High-precision plane step circuit board

Abstract

The utility model discloses a high-precision plane step circuit board, which comprises a circuit board body, a step groove is arranged on the circuit board body, bonding pads connected with a wiring layer are arranged on two sides of an opening of the step groove, and an inclined conical notch is arranged on one side of each bonding pad. According to the utility model, after the element is installed in the stepped groove, during welding, a part of tin liquid flows into the conical gap, and is fixed in the conical gap after being solidified, so that the connection effect of the element and the bonding pad is enhanced, and a part of the tin liquid can be filled between the element and the inner wall of the stepped groove, so that the connection between the element and the bonding pad is tighter; in addition, due to the fact that the conical notches obliquely extend from the inner side of the bonding pad to the outer side of the bonding pad, a barb structure is formed after the bonding pad is welded, and elements are not prone to loosening or falling off.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board, specifically relates to a high-precision plane step circuit board. BACKGROUND

[0002] The step circuit board is also called a stepped groove circuit board, and is a special type of printed circuit board; the stepped groove circuit board is provided with grooves with different depths and is used for mounting elements with different heights, such as mounting a patch capacitor, a patch resistor or a patch inductor, and can also well hide the elements to make the plane of the circuit board more flat; the more concentrated layout improves the density of element interconnection, optimizes the spatial layout, and can also reduce mutual interference.

[0003] The step circuit board is suitable for the demand of high-density and high-performance electronic equipment, is widely applied to the fields of data transmission, industrial automation, automobile electronics, the Internet of Things, 5G, communication, medical treatment, new energy, artificial intelligence and the like.

[0004] In the prior art, after the elements are mounted into the stepped groove, welding is usually directly performed on the solder pad. However, the elements are generally parallel to the surface of the circuit board in the stepped groove, and after welding, the element electrode and the solder pad can be loose or in poor contact due to temperature difference change or poor welding. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a high-precision plane step circuit board to solve the technical defects that the elements in the stepped groove of the existing step circuit board are prone to loosen or in poor contact after welding.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme.

[0007] A high-precision plane step circuit board comprises a circuit board body, the circuit board body is provided with a stepped groove, the two sides of the mouth of the stepped groove are provided with solder pads connected with a wiring layer, and the side of the solder pad is provided with an inclined conical notch.

[0008] As a preferred scheme of the utility model, the lower end of the conical notch extends into the wiring layer.

[0009] As a preferred scheme of the utility model, the wiring layer is covered with a solder resist layer.

[0010] As a preferred scheme of the utility model, the circuit board body is a multilayer circuit board.

[0011] As a preferred scheme of the utility model, the solder pad is a rectangular solder pad.

[0012] As a further scheme of the utility model, the inclination angle of the conical notch and the horizontal plane is 30°-60°.

[0013] As a further scheme of the utility model, the taper gap is provided with two groups, and the two groups of taper gaps are arranged at two sides of the stepped groove.

[0014] Compared with the prior art, the utility model provides a high-precision plane stepped circuit board with the following beneficial effects.

[0015] 1, after installing the component into the stepped groove, tin liquid will flow into the taper gap during welding, and is fixed in the taper gap after solidification, thereby enhancing the connecting effect of the component and the solder pad, and part of the tin liquid can also be filled between the component and the inner wall of the stepped groove, so that the connection between the component and the solder pad is more compact, and the contact failure is less likely to occur.

[0016] 2, since the taper gap extends from the inner side of the solder pad to the outer side in an inclined manner, a "barb" structure is formed after welding, so that the component is less likely to be loosened or dropped. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only an embodiment of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0018] Figure 1 It is a structural schematic diagram of the embodiment of the utility model.

[0019] Figure 2 It is an enlarged structural schematic diagram of A part in the embodiment of the utility model. Figure 1

[0020] Figure 3 It is a structural schematic diagram of the stepped groove in the embodiment of the utility model.

[0021] Mark: 100, circuit board body;200, stepped groove;201, taper gap;300, solder pad;400, solder resist layer;500, wiring layer. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0023] ​In the description of the embodiments of the present application, it should be understood that the terms "upper", "lower", "front", "back", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0024] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, integrally connected, or detachably connected, it can be the communication inside two elements, it can be directly connected or indirectly connected through an intermediate medium, and for those skilled in the art, the specific meaning of the above terms in the embodiments of the present application should be understood according to the specific circumstances.

[0025] Referring to the drawings Figures 1-3 As shown in the drawings, the utility model embodiment a high precision plane step circuit board, including circuit board body 100, the circuit board body 100 is set up on the stepped groove 200, the mouth both sides of stepped groove 200 are provided with the solder pad 300 connected with the wiring layer 500, the one side of solder pad 300 is provided with the inclined conical notch 201. Among them, the circuit board body 100 is multilayer circuit board.

[0026] Specifically, the wiring layer 500 is covered with a solder resist layer 400. The lower end of the conical notch 201 extends into the wiring layer 500. In order to maintain the depth of the conical notch 201 and effective design, the conical notch 201 needs to extend a deep distance downward during implementation.

[0027] During implementation, the solder pad 300 is a rectangular solder pad. The rectangular solder pad facilitates increasing the contact area with the electrodes of the component, and also facilitates the processing of the conical notch 201. The inclination angle of the conical notch 201 with the horizontal plane is 30°-60°, and during implementation, an angle of 45° is preferably processed. The conical notch 201 is provided with two groups, and the two groups of conical notches 201 are respectively arranged on the two sides of the stepped groove 200. The two groups of conical notches 201 correspond to the two end electrodes of the component, and if symmetrically arranged, it is more convenient to fix the two ends of the component.

[0028] After the component is installed into the stepped groove 200, when soldering, tin liquid will flow into the conical gap 201, and after solidification, the tin liquid is fixed in the conical gap 201, the connection effect of the component and the soldering pad is strengthened, and part of the tin liquid can be filled between the component and the inner wall of the stepped groove 200, so that the connection of the component and the soldering pad 300 is more compact, and the contact failure is not easy to occur. Since the conical gap 201 is inclined and extends from the inner side to the outer side of the soldering pad 300, after soldering, a structure similar to a "barb" is formed, and the component is not easy to come off; it is also not easy to loosen or fall off.

[0029] The basic principles of the present application are shown and described above, and the above is only the preferred embodiment of the present application, and is not used to limit the present application, and the above embodiment and the description in the specification only illustrate the principles of the present application, and any modification, equivalent replacement and improvement within the scope of the present application should be included in the protection scope of the present application.

Claims

1. A high-precision planar stepped wiring board, characterized by: The application relates to a circuit board body (100) provided with a stepped groove (200), the two sides of the mouth of the stepped groove (200) are provided with solder pads (300) connected with a wiring layer (500), and the side of the solder pads (300) is provided with an inclined conical notch (201).

2. The high-precision planar stepped circuit board according to claim 1, wherein: The lower end of the conical notch (201) extends into the wiring layer (500).

3. The high-precision planar stepped circuit board of claim 1, wherein: The wiring layer (500) is covered with a solder resist layer (400).

4. The high-precision planar stepped circuit board of claim 1, wherein: The circuit board body (100) is a multilayer circuit board.

5. The high-precision planar stepped circuit board of claim 1, wherein: The solder pads (300) are rectangular solder pads.

6. The high-precision planar stepped circuit board according to claim 5, wherein: The inclination angle of the conical notch (201) with a horizontal plane is 30-60 degrees.

7. The high-precision planar stepped circuit board according to claim 6, wherein: The conical notch (201) is provided with two groups, and the two groups of conical notches (201) are arranged on the two sides of the stepped groove (200).

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