LED structure

Abstract

The utility model discloses a light-emitting diode (LED) structure, which belongs to the technical field of LED lamps and comprises a substrate, an LED chip, a reflection supporting piece, a fluorescent glue layer and a packaging glue layer, the LED chip and the reflection supporting piece are both installed on the substrate, and the reflection supporting piece is arranged around the periphery of the LED chip and is attached to the outer wall of the LED chip. The fluorescent glue layer is installed on the LED chip, and at least part of the fluorescent glue layer is arranged on the reflection supporting body. The packaging adhesive layer is mounted on the fluorescent adhesive layer, and the width of the packaging adhesive layer is greater than or equal to that of the fluorescent adhesive layer; when the width of the packaging adhesive layer is larger than that of the fluorescent adhesive layer, the packaging adhesive layer can be inversely buckled on the fluorescent adhesive layer, the inner wall of the packaging adhesive layer is attached to the outer wall of the fluorescent adhesive layer, and light of the LED chip is emitted towards the periphery through the packaging adhesive layer after being excited by the fluorescent adhesive layer, so that top-surface and four-surface light emitting of the LED structure is realized, and the LED structure has a multi-surface light emitting function.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of LED lamp, in particular to a LED structure. BACKGROUND

[0002] The LED structure on the market generally includes substrate, LED chip, fluorescent glue layer, encapsulation glue layer, reflection wall, the LED chip is installed on the substrate, the reflection wall is arranged at the both sides of LED chip, then the fluorescent glue layer and encapsulation glue layer are laid on the LED chip, the existing reflection wall simple structure leads to the existing LED structure can only single side emit light. SUMMARY

[0003] The utility model aims at improving the problem that the existing LED structure can only single side emit light, provides a kind of LED structure.

[0004] The technical scheme for achieving the above-mentioned purposes includes the following:

[0005] LED structure, including: substrate, LED chip, reflection support, fluorescent glue layer, encapsulation glue layer, the LED chip, reflection support are installed on the substrate, and the reflection support is arranged around the periphery of LED chip, and is attached with the outer wall of LED chip;

[0006] The fluorescent glue layer is installed on the LED chip, and the fluorescent glue layer is at least partially arranged on the reflection support;The encapsulation glue layer is installed on the fluorescent glue layer, and the width of the encapsulation glue layer is greater than or equal to the width of the fluorescent glue layer;

[0007] The reflection support is L-shaped, and the reflection support has L-shaped groove, and the encapsulation glue layer is at least partially arranged in the L-shaped groove.

[0008] In one embodiment, the width of the encapsulation glue layer is equal to the width of the fluorescent glue layer, the L-shaped groove of the reflection support is arranged towards the LED chip, and the end of the encapsulation glue layer and the fluorescent glue layer is installed in the L-shaped groove of the reflection support.

[0009] In one embodiment, the width of the encapsulation glue layer is greater than the width of the fluorescent glue layer, the L-shaped groove of the reflection support is arranged away from the LED chip, and the end of the encapsulation glue layer is installed in the L-shaped groove of the reflection support.

[0010] In one embodiment, the encapsulation glue layer includes a first transmissive body, a second transmissive body and a third transmissive body, the second transmissive body and the third transmissive body are respectively installed at both ends of the first transmissive body, and form a door-shaped structure.

[0011] The fluorescent glue layer is arranged between the second transmissive body and the third transmissive body.

[0012] In one embodiment, the reflective support comprises a first support body, a second support body, the first support body is mounted on the second support body, the first support body has a first support surface and a first reflective surface, and the second support body has a second reflective surface;

[0013] When the width of the encapsulation layer is equal to the width of the fluorescent layer, the fluorescent layer is at least partially mounted on the first support surface, the first reflective surface is attached to the sidewall of the LED chip, and the second reflective surface is attached to the sidewall of the encapsulation layer and the fluorescent layer.

[0014] In one embodiment, the second support body further has a third reflective surface and a second support surface, the third reflective surface is attached to the sidewall of the LED chip, and when the width of the encapsulation layer is greater than the width of the fluorescent layer, the encapsulation layer is at least partially mounted on the first support surface, the fluorescent layer is at least partially mounted on the second support surface, and the encapsulation layer is at least partially attached to the sidewall of the fluorescent layer.

[0015] In one embodiment, the first reflective surface, the second reflective surface, and the third reflective surface are arranged in parallel, and the first support surface and the second support surface are arranged in parallel.

[0016] And the first reflective surface is perpendicular to the first support surface.

[0017] In one embodiment, the fluorescent layer comprises glue, fluorescent powder, diluent, and diffusion powder, and the mass ratio of the glue, the fluorescent powder, the diluent, and the diffusion powder is 1:1.5:1.5:(0.04-0.08).

[0018] In one embodiment, the encapsulation layer comprises glue and diffusion powder, and the mass ratio of the glue and the diffusion powder is 1:(0.045-0.095).

[0019] In one embodiment, the substrate is at least partially made of ceramic or silicon carbide.

[0020] The technical solution provided by the utility model has the following advantages and effects:

[0021] When the width of the encapsulation glue layer is equal to the width of the fluorescent glue layer, the inner wall of the reflective support is used to be attached with the outer wall of the encapsulation glue layer and the fluorescent glue layer, the light generated by the LED chip is emitted after penetrating the encapsulation glue layer after excitation by the fluorescent glue layer, and single-side light emission of the LED structure is realized. When the width of the encapsulation glue layer is greater than the width of the fluorescent glue layer, the encapsulation glue layer can be inverted on the fluorescent glue layer, the inner wall of the reflective support is used to shield the light of the LED chip, the inner wall of the encapsulation glue layer is attached with the outer wall of the fluorescent glue layer, and the light of the LED chip is emitted towards the surrounding after excitation by the fluorescent glue layer through the encapsulation glue layer, top and four-side light emission of the LED structure is realized, and the LED structure has the function of multi-face light emission. BRIEF DESCRIPTION OF DRAWINGS

[0022] The drawings of the present application show the specific examples of the technical scheme of the present application, and constitute a part of the specification together with the specific embodiments, for explaining the technical scheme, principle and effect of the present application.

[0023] Unless specifically stated or defined otherwise, the same reference signs in different drawings represent the same or similar technical features, and different reference signs may also be used to represent the same or similar technical features.

[0024] Figure 1 is a schematic diagram of the LED structure in an embodiment of the present application Figure 1 ;

[0025] Figure 2 is a schematic diagram of the LED structure in an embodiment of the present application Figure 2 ;

[0026] Figure 3 is a schematic diagram of the reflective support in an embodiment of the present application Figure 1 ;

[0027] Figure 4 is a schematic diagram of the reflective support in an embodiment of the present application Figure 2 ;

[0028] Figure 5 is a schematic diagram of the encapsulation glue layer in an embodiment of the present application

[0029] BRIEF DESCRIPTION OF DRAWINGS

[0030] 100, LED structure

[0031] 1, substrate

[0032] 2, LED chip

[0033] 3, reflective support; 31, first support body; 311, first support surface; 312, first reflective surface; 32, second support body; 321, second reflective surface; 322, third reflective surface; 323, second support surface; 33, L-shaped groove;

[0034] 4, fluorescent glue layer;

[0035] 5, encapsulation glue layer; 51, first transmission body; 52, second transmission body; 53, third transmission body. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the present application, the specific embodiments of the present application will be described in more detail below with reference to the accompanying drawings.

[0037] Unless specifically stated or otherwise defined, the "first, second" used in this paper is only used for the differentiation of the name, and does not represent the specific quantity or order.

[0038] Unless specifically stated or otherwise defined, the term "and / or" used in this paper includes any and all combinations of one or more related listed items.

[0039] It should be noted that when an element is considered to be "fixed" to another element, it can be directly fixed to another element, or there can be a middle element; when an element is considered to be "connected" to another element, it can be directly connected to another element, or there can be a middle element; when an element is considered to be "mounted" to another element, it can be directly mounted to another element, or there can be a middle element. When an element is considered to be "provided" in another element, it can be directly provided in another element, or there can be a middle element.

[0040] The present application provides a kind of LED structure 100, as shown in Figure 1 And Figure 2 As shown, it includes substrate 1, LED chip 2, reflective support 3, fluorescent glue layer 4, encapsulation glue layer 5, LED chip 2, reflective support 3 are installed on substrate 1, and reflective support 3 is set around the periphery of LED chip 2, and is attached with the outer wall of LED chip 2;Fluorescent glue layer 4 is installed on LED chip 2, and fluorescent glue layer 4 is at least partially set on reflective support 3 body;Encapsulation glue layer 5 is installed on fluorescent glue layer 4, and the width of encapsulation glue layer 5 is greater than or equal to the width of fluorescent glue layer 4;When the width of encapsulation glue layer 5 is equal to the width of fluorescent glue layer 4, the inner wall of reflective support 3 is attached with LED chip 2, fluorescent glue layer 4, encapsulation glue layer 5;When the width of encapsulation glue layer 5 is greater than the width of fluorescent glue layer 4, the inner wall of encapsulation glue layer 5 is attached with the outer wall of fluorescent glue layer 4.

[0041] Specifically, the substrate 1 is used to support the LED chip 2, and the substrate 1 serves as a conductive structure to facilitate the conduction between the LED chip 2 and a power supply. The reflective support 3 is arranged around the periphery of the LED chip 2 and is attached to the outer wall of the LED chip 2. The reflective support 3 is used to shield the side wall of the LED chip 2, so as to avoid the light of the LED chip 2 from diffusing or leaking from the side wall, and also to avoid external light from irradiating the LED chip 2. The phosphor glue layer 4 is used to cover the LED chip 2. The phosphor glue layer 4 is used to excite the light source emitted by the LED chip 2 to generate white light, and to absorb and reflect external ultraviolet light, so as to protect the LED chip 2 from ultraviolet radiation. The main function of the encapsulation glue layer 5 is to isolate and protect the internal components of the LED structure 100, so as to prevent harmful substances such as moisture, oxygen and dust from entering, thereby ensuring the stability and long-term reliability of the LED chip 2 and the phosphor glue layer 4.

[0042] Furthermore, when the width of the encapsulation glue layer 5 is equal to the width of the phosphor glue layer 4, the inner wall of the reflective support 3 is used to be attached to the outer wall of the encapsulation glue layer 5 and the phosphor glue layer 4. After the light generated by the LED chip 2 is excited by the phosphor glue layer 4, the light penetrates the encapsulation glue layer 5 and is emitted, so as to realize the single-sided light emission of the LED structure 100. When the width of the encapsulation glue layer 5 is greater than the width of the phosphor glue layer 4, the encapsulation glue layer 5 can be inverted on the phosphor glue layer 4. The inner wall of the reflective support 3 is used to shield the light of the LED chip 2, and the inner wall of the encapsulation glue layer 5 is attached to the outer wall of the phosphor glue layer 4. After the light generated by the LED chip 2 is excited by the phosphor glue layer 4, the light is emitted through the encapsulation glue layer 5 towards the periphery, so as to realize the top and four-sided light emission of the LED structure 100, and to make the LED structure 100 have the function of multi-sided light emission.

[0043] In addition, the substrate 1 is at least partially made of ceramic or silicon carbide. The substrate 1 is made of a material with high thermal conductivity, which improves the heat dissipation effect of the LED chip 2, and thus a high-power LED chip 2 can be used. Since the particle size of the fluorescent powder in the phosphor glue layer 4 is large, it will cause uneven light emission and reduce the light emission effect. However, the light emission effect of a high-power LED chip 2 is good, which can improve the problem of poor light emission effect caused by the large particle size of the fluorescent powder in the phosphor glue layer 4. The reflective support 3 is made of high-reflectivity white wall glue and is cured by heating, so as to realize directional light emission, prevent the side leakage of blue light of the LED chip 2, and protect the phosphor glue layer.

[0044] The production process of the LED structure 100 includes: the LED chip 2 is fixed on the solder layer of the substrate 1 by hot pressing or reflow soldering. The liquid high-reflective white glue is wrapped around the LED chip 2 and is leveled with the top of the LED chip 2, and then is moved to the oven for baking and curing at 80℃ / 1H+150℃+2H. After the liquid high-reflective white glue is baked and cured, the reflective support 3 is formed, and then the substrate 1 is moved to the spraying equipment. Before spraying, the spraying amount is weighed to reach the target spraying amount of the predetermined design. The stage is set at a temperature of about 90-100℃ for multiple atomization spraying. After the target spraying is completed, the CIE test is performed to determine whether the product landing point reaches the target color zone, and then the semi-cured product is moved to the oven for semi-curing at 150℃ / 20min.

[0045] The semi-cured product is subjected to plasma cleaning, is held and fixed by a jig on a mold cutting machine, and is set at a temperature of 120-150℃. The encapsulation glue layer 5 is laid, the mold is closed and vacuumized, and after running for about 5min, the mold is opened. The encapsulation glue layer 5 fully covers the outer surface of the fluorescent glue layer 4, and then is moved to the oven for baking and curing at 100℃ / 1H+150℃+2H to form a batch of LED structures 100.

[0046] In some embodiments, the reflective support 3 has an L shape, and the reflective support 3 has an L-shaped groove 33. The width of the encapsulation glue layer 5 is equal to the width of the fluorescent glue layer 4, the L-shaped groove 33 of the reflective support 3 is arranged towards the LED chip 2, and the two ends of the encapsulation glue layer 5 and the fluorescent glue layer 4 are installed in the L-shaped groove 33 of the reflective support 3. Specifically, when the width of the encapsulation glue layer 5 is equal to the width of the fluorescent glue layer 4, the L-shaped groove 33 of the reflective support 3 is arranged towards the LED chip 2, and the two ends of the encapsulation glue layer 5 and the fluorescent glue layer 4 are installed in the L-shaped groove 33 of the reflective support 3, the outer walls of the fluorescent glue layer 4 and the encapsulation glue layer 5 are attached to the inner wall of the reflective support 3, the light of the LED chip 2 is emitted towards the top of the encapsulation glue layer 5 after being excited by the fluorescent glue layer 4, and the single-sided light emission of the LED structure 100 is further realized.

[0047] In some embodiments, the width of the encapsulation glue layer 5 is greater than the width of the fluorescent glue layer 4, the L-shaped groove 33 of the reflective support 3 is arranged away from the LED chip 2, and the two ends of the encapsulation glue layer 5 are installed in the L-shaped groove 33 of the reflective support 3. Specifically, when the width of the encapsulation glue layer 5 is greater than the width of the fluorescent glue layer 4, the L-shaped groove 33 of the reflective support 3 is arranged away from the LED chip 2, and the two ends of the encapsulation glue layer 5 are installed in the L-shaped groove 33 of the reflective support 3, the inner wall of the reflective support 3 is attached to the outer wall of the LED chip 2, and the inner wall of the encapsulation glue layer 5 is attached to the inner wall of the fluorescent glue layer 4, the light of the LED chip 2 is emitted towards the top and the periphery of the encapsulation glue layer 5 after being excited by the fluorescent glue layer 4, and the multi-sided light emission of the LED structure 100 is further realized.

[0048] Preferably, as shown in FIG. 1, the LED structure 100 includes a substrate 1, a solder layer 11, a reflective support 3, a fluorescent glue layer 4, an encapsulation glue layer 5, and an LED chip 2. Figure 5As shown, the encapsulation adhesive layer 5 comprises a first transmissive body 51, a second transmissive body 52, and a third transmissive body 53. The second transmissive body 52 and the third transmissive body 53 are respectively installed at two ends of the first transmissive body 51, and form a door-shaped structure. The fluorescent adhesive layer 4 is arranged between the second transmissive body 52 and the third transmissive body 53. Specifically, when the width of the encapsulation adhesive layer 5 is equal to the width of the fluorescent adhesive layer 4, the first transmissive body 51, the second transmissive body 52, and the third transmissive body 53 form a long strip-shaped structure. When the width of the encapsulation adhesive layer 5 is greater than the width of the fluorescent adhesive layer 4, the first transmissive body 51, the second transmissive body 52, and the third transmissive body 53 form a door-shaped structure. The first transmissive body 51 is used to cover the fluorescent adhesive layer 4 and seal the top of the fluorescent adhesive layer 4. The second transmissive body 52 and the third transmissive body 53 are used to cover the two ends of the fluorescent adhesive layer 4 and seal the two ends of the fluorescent adhesive layer 4, so that the LED chip 2 emits light towards the top of the encapsulation adhesive layer 5 or emits light around the encapsulation adhesive layer 5 after being excited by the fluorescent adhesive layer 4.

[0049] Preferably, as shown in the drawings, Figure 3 As shown, the reflective support 3 comprises a first support body 31 and a second support body 32. The first support body 31 is installed on the second support body 32. The first support body 31 has a first support surface 311 and a first reflective surface 312. The second support body 32 has a second reflective surface 321. The width of the encapsulation adhesive layer 5 is equal to the width of the fluorescent adhesive layer 4. The fluorescent adhesive layer 4 is at least partially installed on the first support surface 311. The first reflective surface 312 is attached to the sidewall of the LED chip 2. The second reflective surface 321 is attached to the sidewall of the encapsulation adhesive layer 5 and the fluorescent adhesive layer 4.

[0050] Specifically, the first support body 31 and the second support body 32 can be a split structure or an integral structure. When the first support body 31 and the second support body 32 are an integral structure, a template is arranged on the substrate 1 when the LED structure 100 is processed. The template surrounds the LED chip 2. According to the need of single-sided light emission or multi-sided light emission of the LED structure 100, the template adopts different installation modes, so that the L-shaped slot 33 has different orientations after the first support body 31 and the second support body 32 are spliced. Moreover, when the width of the encapsulation adhesive layer 5 is equal to the width of the fluorescent adhesive layer 4, the first support surface 311 is used to support the end of the fluorescent adhesive layer 4. The first reflective surface 312 is used to reflect the blue light emitted by the sidewall of the LED chip 2, so as to avoid the leakage of the blue light of the LED chip 2. The second reflective surface 321 is used to reflect the white light after the fluorescent adhesive layer 4 is excited, so as to realize the single-sided light emission of the LED structure 100.

[0051] Preferably, as shown in the drawings, Figure 4As shown, the second support body 32 further has a third reflecting surface 322 and a second support surface 323, the third reflecting surface 322 is attached to the sidewall of the LED chip 2; the width of the encapsulation glue layer 5 is greater than the width of the fluorescent glue layer 4, the encapsulation glue layer 5 is at least partially mounted on the first support surface 311, the fluorescent glue layer 4 is at least partially mounted on the second support surface 323, and the encapsulation glue layer 5 is at least partially located on the sidewall of the fluorescent glue layer 4.

[0052] Specifically, when the width of the encapsulation glue layer 5 is greater than the width of the fluorescent glue layer 4, the second support surface 323 is used to support the end of the fluorescent glue layer 4, and the third reflecting surface 322 is used to reflect the blue light emitted from the sidewall of the LED chip 2, so as to avoid the leakage of the blue light of the LED chip 2. Moreover, the encapsulation glue layer 5 is at least partially located on the sidewall of the fluorescent glue layer 4, and the light emitted by the LED chip 2 is excited by the fluorescent glue layer 4 to form white light, which can be emitted from the top of the fluorescent glue layer 4 and the sidewall of the fluorescent glue layer 4, so as to realize the multi-surface light emission of the LED structure 100.

[0053] Preferably, the first reflecting surface 312, the second reflecting surface 321 and the third reflecting surface 322 are arranged in parallel, the first support surface 311 and the second support surface 323 are arranged in parallel, and the first reflecting surface 312 is perpendicular to the first support surface 311. Specifically, the first reflecting surface 312, the second reflecting surface 321 and the third reflecting surface 322 are all used to reflect the blue light of the LED chip 2, so as to avoid the leakage of the blue light of the LED chip 2 from the sidewall thereof; the first support surface 311 is used to support the fluorescent glue layer 4 or the encapsulation glue layer 5, and the second support surface 323 is only used to support the fluorescent glue layer 4. Moreover, the plurality of reflecting surfaces are arranged in parallel, and the plurality of support surfaces are arranged in parallel, and the reflecting surfaces are perpendicular to the support surfaces, so as to ensure that the light emitted by the LED chip 2 is perpendicular or parallel to the substrate 1, and improve the light emission effect of the LED structure 100 after encapsulation.

[0054] In some embodiments, the fluorescent glue layer 4 comprises glue, fluorescent powder, diluent and diffusion powder, and the mass ratio of the glue, the fluorescent powder, the diluent and the diffusion powder is 1:1.5:1.5:(0.04-0.08). Specifically, the glue, the fluorescent powder, the diluent and the diffusion powder are mixed in a mass ratio of 1:1.5:1.5:0.06, so that the fluorescent glue layer 4 has the effect of exciting blue light into white light.

[0055] In some embodiments, the encapsulation glue layer 5 comprises glue and diffusion powder, and the mass ratio of the glue and the diffusion powder is 1:(0.045-0.095). Specifically, the glue and the diffusion powder are mixed in a mass ratio of 1:0.06, so that the encapsulation glue layer 5 is covered on the fluorescent glue layer 4, the sealing of the fluorescent glue layer 4 is realized, and the overall sealing effect of the LED structure 100 is improved.

[0056] When referring to the drawings, new features appearing in the drawings are explained; in order to avoid the description being less concise due to repeated reference to the drawings, features already described are not referred to again in the drawings where the description is clear.

[0057] The purpose of the above examples is to exemplarily reproduce and deduce the technical solutions of the present application, and to completely describe the technical solutions, purposes and effects of the present application, so that the public can understand the disclosure of the present application more thoroughly and comprehensively, and the protection scope of the present application is not limited thereby.

[0058] The above examples are not exhaustive enumeration based on the present application, and in addition to this, there can be a plurality of other implementation manners not listed. Any replacement and improvement made without violating the concept of the present application belongs to the protection scope of the present application.

Claims

1. LED structure, characterized in that The application relates to a LED chip packaging structure, which comprises a substrate, an LED chip, a reflecting support, a fluorescent glue layer and a packaging glue layer. The LED chip and the reflecting support are both mounted on the substrate, and the reflecting support is arranged around the periphery of the LED chip and is attached to the outer wall of the LED chip. The fluorescent glue layer is mounted on the LED chip and is arranged at least partially on the reflecting support; the packaging glue layer is mounted on the fluorescent glue layer, and the width of the packaging glue layer is greater than or equal to the width of the fluorescent glue layer. The reflecting support is in L shape, and the reflecting support has an L-shaped groove, and the packaging glue layer is arranged at least partially in the L-shaped groove.

2. The LED structure of claim 1, wherein, The width of the packaging glue layer is equal to the width of the fluorescent glue layer, the L-shaped groove of the reflecting support is arranged towards the LED chip, and the ends of the packaging glue layer and the fluorescent glue layer are both mounted in the L-shaped groove of the reflecting support.

3. The LED structure of claim 1, wherein, The width of the packaging glue layer is greater than the width of the fluorescent glue layer, the L-shaped groove of the reflecting support is arranged away from the LED chip, and the end of the packaging glue layer is mounted in the L-shaped groove of the reflecting support.

4. The LED structure of claim 3, wherein, The packaging glue layer comprises a first transmission body, a second transmission body and a third transmission body, the second transmission body and the third transmission body are respectively mounted at two ends of the first transmission body and form a door-shaped structure. The fluorescent glue layer is arranged between the second transmission body and the third transmission body.

5. The LED structure of claim 1, wherein, The reflecting support comprises a first support body and a second support body, the first support body is mounted on the second support body, the first support body has a first support surface and a first reflecting surface, and the second support body has a second reflecting surface. When the width of the packaging glue layer is equal to the width of the fluorescent glue layer, the fluorescent glue layer is mounted at least partially on the first support surface, the first reflecting surface is attached to the side wall of the LED chip, and the second reflecting surface is attached to the side wall of the packaging glue layer and the fluorescent glue layer.

6. The LED structure of claim 5, wherein, The second support body further has a third reflecting surface and a second support surface, the third reflecting surface is attached to the side wall of the LED chip, and when the width of the packaging glue layer is greater than the width of the fluorescent glue layer, the packaging glue layer is mounted at least partially on the first support surface, the fluorescent glue layer is mounted at least partially on the second support surface, and the packaging glue layer is at least partially attached to the side wall of the fluorescent glue layer.

7. The LED structure of claim 6, wherein, The first reflecting surface, the second reflecting surface and the third reflecting surface are arranged in parallel, and the first support surface and the second support surface are arranged in parallel. The first reflecting surface is perpendicular to the first support surface.

8. The LED structure of any of claims 1 to 7, wherein, The fluorescent glue layer comprises glue, fluorescent powder, diluent and diffusion powder, and the mass ratio of the glue, the fluorescent powder, the diluent and the diffusion powder is 1:1.5:1.5:(0.04-0.08).

9. The LED structure of any of claims 1 to 7, wherein, The packaging glue layer comprises glue and diffusion powder, and the mass ratio of the glue and the diffusion powder is 1:(0.045-0.095).

10. The LED structure of any of claims 1 to 7, wherein, The substrate is at least partially made of ceramic or silicon carbide.

Images