PCB pressure welding grounding structure

Abstract

The utility model provides a PCB pressure welding grounding structure, which comprises a framework part, a PCB and a magnetic core, and is characterized in that the framework part is used for bearing a component and is provided with a through hole through which the magnetic core can pass; the PCB is connected to one end of the framework part and is provided with an opening through which the magnetic core can pass; the magnetic core penetrates through the through hole in the framework part and the hole in the PCB, and one end of the magnetic core is welded to the PCB. According to the PCB pressure welding ground structure, the magnetic core and the PCB are directly subjected to pressure welding, compared with the prior art that a ground wire is welded to the magnetic core, the PCB pressure welding ground structure solves the problems of ground wire pseudo soldering, wire body aging, complex installation and high cost, and has the advantages of being stable in structure, firm in welding, simple in installation and low in cost.

Description

Technical Field

[0001] This utility model relates to the field of PCB welding technology, and in particular to a PCB pressure welding ground structure. Background Technology

[0002] In the manufacturing of electronic equipment, especially in applications involving sensitive components such as sensors and integrated circuits, electromagnetic shielding and grounding are key technologies to ensure stable operation and optimal performance. Traditional grounding methods typically involve soldering a ground wire to a magnetic core or other grounded components to achieve timely charge conduction and electromagnetic field shielding. However, this traditional soldering method has many shortcomings and limitations.

[0003] First, the ground wire is prone to poor soldering when soldered to the magnetic core. Factors such as improper operation, material incompatibility, or unstable soldering quality during the soldering process can lead to an insufficiently secure connection between the ground wire and the magnetic core, thus affecting the reliability of grounding and the effectiveness of electromagnetic shielding.

[0004] Secondly, wire aging is also a problem that cannot be ignored. Over time and with changes in the usage environment, the ground wire soldered to the magnetic core may gradually age due to oxidation, corrosion, or mechanical wear, thereby reducing its conductivity and mechanical strength, and further affecting the stability of grounding and the effectiveness of electromagnetic shielding. Utility Model Content

[0005] The main purpose of this utility model is to propose a PCB bonding ground structure that overcomes the above-mentioned technical problems.

[0006] To achieve the above objectives, the present invention proposes the following technical solution:

[0007] A PCB bonding structure includes: a frame portion, a PCB board, and a magnetic core. The frame portion is used to carry components and has through holes through which the magnetic core can pass. The PCB board is connected to one end of the frame portion and has openings through which the magnetic core can pass. The magnetic core passes through the through holes on the frame portion and the openings on the PCB board, with one end soldered to the PCB board.

[0008] Furthermore, a through hole is provided in the middle of the skeleton part.

[0009] Furthermore, the opening is located in the middle of the PCB board, and after installation, it corresponds to the position of the through hole in the skeleton part.

[0010] Furthermore, the magnetic core includes a first part and a second part, the first part being perpendicularly connected to the second part, the first part having through holes and openings, and the second part being soldered to the PCB board.

[0011] Furthermore, the PCB board is generally rounded rectangular, and a connecting device is provided on it to connect the skeleton part and the PCB board.

[0012] Furthermore, it also includes a second magnetic core, which is positioned entirely above the magnetic core.

[0013] Furthermore, the lower part of the second magnetic core passes through a through hole, and the upper part of the second magnetic core is soldered to the PCB board.

[0014] Furthermore, the skeleton is made of a non-magnetic material.

[0015] This invention provides a PCB bonding structure that directly bonds the magnetic core to the PCB board. Compared to existing technologies that bond the ground wire to the magnetic core, this invention solves the problems of poor ground wire bonding, wire aging, complex installation, and high cost. It has the advantages of stable structure, strong welding, simple installation, and low cost. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of a PCB bonding ground structure according to the present invention.

[0018] Figure 2 This is a side view of a PCB bonding ground structure according to the present invention.

[0019] Figure 3 This is a schematic diagram of the front structure of the skeleton.

[0020] Figure 4 This is a schematic diagram of the magnetic core.

[0021] The above figures include the following reference numerals:

[0022] 1. Skeleton part; 2. PCB board; 3. Magnetic core; 4. Connecting device; 5. Second magnetic core; 11. Through hole; 21. Opening; 31. First part; 32. Second part. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0024] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0025] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0026] The following is for reference. Figures 1 to 4 The present invention will be further described below:

[0027] A PCB bonding structure includes: a frame portion 1, a PCB board 2, and a magnetic core 3. The frame portion 1 is used to support components and has through holes 11 through which the magnetic core 3 can pass. The PCB board 2 is connected to one end of the frame portion 1 and has openings 21 through which the magnetic core 3 can pass. The magnetic core 3 passes through the through holes 11 on the frame portion 1 and the openings 21 on the PCB board 2, and one end is soldered to the PCB board 2.

[0028] After the magnetic core 3 is soldered to the grounding part on the PCB board 2, the interference charge induced on the magnetic core 3 can be conducted away in time through the grounding structure to form an equipotential state, thus avoiding the accumulation of interference charge on the magnetic core and playing the role of electromagnetic shielding, reducing the interference of external electromagnetic fields on the sensor.

[0029] The through hole 11 is disposed in the middle of the skeleton part 1.

[0030] The opening 21 is located in the middle of the PCB board 2, and after installation, it corresponds to the position of the through hole 11 in the skeleton part 1.

[0031] The magnetic core 3 includes a first part 31 and a second part 32. The first part 31 and the second part 32 are vertically connected. The first part 31 passes through the through hole 11 and the opening 21. The second part 32 is soldered to the PCB board 2.

[0032] In one embodiment, the PCB bonding structure further includes a second magnetic core 5, which is disposed above the magnetic core 3, with its lower part passing through the through hole 11, and its upper part soldered to the PCB board 2.

[0033] In a preferred embodiment, the magnetic core 3 and the second magnetic core 5 are made of high-performance magnetic materials, such as neodymium iron boron and ferrite. The shape, size, and magnetic properties of the magnetic cores are determined according to specific application requirements. The bottom of the magnetic core is designed as a planar structure that matches the PCB board to ensure stability and reliability during soldering.

[0034] The PCB board 2 is a rounded rectangle, and a connecting device 4 is provided on it to connect the skeleton part 1 and the PCB board 2.

[0035] In this embodiment, the connecting device 4 uses bolts to connect the skeleton part 1 to the PCB board 2.

[0036] In a preferred embodiment, the PCB board 2 uses a high-quality copper foil substrate, and the size, number of layers, and layout of the PCB board 2 are determined according to the circuit design requirements. The PCB board 2 is designed with grooves or bosses that match the bottom plane structure of the second part 32 of the magnetic core 3, as well as grounding lines of sufficient width to improve grounding performance.

[0037] The skeleton part 1 is made of non-magnetic material.

[0038] During the manufacturing process, the PCB board 2 can be pre-treated, such as by cleaning, drying and surface treatment, such as tin plating or nickel plating, to improve its corrosion resistance and conductivity.

[0039] After manufacturing, the PCB bonding and grounding structure undergoes performance testing: a resistance tester is used to measure the resistance value of the grounding line to ensure it is within the specified range. Simultaneously, an electromagnetic shielding tester is used to test the electromagnetic shielding effect of the bonded product at a specific frequency to ensure it meets design requirements.

[0040] Applying the PCB bonding ground structure of this application to the grounding of sensitive components such as sensors and integrated circuits can effectively improve the reliability of grounding and the effect of electromagnetic shielding, reduce the interference of external electromagnetic fields on sensors, and improve the stability and performance of the equipment.

[0041] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0042] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A PCB press welded ground structure, characterized by, The application relates to a magnetic core structure comprising a skeleton part (1) for bearing components, a PCB board (2) and a magnetic core (3), wherein the skeleton part (1) is provided with a through hole (11) for the magnetic core (3) to pass through; the PCB board (2) is connected to one end of the skeleton part (1) and is provided with an opening (21) for the magnetic core (3) to pass through; and the magnetic core (3) passes through the through hole (11) of the skeleton part (1) and the opening (21) of the PCB board (2), and one end is welded to the PCB board (2). The through hole (11) is arranged at the middle position of the skeleton part (1).

2. The PCB press welded ground structure according to claim 1, wherein, The opening (21) is arranged at the middle position of the PCB board (2) and corresponds to the position of the through hole (11) of the skeleton part (1) after installation.

3. The PCB press welded ground structure according to claim 1, wherein, The magnetic core (3) comprises a first part (31) and a second part (32), the first part (31) is vertically connected to the second part (32), the first part (31) passes through the through hole (11) and the opening (21), and the second part (32) is welded to the PCB board (2).

4. The PCB press welded ground structure of claim 1, wherein, The PCB board (2) is a whole rounded rectangle and is provided with a connecting device (4) for connecting the skeleton part (1) and the PCB board (2).

5. The PCB press welded ground structure of claim 1, wherein, The application further comprises a second magnetic core (5), which is arranged above the magnetic core (3).

6. The PCB press welded ground structure of claim 1, wherein, The lower part of the second magnetic core (5) passes through the through hole (11), and the upper part of the second magnetic core (5) is welded to the PCB board (2).

7. The PCB press welded ground structure according to claim 6, wherein, The material of the skeleton part (1) is non-magnetic material.

8. The PCB press welded ground structure of claim 1, wherein, ​

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