Bus bar and switching power supply

Abstract

The utility model provides a bus bar and a switching power supply. The bus bar comprises a surface mounting surface, pins and a heat dissipation surface which are integrally formed, the surface pasting surface is plate-shaped and is used for being welded with a printed circuit board; the pin is of a downward bending structure and is used for being welded with a printed circuit board; the heat dissipation surfaces are arranged on the two sides of the surface attaching surface in an edge-on mode According to the bus bar and the switching power supply provided by the embodiment of the utility model, the surface-mounted surface and the printed circuit board can be fixed together for heat dissipation, and the overcurrent capability of the surface of the printed circuit board can also be improved; the pins can increase the stability of the bus bar and can also increase the overcurrent capability of current from the printed circuit board; the heat dissipation surface can dissipate heat for itself and can also indirectly dissipate heat for the printed circuit board. The bus bar is simple in structure, low in cost, easy to dissipate heat and easy to produce and process.

Description

Technical Field

[0001] This utility model relates to the field of switching power supply technology, and more specifically, to a busbar and a switching power supply. Background Technology

[0002] Busbars are generally used in conjunction with PCBs (Printed Circuit Boards) to primarily address the issue of insufficient current carrying capacity on PCBs. If the PCB has many layers, the cost increases significantly, rendering it impractical. Without busbars, the copper current density on the PCB is high, resulting in substantial heat loss per unit area. Once the PCB temperature rises above the TG (glass transition temperature) point, the PCB will fail.

[0003] Currently, busbars are either attached to or inserted into the PCB. The former has the disadvantages of being unable to be fixed and having inconvenient heat dissipation, while the latter has the disadvantage of being crooked and difficult to process during wave soldering. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model embodiment is to provide a busbar.

[0005] In a first aspect, this utility model provides a busbar, comprising: an integrally formed surface, pins, and a heat dissipation surface; the surface is plate-shaped and used for soldering to a printed circuit board; the pins are downwardly bent and used for soldering to the printed circuit board; the heat dissipation surface is disposed on both sides of the surface.

[0006] Optionally, the surface mount is soldered onto the printed circuit board.

[0007] Optionally, the pins are wave soldering pins.

[0008] Optionally, the number of pins can be multiple.

[0009] Optionally, the surface mount includes: a terminal block with outputs; the terminal block with outputs is used as an external interface.

[0010] Optionally, the surface panel includes a fixing terminal; the fixing terminal is used to connect other components.

[0011] Optionally, the surface mount includes: through holes; the through holes are used to place devices on the printed circuit board.

[0012] Alternatively, the heat dissipation surface may be plate-shaped, toothed, or folded.

[0013] Alternatively, the busbar can be made of pure copper or brass.

[0014] Secondly, this utility model embodiment provides a switching power supply, including: a busbar and a printed circuit board adapted to the busbar.

[0015] In the above-described embodiment of this utility model, the surface-mount surface can be fixed together with the printed circuit board for heat dissipation and also increases the current carrying capacity of the printed circuit board surface; the pins can increase the stability of the busbar and also increase the current carrying capacity from the printed circuit board; the heat dissipation surface can dissipate heat for itself and indirectly dissipate heat for the printed circuit board. This busbar has a simple structure, low cost, easy heat dissipation, and is easy to manufacture.

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of a busbar structure provided in an embodiment of the present invention is shown;

[0019] Figure 2 This invention provides a schematic diagram of a busbar structure with different surface-mount surfaces according to an embodiment of the present invention.

[0020] Figure 3 This invention provides a schematic diagram of a busbar structure with different heat dissipation surfaces according to an embodiment of the present invention.

[0021] Figure 4 An exploded view of the structure of a switching power supply provided in an embodiment of this utility model is shown.

[0022] icon:

[0023] 1-Surface mount, 2-Pin, 3-Heat dissipation surface, 11-With output terminal, 12-Fixed terminal, 13-Through hole, 10-Busbar, 20-Printed circuit board. Detailed Implementation

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] The inventors discovered that as busbars become increasingly power-density, output voltage decreases while output current increases. It has become extremely difficult, if not impossible, to handle hundreds of amps of current using only a limited PCB (Printed Circuit Board), yet market demand is urgent. Therefore, to address this challenge, this invention provides a busbar that is low-cost, highly reliable, and multifunctional.

[0028] like Figure 1 As shown, the busbar includes: a one-piece molded surface mount 1, pins 2, and a heat dissipation surface 3. That is, the surface mount 1, pins 2, and heat dissipation surface 3 of the busbar are completely connected together, not separate components. The surface mount 1 is plate-shaped and is used to solder to the printed circuit board to form a single integrated structure. The pins 2 have a downwardly bent structure and are used to solder to the printed circuit board soldered to the lower surface of the busbar. The heat dissipation surfaces 3 are positioned on both sides of the surface mount 1; as the name suggests, the main purpose of the heat dissipation surfaces 3 is for heat dissipation.

[0029] The busbar provided in this embodiment of the invention includes a surface-mount surface 1 that can be fixed to the printed circuit board for heat dissipation and also increases the current carrying capacity of the printed circuit board surface; pins 2 can increase the stability of the busbar and also increase the current carrying capacity from the printed circuit board; the heat dissipation surface 3 can dissipate heat for itself and indirectly dissipate heat for the printed circuit board. This busbar has a simple structure, low cost, easy heat dissipation, and is easy to manufacture.

[0030] Optionally, the surface mount 1 is soldered onto the printed circuit board. In other words, the busbar can be soldered to the printed circuit board by surface mounting, which can solve the disadvantages of existing busbars that are directly attached to the printed circuit board, such as difficulty in fixing and inconvenience in heat dissipation.

[0031] Optionally, pin 2 is a wave soldering pin. That is, the busbar is soldered to the printed circuit board by wave soldering. Specifically, the busbar can be first attached to the surface of the printed circuit board and then reflow soldered and wave soldered together with the printed circuit board. This allows current to pass through the busbar and also provides heat dissipation for the printed circuit board.

[0032] Optionally, such as Figure 1 As shown, there are multiple pins 2 for better fixation and current flow.

[0033] Optionally, such as Figure 2 As shown, the surface mount 1 includes: an output terminal 11; the output terminal 11 is used as an external interface. Optionally, as... Figure 2 As shown, the surface mount 1 includes: a fixing terminal 12; the fixing terminal 12 is used to connect other components. Optionally, as... Figure 2 As shown, the surface mount surface 1 includes through holes 13. The shape of the through holes 13 can be regular or irregular, and the number of through holes 13 can be adjusted according to actual needs to accommodate components on the printed circuit board, thereby maximizing space utilization. It should be noted that the output terminal 11 and the fixed terminal 12 are located in... Figure 2 All are shown in the same shape for illustrative purposes only; the through hole 13 can be directly set on the surface 1, or directly set on the output terminal 11 or the fixed terminal 12.

[0034] Optionally, such as Figure 1 As shown, the heat dissipation surface 3 is plate-shaped, or it can also be toothed (not directly shown in the figure) or folded (see [reference]). Figure 3 (as shown), in order to better dissipate heat from the busbars and printed circuit boards.

[0035] Optionally, the busbar material can be pure copper or brass. Specifically, the conductive substrate of the busbar is usually a metal with excellent conductivity, such as pure copper or brass. Pure copper has high electrical and thermal conductivity and good corrosion resistance, but it is relatively soft and has poor straightness after processing, making it suitable for shorter or vertically placed busbars. For some longer busbars placed horizontally, pure copper is not suitable due to its large deformation. Brass, except for slightly lower conductivity than pure copper, has similar properties, but its strength is much higher. This embodiment of the invention allows for the selection of different materials to manufacture the busbar according to actual needs.

[0036] Furthermore, this embodiment of the invention also provides a switching power supply, such as... Figure 4 As shown, the switching power supply includes at least: a busbar 10 and a printed circuit board 20 adapted to the busbar 10.

[0037] The specific structure of busbar 10 can be designed according to the corresponding drawings based on the printed circuit board 20 and space requirements, and the processing plant will manufacture the required busbar 10 according to the drawings. For example... Figure 4 As shown, the busbar 10 needs to be used in conjunction with the printed circuit board 20 and is processed into a finished product (or semi-finished product) through manufacturing processes such as reflow soldering and wave soldering. For example, holes for accommodating the pins 2 of the busbar 10 are pre-drilled on the surface of the printed circuit board 20 to fit the busbar 10, ultimately forming a switching power supply with the busbar 10.

[0038] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A busbar, characterized in that The utility model relates to a kind of busbar, including: Integrated surface (1), pin (2) and heat dissipation surface (3) are pasted;The surface (1) is plate-shaped, for welding with printed circuit board;The pin (2) is downward bending structure, for welding with the printed circuit board;The heat dissipation surface (3) is set up on the both sides of the surface (1) side.

2. The busbar of claim 1, wherein The surface (1) is welded on the printed circuit board.

3. The busbar of claim 1, wherein The pin (2) is wave-soldering pin.

4. The busbar of claim 1, wherein The number of the pin (2) is multiple.

5. The busbar of claim 1, wherein The surface (1) includes: band output terminal (11);The band output terminal (11) is used as external interface.

6. The busbar of claim 1, wherein The surface (1) includes: fixed terminal (12);The fixed terminal (12) is used to connect other components.

7. The busbar of claim 1, wherein The surface (1) includes: through-hole (13);The through-hole (13) is used to place device on printed circuit board.

8. The busbar of claim 1, wherein The heat dissipation surface (3) is plate-shaped, tooth-shaped or folded.

9. The busbar of claim 1, wherein The material of the busbar is pure copper plate or brass plate.

10. A switching power supply, characterized by Including: Busbar (10) and printed circuit board (20) matched with the busbar (10).

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