Integrated capacitor

Abstract

The utility model discloses an integrated capacitor which comprises the components of a housing which is provided with an accommodating cavity and a heat radiation part, the heat radiation part is arranged on the bottom wall of the housing along a first direction, and a heat radiation channel is arranged at one side of the heat radiation part back to the accommodating cavity; the capacitor is installed on the shell and provided with a capacitor core, and the capacitor core is contained in the containing cavity; one part of the filter is accommodated in the accommodating cavity and is connected with the capacitor core, and one part of the filter and the capacitor core are fixed in the accommodating cavity through pouring sealant. According to the integrated capacitor provided by the utility model, the filter, the capacitor and the radiator can be combined more compactly, the occupied space is smaller, and the radiating efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field, especially a kind of integrated capacitor. BACKGROUND

[0002] Electromagnetic compatibility (Electro Magnetic Compatibility, EMC for short) filter and capacitor are important components inside motor controller, and motor controller is the key device for converting direct current of power supply into alternating current of driving motor in new energy vehicle. Among them, EMC filter eliminates interference and improves electromagnetic compatibility, while DC bus capacitor stabilizes current and reduces voltage fluctuation, and both are crucial to the performance of motor controller. However, the EMC filter, capacitor and radiator in the prior art exist independently, resulting in large space occupation, heavy weight and low heat dissipation efficiency. Moreover, there are problems of high cost of additional parts and complex manufacturing. SUMMARY

[0003] The utility model discloses a kind of integrated capacitors, filter, capacitor and radiator three more compact combination, less space occupation, and improve heat dissipation efficiency.

[0004] To solve the above technical problems, the embodiment of the utility model discloses an integrated capacitor, comprising: a shell, with containing cavity and heat dissipation part, along the first direction, the heat dissipation part is located at the bottom wall of the shell, and the side of the heat dissipation part away from the containing cavity is provided with a heat dissipation channel;Capacitor, installed in the shell, with capacitor core, the capacitor core is contained in the containing cavity;Filter, the part of the filter is contained in the containing cavity, and connected with the capacitor core, and part of the filter and the capacitor core are fixed in the containing cavity by pouring sealant.

[0005] Using the above technical scheme, the heat dissipation part and the shell are integrated in the embodiment of the application, so that the heat dissipation part becomes part of the shell, and the capacitor core and part of the filter are directly assembled into the shell with heat dissipation structure, so that the overall structure of the capacitor core, the filter and the heat dissipation part is more compact and occupies less space. That is, compared with the existing embodiment, the present scheme does not need to fill a heat-conducting medium (such as heat-conducting glue) between the shell and the heat dissipation part, so that the shell is highly integrated, the internal space is fully utilized, the material weight is reduced, and the cost is reduced. On the other hand, the heat generated by the capacitor and the filter can be carried away by the coolant through the heat dissipation channel of the heat dissipation part in a shorter conduction path, thereby improving the heat dissipation efficiency of the integrated capacitor.

[0006] And, the capacitor core and the part of the filter in the accommodating cavity are packaged together by the potting glue, not only can the bolt connection between the filter and the shell be omitted, the assembly process of the filter is reduced, but also the shielding effect can be improved, and a separate electromagnetic shielding device (for example, an EMC shielding plate arranged on a magnetic ring) for the filter is no longer needed, so that the integrated capacitor of the embodiment of the application is more compact, and the cost of additional parts is saved.

[0007] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the shell comprises an opening, the accommodating cavity is communicated with the outside through the opening, the opening is used for the capacitor core and the part of the filter to pass through and enter the accommodating cavity, and the potting glue covers the capacitor core and the part of the filter and seals the opening.

[0008] By adopting the above technical scheme, in the assembly process of the integrated capacitor, the opening of the shell can be placed upwards along the first direction, then the capacitor core and the part of the filter connected with the capacitor core are placed into the accommodating cavity, and then the capacitor core and the part of the filter are fixedly installed in the accommodating cavity by pouring the potting glue (for example, the potting glue). In this way, the assembly of the integrated capacitor is realized, so that the subsequent normal work of the integrated capacitor is ensured.

[0009] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the shell comprises an opening, the accommodating cavity is communicated with the outside through the opening, the opening is used for the capacitor core and the part of the filter to pass through and enter the accommodating cavity, and the potting glue covers the capacitor core and the part of the filter and seals the opening.

[0010] By adopting the above technical scheme, in the assembly process of the integrated capacitor, the opening of the shell can be placed upwards along the first direction, then the capacitor core and the part of the filter connected with the capacitor core are placed into the accommodating cavity, and then the capacitor core and the part of the filter are fixedly installed in the accommodating cavity by pouring the potting glue (for example, the potting glue). In this way, the assembly of the integrated capacitor is realized, so that the subsequent normal work of the integrated capacitor is ensured.

[0011] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the shell further comprises a partition portion, which extends along the second direction, and the partition portion is connected to the outer side of the bottom wall of the first recess and the outer side of the bottom wall of the second recess respectively; along the third direction, the part of the filter and the capacitor core are arranged on opposite sides of the partition portion, the first direction intersects the third direction, and the second direction intersects the third direction.

[0012] By adopting the above technical scheme, the two ends of the partition portion of the embodiment of the present application are connected to the inner side walls of the first recess and the second recess respectively, so as to divide the accommodating cavity into two regions, so that the part of the filter and the capacitor core are located on opposite sides of the partition portion respectively, and are packaged in two different regions by the potting glue, so that the internal structure of the shell of the integrated capacitor of the embodiment of the present application is more compact.

[0013] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the shell further comprises a plurality of mounting portions, the plurality of mounting portions are located on the outer side of the shell, and the plurality of mounting portions are arranged on the outer edge of the bottom wall of the shell in a circumferential direction, and each mounting portion is provided with a mounting hole extending along the first direction.

[0014] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the capacitor further has a copper bar, the copper bar comprises a positive copper bar and a negative copper bar, along the first direction, the part of the positive copper bar and the part of the negative copper bar are arranged on opposite sides of the capacitor core respectively, and the potting glue covers a part of the positive copper bar and a part of the negative copper bar.

[0015] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, another part of the positive copper bar comprises a plurality of positive copper bar terminals, the plurality of positive copper bar terminals extend along the first direction and protrude out of the accommodating cavity through the bottom wall of the shell, another part of the negative copper bar comprises a plurality of negative copper bar terminals, the plurality of negative copper bar terminals extend along the first direction and protrude out of the accommodating cavity through the bottom wall of the shell; along the second direction, the plurality of positive copper bar terminals and the plurality of negative copper bar terminals are arranged in a one-to-one interval.

[0016] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the part of the filter comprises a first end of a positive electrode terminal, a first end of a negative electrode terminal and a magnetic ring, along a second direction, the first end of the positive electrode terminal and the first end of the negative electrode terminal both pass through the magnetic ring, the potting glue wraps the first end of the positive electrode terminal, the first end of the negative electrode terminal and the magnetic ring, another part of the filter comprises a second end of the positive electrode terminal and a second end of the negative electrode terminal, the second end of the positive electrode terminal and the second end of the negative electrode terminal both extend out of the accommodating cavity through the side of the accommodating cavity; the capacitor core further comprises a positive electrode capacitor terminal and a negative electrode capacitor terminal, along the second direction, the positive electrode capacitor terminal and the negative electrode capacitor terminal are arranged at intervals and are respectively connected with the first end of the positive electrode terminal and the first end of the negative electrode terminal.

[0017] According to another specific embodiment of the present application, the embodiment of the present application discloses an integrated capacitor, the part of the filter further comprises a plurality of X / Y capacitors and a plurality of first ends of grounding terminals, each X / Y capacitor is connected with the first end of the corresponding grounding terminal and the positive electrode terminal or the negative electrode terminal respectively, the potting glue covers the plurality of X / Y capacitors and the first end of each grounding terminal, the other part of the filter further comprises a plurality of second ends of grounding terminals, each second end of the grounding terminal is arranged on the inner side wall of the shell, and each second end of the grounding terminal extends out of the potting glue. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 An exploded view of an EMC filter, a capacitor and a heat sink in an embodiment is shown;

[0019] Figure 2A A perspective view of an integrated capacitor of the embodiment of the present application is shown Figure 1 ;

[0020] Figure 2B A perspective view of an integrated capacitor of the embodiment of the present application is shown

[0021] Figure 3 An exploded view of an integrated capacitor of the embodiment of the present application is shown. DETAILED DESCRIPTION

[0022] The following describes the embodiments of the present application with specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. Although the description of the present application is introduced with preferred embodiments, it does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the embodiments of the present application is to cover other options or modifications that can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0023] It should be noted that in this specification, similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0024] In the description of the present embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0025] The terms "first", "second", and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present embodiment, it should also be noted that unless otherwise explicitly specified and limited, the terms "provided", "connected", "connected" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present embodiment can be understood according to the specific circumstances.

[0027] In order to make the purpose, technical scheme and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0028] Figure 1 An exploded view of an EMC filter, a capacitor and a heat sink in an embodiment is shown.

[0029] As shown in Figure 1 , the capacitor 101 is arranged in the capacitor shell 100, the heat sink 102 is installed on the bottom of the capacitor shell 100 through four bolts 1001, and the EMC filter 103 is electrically connected to one end of the capacitor 101 extending out of the capacitor shell 100 through two bolts 1001. Specifically, the assembly process of the EMC filter, the capacitor and the heat sink includes: first, apply a certain amount of heat-conducting glue to one side of the heat sink 102 facing the capacitor shell 100, then pre-press the capacitor shell 100 and the side of the heat sink 102 coated with heat-conducting glue, and fasten four bolts 1001 at the corresponding four corners of the capacitor shell 100 and the heat sink 102 respectively, so that the heat-conducting glue between the heat sink and the capacitor shell is flattened after being extruded and filled, so as to achieve the function of heat conduction.

[0030] However, since the EMC filter 103, the capacitor 101 and the heat sink 102 exist independently in the prior art, the overall space occupied is large and the weight is heavy, and the EMC filter 103 is not tightly attached to the heat sink 102, so the heat sink 102 cannot directly cool the EMC filter 103, and the heat dissipation efficiency between the heat sink 102 and the capacitor 101 is low.

[0031] In order to reduce the occupied space and improve the heat dissipation efficiency, the embodiment of the present application provides an integrated capacitor 2, which integrates the EMC filter, the capacitor and the heat sink together to improve the heat dissipation effect and reduce the cost.

[0032] Reference Figure 2A and Figure 2B in combination Figure 3 , the embodiment of the present application provides an integrated capacitor 2. Wherein, the integrated capacitor 2 of the embodiment of the present application comprises: a shell 200, a capacitor 201 and a filter. Exemplarily, the filter of the embodiment of the present application is an EMC filter 202. In order to facilitate the description, the EMC filter 202 is taken as an example for description.

[0033] Specifically, as shown in Figure 2A and Figure 2B and Figure 3As shown, the housing 200 has a receiving cavity 2001 and a heat dissipation portion 2002. The receiving cavity 2001 is used to accommodate a portion of the capacitor 201 and a part of the EMC filter 202 (e.g., the first end 20211 of the positive terminal 2021, the first end 20221 of the negative terminal 2022, the magnetic ring 2023, the X / Y capacitor 2024, and the first end 20251 of the ground terminal 2025, described later). The capacitor 201 has a capacitor core 2011, which is accommodated within the receiving cavity 2001. A part of the EMC filter 202 is accommodated within the receiving cavity 2001 and connected to the capacitor core 2011. Exemplarily, the housing 200 of this embodiment is rectangular in shape, along a first direction (e.g., Figure 2A As shown in the Z direction, the heat dissipation part 2002 is located on the outside of the bottom wall 2008 of the housing 200. A heat dissipation channel 20021 (a portion of the heat dissipation channel 20021 is shown in the figure) is provided on the side of the heat dissipation part 2002 facing away from the receiving cavity 2001. The heat dissipation channel 20021 extends from one end of the heat dissipation part 2002 in the second direction X (i.e., the length direction) to the other end. The heat dissipation channel 20021 is supplied with coolant to dissipate heat to the capacitor 201 (e.g., capacitor core 2011 and copper busbar 2012 described later, see [reference]) located within the receiving cavity 2001. Figure 3 The heat generated by the heat from the EMC filter 202 is dissipated.

[0034] For example, such as Figure 2A and Figure 2B As shown, the heat dissipation unit 2002 includes an inlet 20022 and an outlet 20023, and the housing 200 includes a first recess 2003, a second recess 2004, a first sidewall 20051, and a second sidewall 20052. Along the second direction (e.g.) Figure 2A and Figure 2B (As shown in the X direction), the first sidewall 20051 and the second sidewall 20052 are arranged opposite to each other, and the first recess 2003 is provided on the first sidewall 20051, and the second recess 2004 is provided on the second sidewall 20052. The inlet 20022 and the outlet 20023 are both connected to the heat dissipation channel 20021. The first recess 2003 corresponds to the inlet 20022 of the heat dissipation part 2002, and the second recess 2004 corresponds to the outlet 20023 of the heat dissipation part 2002. The inlet 20022 and the outlet 20023 are respectively provided on opposite sides of the receiving cavity 2001, so that the external coolant can enter the heat dissipation channel 20021 from the inlet 20022 along the first direction Z, and flow in the heat dissipation channel 20021 along the second direction X to the outlet 20023. For example, the housing 200 in this application embodiment is made of die-cast aluminum or plastic, and the first direction Z is perpendicular to the second direction X.

[0035] In the working process of the integrated capacitor 2, the capacitor core 2011 and the EMC filter 202 in the accommodating cavity 2001 generate heat, and the heat dissipation channel 20021 is located outside the bottom wall 2008 of the shell 200. The capacitor core 2011 and the EMC filter 202 are in close contact with the heat dissipation channel 20021 in the accommodating cavity 2001. The flow of the cooling liquid in the heat dissipation channel 20021 can directly take away the heat generated by the capacitor core 2011 and the EMC filter 202 in the accommodating cavity 2001 above the heat dissipation channel 20021, thereby improving the heat dissipation performance of the integrated capacitor 2 and prolonging the service life of the integrated capacitor 2.

[0036] It can be understood that the structure of the heat dissipation channel 20021 of the heat dissipation part 2002 is not limited in the embodiment of the present application, as long as it can be used for the flow of the cooling liquid to dissipate the heat generated by the capacitor 201 and the EMC filter 202 in the accommodating cavity 2001. Moreover, the structure of the shell 200 is not limited in the embodiment of the present application, for example, the shell 200 can also be circular.

[0037] Continuing to refer to Figure 2A and Figure 3 The capacitor 201 also includes a copper bar 2012. Moreover, the shell 200 of the embodiment of the present application also includes an opening 2006. In the first direction Z, the opening 2006 and the heat dissipation part 2002 are oppositely arranged. The accommodating cavity 2001 of the shell 200 is in communication with the outside through the opening 2006. The opening 2006 is used for the capacitor core 2011 and the EMC filter 202 to pass through and enter the accommodating cavity 2001. Exemplarily, as shown in Figure 3 The integrated capacitor 2 of the embodiment of the present application also includes potting glue 203, for example, potting glue made of epoxy resin and the like. The potting glue 203 is filled in the accommodating cavity 2001 to coat the capacitor core 2011, a part of the EMC filter 202 and a part of the copper bar 2012 (for example, a part of the positive copper bar 20121 and a part of the negative copper bar 20122 described below), and to close the opening 2006, so as to jointly fix the part of the EMC filter 202, the capacitor core 2011 and the part of the copper bar 2012 in the accommodating cavity 2001.

[0038] Therefore, the heat dissipation part 2002 and the shell 200 are integrated in the embodiment of the application, so that the heat dissipation part 2002 becomes a part of the shell 200, and the capacitor core 2011 and a part of the EMC filter 202 are directly assembled into the shell 200 with the heat dissipation structure, so that the overall structure of the capacitor core 2011, the EMC filter 202 and the heat dissipation part 2002 is more compact and occupies less space. That is, compared with the existing implementation, the present solution does not need to fill a heat-conducting medium (for example, heat-conducting glue) between the shell 200 and the heat dissipation part 2002, so that the shell 200 is highly integrated, the internal space is fully utilized, the material weight is reduced, and the cost is reduced. On the other hand, the heat generated by the capacitor 201 and the EMC filter 202 can be carried away by the cooling liquid through the heat dissipation channel 20021 of the heat dissipation part 2002 in a shorter conduction path, thereby improving the heat dissipation efficiency of the integrated capacitor 2.

[0039] In addition, the capacitor core 2011 and a part of the EMC filter 202 in the accommodating cavity 2001 are packaged together by the potting glue 203, which not only can save the bolt connection between the EMC filter 202 and the shell 200 and reduce the assembly process of the EMC filter 202, but also can improve the EMC shielding effect, so that a separate electromagnetic shielding device (for example, an EMC shielding plate provided on a magnetic ring) is no longer needed for the EMC filter 202, and the entire device of the integrated capacitor 2 of the embodiment of the application is further more compact, and the cost of additional parts is saved.

[0040] Further, in the assembly process of the integrated capacitor 2, the opening 2006 of the shell 200 is placed upward along the first direction Z, and then the capacitor core 2011, a part of the copper bar 2012 provided on the capacitor core 2011 and a part of the EMC filter 202 connected with the capacitor core 2011 are placed into the accommodating cavity 2001, and then the liquid potting glue 203 (for example, epoxy resin) is injected into the inside of the accommodating cavity 2001, so that the liquid potting glue 203 covers the capacitor core 2011, the part of the copper bar 2012 and the part of the EMC filter 202, and finally the liquid potting glue 203 is solidified and fixedly connected with the inner side of the side wall 2005 of the shell 200, so as to close the opening 2006 and fix the capacitor core 2011, the part of the copper bar 2012 and the part of the EMC filter 202 in the accommodating cavity 2001. In this way, the assembly of the integrated capacitor 2 is realized, so as to ensure the normal work of the integrated capacitor 2.

[0041] The structure and working principle of the shell 200, the capacitor 201 and the EMC filter 202 of the embodiment of the application will be described in detail below with reference to the accompanying drawings.

[0042] Reference Figure 2A and combinedFigure 3 The shell 200 of the embodiment of the present application further comprises a partition 2007. The partition 2007 extends along a second direction (as shown in the X direction in Figure 2A FIG. 2B) and connects the first recess 2003 and the second recess 2004 respectively. Specifically, as shown in Figure 2A and Figure 3 , two ends of the partition 2007 are connected to the outer side of the bottom wall 20031 of the first recess 2003 (see Figure 3 ) and the outer side of the bottom wall 20041 of the second recess 2004 (see Figure 3 ) respectively, so as to divide the accommodation cavity 2001 into two areas along a third direction (as shown in the Y direction in Figure 2A and Figure 3 FIG. 2B), so that a part of the EMC filter 202 and the capacitor core 2011 are located on opposite sides of the partition 2007 respectively and are packaged in two different areas, so that the internal structure of the shell 200 of the integrated capacitor 2 of the embodiment of the present application is more compact. Exemplarily, the first direction Z (i.e. the height direction of the shell 200) intersects the third direction Y (i.e. the width direction of the shell 200), and the second direction X (i.e. the length direction of the shell 200) is perpendicular to the third direction Y.

[0043] With reference to Figure 2A and in combination with Figure 3 , the EMC filter 202 of the embodiment of the present application further comprises a positive terminal 2021, a negative terminal 2022 and two magnetic rings 2023. It can be understood that the number of magnetic rings 2023 is not limited in the embodiment of the present application, for example, the number of magnetic rings 2023 can also be one, three, four, five, six or more. For the convenience of description, two magnetic rings 2023 are taken as an example for description below. Moreover, the capacitor core 2011 of the embodiment of the present application further comprises a positive capacitor terminal 20111 and a negative capacitor terminal 20112. Among them, the positive capacitor terminal 20111 corresponds to the first end 20211 of the positive terminal 2021, and the negative capacitor terminal 20112 corresponds to the first end 20221 of the negative terminal 2022.

[0044] Specifically, as shown in Figure 2A and Figure 3As shown, a portion of the aforementioned EMC filter 202 includes a first end 20211 of the positive terminal 2021, a first end 20221 of the negative terminal 2022, and two magnetic rings 2023. The other portion of the EMC filter 202 includes a second end 20212 of the positive terminal 2021 and a second end 20222 of the negative terminal 2022. Along the second direction Y, the first ends 20211 of the positive terminal 2021 and 20221 of the negative terminal 2022 of the EMC filter 202 both pass through the two magnetic rings 2023. The positive capacitor terminal 20111 and the negative capacitor terminal 20112 of the capacitor core 2011 are spaced apart and connected to the first ends 20211 of the positive terminal 2021 and 20221 of the negative terminal 2022, respectively. Furthermore, the second end 20212 of the positive terminal 2021 and the second end 20222 of the negative terminal 2022 both extend out of the receiving cavity 2001 through the side portion (i.e., the side wall 2005 of the housing 200) of the receiving cavity 2001, so that the potting compound 203 encapsulates the first end 20211 of the positive terminal 2021, the first end 20221 of the negative terminal 2022, and the magnetic ring 2023 located in the receiving cavity 2001.

[0045] For example, in this application embodiment, the positive terminal 2021 and the negative terminal 2022 are stacked along the first direction Z, and the positive terminal 2021 and the negative terminal 2022 are respectively connected to the positive capacitor terminal 20111 and the negative capacitor terminal 20112 by bolts 30. The first end 20221 and the second end 20212 of the positive terminal 2021, the first end 20221 and the second end 20222 of the negative terminal 2022, the positive capacitor terminal 20111 and the negative capacitor terminal 20112 are all provided with bolt holes 31 through which the bolts 30 are threaded. However, this application does not limit the specific structure of the positive terminal 2021 and the negative terminal 2022, nor the connection method between the positive terminal 2021 and the negative terminal 2022 and the positive capacitor terminal 20111 and the negative capacitor terminal 20112, respectively. For example, the positive terminal 2021 and the negative terminal 2022 can also be connected to the positive capacitor terminal 20111 and the negative capacitor terminal 20112, respectively, by laser welding.

[0046] For example, such as Figure 2A and Figure 3As shown, a gap 20071 is formed between the partition 2007 and the first recess 2003, and the first end 20211 of the positive terminal 2021 and the first end 20221 of the negative terminal 2022 form an arc-shaped segment structure deflecting to the second direction Y, so that the first end 20211 of the positive terminal 2021 and the first end 20221 of the negative terminal 2022 are respectively connected to the positive capacitor terminal 20111 and the negative capacitor terminal 20112 through the gap 20071, so that the internal structure of the shell 200 of the integrated capacitor 2 of the embodiment is more compact.

[0047] Exemplarily, the sidewall 2005 of the shell 200 of the embodiment is provided with a corresponding through hole (not shown in the figure) for the second end 20212 of the positive terminal 2021 and the second end 20222 of the negative terminal 2022 of the EMC filter 202 to pass through and extend out, which allows the positive terminal 2021 and the negative terminal 2022 of the EMC filter 202 to be electrically connected to an external device (for example, an inverter). Moreover, the second end 20212 of the positive terminal 2021 and the second end 20222 of the negative terminal 2022 form a bending structure outside the shell 200, and the EMC filter 202 of the embodiment forms a staggered structure with the shell 200 through the bending structure, which is conducive to insulation and volume reduction, and improves the integration of the integrated capacitor 2 of the embodiment.

[0048] Continuing to refer to Figure 2B and in combination with Figure 3 The EMC filter 202 of the embodiment further includes four X / Y capacitors 2024 and three ground terminals 2025. It can be understood that the number of the X / Y capacitors 2024 and the ground terminals 2025 of the EMC filter 202 of the embodiment is not limited, for example, the number of the X / Y capacitors 2024 can also be two, three, five, six or more, and the number of the ground terminals 2025 can also be two, four, five, six or more. For the convenience of description, four X / Y capacitors 2024 and three ground terminals 2025 are taken as examples for description below.

[0049] Specifically, as Figure 2B and Figure 3As shown, one part of the EMC filter 202 includes four X / Y capacitors 2024 and a first end 20251 of three ground terminals 2025. Another part of the EMC filter 202 includes a second end 20252 of each ground terminal 2025. The second end 20252 of each ground terminal 2025 is arranged inside the side wall 2005 of the housing 200. Two X / Y capacitors 2024 are arranged between the first end 20211 of the positive terminal 2021 and the side wall 2005 of the housing 200, and are connected to the positive terminal 2021 and the negative terminal 2022, respectively. The two X / Y capacitors 2024 share one ground terminal 2025 arranged on the side wall 2005 of the housing 200, which allows the two X / Y capacitors 2024 to be reliably grounded. The other two X / Y capacitors 2024 are arranged between the two magnetic rings 2023 and the partition 2007, and are connected to the positive terminal 2021 and the negative terminal 2022, respectively. The two X / Y capacitors 2024 share one ground terminal 2025 arranged on the partition 2007, which allows the two X / Y capacitors 2024 to be reliably grounded.

[0050] In addition, exemplary embodiments of the present application also include one ground terminal 2025 arranged on the side wall 2005 of the housing 200 and connected to the negative terminal 2022, which allows the negative terminal 2022 to be reliably grounded. Furthermore, the potting glue 203 of the embodiments of the present application covers the four X / Y capacitors 2024 and the first end 20251 of each ground terminal 2025 (i.e., the part of each ground terminal 2025 located inside the accommodating cavity 2001), and the second end 20252 of each ground terminal 2025 extends out of the potting glue 203.

[0051] Therefore, the positive terminal 2021, the negative terminal 2022, the magnetic ring 2023, the X / Y capacitor 2024, and the ground terminal 2025 of the EMC filter 202 are encapsulated in the housing 200 of the embodiments of the present application, which greatly simplifies the arrangement of the electrical structure. In particular, after the housing 200 is filled with the potting glue 203, the entire device only has the second end 20212 of the positive terminal 2021, the second end 20222 of the negative terminal 2022, and the second end 20252 of the ground terminal 2025 as external interfaces, making the entire device more compact.

[0052] In some possible implementations, reference is made to Figure 3 and in combination with Figure 2BThe copper bars 2012 of the embodiment of the application include positive copper bars 20121 and negative copper bars 20122. Along the first direction Z, a part of the positive copper bars 20121 and a part of the negative copper bars 20122 are respectively arranged on opposite sides of the capacitor core 2011. Similarly, the potting glue 203 covers a part of the positive copper bars 20121 and a part of the negative copper bars 20122 located in the accommodating cavity 2001, so as to jointly fix a part of the EMC filter 202, the capacitor core 2011 and a part of the copper bars 2012 in the accommodating cavity 2001.

[0053] Specifically, as shown in Figure 3 and Figure 2B A part of the positive copper bars 20121 includes a plate-shaped structure located on the upper surface 201101 of the capacitor core 2011 along the first direction Z, and the plate-shaped structure is welded with the upper surface 201101 of the capacitor core 2011. A part of the negative copper bars 20122 includes a plate-shaped structure located on the lower surface (not shown in the figure) of the capacitor core 2011 along the first direction Z, and the plate-shaped structure is welded with the lower surface of the capacitor core 2011. Exemplarily, the part of the positive copper bars 20121 further includes an extension segment 201211 extending downward along the first direction Z, and the extension segment 201211 covers the outer side surface 201102 between the upper surface 201101 and the lower surface of the capacitor core 2011.

[0054] In addition, another part of the positive copper bars 20121 includes three positive copper bar terminals 201212 extending downward along the first direction Z, and another part of the negative copper bars 20122 includes three negative copper bar terminals 201221 extending downward along the first direction Z. Along the second direction Y, the three positive copper bar terminals 201212 and the three negative copper bar terminals 201221 are arranged at intervals one by one and extend out of the accommodating cavity 2001 through the bottom wall 2008 of the shell 200.

[0055] Similarly, the bottom wall 2008 of the shell 200 of the embodiment of the application is provided with corresponding through holes (not shown in the figure) for the positive copper bar terminals 201212 and the negative copper bar terminals 201221 to pass through and extend out, which allows the positive copper bar terminals 201212 and the negative copper bar terminals 201221 to be electrically connected to external devices (for example, an inverter). Moreover, the positive copper bar terminals 201212 and the negative copper bar terminals 201221 form a bending structure outside the shell 200, and through the bending structure, the copper bars 2012 of the embodiment of the application form a staggered structure with the shell 200, which is conducive to insulation and reducing the volume and improving the integration of the integrated capacitor 2 of the embodiment of the application.

[0056] For example, each positive copper busbar terminal 201212 and each negative copper busbar terminal 201221 is provided with a connection hole 32 so that each positive copper busbar terminal 201212 and each negative copper busbar terminal 201221 can be electrically connected to an external device through the connection hole 32. However, it is not limited to this. The embodiments of this application do not limit the number and specific structure of the positive copper busbar terminals 201212 and the negative copper busbar terminals 201221. For example, the number of positive copper busbar terminals 201212 and the negative copper busbar terminals 201221 can also be one, two, four, five, six or more.

[0057] In addition, such as Figure 2B and Figure 3 As shown, the outer side of the housing 200 in this embodiment of the application is further provided with ten mounting portions. The ten mounting portions are spaced apart along the circumference of the housing 200 at the outer edge 20081 of the bottom wall 2008 of the housing 200, and each mounting portion has a mounting hole extending in the first direction Z. Exemplarily, each mounting portion is a fixing post 40 extending in the first direction Z, and each fixing post 40 has a fixing hole 41 extending in the first direction Z, so that the housing 200 of this embodiment of the application can be mounted and fixed to an external device (such as other electronic control devices inside a vehicle) through the fixing holes 41 of the ten fixing posts 40. However, this embodiment of the application does not limit the number and specific structure of the mounting portions. For example, the number of mounting portions in this embodiment of the application can be two, three, four, six, seven, eight, nine or more, and the mounting portions can also be threaded holes or other fixing structures such as elastic snap-fit ​​members.

[0058] In summary, the integrated capacitor 2 in this embodiment integrates the heat sink 2002, EMC filter 202, and capacitor 201 into the housing 200, improving the overall compactness of the heat sink 2002, EMC filter 202, and capacitor 201, occupying less space, and also improving heat dissipation efficiency. Furthermore, this embodiment does not limit the topology of the EMC filter 202; it is also applicable to other topologies such as current-fed boost-buck (CLC) topologies.

[0059] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. An integrated capacitor, characterized by The application relates to a shell, a capacitor and a filter. The shell has a containing cavity and a heat dissipation part, the heat dissipation part is arranged outside the bottom wall of the shell along a first direction, and a heat dissipation channel is arranged on the side of the heat dissipation part which is opposite to the containing cavity. The capacitor has a capacitor core, and the capacitor core is arranged in the containing cavity. Part of the filter is arranged in the containing cavity and connected with the capacitor core, and the part of the filter and the capacitor core are fixed in the containing cavity by pouring glue.

2. The integrated capacitor of claim 1, wherein, The shell comprises an opening, the containing cavity is communicated with the outside through the opening, the opening is used for the capacitor core and the part of the filter to pass through and enter the containing cavity, and the pouring glue covers the capacitor core and the part of the filter and seals the opening.

3. The integrated capacitor of claim 2, wherein, The heat dissipation part comprises a water inlet and a water outlet, and the shell comprises a first side wall and a second side wall. Along a second direction, the first side wall and the second side wall are oppositely arranged, the first side wall is provided with a first recess, the second side wall is provided with a second recess, the first recess corresponds to the water inlet, the second recess corresponds to the water outlet, the water inlet and the water outlet are arranged on opposite sides of the containing cavity and are communicated with the heat dissipation channel, and the first direction intersects with the second direction.

4. The integrated capacitor of claim 3, wherein, The shell further comprises a separation part which extends along the second direction and is connected with the outer side of the bottom wall of the first recess and the outer side of the bottom wall of the second recess respectively. Along a third direction, the part of the filter and the capacitor core are arranged on opposite sides of the separation part respectively, the first direction intersects with the third direction, and the second direction intersects with the third direction.

5. The integrated capacitor of claim 1, wherein, The shell further comprises a plurality of mounting parts which are arranged on the outer side of the shell and are arranged on the outer edge of the bottom wall of the shell in a circumferential direction, and each mounting part is provided with a mounting hole which extends along the first direction.

6. The integrated capacitor of claim 4, wherein, The capacitor further has a copper bar which comprises a positive copper bar and a negative copper bar, and along the first direction, part of the positive copper bar and part of the negative copper bar are arranged on opposite sides of the capacitor core respectively, and the pouring glue covers the part of the positive copper bar and the part of the negative copper bar.

7. The integrated capacitor of claim 6, wherein, Another part of the positive copper bar comprises a plurality of positive copper bar terminals which extend along the first direction and protrude out of the containing cavity through the bottom wall of the shell, and another part of the negative copper bar comprises a plurality of negative copper bar terminals which extend along the first direction and protrude out of the containing cavity through the bottom wall of the shell. Along the second direction, the plurality of positive copper bar terminals and the plurality of negative copper bar terminals are arranged in a one-to-one interval.

8. The integrated capacitor of claim 4, wherein, The part of the filter comprises a first end of a positive electrode terminal, a first end of a negative electrode terminal and a magnetic ring, the first end of the positive electrode terminal and the first end of the negative electrode terminal both pass through the magnetic ring in a second direction, the potting glue wraps the first end of the positive electrode terminal, the first end of the negative electrode terminal and the magnetic ring, another part of the filter comprises a second end of the positive electrode terminal and a second end of the negative electrode terminal, the second end of the positive electrode terminal and the second end of the negative electrode terminal both extend out of the accommodating cavity through the side of the accommodating cavity; The capacitor core further comprises a positive electrode capacitor terminal and a negative electrode capacitor terminal, the positive electrode capacitor terminal and the negative electrode capacitor terminal are arranged in a spaced manner in the second direction and are respectively connected with the first end of the positive electrode terminal and the first end of the negative electrode terminal.

9. The integrated capacitor of claim 8, wherein, The part of the filter further comprises a plurality of X / Y capacitors and a plurality of first ends of ground terminals, each of the X / Y capacitors is connected with the first end of the corresponding ground terminal and the positive electrode terminal or the negative electrode terminal, the potting glue covers the plurality of X / Y capacitors and the first end of each of the ground terminals, the other part of the filter further comprises a plurality of second ends of the ground terminals, each of the second ends of the ground terminals is arranged on the inner side of the side wall of the shell, and each of the second ends of the ground terminals extends out of the potting glue.

Images