Crystal oscillator packaging structure

Abstract

The utility model discloses a crystal oscillator packaging structure, comprising a packaging seat, the packaging seat comprises a heat radiation pedestal, an upper connecting seat and a lower connecting seat, the heat radiation pedestal, the upper connecting seat and the lower connecting seat are connected through an adhesive layer, the upper connecting seat and the lower connecting seat are respectively provided with a crystal wafer and a control chip, and the crystal wafer and the control chip are connected with the packaging seat. The crystal wafer and the control chip are connected through a connecting wire, an upper packaging body is arranged on the upper connecting seat, an upper shielding cover is arranged in the upper packaging body, a lower packaging body is arranged on the lower connecting seat, and a lower shielding cover is arranged in the lower packaging body. According to the utility model, the structural design is scientific and reasonable, the upper packaging body, the lower packaging body and the packaging seat are matched with each other, heat generated when the crystal wafer and the control chip work is released, the heat dissipation efficiency is improved, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to crystal oscillator equipment technical field, concretely is a kind of crystal oscillator packaging structure. BACKGROUND

[0002] Crystal oscillator is generally called crystal oscillator, it is a device, with the quartz crystal that electric loss is very small is precisely cut and grinds and is plated electrode and is welded lead to make, also contain control chip, it is the most important component in clock circuit, it can use crystal oscillator in the mobile phone or electronic watch with time display function, the crystal oscillator here can also be called clock crystal oscillator, it is abbreviated as clock oscillator. The existing clock oscillator structure needs to seal the crystal chip into the crystal chamber of ceramic base, one end of the crystal chip is bonded to the electrode by conductive adhesive, and is kept horizontal, then a cover is provided above the crystal chamber, to ensure the sealing of the crystal chamber, the electrode needs to have the best contact and the highest conductivity as possible, because the current is transmitted to the quartz crystal (crystal chip) through the electrode, and the crystal chip can provide the required frequency signal. During the use of crystal oscillator, when there are many high-frequency devices around the crystal oscillator, such as resistors, capacitors and other high-frequency devices, it is easy to cause external interference to the signal of the crystal oscillator, and the crystal oscillator mechanism is easy to generate heat during operation, thereby affecting the normal use of the crystal oscillator. Therefore, we propose a crystal oscillator packaging structure. SUMMARY

[0003] The utility model aims at providing a kind of crystal oscillator packaging structure, to solve the problems raised in the above background.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of crystal oscillator packaging structure, including packaging seat, the packaging seat includes heat dissipation base, upper connecting seat and lower connecting seat, the heat dissipation base, upper connecting seat and lower connecting seat are connected by adhesive layer, the upper connecting seat and lower connecting seat are respectively installed with crystal chip and control chip, the crystal chip and control chip are connected by connecting wire, the upper connecting seat is provided with upper packaging body, the upper packaging body is provided with upper shielding cover, the lower connecting seat is provided with lower packaging body, and the lower packaging body is provided with lower shielding cover.

[0005] In the above scheme, the heat dissipation base is provided with a support column, the upper connecting seat and the lower connecting seat are provided with connecting holes, and the support column is correspondingly clamped in the connecting holes.

[0006] In the above scheme, the heat dissipation base, the upper connecting seat and the lower connecting seat are metal plate pieces, and the end portions are provided with notched grooves.

[0007] In the above scheme, the heat dissipation base, the upper connecting seat and the lower connecting seat are provided with guide holes, and the connecting wire passes through the guide holes.

[0008] In the above scheme, the upper shielding cover is a metal cover, and the crystal wafer is wrapped by the upper shielding cover.

[0009] In the above scheme, the lower shielding cover is a metal cover, and the control chip is wrapped by the lower shielding cover.

[0010] In the above scheme, a strip-shaped slot is formed on the upper shielding cover and the lower shielding cover.

[0011] Compared with the prior art, the crystal oscillator packaging structure has the advantages that the structure design is simple and reasonable, and has strong practicability; the packaging seat, the upper packaging body and the lower packaging body are arranged in cooperation to form the frame of the integral mounting mechanism; when heat is generated during the operation of the oscillator, the heat can be released in time through the heat dissipation base; the notch slot is arranged to improve the heat dissipation efficiency; the upper packaging body, the lower packaging body and the packaging seat are matched with each other to release the heat generated by the crystal wafer and the control chip during operation, improve the heat dissipation efficiency, and prolong the service life.

[0012] The upper shielding cover and the lower shielding cover made of metal are arranged as the protection mechanism of the electronic components, which can effectively reduce the outward radiation of the electromagnetic signals in the crystal oscillator, avoid the external interference of the high-frequency devices on the crystal oscillator, ensure the normal use of the crystal oscillator, and further improve the working quality of the device. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 The figure is a structural schematic view of the utility model.

[0014] Fig. 2 The figure is a structural schematic view of the heat dissipation base of the utility model.

[0015] Fig. 3 The figure is a structural schematic view of the upper shielding cover of the utility model.

[0016] In the figure, 1 is a packaging seat, 101 is a heat dissipation base, 102 is an upper connecting seat, 103 is a lower connecting seat, 104 is a supporting column, 105 is a connecting hole, 106 is a notch slot, 107 is a guide hole, 2 is a crystal wafer, 3 is a control chip, 4 is a connecting wire, 5 is an upper packaging body, 6 is an upper shielding cover, 7 is a lower packaging body, 8 is a lower shielding cover, and 9 is a strip-shaped slot. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0018] Please refer to Figs. 1-3 The utility model provides a technical scheme: a crystal oscillator packaging structure, including the packing seat 1, the packing seat 1 includes the heat dissipation base 101, upper connecting seat 102 and lower connecting seat 103, the heat dissipation base 101, upper connecting seat 102 and lower connecting seat 103 are connected through the adhesive layer, the upper connecting seat 102 and lower connecting seat 103 are installed with crystal piece 2 and control chip 3 respectively, the crystal piece 2 and control chip 3 are connected through connecting wire 4, the upper connecting seat 102 is provided with upper package 5, the upper package 5 is provided with upper shield 6 in, the lower connecting seat 103 is provided with lower package 7, the lower package 7 is provided with lower shield 8 in.

[0019] In the above scheme, the heat dissipation base 101 is provided with a support column 104, the upper connecting seat 102 and the lower connecting seat 103 are provided with connecting holes 105, and the support column 104 is clamped in the connecting holes 105. The support column 104 is used as a connecting mechanism, which further improves the connection strength and deformation resistance between the device plates.

[0020] In the above scheme, the heat dissipation base 101, the upper connecting seat 102 and the lower connecting seat 103 are metal plates, and the ends thereof are provided with notched grooves 106. The packaging seat 1, the upper package 5 and the lower package 7 are used in cooperation to form a frame of the overall mounting mechanism. When the oscillator generates heat during operation, the heat dissipation base 101 can release the heat in time. At the same time, the notched grooves 106 can improve the heat dissipation efficiency. The upper package 5, the lower package 7 and the packaging seat 1 cooperate with each other to guide and release the heat generated by the crystal piece 2 and the control chip 3 during operation, improve the heat dissipation efficiency, and prolong the service life.

[0021] In the above scheme, the heat dissipation base 101, the upper connecting seat 102 and the lower connecting seat 103 are provided with guide holes 107, and the connecting wire 4 passes through the guide holes 107.

[0022] In the above scheme, the upper shield 6 is a metal shield, and the crystal piece 2 is wrapped by the upper shield 6.

[0023] In the above scheme, the lower shield 8 is a metal shield, and the control chip 3 is wrapped by the lower shield 8. The upper shield 6 and the lower shield 8 made of metal are used as the protection mechanism of the electronic components. On the one hand, the electromagnetic signals inside the crystal oscillator are effectively reduced from radiating outward. On the other hand, the high-frequency devices in the surrounding avoid external interference to the crystal oscillator signal, ensure the normal use of the crystal oscillator, and further improve the working quality of the device.

[0024] In the above scheme, the upper shielding cover 6 and the lower shielding cover 8 are both provided with a strip-shaped slot 9.

[0025] Working principle:

[0026] The crystal oscillator packaging structure is provided with the packaging seat 1, the upper packaging body 5 and the lower packaging body 7 which are matched and used to form the frame of the integral mounting mechanism, and the heat generated during the operation of the oscillator can be released in time through the heat dissipation base 101, and the heat dissipation efficiency can be improved by the notch slot 106 during heat dissipation, the upper packaging body 5, the lower packaging body 7 and the packaging seat 1 are matched with each other to guide and release the heat generated by the crystal piece 2 and the control chip 3 during operation, the heat dissipation efficiency is improved, and the service life is prolonged, the upper shielding cover 6 and the lower shielding cover 8 made of metal are used as the protection mechanism of the electronic components, on the one hand, the electromagnetic signals inside the crystal oscillator can be effectively reduced to radiate outward, and on the other hand, the external interference of the surrounding high-frequency devices on the crystal oscillator can be avoided, the normal use of the crystal oscillator is ensured, and the working quality of the device is further improved.

[0027] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A crystal oscillator package structure comprising a package base (1), characterized in that: The packaging seat (1) comprises a heat dissipation base (101), an upper connecting seat (102) and a lower connecting seat (103), the heat dissipation base (101), the upper connecting seat (102) and the lower connecting seat (103) are connected through a glue layer, the upper connecting seat (102) and the lower connecting seat (103) are respectively provided with a crystal piece (2) and a control chip (3), the crystal piece (2) and the control chip (3) are connected through a connecting wire (4), the upper connecting seat (102) is provided with an upper packaging body (5), the upper packaging body (5) is provided with an upper shielding cover (6), the lower connecting seat (103) is provided with a lower packaging body (7), and the lower packaging body (7) is provided with a lower shielding cover (8).

2. The crystal oscillator package structure of claim 1, wherein: The heat dissipation base (101) is provided with a supporting column (104), the upper connecting seat (102) and the lower connecting seat (103) are provided with connecting holes (105), and the supporting column (104) is clamped in the connecting holes (105) correspondingly.

3. The crystal oscillator package structure of claim 1, wherein: The heat dissipation base (101), the upper connecting seat (102) and the lower connecting seat (103) are metal plate parts, and the end portions of the heat dissipation base (101), the upper connecting seat (102) and the lower connecting seat (103) are provided with notched grooves (106).

4. The crystal oscillator package structure of claim 1, wherein: The heat dissipation base (101), the upper connecting seat (102) and the lower connecting seat (103) are provided with guiding holes (107) correspondingly, and the connecting wire (4) passes through the guiding holes (107).

5. The crystal oscillator package structure of claim 1, wherein: The upper shielding cover (6) is a metal cover, and the upper shielding cover (6) wraps the crystal piece (2).

6. The crystal oscillator package structure of claim 1, wherein: The lower shielding cover (8) is a metal cover, and the lower shielding cover (8) wraps the control chip (3).

7. The crystal oscillator package structure of claim 1, wherein: The upper shielding cover (6) and the lower shielding cover (8) are provided with strip-shaped grooves (9).

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