Chemical mechanical grinding fluid conveying device and grinding equipment
By setting up multiple delivery pipelines and flow control modules in the chemical mechanical grinding equipment, the flow rate of the grinding fluid in each delivery pipeline is controlled separately, forming annular grinding fluid bands of different concentrations. This solves the problem of product flatness caused by differences in grinding speed, and achieves precise adjustment and material saving.
Patent Information
- Application Number
- CN202520190117.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-07
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2035-02-07
AI Technical Summary
In existing chemical mechanical grinding equipment, the difference in grinding speed caused by the different linear velocities inside and outside the grinding pad makes it difficult to accurately adjust the flatness of the product and results in serious waste of consumables.
Multiple delivery pipelines and flow control modules are used to control the flow rate of the polishing slurry sprayed from the nozzle at the end of each delivery pipeline, forming annular polishing slurry bands of different concentrations on the polishing pad, thereby achieving precise adjustment of product flatness and saving polishing slurry.
This allows for better control over product flatness, while also saving on polishing slurry consumables, reducing the amount of polishing slurry used, and decreasing the usage time of the polishing pad adjuster.
Smart Images
Figure CN223749401U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of chemical mechanical polishing equipment, in particular to a chemical mechanical polishing liquid conveying device and a polishing equipment. BACKGROUND
[0002] Chemical mechanical polishing (CMP) equipment is a key equipment for realizing wafer surface planarization in the field of semiconductor manufacturing. The current chemical mechanical polishing equipment uses a polishing liquid conveying arm to convey the polishing liquid. After the polishing liquid falls on the polishing pad, the polishing liquid is evenly spread by means of the polishing pad adjuster. However, because the inner and outer line speeds of the polishing pad are different, the inner and outer polishing speeds are different, and the speed of the head and the polishing pad adjuster need to be combined to meet the product flatness requirement, which not only causes waste of consumables but also cannot achieve accurate adjustment.
[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. CONTENT OF THE UTILITY MODEL
[0004] In view of the problems in the prior art, the purpose of the present application is to provide a chemical mechanical polishing liquid conveying device and a polishing equipment. By providing a plurality of conveying pipelines, the flow rate of the polishing liquid sprayed by the nozzle at the end of each conveying pipeline can be controlled, and an annular polishing liquid belt with different concentrations is formed on the polishing pad, which better meets the product flatness requirement while saving the polishing liquid.
[0005] The present application provides a chemical mechanical polishing liquid conveying device, comprising:
[0006] A plurality of conveying pipelines, a first end of each conveying pipeline is provided with a nozzle, the nozzle is arranged above the polishing pad of the chemical mechanical polishing equipment, and the nozzles of the plurality of conveying pipelines are arranged in sequence along the radial direction of the polishing pad;
[0007] A flow control module, a first end of the flow control module is used for inputting the polishing liquid, a second end of the flow control module is connected to a second end of each conveying pipeline, and the flow control module is used for controlling the flow rate of the polishing liquid in the liquid transmission channel of each conveying pipeline.
[0008] In some embodiments, a conveying arm is further included, a containing cavity of the conveying pipeline is formed in the conveying arm, the conveying pipeline is partially arranged in the interior of the conveying arm, the first end of the conveying pipeline is exposed to the conveying arm, and the second end of the conveying pipeline is exposed to the conveying arm and connected to the flow control module.
[0009] In some embodiments, the transfer arm extends along a radial direction of the polishing pad, a first end of the transfer arm is above the polishing pad, and a second end of the transfer arm is outside the polishing pad.
[0010] In some embodiments, each of the nozzles extends downward relative to the transfer conduit, and each of the nozzles is exposed on a lower side of the transfer arm.
[0011] In some embodiments, the flow control module includes a flow control valve corresponding to each of the transfer conduits.
[0012] In some embodiments, the nozzles of the plurality of transfer conduits are uniformly arranged in a radial direction of the polishing pad.
[0013] Embodiments of the present application also provide a chemical mechanical polishing apparatus including a polishing pad and the chemical mechanical polishing liquid transfer device.
[0014] In some embodiments, the chemical mechanical polishing apparatus further includes a polishing pad adjuster including an adjustment disc arranged above the polishing pad and in contact with the polishing pad.
[0015] In some embodiments, the polishing pad adjuster further includes a base and a mechanical arm, one end of the mechanical arm is connected to the adjustment disc, and the other end of the mechanical arm is connected to the base.
[0016] In some embodiments, the polishing pad adjuster further includes a measurement arm and a measurement sensor, one end of the measurement arm is provided with the measurement sensor, and the other end of the measurement arm is connected to the base.
[0017] The chemical mechanical polishing liquid transfer device and the polishing apparatus provided by the present application have the following advantages:
[0018] The present application provides a plurality of transfer conduits, each of which is provided with a polishing liquid nozzle at an end thereof, and a flow control module is used to control the flow of the polishing liquid sprayed by the nozzle at the end of each transfer conduit, so as to form annular polishing liquid belts with different concentrations on the polishing pad, thereby adjusting the polishing speed of different regions of the polishing pad according to needs, achieving better flatness of products, and saving polishing liquid consumables.
[0019] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and are not limiting to the present application. BRIEF DESCRIPTION OF DRAWINGS
[0020] The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application. It is to be understood that the drawings are only schematic and that actual implementations can differ from the concepts illustrated in the drawings.
[0021] Figure 1 is a structural schematic diagram of a chemical mechanical polishing fluid delivery device according to an embodiment of the present application;
[0022] Figure 2 is a structural schematic diagram of a chemical mechanical polishing apparatus according to an embodiment of the present application;
[0023] Figure 3 is a test result diagram simulating the fluid usage on each part of the polishing pad by a manual drop test. DETAILED DESCRIPTION
[0024] Example implementations are now described with reference to the drawings; it being understood that the example implementations can be practiced with other implementations as well. The example implementations will be described with reference to the drawings, wherein like reference numerals refer to like elements throughout. The drawings are not necessarily to scale and certain features can be exaggerated to show details, which with the prior art, and matters such as alternatives, combinations, sub-combinations, and the like, can exist. The examples described herein are not intended to be exhaustive or to be limited to the precise forms disclosed. In some instances, certain features, structures, and / or functions have not been described in detail in order to avoid obscuring the example implementations. Instead, it is desired that only those features that are necessary to describe the example implementations are presented and / or described. Therefore, person skilled in the art understands that the terminology used herein is for the purpose of describing the example implementations only and is not intended to be limiting; many methods and materials other than those described can be used.
[0025] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Although the terms "first" or "second" can be used herein to describe certain features, these terms are used only to distinguish one feature from another and are not intended to limit the number or order of the features.
[0026] To solve the technical problems in the prior art, the application provides a chemical mechanical polishing liquid delivery device and a polishing equipment. Figure 1 is a structural schematic diagram of a chemical mechanical polishing liquid delivery device according to an embodiment of the application. As shown in Figure 1 In an embodiment of the application, the chemical mechanical polishing liquid delivery device comprises a plurality of delivery pipelines and a flow control module, and a nozzle is arranged at the first end of each of the delivery pipelines. The first end of the flow control module is used for inputting polishing liquid, the second end of the flow control module is connected to the second end of each of the delivery pipelines, and the flow control module is used for controlling the flow of the polishing liquid in the liquid transmission channel of each of the delivery pipelines. Figure 2 is a structural schematic diagram of a chemical mechanical polishing equipment according to an embodiment of the application. As shown in Figure 2 In an embodiment of the application, the chemical mechanical polishing equipment comprises a polishing pad 4 and the chemical mechanical polishing liquid delivery device. Figure 1 and Figure 2 As shown in the figures, the nozzle is arranged above the polishing pad 4 of the chemical mechanical polishing equipment, and the nozzles of the plurality of delivery pipelines are arranged along the radial direction of the polishing pad 4 in sequence.
[0027] By using the chemical mechanical polishing liquid delivery device according to the application, a plurality of delivery pipelines are arranged, and a nozzle is arranged at the end of each of the delivery pipelines. The flow of the polishing liquid sprayed by the nozzle at the end of each of the delivery pipelines can be controlled by the flow control module. An annular polishing liquid belt 1 with different concentrations is formed on the polishing pad 4, so that the polishing speed of different regions of the polishing pad 4 can be adjusted according to the needs, and the flatness of the product is better while the consumption of the polishing liquid is saved.
[0028] As shown in Figure 1 and Figure 2As shown, the chemical mechanical polishing liquid delivery device further comprises a delivery arm 3, a receiving cavity of the delivery arm 3 forms the delivery pipeline, and the delivery pipeline is partially arranged inside the delivery arm. The receiving cavity inside the delivery arm 3 can be a large cavity, and the delivery pipeline is arranged inside the cavity and a support bracket of each delivery pipeline is arranged inside the cavity to maintain the installation stability of each delivery pipeline. Alternatively, the receiving cavity inside the delivery arm 3 can be divided into a plurality of strip cavities corresponding to the delivery pipelines one by one, and each delivery pipeline is separately arranged inside the corresponding strip cavity, and the size and shape of the strip cavity are adapted to the size and shape of the tubular part of each delivery pipeline.
[0029] As shown in Figure 1 and Figure 2 , the first end of the delivery pipeline is exposed to the delivery arm 3, and the second end of the delivery pipeline is exposed to the delivery arm 3 and connected to the flow control module. Specifically, the delivery arm 3 extends along the radial direction of the polishing pad 4, the first end of the delivery arm 3 is located above the polishing pad 4, and the second end of the delivery arm 3 is located outside the polishing pad 4. As shown in Figure 2 , each nozzle extends downward relative to the delivery pipeline, and each nozzle is exposed to the lower side of the delivery arm, and the polishing liquid sprayed by the nozzle can form a plurality of annular polishing liquid strips 1 on the polishing pad 4. In this embodiment, the flow control module comprises a flow control valve corresponding to each delivery pipeline, and by separately controlling each individual flow control valve, the opening and closing of each delivery pipeline can be controlled. The flow control valve can be a mechanical valve or an electromagnetic control valve. The flow control module can control the spraying amount of the polishing liquid in different areas to achieve the purpose of accurately controlling the polishing speed of each area of the polishing pad 4 and saving the polishing liquid.
[0030] In this embodiment, the nozzles of the plurality of delivery pipelines are uniformly arranged in the radial direction of the polishing pad 4, that is, the interval of adjacent two nozzles in the radial direction is the same, and the interval between the annular polishing liquid strips of different concentrations formed is also the same. However, the present application is not limited thereto, and in other alternative embodiments, the arrangement of the nozzles in the radial direction of the polishing pad 4 can also be non-uniform, which also falls within the protection scope of the present application.
[0031] As shown in Figure 2As shown, the chemical mechanical polishing device further comprises a polishing pad adjuster 2, which comprises an adjusting disc arranged above and in contact with the polishing pad 4. The adjusting disc comprises opposite front and back surfaces, the front surface being generally a diamond surface for contacting and adjusting the roughness of the polishing pad 4. The polishing pad adjuster 2 further comprises a base for supporting the entire polishing pad adjuster 2 and a mechanical arm, one end of which is connected to the adjusting disc and the other end of which is connected to the base. The end of the mechanical arm is connected to the back surface of the adjusting disc for driving the adjusting disc to move and adjust different positions of the polishing pad 4. In order to realize real-time detection of the state of the polishing pad 4, the polishing pad adjuster further comprises a measuring arm and a measuring sensor, one end of the measuring arm being provided with the measuring sensor and the other end of the measuring arm being connected to the base. The measuring sensor is, for example, a laser displacement sensor, a capacitive sensor, a contact probe, etc., for accurately measuring the surface topography, thickness, flatness, etc. of the polishing pad. The mechanical arm can comprise a plurality of joints and links, so that the adjusting disc can accurately reach the position of the polishing pad 4 that needs to be adjusted. In use, the measuring sensor at the end of the measuring arm will periodically or regularly measure the polishing pad 4 to obtain various parameter information of the surface of the polishing pad 4. After the mechanical arm drives the adjusting disc to reach the surface of the polishing pad 4 that needs to be compensated, the adjusting disc is driven to rotate by a power device, and the diamond particles on the adjusting disc are used to rub against the surface of the polishing pad 4. During the rubbing process, the flattened part of the polishing pad 4 is restored to an upright state, so that the surface of the polishing pad 4 becomes rough again, thereby restoring the polishing ability of the polishing pad 4, ensuring the polishing rate and quality, and at the same time ensuring the uniform distribution of the polishing liquid on the polishing pad 4 and the flatness of the polishing pad 4.
[0032] Figure 3 The test result diagram simulating the amount of polishing liquid at each part of the polishing pad by the manual dripping test. Figure 3 The abscissa represents different positions of the wafer, and the ordinate represents RR, i.e. the flatness of the wafer. From the diagram, it can be seen that the flatness of the wafer is improved by controlling the amount of polishing liquid at each part of the polishing pad. Figure 3 It can be seen that by controlling the amount of polishing liquid at each part of the polishing pad, the flatness of the product can be effectively improved. By arranging a plurality of nozzles arranged along the radial direction and being capable of controlling the spraying amount of polishing liquid of each nozzle in different regions, the adjustment of the polishing liquid on each region of the polishing pad is more accurate, thereby effectively improving the flatness of the product, saving the consumption of materials, and reducing the use time of the polishing pad adjuster and the use amount of the polishing disc and the polishing pad.
[0033] The above is a further detailed description of the present application in combination with specific preferred embodiments, and the specific implementation of the present application cannot be limited to these descriptions. For ordinary skilled persons in the technical field to which the present application belongs, a number of simple deductions or substitutions can be made without departing from the concept of the present application, and all of them should be regarded as falling within the protection scope of the present application.
Claims
1. A chemical mechanical polishing slurry delivery device, characterized in that, The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device.
2. The chemical mechanical polishing fluid delivery apparatus of claim 1, wherein The application relates to a chemical mechanical polishing liquid delivery device.
3. The chemical mechanical polishing fluid delivery apparatus of claim 2, wherein The application relates to a chemical mechanical polishing liquid delivery device.
4. The chemical mechanical polishing fluid delivery apparatus of claim 2, wherein The application relates to a chemical mechanical polishing liquid delivery device.
5. The chemical mechanical polishing fluid delivery apparatus of claim 1, wherein The application relates to a chemical mechanical polishing liquid delivery device.
6. The chemical mechanical polishing fluid delivery apparatus of claim 1, wherein The application relates to a chemical mechanical polishing liquid delivery device.
7. A chemical mechanical polishing apparatus characterized by comprising: The application relates to a chemical mechanical polishing liquid delivery device.
8. The chemical mechanical polishing apparatus of claim 7, wherein The application relates to a chemical mechanical polishing liquid delivery device.
9. The chemical mechanical polishing apparatus of claim 8, wherein The application relates to a chemical mechanical polishing liquid delivery device.
10. The chemical mechanical polishing apparatus of claim 9, wherein The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. The application relates to a chemical mechanical polishing liquid delivery device. 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