Cutting knife for semiconductor processing

Abstract

The utility model discloses a cutting knife for semiconductor processing, which comprises a blade, water storage rings are respectively arranged on the left side and the right side of the blade in a concentric circle mode, a plurality of nuts are arranged on the outer rings of the water storage rings in an annular array mode, through holes are formed in corresponding positions of the blade, and the nuts and the through holes of the water storage rings on the left side and the right side correspond to each other and are fixed through bolts. A water injection hole is formed in the outer surface of the water storage ring, and a plurality of water outlet holes are formed in the outer circle of the water storage ring in an annular array mode. According to the semiconductor cutting device, water cooling can be conducted on the cutting knife through the water storage ring, air cooling can be conducted on the cutting knife through the heat dissipation blades, and water cooling and air cooling are combined, so that the cooling efficiency is improved, a blade and a semiconductor can be cooled conveniently in the cutting process, and damage to the semiconductor caused by too high temperature is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically relates to a cutting knife for semiconductor processing. BACKGROUND

[0002] In the packaging process, the last step cutting operation determines the quality of product appearance, if the semiconductor cutting blade used in the cutting operation is broken in the operation process, it is easy to cause the product to have scratch and damage and other defects, and brings great hidden danger to the product.

[0003] The conductor cutting blade is seriously worn for a long time, influences the later use, and the temperature of the semiconductor is high due to the friction between the blade and the semiconductor in the use process, and the use effect is not good. UTILITY MODEL CONTENT

[0004] The utility model discloses a cutting knife for semiconductor processing.

[0005] To realize the above-mentioned purpose, the utility model adopts the technical scheme, a cutting knife for semiconductor processing, including the blade, its innovation point lies in: the left and right sides of the blade are concentric circle and set up the water storage ring respectively, a plurality of nuts are arranged in the outer ring annular array of the water storage ring, and the corresponding position on the blade is provided with a through hole, and the nut and the through hole of the water storage ring on the left and right sides correspond to each other, and are fixed through the bolt, the outer surface of the water storage ring is provided with a water injection hole, and a plurality of water outlet holes are arranged in the outer ring annular array of the water storage ring.

[0006] Further, the outer ring of the water storage ring is also annular array and is provided with a plurality of heat dissipation fans, and the heat dissipation fans are distributed at intervals with the water outlet holes.

[0007] Further, the internal thread hole of the nut is a counterbore, and the height of the nut is lower than the water storage ring.

[0008] After adopting the above structure, the utility model has the beneficial effects that:

[0009] The utility model discloses a water storage ring can be set up to the cutting knife carries out water cooling, sets up the heat dissipation blade simultaneously, can carry out the air cooling to the cutting knife, and water cooling and air cooling combine each other, thereby improving the cooling efficiency, and the blade and the semiconductor are cooled during cutting, and the semiconductor is prevented from being damaged due to the temperature being too high. DRAWING DESCRIPTION

[0010] Fig. 1 It is the sectional view of the utility model;

[0011] Fig. 2 It is the external schematic view of the utility model.

[0012] MARK DESCRIPTION:

[0013] 1 blade, 2 water storage ring, 3 nut, 4 water injection hole, 5 water outlet hole, 6 cooling fan blade. DETAILED DESCRIPTION

[0014] The utility model will be further described below with reference to the drawings.

[0015] In order to make the utility model's purpose, technical scheme and advantage more clear and obvious, the following combines the drawing and specific implementation, and the utility model is further detailed.The specific implementation described here is only used to explain the utility model, and is not used to limit the utility model.

[0016] Reference Figs. 1-2 A cutting knife for semiconductor processing, including blade 1, the left and right sides of blade 1 are concentrically arranged water storage ring 2, multiple nuts 3 are arranged in the outer ring array of water storage ring 2, and through holes are formed in the corresponding positions on the blade, and the nuts 3 and through holes of the left and right water storage rings correspond to each other, and are fixed by bolts, water injection holes 4 are formed on the outer surface of water storage ring 2, and multiple water outlet holes 5 are formed in the outer ring array of water storage ring 2.Specifically, water storage ring 2 is symmetrically arranged on the left and right sides of blade 1, and is fixedly connected by bolts passing through the nuts 3 and through holes on both sides, so that water storage ring 2 is fixed on the left and right sides of blade 1, then clean water is injected into the water injection hole 4, and when the cutting knife rotates, the clean water is thrown out, and the blade and the semiconductor are water-cooled to prevent the semiconductor from being damaged due to high temperature.

[0017] In the embodiment, multiple cooling fan blades 6 are arranged in the outer ring array of water storage ring 2, and the cooling fan blades 6 are distributed at intervals with the water outlet holes 5.When the cutting knife rotates, the cooling fan blades 6 are driven to rotate, generating wind power, thereby air-cooling the blade and the semiconductor, and further combining water cooling to improve the cooling efficiency.

[0018] In the embodiment, the internal thread hole of nut 3 is a counterbore, and the height of nut is lower than that of water storage ring 2, which is conducive to embedding the bolt in the counterbore and better cutting.

[0019] The above description is only used to explain the technical scheme of the utility model, not to limit it, and other modifications or equivalent replacements of the technical scheme of the utility model made by those skilled in the art should be covered in the scope of the claims of the utility model.

Claims

1. A dicing blade for semiconductor processing, comprising a blade, characterized by: The left and right sides of the blade are respectively provided with concentric water storage rings, a plurality of nuts are arranged in an annular array on the outer ring of the water storage ring, and a through hole is formed in a corresponding position on the blade, the nuts and the through hole of the left and right water storage rings correspond to each other, and are fixed through bolts, a water injection hole is formed on the outer surface of the water storage ring, and a plurality of water outlet holes are formed in an annular array on the outer ring of the water storage ring.

2. The dicing blade according to claim 1, wherein: A plurality of heat dissipation fan blades are arranged in an annular array on the outer ring of the water storage ring, and the heat dissipation fan blades are distributed at intervals with the water outlet holes.

3. The dicing blade of claim 1, wherein: The internal thread hole of the nut is a counterbore, and the height of the nut is lower than that of the water storage ring.

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