Combined sensor and electronic equipment

Abstract

The utility model provides a combined sensor and electronic equipment. The combined sensor comprises a substrate, a first chip set and a second chip set, wherein the first chip set and the second chip set are arranged on the substrate; wherein a first isolation piece is arranged between the substrate and the first chip set, and a second isolation piece which is arranged in a manner of surrounding the first chip set is arranged on the first isolation piece; the first chip set and the second chip set are isolated through the first isolation piece and the second isolation piece. According to the utility model, the space can be saved, the product size can be reduced, and crosstalk among the chips can be effectively prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technician technical field more specifically, relate to a combination sensor and electronic equipment. BACKGROUND

[0002] With the progress of society and the development of technology, in recent years, the volume of electronic products such as mobile phones, computers and wearable devices is continuously reduced, and people's performance requirements for these portable electronic products are also higher and higher, so that the volume of electronic parts matched with them is also continuously reduced, and the performance and consistency are continuously improved. MEMS (Micro-Electro-Mechanical-System, abbreviated as MEMS) process integrated MEMS products begin to be applied in large quantities to such electronic products, and their packaging volume is smaller than that of traditional electronic devices, which is favored by most manufacturers.

[0003] At present, in the existing combination sensor or combination sensor, the conventional setting is to directly lay the acoustic chip and the pressure detection chip on the circuit board, which not only leads to the large overall size of the sensor, but also causes crosstalk between the chips, affecting the performance of the sensor. UTILITY MODEL CONTENT

[0004] In view of the above problems, the utility model aims to provide a combination sensor and electronic equipment to solve the problems that the existing sensor not only leads to the large overall size of the sensor, but also has poor environmental compatibility and consistency.

[0005] The combination sensor provided by the utility model comprises a substrate, a first chip group and a second chip group arranged on the substrate, wherein,

[0006] A first isolation piece is arranged between the substrate and the first chip group, and a second isolation piece surrounding the first chip group is arranged on the first isolation piece.

[0007] The first chip group and the second chip group are isolated by the first isolation piece and the second isolation piece.

[0008] In addition, the optional structural feature is that the first isolation piece is a metal layer attached to the substrate, and the first chip group is insulatively arranged on the metal layer.

[0009] In addition, the optional structural feature is that a first avoiding hole is arranged on the metal layer.

[0010] The first chip group is connected and conducted with the substrate through the conductive column in the first avoiding hole.

[0011] In addition, an optional structural feature is that the first isolation member is a copper foil layer exposed by the substrate.

[0012] The first chip set is fixed on the copper foil layer by solder resist or insulating glue.

[0013] In addition, an optional structural feature is that a second avoiding hole is arranged on the copper foil layer.

[0014] The first chip set is connected and conducted with the substrate through a conductive column in the second avoiding hole.

[0015] In addition, an optional structural feature is that the second isolation member comprises a metal ring or a metal shell covering the first chip set.

[0016] The metal ring or the metal shell is connected and conducted with the first isolation member.

[0017] In addition, an optional structural feature is that when the second isolation member is a metal shell, at least one pressure relief hole is arranged on the metal shell.

[0018] In addition, an optional structural feature is that the first chip set comprises a pressure ASIC chip arranged on the first isolation member and a pressure MEMS chip arranged on a side of the pressure ASIC chip away from the substrate.

[0019] The pressure ASIC chip is connected and conducted with the pressure MEMS chip, and the pressure ASIC chip is connected and conducted with the substrate through an electric connection line.

[0020] The second chip set comprises a microphone MEMS chip arranged on the substrate and a microphone ASIC chip arranged on the substrate or embedded in the substrate.

[0021] In addition, an optional structural feature is that the utility model further comprises a shell forming a packaging structure with the substrate and an acoustic hole.

[0022] The acoustic hole is arranged on the shell, or the acoustic hole is arranged on the substrate and conducted with the microphone MEMS chip.

[0023] In another aspect, the utility model also provides an electronic device comprising the combined sensor.

[0024] The combined sensor and the electronic device can effectively prevent electromagnetic interference between chips and improve sensor detection performance. BRIEF DESCRIPTION OF DRAWINGS

[0025] Other objects and advantages of the present application will become more apparent in light of the following description and accompanying drawings. In the drawings:

[0026] Figure 1 Structure diagram of a combined sensor according to an embodiment of the present application Figure 1 ;

[0027] Figure 2 Structure diagram of a combined sensor according to an embodiment of the present application Figure 2 ;

[0028] Figure 3 Structure diagram of a combined sensor according to an embodiment of the present application Figure 3 ;

[0029] Figure 4 Structure diagram of a combined sensor according to an embodiment of the present application Figure 4 .

[0030] The reference signs in the above drawings include: substrate 1, metal ring 21, metal shell 22, conductive piece 3, microphone MEMS chip 4, microphone ASIC chip 5, housing 6, pressure ASIC chip 7, pressure MEMS chip 8, avoiding hole 9, first isolation piece 11, insulating layer 12, sound hole 13, pressure relief hole 14, sound hole 61.

[0031] The same reference signs in all the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0032] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It is apparent, however, that the embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0033] In the following description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0034] To provide a detailed description of the combined sensor and electronic device of this utility model, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0035] Figures 1 to 4 Schematic structures of the combined sensor according to embodiments of the present invention are shown respectively.

[0036] like Figure 1 This Figure 4 As shown in the figure, the combined sensor of this utility model embodiment includes a substrate 1 and a first chip group and a second chip group disposed on the substrate 1; wherein, a first isolation member 11 is disposed between the substrate 1 and the first chip group, and a second isolation member is disposed on the first isolation member 11 surrounding the first chip group. The first isolation member 11 and the second isolation member cooperate to form an isolation space, and the first chip group is located in the isolation space. By isolating the first chip group and the second chip group through the first isolation member 11 and the second isolation member, electromagnetic interference between the chips can be effectively prevented, ensuring stable sensor detection performance.

[0037] In one specific embodiment of this utility model, the first isolation member 11 can be a metal layer attached to the substrate 1, and the first chip group is insulatedly disposed on the metal layer. In order to enable the first chip group to connect and conduct with the substrate 1, a first clearance hole is also provided on the metal layer. The first chip group is connected and conducts with the substrate 1 through the conductive post in the first clearance hole. The first chip group and the conductive post in the first clearance hole can be connected and conducted through an electrical connection wire, so as to realize the communication between the first chip group and the substrate 1 while isolating it from the metal layer to prevent signal interference.

[0038] In another specific embodiment of this utility model, the first isolation member 11 can be the exposed copper foil layer of the substrate 1, that is, the copper foil layer of the substrate 1 is partially exposed, forming the first isolation member 11 that cooperates with the second isolation member to form an isolation space. Similarly, in order to make the copper foil layer insulatingly limit the first chip group, the first chip group can be fixed on the copper foil layer with solder resist or insulating adhesive, that is, an insulating layer 12 is formed between the first chip group and the copper foil layer; at the same time, a second clearance hole is provided on the copper foil layer, and the first chip group is connected to the substrate 1 through the conductive post in the second clearance hole. The first chip group and the conductive post in the second clearance hole can be connected to each other through an electrical connection wire.

[0039] It should be noted that the first isolation piece 11 and the second isolation piece are metal pieces or conductive pieces, and the first isolation piece 11 and the second isolation piece need to be connected and conducted through tin paste or conductive glue or the like conductive piece 3, so as to form a safe isolation space for the first chip set, and the first isolation piece 11 and the second isolation piece are respectively insulated from the first chip set or arranged to be isolated from each other, so as to prevent interference on the chip.

[0040] Specifically, the first chip set can be fixed on the first isolation piece 11 through solder resist or insulating glue, and the area of the solder resist or the insulating glue is not less than the area of the first chip set, but is less than the area of the first isolation piece 11, so as to reserve space for the connection of the first isolation piece 11 and the second isolation piece. In addition, the second isolation piece can adopt a metal ring 21 or a metal shell 22 which is arranged on the first chip set in a covering mode; the metal ring 21 or the metal shell 22 is connected and conducted with the first isolation piece 11, and when the second isolation piece is the metal shell 22, at least one pressure relief hole 14 needs to be arranged on the metal shell 22, so as to ensure the accuracy of detection of the first chip set.

[0041] In the combined sensor of the embodiment of the utility model, the first chip set includes a pressure ASIC chip 7 arranged on the first isolation piece 11 and a pressure MEMS chip 8 arranged on the side of the pressure ASIC chip 7 away from the substrate 1; the pressure ASIC chip 7 and the pressure MEMS chip 8 are connected and conducted through an electric connecting line, the pressure ASIC chip 7 is connected and conducted with the substrate 1 through the electric connecting line, and the electric connecting line needs to be arranged through the avoiding hole 9 (the first avoiding hole or the second avoiding hole); the second chip set includes a microphone MEMS chip 4 arranged on the substrate 1 and a microphone ASIC chip 5 arranged on the substrate 1 or embedded in the substrate 1; in the case that the space is limited or the product size requirement is higher, the microphone ASIC chip 5 can be embedded in the substrate 1, so as to reduce the overall size of the sensor module, and be beneficial to the miniaturization development of the product.

[0042] In addition, the combined sensor of the utility model further includes a shell 6 forming a packaging structure with the substrate 1 and an acoustic hole; wherein the acoustic hole 61 can be arranged on the shell 6, such as shown in Figs. 1 and 2; or the acoustic hole 13 can also be arranged on the substrate 1 and connected and conducted with the microphone MEMS chip 4, such as shown in Figs. 3 and 4, and can be flexibly adjusted according to design requirements. Figure 1 and Figs. 3 and 4. Figure 2 As shown in Figs. 1 and 2. Figure 3 and Figs. 3 and 4. Figure 4

[0043] Corresponding to the above combined sensor, the utility model further provides an electronic equipment including the above combined sensor. Specifically, the embodiment of the electronic equipment can refer to the description in the combined sensor embodiment, which will not be described here.

[0044] ​According to the combination sensor and the electronic equipment, the first isolation piece is arranged between the substrate and the first chip set, the second isolation piece is arranged on the first isolation piece and surrounds the first chip set, the first chip set is insulatedly connected with the first isolation piece, and the substrate is connected in conduction, isolation protection of the first chip set is formed through the first isolation piece and the second isolation piece, electromagnetic interference between the chips can be effectively prevented, signal crosstalk problems can be overcome, and the detection performance of the sensor is improved; meanwhile, part of the chips in the second chip set can be embedded in the substrate, the occupied space of the chips is saved, and the purpose of reducing the size of the sensor is achieved.

[0045] The combination sensor and the electronic equipment according to the utility model are described above with reference to the drawings in an exemplary manner. However, it should be understood by those skilled in the art that various improvements can be made to the combination sensor and the electronic equipment according to the utility model without departing from the content of the utility model. Therefore, the protection scope of the utility model should be determined by the content of the appended claims.

Claims

1. A combination sensor characterized by, The combination sensor comprises a substrate, a first chip group and a second chip group arranged on the substrate, wherein a first isolation member is arranged between the substrate and the first chip group, and a second isolation member is arranged on the first isolation member and surrounds the first chip group; the first chip group and the second chip group are isolated by the first isolation member and the second isolation member.

2. The combination sensor according to claim 1, wherein the first isolation member is a metal layer attached to the substrate; the first chip group is arranged on the metal layer in an insulating manner.

3. The combination sensor according to claim 2, wherein a first avoiding hole is arranged on the metal layer; the first chip group is connected to the substrate in a conductive manner through a conductive column in the first avoiding hole.

4. The combination sensor according to claim 1, wherein the first isolation member is a copper foil layer exposed from the substrate; the first chip group is fixed on the copper foil layer by solder resist or insulating glue.

5. The combination sensor according to claim 4, wherein a second avoiding hole is arranged on the copper foil layer; the first chip group is connected to the substrate in a conductive manner through a conductive column in the second avoiding hole.

6. The combination sensor according to claim 1, wherein the second isolation member comprises a metal ring or a metal shell covering the first chip group; the metal ring or the metal shell is connected to the first isolation member in a conductive manner.

7. The combination sensor according to claim 6, wherein when the second isolation member is a metal shell, at least one pressure relief hole is arranged on the metal shell.

8. The combination sensor according to claim 1, wherein the first chip group comprises a pressure ASIC chip arranged on the first isolation member and a pressure MEMS chip arranged on a side of the pressure ASIC chip away from the substrate; the pressure ASIC chip is connected to the pressure MEMS chip in a conductive manner, and the pressure ASIC chip is connected to the substrate in a conductive manner through an electric connection line; the second chip group comprises a microphone MEMS chip arranged on the substrate and a microphone ASIC chip arranged on the substrate or embedded in the substrate.

9. The combination sensor of claim 8, wherein, a housing forming a packaging structure with the substrate and an acoustic hole, wherein the acoustic hole is arranged on the housing, or the acoustic hole is arranged on the substrate and connected to the microphone MEMS chip in a conductive manner.

10. An electronic device, comprising: The combination sensor comprises the combination sensor according to any one of claims 1 to 9.

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