Embedded storage chip module based on SD card protocol
By designing an embedded storage chip module, the problem of poor contact caused by loose SD cards was solved, achieving miniaturization and improved stability, reducing the return rate, and improving signal transmission speed and user experience.
Patent Information
- Application Number
- CN202520276785.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing SD cards and Micro SD cards are designed for plug-and-play use, which renders them unusable in small or micro electronic products. Furthermore, they are prone to loosening during use, leading to poor contact, which affects user experience and increases the return rate.
Design an embedded storage chip module based on the SD card protocol, including a housing, a circuit board, a main control module, a flash memory module, and external pins. The components are connected using a soldering process. The main control module manages the flash memory module, which occupies most of the space on the lower side of the circuit board. The external pins extend to the outside of the housing. A large-size design is adopted to improve stability.
It achieves miniaturization, high stability, and fast signal transmission speed, reducing product return rate and improving user experience.
Smart Images
Figure CN223757103U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the memory technical field, concretely relates to a kind of embedded storage chip module based on SD card protocol. BACKGROUND
[0002] Memory is a new generation memory device based on semiconductor flash memory, due to its fast data transmission speed, hot plug and other excellent characteristics, it is widely used in portable devices such as electronic dictionary, mobile phone, digital camera, car navigation system, or used as flash memory disk, and is liked by the majority of consumers.
[0003] The current SD card and Micro SD card are plug-in type, not only bulky, leading to small or miniature electronic products cannot be used, but also loose during use, leading to poor contact, resulting in the need to store handheld mobile electronic products in consumers' hands Experience poor, product repair rate is high. UTILITY MODEL CONTENT
[0004] (1) technical problem to be solved
[0005] In view of the deficiency of prior art, the utility model aims at providing a kind of embedded storage chip module based on SD card protocol, which aims at solving the problem that the current SD card and Micro SD card are plug-in type, not only bulky, leading to small or miniature electronic products cannot be used, but also loose during use, leading to poor contact, resulting in the need to store handheld mobile electronic products in consumers' hands Experience poor, product repair rate is high.
[0006] (2) technical scheme
[0007] In order to solve the above technical problems, the utility model provides a kind of embedded storage chip module based on SD card protocol, which comprises a shell, the inside of shell is provided with circuit board, circuit board is installed with main control module, flash memory module and external pin, main control module is located on the upper side of circuit board, flash memory module is located on the lower side of circuit board, external pin includes four left pins, four right pins, main pin and auxiliary pin, main pin is located between left pin and right pin, auxiliary pin is arranged at the left side top end of circuit board.
[0008] Preferably, main control module, flash memory module and external pin are all welded on circuit board.
[0009] Further, a plurality of first elements are arranged on the circuit board and peripherally to the main control module, and the first elements are welded in conduction with the main control module by wires.
[0010] Further, a plurality of capacitors are arranged on the circuit board and to the right of the main control module.
[0011] Further, a plurality of second elements are arranged on the circuit board and at the lower side of the flash memory module, and the second elements are welded and connected with the flash memory module through wires.
[0012] Further, the shell, the circuit board, the main control module, the flash memory module and the external pin are integrally made into an insulating package, and the external pin extends to the outside of the shell.
[0013] (3) Advantageous effects
[0014] Compared with the prior art, the utility model has the beneficial effects that:
[0015] The utility model discloses a standard interface is provided to the main control module and manages the flash memory module, and the flash memory module occupies most of the space at the lower side of the circuit board, not only has extensive product compatibility, and interface protocol is simple, and cost is low, and volume is small, and storage capacity is big, and the connecting path between the first element and the main control module, the second element and the flash memory module is shortened, thereby the signal transmission speed is accelerated, and the signal transmission quality is improved, and large -size external pin is used simultaneously, and it is not easy to loosen when using, and stability is good, can obviously increase product stability, and reduce the repair rate of product. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the internal structure schematic view of the utility model.
[0017] Figure 2 It is the front structure schematic view of the utility model.
[0018] Figure 3 It is the circuit structure schematic view of the utility model.
[0019] The mark in the drawing is: 1, shell, 2, circuit board, 3, main control module, 4, flash memory module, 5, external pin, 6, first element, 7, capacitor, 8, second element, 501, left pin, 502, right pin, 503, main pin, 504, auxiliary pin. DETAILED DESCRIPTION
[0020] The specific embodiment is a kind of embedded storage chip module based on SD card protocol, and its structure schematic view is as shown in Figures 1-3As shown, the module includes a shell 1, the inside of the shell 1 is provided with a circuit board 2, the circuit board 2 is installed with a master control module 3, a flash memory module 4 and an external pin 5, the master control module 3 is located on the upper side of the circuit board 2, the flash memory module 4 is located on the lower side of the circuit board 2, the master control module 3 provides a standard interface and manages the flash memory module 4, the flash memory module 4 occupies most of the space on the lower side of the circuit board 2, the external pin 5 includes four left pins 501, four right pins 502, a main pin 503 and an auxiliary pin 504, the main pin 503 is located between the left pin 501 and the right pin 502, and the auxiliary pin 504 is arranged at the left top end of the circuit board 2.
[0021] Specifically, the four left pins 501 are evenly arranged in the middle of the left side of the circuit board 2, the four left pins 501 are evenly arranged in the middle of the right side of the circuit board 2, the main pin 503 is larger in size, and the auxiliary pin 504 is triangular in structure.
[0022] As shown in Figure 1 and Figure 2 : In this embodiment, the master control module 3, the flash memory module 4 and the external pin 5 are all welded on the circuit board 2; welding as an important connection process plays an irreplaceable role in manufacturing industry, not only the connection is firm, but also it can remain stable even under a larger load, at the same time, the welding process can realize automation, improve production efficiency and welding quality.
[0023] As shown in Figure 1 : In this embodiment, a plurality of first elements 6 are arranged on the circuit board 2 and located at the periphery of the master control module 3, and the first elements 6 are welded in conduction with the master control module 3 through wires; a plurality of second elements 8 are arranged on the circuit board 2 and located at the lower side of the flash memory module 4, and the second elements 8 are welded in conduction with the flash memory module 4 through wires.
[0024] In this way, the connection path between the first element 6 and the master control module 3, and the second element 8 and the flash memory module 4 is shortened, thereby accelerating the signal transmission speed and improving the signal transmission quality.
[0025] As shown in Figure 1 and Figure 2 : In this embodiment, a plurality of capacitors 7 are arranged on the circuit board 2 and located at the right side of the master control module 3; the capacitors 7 are filtering capacitors and are close to the master control module 3, which can shorten the path and further improve the filtering effect.
[0026] As shown in Figure 2As shown: in this embodiment, the shell 1, circuit board 2, master module 3, flash module 4 and external pin 5 are made into an insulating package as a whole, the external pin 5 extends to the outside of the shell 1, specifically using epoxy plastic sealing material, the epoxy plastic sealing material is a commonly used material for semiconductor chip packaging, its high temperature insulation resistance test is the key material to ensure the safety of chip operation, which can effectively screen out the required material and prevent problems such as leakage and short circuit.
[0027] Working principle: the master module 3 provides a standard interface and manages the flash module 4, the flash module 4 occupies most of the space on the lower side of the circuit board 2, not only has extensive product compatibility, simple interface protocol, low cost, small size, large storage capacity, but also the connection path between the first element 6 and the master module 3, the second element 8 and the flash module 4 is shortened, thereby speeding up the signal transmission speed and improving the signal transmission quality, at the same time, the large size external pin 5 is adopted, which is not easy to loosen during use, has good stability, can obviously increase the product stability, reduce the product repair rate, and can solve the pain points of handheld mobile electronic product industry such as smart watch, point reading pen, recording pen and the like.
[0028] All the technical features in the embodiment can be freely combined according to actual needs.
[0029] The above embodiment is a preferred implementation scheme of the present application, in addition to this, the present application can be realized in other ways, any obvious replacement without departing from the technical scheme concept is within the protection scope of the present application.
Claims
1. An embedded memory chip module based on SD card protocol, the module comprising a shell (1), the inside of the shell (1) is provided with a circuit board (2), a main control module (3), a flash memory module (4) and external pins (5) are installed on the circuit board (2), characterized in that: The main control module (3) is located on the upper side of the circuit board (2), the flash memory module (4) is located on the lower side of the circuit board (2), the external pin (5) comprises four left pins (501), four right pins (502), a main pin (503) and an auxiliary pin (504), the main pin (503) is located between the left pin (501) and the right pin (502), and the auxiliary pin (504) is arranged at the left top end of the circuit board (2).
2. The SD card protocol based embedded memory chip module according to claim 1, wherein, The main control module (3), the flash memory module (4) and the external pin (5) are all welded on the circuit board (2).
3. The SD card protocol based embedded memory chip module according to claim 2, wherein, A plurality of first elements (6) are arranged on the circuit board (2) and at the periphery of the main control module (3), and the first elements (6) are welded in conduction with the main control module (3) through wires.
4. The SD card protocol based embedded memory chip module according to claim 3, wherein, A plurality of capacitors (7) are arranged on the circuit board (2) and at the right side of the main control module (3).
5. The SD card protocol based embedded memory chip module according to claim 4, wherein, A plurality of second elements (8) are arranged on the circuit board (2) and at the lower side of the flash memory module (4), and the second elements (8) are welded in conduction with the flash memory module (4) through wires.
6. The SD card protocol based embedded memory chip module according to claim 5, wherein, The shell (1), the circuit board (2), the main control module (3), the flash memory module (4) and the external pin (5) are integrally made into an insulating package body, and the external pin (5) extends to the outside of the shell (1).