IC carrier plate copper foil angle twisting mechanism

Abstract

The utility model discloses an IC carrier plate copper foil angle twisting mechanism which comprises a machine table and an angle twisting mechanism body, the angle twisting mechanism body comprises a diagonal air cylinder, a support plate, a vertical plate, a pressing plate air cylinder, a pressing plate arm, an air cylinder seat, an angle twisting air cylinder, an angle twisting arm and an angle twisting cutter, and the contact face of the angle twisting cutter and a plate on the machine table is of an L-shaped structure. According to the utility model, the angle twisting cylinder is repeatedly started and reset, so that the angle twisting cutter performs reciprocating twisting on the copper foil of the IC carrier plate, and when the IC carrier plate is in contact with the bending part of the L-shaped structure due to relative movement between the L-shaped structure and the IC carrier plate, the angle twisting cutter is hinged to the angle twisting arm, so that the IC carrier plate is prevented from being damaged. The L-shaped structure of the angle twisting cutter can move relative to the side edge of the IC carrier plate in the vertical direction, so that the corners of the copper foil are warped, the whole copper foil can be stripped conveniently, manual operation is reduced, the efficiency of angle twisting work is guaranteed, the hands of an operator are prevented from being injured in the angle twisting process, and the safety of overall work is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board production and processing, especially relates to a IC carrier plate copper foil angle rubbing mechanism. BACKGROUND

[0002] After the IC carrier plate is pressed, copper foil is used on the surface and the back surface to protect the carrier plate, so the copper foil needs to be separated and removed after pressing to avoid interference or influence on the subsequent process. In the prior art, the corner of the copper foil is usually rubbed by manual method to make the edge of the copper foil lift up, thereby facilitating the stripping of the copper foil. This method is low in efficiency and cannot meet the needs of mass production and processing. At the same time, this manual angle rubbing method is easy to cause injury to the fingers or hands of the operator, and if protective articles such as gloves are worn, the angle rubbing efficiency will be affected.

[0003] Therefore, the prior art has defects and needs to be improved. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at overcoming the defects of the prior art and providing an IC carrier plate copper foil angle rubbing mechanism.

[0005] The technical scheme of the utility model is as follows: an IC carrier plate copper foil angle rubbing mechanism is provided, which comprises a machine table and a plurality of angle rubbing mechanisms arranged at any inner corner positions of the machine table. The angle rubbing mechanism comprises a diagonal cylinder arranged at the inner corner position of the machine table, a support plate arranged at the output end of the diagonal cylinder, a vertical plate arranged on the support plate, a pressing plate cylinder arranged on the vertical plate, a pressing plate arm connected with the output end of the pressing plate cylinder, a cylinder seat arranged on the support plate, a angle rubbing cylinder arranged on the cylinder seat, a angle rubbing arm connected with the output end of the angle rubbing cylinder, and a angle rubbing cutter hinged to the front end of the angle rubbing arm. The contact surface of the angle rubbing cutter and the plate on the machine table is in L-shaped structure.

[0006] Further, the contact surface of the angle rubbing cutter and the plate placed on the machine table faces upward or downward.

[0007] Further, the connecting surface of the cylinder seat in contact with the angle rubbing cylinder is a horizontal surface, or a slanted surface with one end close to the center of the machine table higher than the other end away from the center of the machine table.

[0008] Further, an elastic member is arranged between the angle rubbing arm and the angle rubbing cutter.

[0009] Further, the adjacent angle rubbing mechanisms are arranged on the adjacent inner corners of the machine table, or in the diagonal direction of the machine table.

[0010] Further, the machine table is provided with a plurality of beaters alignment mechanisms, which are correspondingly arranged on the side positions of the machine table.

[0011] Further, the beater alignment mechanism adopts a pneumatic beater mechanism, which comprises a beater cylinder arranged at the bottom of the machine table and a beater seat connected with the output end of the beater cylinder, wherein the beater seat is provided with a plurality of beater blocks which extend through the machine table to a position higher than the upper surface of the machine table.

[0012] Further, the beater alignment mechanism adopts an electric beater mechanism, which comprises a motor driving module arranged at the bottom of the machine table and a beater seat connected with the output end of the motor driving module, wherein the beater seat is provided with a plurality of beater blocks which extend through the machine table to a position higher than the upper surface of the machine table.

[0013] By repeatedly starting and resetting the angle rolling cylinder, the angle rolling cutter reciprocally rolls on the copper foil of the IC board, and when the L-shaped structure and the IC board relatively move to make the copper foil of the IC board contact the bent portion of the L-shaped structure, the angle rolling cutter rotates around the hinge position to avoid the copper foil, and in the process of avoiding the copper foil, the L-shaped structure of the angle rolling cutter relatively moves with the side of the IC board in the up-down direction, so that the corner of the copper foil is lifted to realize the angle rolling action, which facilitates the peeling of the whole copper foil, reduces manual operation, ensures the efficiency of the angle rolling work, avoids the damage to the hands of the operator during the angle rolling process, and improves the safety of the whole work. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a top view of the utility model.

[0015] Figure 2 It is a structure schematic view of the angle rolling mechanism corresponding to the copper foil angle rolling work on the surface of the IC board.

[0016] Figure 3 It is a structure schematic view of the angle rolling mechanism corresponding to the copper foil angle rolling work on the bottom surface of the IC board.

[0017] Figure 4 It is a bottom view of the utility model. DETAILED DESCRIPTION

[0018] The utility model will be described in detail below in combination with the drawings and specific embodiments.

[0019] Please refer to Figures 1 to 3The utility model provides a kind of IC carrier plate copper foil angle twisting mechanism, comprising: machine table 1, and several angle twisting mechanisms 2 being set in the arbitrary inner corner position of the machine table 1, the angle twisting mechanism 2 includes: diagonal cylinder 21 being set in the inner corner position of the machine table 1, support plate 22 being set in the output of the diagonal cylinder 21, vertical plate 23 being set in the support plate 22, pressing plate cylinder 24 being set in the vertical plate 23, the pressing plate arm 25 being connected with the output of the pressing plate cylinder 24, cylinder seat 26 being set in the support plate 22, angle twisting cylinder 27 being set in the cylinder seat 26, the angle twisting arm 28 being connected with the output of the angle twisting cylinder 27, and angle twisting cutter 29 being hinged in the front end of the angle twisting arm 28, the contact surface of the angle twisting cutter 29 and the plate on the machine table 1 is L-shaped structure.

[0020] When angle twisting is carried out, first, the IC carrier plate on which copper foil needs to be twisted is placed on the machine table 1, the diagonal cylinder 21 is started, the support plate 22 is moved towards the inner corner of the IC carrier plate, and the angle twisting cutter 29 is brought into contact with the side of the IC carrier plate on which angle twisting needs to be carried out. The pressing plate cylinder 24 is started, the pressing plate arm 25 is driven to move downwards, so that the IC carrier plate is pressed on the machine table 1 by the pressing plate arm 25, to avoid the IC carrier plate from sliding during angle twisting and affecting the angle twisting effect. Then, the angle twisting cylinder 27 is repeatedly started and reset multiple times, so that the angle twisting cutter 29 reciprocally rubs on the copper foil of the IC carrier plate. When the L-shaped structure comes into contact with the IC carrier plate at the bending position of the L-shaped structure due to relative movement between the L-shaped structure and the IC carrier plate, the angle twisting cutter 29 rotates about the hinge position to avoid the IC carrier plate, and in the process of avoiding, the L-shaped structure of the angle twisting cutter 29 moves relative to the side of the IC carrier plate in the upward and downward directions, so that the edge and corner of the copper foil are raised, the action of angle twisting is realized, and the whole copper foil is conveniently peeled off.

[0021] In some embodiments, the contact surface of the angle twisting cutter 29 and the plate placed on the machine table 1 faces upwards or downwards. In actual work, the surface and the bottom surface of the IC carrier plate are respectively attached with copper foil, to provide protection for the IC carrier plate. If only one of the surface or the bottom surface of the IC carrier plate is twisted by the angle twisting cutter 29 during angle twisting, and then the other surface is twisted after the IC carrier plate is turned over, this way will greatly affect the overall processing efficiency, and there is a situation of missing or repeated angle twisting, which is not conducive to improving the overall processing efficiency. Therefore, in some optional embodiments, two groups of angle twisting mechanisms 2 are provided on the machine table 1, to correspond to the angle twisting work of the copper foil on the surface and the bottom surface of the IC carrier plate. The contact surface of the angle twisting cutter 29 of the angle twisting mechanism 2 corresponding to the surface copper foil faces downwards, and the contact surface of the angle twisting cutter 29 of the angle twisting mechanism 2 corresponding to the bottom copper foil faces upwards, to respectively meet the angle twisting work of the surface copper foil and the bottom copper foil.

[0022] In some embodiments, a resilient member is arranged between the angle rolling arm 28 and the angle rolling cutter 29. Specifically, the resilient member is a spring or a torsion spring.

[0023] When the resilient member is a spring, the spring is arranged at the back side of the contact surface between the angle rolling cutter 29 and the IC carrier, so as to tilt the angle rolling cutter 29 out of the angle rolling arm 28, avoiding the influence on the angle rolling effect of the copper foil attached on the IC carrier due to the same plane height of the angle rolling cutter 29 and the angle rolling arm 28. Meanwhile, when the angle rolling cutter 29 acts on the IC carrier, the IC carrier pushes the angle rolling cutter 29 and compresses the spring, so as to make the angle rolling cutter 29 avoid the position around the hinge shaft, and due to the elastic effect of the spring, the angle rolling cutter 29 is always attached to the edge of the copper foil of the IC carrier, and the friction between the angle rolling cutter 29 and the edge of the copper foil is increased, so as to facilitate the edge of the copper foil to be rolled up and the angle of the copper foil to be rolled up.

[0024] When the resilient member is a torsion spring, the torsion spring is arranged on the hinge shaft between the angle rolling cutter 29 and the angle rolling arm 28, so as to tilt the angle rolling cutter 29 out of the angle rolling arm 28, avoiding the influence on the angle rolling effect of the copper foil attached on the IC carrier due to the same plane height of the angle rolling cutter 29 and the angle rolling arm 28. Meanwhile, when the angle rolling cutter 29 acts on the IC carrier, the IC carrier pushes the angle rolling cutter 29 and the torsion spring is twisted, so as to make the angle rolling cutter 29 avoid the position around the hinge shaft, and due to the elastic effect of the torsion spring, the angle rolling cutter 29 is always attached to the edge of the copper foil of the IC carrier, and the friction between the angle rolling cutter 29 and the edge of the copper foil is increased, so as to facilitate the edge of the copper foil to be rolled up and the angle of the copper foil to be rolled up.

[0025] In some embodiments, the connecting surface of the cylinder seat 26 in contact with the angle rolling cylinder 27 is a horizontal surface, or an inclined surface with one end close to the center of the machine table 1 higher than the other end away from the center of the machine table 1.

[0026] When the angle rolling mechanism 2 for the copper foil with corresponding surface is used, the connecting surface of the cylinder seat 26 is arranged as an inclined surface, so that the angle rolling arm 28 extends upward in an inclined manner, which can meet the angle rolling demand of the copper foil of the IC carrier with different specifications and sizes.

[0027] When the angle rolling mechanism 2 for the copper foil with corresponding bottom surface is used, the connecting surface of the cylinder seat 26 is arranged as a horizontal surface, which can avoid the collision between the angle rolling arm 28 or the angle rolling cutter 29 and the machine table 1 during the movement of the angle rolling cylinder 21 driving the bracket plate 22, and improve the safety of the overall mechanism.

[0028] In some embodiments, the adjacent corner-rubbing mechanisms 2 are located at adjacent inner corners of the machine base 1, or along a diagonal direction on the machine base 1. When the adjacent corner-rubbing mechanisms 2 are located at adjacent inner corners of the machine base 1, the IC carrier can be placed from the side of the machine base 1 where the corner-rubbing mechanisms 2 are not located during placement and removal, avoiding interference from the corner-rubbing mechanisms 2 that could affect the feeding and unloading of the IC carrier. When the adjacent corner-rubbing mechanisms 2 are located along a diagonal direction on the machine base 1, the direction of the force on the IC carrier is more stable during corner-rubbing, preventing the IC carrier from shifting due to force during the corner-rubbing process, which could adversely affect the corner-rubbing effect.

[0029] In some embodiments, please refer to Figure 1 , Figure 4 The machine base 1 is equipped with several plate alignment mechanisms 3, which are correspondingly located on the side of the machine base 1. After the IC carrier is placed on the machine base 1, the placement position of the IC carrier is adjusted by the plate alignment mechanisms 3, so that the inner corner of the IC carrier can be stably located in the working area of ​​the corner-rubbing mechanism 2, which satisfies the corner-rubbing and corner-raising work of the copper foil on the IC carrier.

[0030] In some embodiments, the clapping mechanism 3 is a pneumatic clapping mechanism, which includes a clapping cylinder 311 disposed at the bottom of the machine base 1 and a clapping base 32 connected to the output end of the clapping cylinder 311. The clapping base 32 is provided with a plurality of clapping plates 33, which extend through the machine base 1 to a position above the upper surface of the machine base 1. The clapping cylinder 311 drives the clapping base 32 to move, causing the clapping plates 33 to move towards the center of the machine base 1, thereby pushing the IC carrier board and centering the IC carrier board.

[0031] In some embodiments, the clapping mechanism 3 is an electric clapping mechanism, which includes: a motor drive module 312 disposed at the bottom of the machine base 1, and a clapping base 32 connected to the output end of the motor drive module 312. The clapping base 32 is provided with a plurality of clapping plates 33, which extend through the machine base 1 to a position above the upper surface of the machine base 1. The motor drive module 312 drives the clapping base 32 to move, causing the clapping plates 33 to move towards the center of the machine base 1, thereby pushing the IC carrier board and centering it.

[0032] In summary, the utility model discloses repeatedly start and reset the angle rolling cylinder 27 multiple times, make the angle rolling cutter 29 reciprocating rolling on the copper foil of IC carrier plate, when the L type structure and IC carrier plate contact because of relative movement between L type structure and IC carrier plate, because the angle rolling cutter 29 is articulated on the angle rolling arm 28, therefore the angle rolling cutter 29 will rotate and avoid the position around the articulated position, in the process of avoiding the position, the L type structure of angle rolling cutter 29 will move with the side of IC carrier plate in the relative movement of up and down direction, so that the edge of copper foil is raised, realize the action of angle rolling, facilitate the whole copper foil to be peeled, reduce manual operation, guarantee the efficiency of angle rolling work, and avoid the harm to the hand of operator in the process of angle rolling, improve the security of overall work.

[0033] The above is only the preferred embodiment of the utility model, and is not used for limiting the utility model, and any modification, equivalent replacement and improvement etc. in the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. An IC carrier board copper foil skewing mechanism characterized by comprising: The utility model relates to a machine table and a plurality of angle rolling mechanisms arranged at any inner corner position of the machine table, the angle rolling mechanism comprising: a diagonal cylinder arranged at the inner corner position of the machine table, a support plate arranged at the output end of the diagonal cylinder, a vertical plate arranged at the support plate, a pressing plate cylinder arranged at the vertical plate, a pressing plate arm connected with the output end of the pressing plate cylinder, a cylinder seat arranged at the support plate, an angle rolling cylinder arranged at the cylinder seat, an angle rolling arm connected with the output end of the angle rolling cylinder, and an angle rolling cutter hinged at the front end of the angle rolling arm, wherein the contact surface of the angle rolling cutter with the plate on the machine table is in an L-shaped structure. The contact surface of the angle rolling cutter with the plate placed on the machine table faces upwards or downwards.

2. The IC board copper foil skewing mechanism according to claim 1, wherein The connecting surface of the cylinder seat in contact with the angle rolling cylinder is a horizontal surface or an inclined surface with one end close to the center of the machine table higher than the other end away from the center of the machine table.

3. The IC board copper foil skewing mechanism according to claim 1, wherein An elastic member is arranged between the angle rolling arm and the angle rolling cutter.

4. The IC board copper foil skewing mechanism according to claim 1, wherein Adjacent angle rolling mechanisms are arranged at adjacent inner corner positions on the machine table or in the diagonal direction on the machine table.

5. The IC board copper foil skewing mechanism according to claim 1, wherein A plurality of beat plate alignment mechanisms are arranged on the machine table, and the beat plate alignment mechanisms are arranged at the side edge positions on the machine table.

6. The IC Substrate Copper Foil Skewing Mechanism of claim 1, wherein, The beat plate alignment mechanism adopts a pneumatic beat plate mechanism, which comprises a beat plate cylinder arranged at the bottom of the machine table and a beat plate seat connected with the output end of the beat plate cylinder, wherein the beat plate seat is provided with a plurality of beat plate blocks, and the beat plate blocks extend through the machine table to a position higher than the upper surface of the machine table.

7. The IC board copper foil skewing mechanism according to claim 6, wherein The beat plate alignment mechanism adopts an electric beat plate mechanism, which comprises a motor drive module arranged at the bottom of the machine table and a beat plate seat connected with the output end of the motor drive module, wherein the beat plate seat is provided with a plurality of beat plate blocks, and the beat plate blocks extend through the machine table to a position higher than the upper surface of the machine table.

8. The IC board copper foil skewing mechanism according to claim 6, wherein ​

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