Conductive PC board and display assembly

Abstract

The utility model relates to the technical field of PC boards, in particular to a conductive PC board, which comprises a PC board, one surface of the PC board is a conductive surface, and the other surface is a non-conductive surface; and the conductive silver paste layer is arranged on the conductive surface of the PC board. The conductive silver paste is printed on the surface of the PC board, so that the conductive silver paste is compounded with the PC board, smooth transmission of current on the PC board is ensured, stable conductive performance can be maintained, and the service life is prolonged. The utility model further relates to a display assembly which comprises the PC board. The conductive silver paste layer is arranged on the conductive surface of the PC board; the display diaphragm is arranged on the non-conductive surface of the PC board; the backlight module is located on the lower surface of the conductive silver paste layer; the electric control board is electrically connected with the backlight module; one end of the elastic conductor is electrically connected with the electric control board, and the other end of the elastic conductor is electrically connected with the conductive silver paste layer; the influence of the conductive silver paste layer on the display effect of the display diaphragm is avoided, and the reliability of the display assembly is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to PC board technical field especially relates to a kind of conductive PC board and display assembly. BACKGROUND

[0002] In the production process of existing PC board, conductive ink is usually printed on the surface of PC board to conduct electricity. However, the conductive ink may not adhere well to the surface of PC board, leading to ink peeling or falling off. In the printing process, there may also be uneven distribution of ink, leading to inconsistent conductivity.

[0003] In addition, some conductive ink takes a long time to dry on the PC board, which easily affects production efficiency and increases the risk of environmental pollution. In a high-temperature environment, the PC board may also deform or exhibit metal migration, affecting the performance of the conductive ink and reducing its stability in practical applications.

[0004] Due to the printing of conductive ink, the transparency or optical performance of the PC board may also be affected, leading to poor performance in some applications. SUMMARY

[0005] The utility model aims to provide a kind of conductive PC board and display assembly, improve the conductivity and stability of PC board.

[0006] To achieve the above purpose, the utility model employs the technical scheme of:

[0007] The utility model provides a kind of conductive PC board in the first aspect, comprising:

[0008] PC board, one side of the PC board is a conductive surface, and the other side is a non-conductive surface;

[0009] Conductive silver paste layer, the conductive silver paste layer is arranged on the conductive surface of the PC board, and the conductive silver paste layer is arranged in a grid shape; the conductive silver paste layer is made of conductive silver paste; the viscosity of the conductive silver paste is 10000~12000 mPa•S; the particle size of the conductive silver paste is ≤15 μm.

[0010] Further, the thickness of the PC board is 0.3±0.02mm.

[0011] Further, the thickness of the conductive silver paste layer is 0.02~0.05mm.

[0012] Further, the solid content of the conductive silver paste is 54±1wt%.

[0013] Further, the resistivity of the conductive silver paste is <25Ω•m.

[0014] Further, the adhesion of the conductive silver paste is 4B~5B.

[0015] The utility model discloses a second aspect provides a kind of display assembly, comprising:

[0016] PC board, one side of the PC board is conductive surface, and the other side is non-conductive surface;

[0017] Conductive silver paste layer, the conductive silver paste layer is arranged on the conductive surface of the PC board;

[0018] Display diaphragm, the display diaphragm is arranged on the non-conductive surface of the PC board;

[0019] Backlight module, the backlight module is located on the lower surface of the conductive silver paste layer;

[0020] Electric control board, the electric control board is electrically connected with the backlight module;

[0021] Elastic conductive body, one end of the elastic conductive body is electrically connected with the electric control board, and the other end of the elastic conductive body is electrically connected with the conductive silver paste layer.

[0022] Further, the display diaphragm is attached with the PC board by in-film composite process.

[0023] Further, the PC board is transparent PC board, and the light transmittance of the transparent PC board is greater than or equal to 45% and less than or equal to 55%.

[0024] Further, the backlight module includes backlight plate and a plurality of light sources arranged on the backlight plate.

[0025] Due to the above technical scheme, the utility model has the following advantages compared with prior art:

[0026] The conductive PC board in the utility model is printed with conductive silver paste with viscosity of 10000~12000 mPa•S and particle size ≤15 μm on the surface of PC board, so that the conductive silver paste is combined with the PC board, the stable conductive performance is maintained while ensuring smooth transmission of current on the PC board, and the service life is prolonged.

[0027] Further, the utility model integrates PC board, conductive silver paste layer, display diaphragm, backlight module, electric control board and elastic conductive body to form a display assembly, compared with the prior art that conductive silver paste layer is directly connected with display diaphragm, the influence of conductive silver paste layer on display effect of display diaphragm is avoided, and the reliability of the display assembly is improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are presented by way of illustration and not of limitation. The same reference numbers in the drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0029] Figure 1 is a schematic diagram of a conductive PC board provided in the present application (I);

[0030] Figure 2 is a schematic diagram of a conductive PC board provided in the present application (II);

[0031] Figure 3 is a schematic diagram of a display assembly provided in the present application;

[0032] In the drawings, the reference signs are explained as follows:

[0033] 1, PC board; 2, conductive silver paste layer; 3, display diaphragm; 4, backlight module; 401, backlight plate; 402, light source; 5, electric control board; 6, elastic conductor. DETAILED DESCRIPTION

[0034] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] Referring to Figure 1 and Figure 2 , the conductive PC board provided in the present application embodiment includes a PC board 1 and a conductive silver paste layer 2 arranged on the conductive surface of the PC board in a grid shape. The thickness of the PC board 1 is controlled at 0.3±0.02mm, and the thickness of the conductive silver paste layer 2 is controlled at 0.02~0.05mm. The specific thickness can be reasonably arranged and adjusted according to the needs, to ensure the conductivity and stability of the PC board.

[0036] For the thickness of the conductive silver paste layer 2, if the thickness of the conductive silver paste is printed too thick, the internal particles of the conductive silver paste layer 2 may be isolated from each other, thereby affecting the conductivity of the PC board. Moreover, the drying time of the thick conductive silver paste will be correspondingly prolonged, thereby affecting the production efficiency of the PC board. The thick conductive silver paste is also more likely to peel off or crack, affecting the mechanical strength. The too large thickness value may also cause the surface of the PC board to be uneven, affecting the subsequent assembly of components or connection of electrical devices.

[0037] If the thickness of the conductive silver paste is too thin, it may not provide sufficient conductivity, and it is difficult to ensure the uniformity of the printing. Therefore, the thickness of the conductive silver paste layer 2 should not be too thick or too thin.

[0038] In this embodiment, the conductive silver paste is printed on the PC board 1 to make the conductive silver paste and the PC board 1 work together. Unlike the prior art of printing conductive ink on the PC board 1, the conductive silver paste is much more resistant and has higher adhesion and durability.

[0039] In this embodiment, the components of the conductive silver paste in the conductive silver paste layer 2 are as follows: silver powder 45%, poly (vinyl chloride-CO-vinyl acetate-CO-maleic acid) 9%, diethylene glycol monoethyl ether acetate 46%. The silver powder serves as the main conductive body, and its small particle size enables the conductive silver paste to form a continuous and dense conductive network after curing. The poly (vinyl chloride-CO-vinyl acetate-CO-maleic acid) and diethylene glycol monoethyl ether acetate serve as carriers to uniformly disperse the silver powder and give the conductive silver paste good adhesion and flexibility.

[0040] For the above-mentioned conductive silver paste, the viscosity is 10000-12000 mPa•S, the particle size is ≤15 μm, the solid content is 54±1 wt%, the adhesion is 4B-5B, and the curing temperature is 70℃. The curing and sintering time of this kind of conductive silver paste is relatively short, and it can be cured at a relatively low temperature of 70℃. In addition, the binding force of this kind of conductive silver paste with PEN, PET and paper-based is relatively good, especially for the PET without surface treatment, and the printing suitability is relatively good.

[0041] When the above-mentioned conductive PC board is specifically prepared, the PC board 1 is first divided into strips according to production needs, and then the conductive silver paste is printed on the rough surface (i.e. the conductive surface) of the PC board 1. After printing, the PC board 1 is sent to the oven for drying and then discharged. Then, the appearance of the PC board 1 is checked for compliance (for qualified PC boards, the printing area should be confirmed for compliance after discharging, and the printing area should not have transfer printing, ink contamination, splashing, uneven printing, etc.). The impedance of the qualified PC board 1 is tested. After passing the test, the PC board 1 can be packed.

[0042] Generally, the drying temperature of the PC board 1 is set at 90±3℃, which should not be too high or too low. The PC board 1 has a low heat distortion temperature, and a too high drying temperature will cause it to deform, shrink or even melt. High temperature may also cause the optical performance of the PC board 1 to decrease, affecting its transparency and light scattering properties, especially in optical applications. In addition, high temperature will accelerate the degradation and aging of the material, which may cause the mechanical properties of the PC board 1 to decrease and shorten its service life.

[0043] If the drying temperature is set too low, the PC board 1 may absorb moisture during the production process, and the moisture cannot be effectively removed, which may cause problems such as bubbles and surface defects during subsequent processing, affecting the strength of the product.

[0044] In addition, when the appearance of the PC board 1 is qualified, the impedance value should be less than 10Ω, and it can be determined as qualified.

[0045] It should be noted that before printing the PC board 1, the above-mentioned conductive silver paste needs to be diluted, and generally a conductive silver paste diluent is used for dilution (the input ratio of conductive silver paste to diluent is 100:15). The conductive silver paste diluent used in this embodiment is a colorless transparent liquid, and the specific gravity of the diluent is 0.9, the boiling point is 180℃, and the viscosity is 100mPa•S. When the diluent is mixed with the conductive silver paste, a small amount is added at a time, and after addition, it needs to be stirred uniformly.

[0046] In the embodiment of the utility model, a display assembly is also provided, which comprises: a PC board 1, a conductive silver paste layer 2, a display diaphragm 3, a backlight module 4, an electric control board 5 and an elastic conductor 6.

[0047] Specifically, the above-mentioned conductive silver paste layer 2 is arranged on the conductive surface of the PC board 1, and the display diaphragm 3 is arranged on the non-conductive surface of the PC board 1, that is, the conductive silver paste layer 2 and the display diaphragm 3 are respectively located on the two sides of the PC board 1.

[0048] In this embodiment, the display diaphragm 3 and the PC board 1 are attached by a corresponding film-in composite process or a film-in decoration process. In the display assembly, the PC board 1 is a transparent PC board with certain light transmission performance, and the light transmission rate of the transparent PC board is greater than or equal to 45% and less than or equal to 55%. The light transmission rate of the PC board 1 is set in the above range, so that the PC board 1 will present a black and non-transparent state when the display assembly is in the screen-off state, thereby having good consistency in visual effect.

[0049] The PC material used to manufacture the above-mentioned PC board 1 generally has high strength and elasticity, strong impact resistance, which can effectively protect the internal structure of the display assembly; at the same time, it has high transparency and can be freely dyed, thereby facilitating the display of patterns; in addition, the PC material has strong weather resistance, temperature resistance and wear resistance, long service life; excellent electrical properties, low molding shrinkage, excellent dimensional stability, and convenient processing and manufacturing of the PC board 1.

[0050] The backlight module 4 is arranged on the lower surface of the conductive silver paste layer, that is, the backlight module 4 is arranged apart from the PC board 1, and the backlight module 4 and the conductive silver paste layer 2 are located on the same side of the PC board 1. The backlight module 4 in the embodiment of the utility model comprises a backlight plate 401 and a plurality of light sources 402 arranged on the backlight plate 401. The light emitted by the backlight module 4 can pass through the conductive silver paste layer 2, the PC board and the display film 3.

[0051] In the embodiment of the utility model, the electric control board 5 is further electrically connected to the backlight module 4, and the electric control board 5 supplies energy for the aforementioned light sources 402.

[0052] In addition, the utility model discloses an elastic conductor 6, one end of the elastic conductor 6 is electrically connected to the electric control board 5, and the other end of the elastic conductor 6 is electrically connected to the aforementioned conductive silver paste layer 2. When a person touches the PC board 1, a capacitor is formed between the human body and the conductive silver paste layer 2 and releases current, and the elastic conductor 6 transmits the current to the electric control board 5, so that the electric control board 5 controls the equipment using the display assembly to execute corresponding functions.

[0053] In conclusion, the conductive PC board disclosed in the utility model is printed with the conductive silver paste with low resistivity on the surface of the PC board 1, so that the conductive silver paste is combined with the PC board 1, the stable conductive performance is ensured while the current is smoothly transmitted on the PC board 1, and the service life is prolonged. The display assembly disclosed in the utility model integrates the PC board 1, the conductive silver paste layer 2, the display film 3, the backlight module 4, the electric control board 5 and the elastic conductor 6 to form a display assembly, compared with the prior art that the conductive silver paste layer is directly connected with the display film, the influence of the conductive silver paste layer 2 on the display effect of the display film 3 is avoided, and the reliability of the display assembly is improved.

[0054] The above embodiments are only for describing the technical concept and characteristics of the utility model, the purpose is to enable people skilled in the art to understand the content of the utility model and implement it, and it cannot limit the protection scope of the utility model, and equivalent changes or modifications according to the spirit and essence of the utility model should be covered in the protection scope of the utility model.

Claims

1. An electrically conductive PC board, characterized in that, The application relates to a PC plate (1) with a conductive surface and a non-conductive surface, a conductive silver paste layer (2) arranged on the conductive surface of the PC plate (1) and in a grid shape, and a display film (3) arranged on the non-conductive surface of the PC plate (1). The conductive silver paste layer (2) is made of conductive silver paste with a viscosity of 10000-12000 mPa.s and a particle size of less than or equal to 15 microns. The PC plate (1) has a thickness of 0.3+ / -0.02 mm, and the conductive silver paste layer (2) has a thickness of 0.02-0.05 mm. The conductive silver paste has a solid content of 54+ / -1 wt%, a resistivity of less than 25 ohm.m and an adhesion of 4B-5B.

2. The conductive PC board of claim 1, wherein, The application relates to a PC plate (1) with a conductive surface and a non-conductive surface, a conductive silver paste layer (2) arranged on the conductive surface of the PC plate (1), a display film (3) arranged on the non-conductive surface of the PC plate (1), a backlight module (4) arranged on the lower surface of the conductive silver paste layer (2), an electric control board (5) electrically connected with the backlight module (4), and an elastic conductive body (6) with one end electrically connected with the electric control board (5) and the other end electrically connected with the conductive silver paste layer (2).

3. The conductive PC board of claim 1, wherein, The display film (3) is attached to the PC plate (1) through an in-film compounding process.

4. A display assembly characterized by, The PC plate (1) is a transparent PC plate with a light transmittance of greater than or equal to 45% and less than or equal to 55%. The backlight module (4) comprises a backlight plate (401) and a plurality of light sources (402) arranged on the backlight plate (401). ​ ​ ​ ​ ​ 5. A display assembly according to claim 4, wherein, ​ 6. A display assembly according to claim 4, wherein, ​ 7. A display assembly according to claim 4, wherein, ​

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