Wafer cleaning device

Abstract

The utility model relates to the technical field of wafer production, and discloses a wafer cleaning device which comprises a cleaning barrel, and an insertion groove is formed in the top in the cleaning barrel. Compared with the prior art, the wafer cleaning device has the advantages that the adjusting assembly is used in the wafer cleaning device to drive the stirring assembly to stir and shake the wafer cleaning agent in the cleaning barrel, so that the contact between the cleaning agent and the surface of the wafer is more sufficient, pollutants can be conveniently washed away, the cleaning agent is more uniformly mixed compared with a static state, and the cleaning effect is better. And the pressing assembly is used in the wafer cleaning device, so that the wafer can be conveniently fixed, and the wafer is more stable and is not easy to collide and damage during cleaning.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a wafer cleaning device. Background Technology

[0002] With the rapid development of modern technology, the semiconductor industry has become a core force driving progress in many fields. It plays an indispensable role in many industries such as electronic communications, computers, artificial intelligence, and automotive electronics. In the wafer production process, from the initial preparation of silicon raw materials to undergoing many complex processing steps, various contaminants will inevitably be contaminated on its surface, requiring cleaning.

[0003] Existing wafer cleaning equipment uses cleaning agents to remove surface contaminants. However, the internal cleaning agents are relatively static and have poor flowability, which makes it difficult to wash away the contaminants adhering to the wafer surface. The internal cleaning agents tend to settle and form uneven layers after a long period of static operation, which reduces the cleaning effect of the cleaning agents. Furthermore, the wafers are not fixed during cleaning and may shake and be damaged, which makes the equipment have certain shortcomings. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a wafer cleaning device, including a cleaning tank, a slot is provided at the top of the cleaning tank, a fixing frame is inserted into the slot, an adjustment component is connected to one end of the fixing frame, a support base plate is fixedly connected to the bottom of the inner wall of the cleaning tank, and a pressing component is connected to the support base plate.

[0006] The adjustment assembly includes a support frame, which is fixedly connected to one end of a fixed frame. A connecting frame is fixedly connected to the outside of the support frame. A drive motor is fixedly connected to the bottom end of the connecting frame. A connecting block is fixedly connected to the middle of the support frame. A turntable is fixedly connected to the output end of the drive motor through the connecting block. A sliding groove is formed inside the turntable. Support blocks are fixedly connected to both ends of the support frame. A fixed rod is rotatably connected inside the support block. A fixed plate is fixedly connected to the outside of the fixed rod. There are two sets of fixed plates. A drive rod is fixedly connected between the two sets of fixed plates. A sleeve is rotatably and slidably connected to the outside of the drive rod. A sliding rod is fixedly connected to the outside of the sleeve. The sliding rod slides in the sliding groove. A stirring assembly is connected to the bottom of the fixed rod.

[0007] As a further description of the above technical solution:

[0008] The stirring assembly includes a driven rod fixedly connected to the bottom of a fixed rod. A stirring blade and a crossbar are fixedly connected to the outside of the driven rod. A scraper is fixedly connected to one end of the crossbar, and the scraper slides on the inner wall of the cleaning tank.

[0009] As a further description of the above technical solution:

[0010] The clamping assembly includes a connecting bracket, which is fixedly connected to the top of the support base plate. One end of the connecting bracket is fixedly connected to a top plate. A limiting groove is formed in the top plate, and a vertical rod is slidably connected in the limiting groove. A pressure plate is fixedly connected to the bottom of the vertical rod, and a spring is fixedly connected between the pressure plate and the top plate. A handle is fixedly connected to the top of the vertical rod.

[0011] As a further description of the above technical solution:

[0012] The spring is sleeved on the outside of the upright.

[0013] As a further description of the above technical solution:

[0014] The supporting base plate is parallel to the pressure plate.

[0015] As a further description of the above technical solution:

[0016] The stirring blade has a through groove.

[0017] As a further description of the above technical solution:

[0018] The fixed rod is parallel to the drive rod.

[0019] This utility model has the following beneficial effects:

[0020] 1. In this utility model, the adjusting component is used in the wafer cleaning device to drive the stirring component to stir and shake the wafer cleaning agent in the cleaning tank, so that the cleaning agent has more sufficient contact with the wafer surface, making it easier to wash away contaminants, and the cleaning agent is more uniformly mixed compared to the static state, thus improving the cleaning effect on the wafer.

[0021] 2. In this utility model, the use of a clamping component in the wafer cleaning device makes it easier to fix the wafer, making it more stable and less prone to damage during cleaning. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a wafer cleaning device proposed in this utility model. Figure 1 ;

[0023] Figure 2 This is a schematic diagram of the overall structure of a wafer cleaning device proposed in this utility model. Figure 2 ;

[0024] Figure 3 This is a partial structural diagram of a wafer cleaning device proposed in this utility model. Figure 1 ;

[0025] Figure 4 This is a partial structural diagram of a wafer cleaning device proposed in this utility model. Figure 2 .

[0026] Legend:

[0027] 1. Cleaning tank; 2. Slot; 3. Fixing frame; 4. Support frame; 5. Connecting frame; 6. Drive motor; 7. Connecting block; 8. Support block; 9. Fixing rod; 10. Fixing plate; 11. Drive rod; 12. Sleeve; 13. Slide rod; 14. Turntable; 15. Slide groove; 16. Support base plate; 17. Connecting bracket; 18. Top plate; 19. Limiting groove; 20. Vertical rod; 21. Spring; 22. Handle; 23. Pressure plate; 24. Driven rod; 25. Stirring blade; 26. Crossbar; 27. Scraper. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Reference Figures 1-4 An embodiment of this utility model is provided: a wafer cleaning device, including a cleaning tank 1, a slot 2 is provided at the top of the cleaning tank 1, a fixing frame 3 is inserted into the slot 2, an adjustment component is connected to one end of the fixing frame 3, a support base plate 16 is fixedly connected to the bottom of the inner wall of the cleaning tank 1, and a pressing component is connected to the support base plate 16.

[0030] The adjustment assembly includes a support frame 4, which is fixedly connected to one end of a fixed frame 3. A connecting frame 5 is fixedly connected to the outside of the support frame 4. A drive motor 6 is fixedly connected to the bottom of the connecting frame 5. A connecting block 7 is fixedly connected to the middle of the support frame 4. A turntable 14 is fixedly connected to the output end of the drive motor 6 through the connecting block 7. A sliding groove 15 is provided in the turntable 14. Support blocks 8 are fixedly connected to both ends of the support frame 4. A fixed rod 9 is rotatably connected inside the support block 8. A fixed plate 10 is fixedly connected to the outside of the fixed rod 9. There are two sets of fixed plates 10. A drive rod 11 is fixedly connected between the two sets of fixed plates 10. A sleeve 12 is rotatably and slidably connected to the outside of the drive rod 11. A sliding rod 13 is fixedly connected to the outside of the sleeve 12. The sliding rod 13 slides in the sliding groove 15. A stirring assembly is connected to the bottom of the fixed rod 9 to make the cleaning agent more fully contact the wafer surface and improve the cleaning effect on the wafer.

[0031] The stirring assembly includes a driven rod 24 fixedly connected to the bottom of the fixed rod 9. A stirring blade 25 and a crossbar 26 are fixedly connected to the outside of the driven rod 24. A scraper 27 is fixedly connected to one end of the crossbar 26 and slides on the inner wall of the cleaning tank 1. The pressing assembly includes a connecting bracket 17 fixedly connected to the top of the supporting base plate 16. A top plate 18 is fixedly connected to one end of the connecting bracket 17. A limiting groove 19 is opened in the top plate 18. A vertical rod 20 is slidably connected in the limiting groove 19. A pressure plate 23 is fixedly connected to the bottom of the vertical rod 20. A spring 21 is fixedly connected between the pressure plate 23 and the top plate 18. A handle 22 is fixedly connected to the top of the vertical rod 20. The spring 21 is sleeved on the outside of the vertical rod 20. The supporting base plate 16 is parallel to the pressure plate 23. A through groove is opened in the stirring blade 25. The fixed rod 9 is parallel to the drive rod 11 to improve the cleaning effect.

[0032] Working principle: In the wafer cleaning device, the drive motor 6 is started to drive the turntable 14 to rotate, causing the slide rod 13 to rotate with the turntable 14 and slide in the slide groove 15, driving the sleeve 12 to move. At the same time, the sleeve 12 rotates and slides on the drive rod 11, causing the drive rod 11 to swing back and forth, driving the fixed plate 10 to swing, thereby driving the fixed rod 9 to swing back and forth, causing the driven rod 24 to drive the stirring blade 25 to rotate back and forth, mixing and stirring the wafer cleaning agent in the cleaning tank 1. At the same time, the scraper 27 can scrape off the agent adhering to the inner wall of the cleaning tank 1. The cleaning agent is thoroughly mixed to ensure better contact with the wafer surface, making it easier to rinse away contaminants. This also results in a more uniform mixing of the cleaning agent compared to a static state, improving the cleaning effect on the wafer. In the wafer cleaning device, pulling the handle 22 upwards moves the pressure plate 23 upwards, while simultaneously increasing the pressure on the spring 21, placing the wafer on the two side support base plates 16. Releasing the handle 22 allows the pressure plate 23 to fix the wafer in place under the force of the spring 21, making it more stable during cleaning and less susceptible to damage from impacts caused by the movement of the cleaning agent.

[0033] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer cleaning apparatus comprising a cleaning tank (1), characterized in that: The cleaning barrel (1) is provided with a slot (2) in the top, a fixing frame (3) is inserted into the slot (2), one end of the fixing frame (3) is connected with an adjusting assembly, a supporting bottom plate (16) is fixedly connected to the inner wall of the cleaning barrel (1), and a pressing assembly is connected to the supporting bottom plate (16). The adjusting assembly comprises a supporting frame (4) fixedly connected to one end of the fixing frame (3), a connecting frame (5) fixedly connected to the outer side of the supporting frame (4), a driving motor (6) fixedly connected to the bottom end of the connecting frame (5), a connecting block (7) fixedly connected to the middle of the supporting frame (4), a rotating disc (14) fixedly connected to the output end of the driving motor (6) penetrating through the connecting block (7), a sliding groove (15) formed in the rotating disc (14), a supporting block (8) fixedly connected to each end of the supporting frame (4), a fixed rod (9) rotatably connected to the supporting block (8), a fixed plate (10) fixedly connected to the outer side of the fixed rod (9), two groups of the fixed plate (10), a driving rod (11) fixedly connected between the two groups of the fixed plate (10), a sleeve (12) rotatably and slidably connected to the outer side of the driving rod (11), a sliding rod (13) fixedly connected to the outer side of the sleeve (12), the sliding rod (13) sliding in the sliding groove (15), and a stirring assembly connected to the bottom of the fixed rod (9).

2. The wafer cleaning apparatus of claim 1, wherein: The stirring assembly comprises a driven rod (24) fixedly connected to the bottom of the fixed rod (9), a stirring blade (25) and a cross rod (26) fixedly connected to the outer side of the driven rod (24), a scraper (27) fixedly connected to one end of the cross rod (26), and the scraper (27) sliding in the inner wall of the cleaning barrel (1).

3. The wafer cleaning apparatus of claim 1, wherein: The pressing assembly comprises a connecting support (17) fixedly connected to the top of the supporting bottom plate (16), a top plate (18) fixedly connected to one end of the connecting support (17), a limiting groove (19) formed in the top plate (18), a vertical rod (20) slidably connected to the limiting groove (19), a pressing plate (23) fixedly connected to the bottom of the vertical rod (20), a spring (21) fixedly connected between the pressing plate (23) and the top plate (18), and a handle (22) fixedly connected to the top of the vertical rod (20).

4. The wafer cleaning apparatus of claim 3, wherein: The spring (21) is sleeved on the outer side of the vertical rod (20).

5. The wafer cleaning apparatus of claim 1, wherein: The supporting bottom plate (16) is parallel to the pressing plate (23).

6. The wafer cleaning apparatus of claim 2, wherein: A through groove is formed in the stirring blade (25).

7. The wafer cleaning apparatus of claim 1, wherein: The fixed rod (9) is parallel to the driving rod (11).

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