means for implementing the functions / acts specified in the flowcharts and / or block diagrams. The program code can be executed entirely on a machine, partially on a machine, partially on a machine and partially on a remote machine or entirely on a remote machine or server.

[0125] In the context of the present disclosure, a machine-readable medium can be a tangible medium that contains or stores a program for use by or in connection with an instruction execution system, apparatus, or device. The machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include but is not limited to an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of the machine-readable storage medium will include one or more lines of electrical connections, portable computer disks, hard disk drives, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash memory), optical fibers, portable compact disc read-only memories (CD-ROMs), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0126] To provide for interaction with a user, the systems and techniques described here can be implemented on a computer having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0127] The systems and techniques described here can be implemented in a computing system that includes a back end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front end component (e.g., a user computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0128] The computing system can include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.

[0129] It should be understood that the various forms of flow shown above can be re-ordered, added to, or deleted from without departing from the spirit of the technology. For example, the steps recited in the technology solution disclosure can be performed in parallel, sequentially, or in different orders, as long as the desired results of the technology solution are achieved, and the present disclosure is not limited herein.

[0130] While embodiments or examples of this disclosure have been described with reference to the figures, it will be understood that the methods, systems, and devices described above are merely exemplary embodiments or examples, and the scope of the application is not limited to these embodiments or examples. Various elements of the embodiments or examples can be omitted or substituted by equivalents thereof. Furthermore, the steps can be performed in a different order than described in the disclosure. Further, various elements of the embodiments or examples can be combined in various ways. It is important that as technology evolves, many of the elements described herein can be substituted by equivalents which serve the same function.

Claims

1. An electronic device, comprising: The first serial communication interface comprises: a first power pin for connecting with a power supply; a first serial data pin for connecting with a serial communication driving module, the first serial data pin is arranged apart from the first power pin, and the first serial data pin and the first power pin are arranged apart in a direction parallel to a side on which the first serial data pin is located.

2. The electronic device of claim 1, wherein, The first power pin and the first serial data pin are located on the same side, or the first power pin and the first serial data pin are located on opposite sides respectively.

3. The electronic device of claim 1, wherein, The first serial communication interface comprises a plurality of first power pins and a plurality of first serial data pins; The plurality of first power pins are located on the same side or distributed on opposite sides, and the plurality of first serial data pins are located on the same side or distributed on opposite sides.

4. The electronic device of claim 1, wherein, The first serial data pin and the first power pin are arranged apart by at least three pins in a direction parallel to a side on which the first serial data pin is located.

5. The electronic device of any of claims 1-4, wherein, The first serial communication interface further comprises: a first logic voltage pin for transmitting a working voltage to the serial communication driving module; a discharge capacitor, the first logic voltage pin is connected with the discharge capacitor, and a capacitance of the discharge capacitor is greater than or equal to 4.7uf.

6. The electronic device of claim 5, wherein, The capacitance of the discharge capacitor is 4.7uf, 9.4uf or 10uf.

7. The electronic device of any of claims 1-4, wherein, The first serial communication interface further comprises: a first logic voltage pin for transmitting a working voltage to the serial communication driving module; a transient voltage suppression diode, the first logic voltage pin is connected with the transient voltage suppression diode, and a rated reverse off voltage of the transient voltage suppression diode is less than or equal to 2.5V and greater than 1.8V.

8. A connector for a serial communication interface, characterized in that The first end of the connector is used for connecting with a first serial communication interface of an electronic device, and the second end is used for connecting with a serial communication driving module, the first end of the connector comprises: a second power pin for connecting with a first power pin of the first serial communication interface; a second serial data pin for connecting with a first serial data pin of the first serial communication interface to transmit data of the electronic device to the serial communication driving module; The second serial data pin is arranged apart from the second power pin, and the second serial data pin and the second power pin are arranged apart in a direction parallel to a side on which the second serial data pin is located.

9. The connector of claim 8, wherein, The second power pin and the second serial data pin are located on the same side, or the second power pin and the second serial data pin are located on opposite sides respectively.

10. The connector of claim 8, wherein The first end of the connector comprises a plurality of second power pins and a plurality of second serial data pins; The plurality of second power pins are located on the same side or distributed on opposite sides, and the plurality of second serial data pins are located on the same side or distributed on opposite sides.

11. The connector of claim 8, wherein, The second serial data pin and the second power pin are arranged apart by at least three pins in a direction parallel to a side on which the second serial data pin is located.

12. The connector of any one of claims 8-11, wherein, The second end of the connector comprises: a serial data binding pin connected with the second serial data pin, the serial data binding pin being further configured to be connected with the serial communication driving module, wherein the serial data binding pin comprises a plurality of sub-binding pins, and the ends of the plurality of sub-binding pins configured to be connected with the second serial data pin are in an integral structure.

13. The connector of claim 12, wherein, The serial data binding pin comprises two sub-binding pins.

14. A display device comprising: The display device comprises: a serial communication driving module configured to receive display data from the electronic device through the connector according to any one of claims 8-13; a display screen configured to display the display data received by the serial communication driving module.

15. The display device of claim 14, wherein, The display screen comprises a display area and a non-display area located at the periphery of the display area, the serial communication driving module is arranged in the non-display area, and the non-display area is further provided with a display data transmission line; The display device further comprises a second serial communication interface in communication connection with the second end of the connector, and the display data transmission line is configured to connect the second serial communication interface and the serial communication driving module; wherein the line width of the display data transmission line is greater than or equal to 65um.

Images