Silicon wafer cleaning machine and cleaning assembly capable of reducing dirty wafer occurrence rate

Abstract

The utility model discloses a silicon wafer cleaning machine and a cleaning assembly thereof capable of reducing the occurrence rate of dirty wafers, the cleaning assembly comprises a cleaning tank and an air injection assembly, the cleaning tank is provided with a first side edge and a second side edge, the first side edge is the side edge of the cleaning tank close to a wafer feeding position, and the second side edge is the side edge of the cleaning tank located at two sides of the first side edge; the air injection assembly comprises a plurality of first air injection nozzles and a plurality of second air injection nozzles, the first air injection nozzles are installed on the first side edge, and the second air injection nozzles are installed on the second side edge; when the silicon wafer sinks under the water surface in the cleaning tank to be cleaned, the first air nozzle and the second air nozzle can blow off floating dirt on the water surface in the cleaning tank, and the floating dirt on the water surface above the silicon wafer can be completely blown away, so that the water surface above the silicon wafer can be kept clean without floating dirt; and the silicon wafer is not polluted by floating dirt when being lifted out of the water surface, so that the occurrence rate of the polluted wafer is reduced, the water changing period can be prolonged, the pure water consumption and the medicament consumption are reduced, and the cost is saved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cleaning technology, specifically to a silicon wafer cleaning machine and its cleaning components that can reduce the occurrence rate of contaminated wafers. Background Technology

[0002] After the silicon wafer slicing machine cuts the silicon rod into wafers, a debinding process is required to remove the silicon wafers from the resin substrate. A cleaning machine then cleans the wafers by adding chemicals and pure water to multiple cleaning tanks, and installing ultrasonic waves, heaters, and other devices. However, silicon wafers have high cleanliness requirements. At the end of the cleaning cycle, a significant amount of contaminants floats on the surface of the water in the cleaning tanks. When the silicon wafers are lifted from the water, they are easily contaminated by these floating contaminants, resulting in contaminated wafers at the end of the cleaning cycle. This prevents the wafers from meeting cleanliness requirements, necessitating timely water replacement and increasing the consumption of pure water and chemicals. Although some existing cleaning tanks are equipped with high-pressure air blowing devices, such as the cleaning tank disclosed in Chinese Utility Model Patent Application No. 2021204156866, which can blow away floating dirt on the water surface using high-pressure air blowing devices, the high-pressure air blowing is located at the top of the cleaning tank, and the blowing effect is not good. Some floating dirt will still float on the water surface above the silicon wafer. When the silicon wafer is lifted out of the water, this floating dirt will contaminate the silicon wafer, leading to an increase in the rate of contaminated wafers. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a cleaning component that can reduce the occurrence of sludge flakes, extend the water change cycle, reduce the amount of pure water and chemicals used, and save costs.

[0004] To solve the above problems, the technical solution adopted by this utility model is as follows: a cleaning assembly that can reduce the occurrence rate of contaminated wafers, including a cleaning tank and an air jet assembly. The cleaning tank has a first side and a second side. The first side is the side of the cleaning tank near the wafer inlet position, and the second side is the side of the cleaning tank located on both sides of the first side. The air jet assembly includes a plurality of first air jet nozzles and a plurality of second air jet nozzles. The plurality of first air jet nozzles are installed on the first side, and the plurality of second air jet nozzles are installed on the second side. When the silicon wafer is submerged in the water in the cleaning tank for cleaning, the first air jet nozzles and the second air jet nozzles can blow away the floating contaminants in the water surface of the cleaning tank.

[0005] Compared with the prior art, the beneficial effects of this utility model are as follows: This cleaning water tank is equipped with a first air nozzle and a second air nozzle. The second air nozzle is located on both sides of the first side and sprays air towards the middle position, concentrating the floating dirt on the water surface towards the middle. The first air nozzle is located on the side near the wafer entry position and blows the floating dirt concentrated in the middle of the water surface away from the top of the silicon wafer. With the combined blowing of the first and second air nozzles, the floating dirt on the water surface above the silicon wafer will be completely blown away, so that the water surface above the silicon wafer can be kept clean and free of floating dirt. When the silicon wafer is lifted out of the water, it will not be contaminated by floating dirt, thereby reducing the occurrence rate of contaminated wafers, extending the water change cycle, reducing the amount of pure water and chemicals used, and saving costs.

[0006] The cleaning assembly described above, which can reduce the occurrence of contaminated sheets, has a plurality of second jet nozzles distributed outward in a direction away from the sheet inlet position.

[0007] The aforementioned cleaning assembly, which can reduce the occurrence of soiled sheets, further includes an air jet assembly connected to the second side, the air jet mounting plate having a mounting surface that is inclined outward in a direction away from the sheet inlet position, and a plurality of second air jet nozzles sequentially connected to the mounting surface.

[0008] The aforementioned cleaning components that can reduce the occurrence of soiled flakes also include a visual recognition system, which is installed at the top of the cleaning tank and is used to identify the degree of dirt on the water surface in the cleaning tank.

[0009] The aforementioned cleaning assembly that can reduce the occurrence of sludge flakes includes an air supply component and a control component. The air supply component is connected to the first air nozzle and the second air nozzle. The control component is connected to the air supply component and the vision recognition system. The control component can control the air jet volume of the air supply component according to the degree of dirtiness on the water surface identified by the vision recognition system.

[0010] This utility model also provides a silicon wafer cleaning machine, including the cleaning components described above that can reduce the occurrence rate of contaminated wafers, which at least has all the beneficial effects that the cleaning components described above can bring to reduce the occurrence rate of contaminated wafers.

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer cleaning machine according to an embodiment of the present invention;

[0013] Figure 2 This is a schematic diagram of the structure of the cleaning water tank according to an embodiment of the present utility model.

[0014] The reference numerals are as follows: 100 Cleaning assembly, 110 Cleaning tank, 111 First side, 112 Second side, 120 Jet assembly, 121 First jet nozzle, 122 Second jet nozzle, 123 Jet mounting plate, 1231 Mounting surface, 130 Camera. Detailed Implementation

[0015] The embodiments of this utility model are described in detail below, with reference to Figure 1 and Figure 2 This utility model provides a silicon wafer cleaning machine and a cleaning assembly capable of reducing the rate of contaminated wafers. The silicon wafer cleaning machine includes multiple cleaning tanks 110, including but not limited to chemical tanks, pure water tanks, and tap water tanks. (See reference...) Figure 2 In an embodiment of this utility model, the cleaning assembly 100 includes a cleaning tank 110 and an air jet assembly 120. The cleaning tank 110 has a first side 111 and a second side 112. The first side 111 is the side of the cleaning tank 110 near the wafer inlet position, and the second side 112 is the side of the cleaning tank 110 located on both sides of the first side 111. The air jet assembly 120 includes a plurality of first air jet nozzles 121 and a plurality of second air jet nozzles 122. The plurality of first air jet nozzles 121 are installed on the first side 111, and the plurality of second air jet nozzles 122 are installed on the second side 112. When the silicon wafer is submerged in the water in the cleaning tank 110 for cleaning, the first air jet nozzles 121 and the second air jet nozzles 122 can blow away the floating dirt in the water in the cleaning tank 110.

[0016] This cleaning tank is equipped with a first air nozzle 121 and a second air nozzle 122. The second air nozzle 122 is located on both sides of the first side 111, spraying air towards the center to concentrate floating debris on the water surface. The first air nozzle 121 is located on the side near the wafer inlet, blowing the floating debris concentrated in the center of the water away from the top of the silicon wafer. With the combined blowing of the first air nozzle 121 and the second air nozzle 122, the floating debris on the water surface above the silicon wafer will be completely blown away, keeping the water surface above the silicon wafer clean and free of floating debris. When the silicon wafer is lifted out of the water, it will not be contaminated by floating debris, thereby reducing the rate of wafer contamination, extending the water change cycle, reducing the amount of pure water and chemicals used, and saving costs. Figure 1 and Figure 2 For example, in the cleaning tank, the right side is the wafer entry position. The cleaning sequence of the silicon wafer is from the right cleaning tank to the left cleaning tank. When the first air nozzle 121 sprays air, it will blow the floating dirt on the water surface to the left, so that the water surface on the right side of the cleaning tank 110 is kept clean, that is, the water surface near the wafer entry position is kept clean. When the silicon wafer is cleaned, it will be lifted out of the water surface at that point, thereby avoiding contamination of the silicon wafer by the floating dirt on the water surface.

[0017] Furthermore, referring to Figure 2Multiple second jet nozzles 122 are distributed outwards along a direction away from the inlet position. The further away from the inlet position, the less influence the airflow of the second jet nozzles 122 has on the airflow of the first jet nozzle 121. This results in the overall airflow direction of the first jet nozzle 121 being funnel-shaped, thus preventing floating debris near the inlet position from returning due to water ripples, improving the cleanliness of the water surface near the inlet position. Specifically, the jet assembly 120 also includes a jet mounting plate 123 connected to the second side 112. The jet mounting plate 123 has a mounting surface 1231, which is inclined outwards along a direction away from the inlet position. Multiple second jet nozzles 122 are sequentially connected to the mounting surface 1231. It is understood that both the first jet nozzle 121 and the second jet nozzles 122 are connected to air supply components such as air pumps to provide airflow. Further, as... Figure 2 As shown, a second air nozzle 122 is installed on the second side 112 of the cleaning tank 110, near the wafer entry position, while no second air nozzle 122 is installed away from the wafer entry position, so as to give the floating dirt on the water surface a larger floating space and further reduce the probability of the floating dirt returning to the water surface above the silicon wafer.

[0018] Furthermore, this cleaning tank also includes a visual recognition system, which is installed at the top of the cleaning tank 110 to identify the degree of dirt on the water surface within the cleaning tank 110. The jet assembly 120 also includes an air supply component and a control component. The air supply component is connected to the first jet nozzle 121 and the second jet nozzle 122. The control component is connected to the air supply component and the visual recognition system, and can control the jet volume of the air supply component according to the degree of dirt on the water surface identified by the visual recognition system. In the initial stage of cleaning, when the degree of dirt on the water surface is low, a smaller jet volume can be set. In the later stage of cleaning, when the degree of dirt on the water surface is more severe, the air volume can be increased to ensure that floating dirt on the water surface is completely blown away. Specifically, the visual recognition system can adopt an existing system including a camera 130, which is installed at the top of the cleaning tank 110 to capture the degree of dirt on the water surface and feed it back to the backend. The air supply component can adopt a structure such as an air pump, and the control component can adopt a general structure for controlling the opening size of an air valve.

[0019] An embodiment of this utility model also provides a silicon wafer cleaning machine, including the cleaning components described above that can reduce the occurrence rate of contaminated wafers, which at least has all the beneficial effects that the cleaning components described above can bring to reduce the occurrence rate of contaminated wafers.

[0020] It should be noted that in the description of this utility model, any descriptions of orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation of this utility model.

[0021] In the description of this utility model, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is mentioned, it is only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A cleaning assembly capable of reducing the incidence of streaks, characterized in that, The application relates to a cleaning assembly (100) capable of reducing the occurrence of contaminated wafers, which comprises: a cleaning tank (110) having a first side (111) and a second side (112), wherein the first side (111) is the side of the cleaning tank (110) close to a wafer feeding position, and the second side (112) is the side of the cleaning tank (110) on the two sides of the first side (111); and an air jet assembly (120) comprising a plurality of first air jet nozzles (121) and a plurality of second air jet nozzles (122), wherein the plurality of first air jet nozzles (121) are installed on the first side (111), and the plurality of second air jet nozzles (122) are installed on the second side (112); when a wafer sinks into the water in the cleaning tank (110) for cleaning, the first air jet nozzles (121) and the second air jet nozzles (122) can blow the floating contaminants on the water surface in the cleaning tank (110).

2. The cleaning assembly capable of reducing the occurrence of streaks according to claim 1, wherein, The plurality of second air jet nozzles (122) are distributed outward along a direction away from the wafer feeding position.

3. The cleaning assembly capable of reducing the occurrence of streaks according to claim 2, wherein, The air jet assembly (120) further comprises an air jet mounting plate (123) connected to the second side (112), wherein the air jet mounting plate (123) has a mounting surface (1231) which is inclined outward along a direction away from the wafer feeding position, and the plurality of second air jet nozzles (122) are sequentially connected to the mounting surface (1231).

4. The cleaning assembly capable of reducing the occurrence of streaks according to claim 1, wherein, The application further comprises a visual identification system arranged on the top of the cleaning tank (110) and used for identifying the contamination degree of the water surface in the cleaning tank (110).

5. The cleaning assembly capable of reducing the occurrence of streaks according to claim 4, wherein, The air jet assembly (120) further comprises a gas supply component and a control component, wherein the gas supply component is connected to the first air jet nozzles (121) and the second air jet nozzles (122), the control component is connected to the gas supply component and the visual identification system, and the control component can control the air jet amount of the gas supply component according to the contamination degree of the water surface identified by the visual identification system.

6. A silicon wafer cleaning machine characterized by comprising: The application relates to a cleaning assembly (100) capable of reducing the occurrence of contaminated wafers, which comprises: a cleaning tank (110) having a first side (111) and a second side (112), wherein the first side (111) is the side of the cleaning tank (110) close to a wafer feeding position, and the second side (112) is the side of the cleaning tank (110) on the two sides of the first side (111); and an air jet assembly (120) comprising a plurality of first air jet nozzles (121) and a plurality of second air jet nozzles (122), wherein the plurality of first air jet nozzles (121) are installed on the first side (111), and the plurality of second air jet nozzles (122) are installed on the second side (112); when a wafer sinks into the water in the cleaning tank (110) for cleaning, the first air jet nozzles (121) and the second air jet nozzles (122) can blow the floating contaminants on the water surface in the cleaning tank (110). The plurality of second air jet nozzles (122) are distributed outward along a direction away from the wafer feeding position. The air jet assembly (120) further comprises an air jet mounting plate (123) connected to the second side (112), wherein the air jet mounting plate (123) has a mounting surface (1231) which is inclined outward along a direction away from the wafer feeding position, and the plurality of second air jet nozzles (122) are sequentially connected to the mounting surface (1231). The application further comprises a visual identification system arranged on the top of the cleaning tank (110) and used for identifying the contamination degree of the water surface in the cleaning tank (110). The air jet assembly (120) further comprises a gas supply component and a control component, wherein the gas supply component is connected to the first air jet nozzles (121) and the second air jet nozzles (122), the control component is connected to the gas supply component and the visual identification system, and the control component can control the air jet amount of the gas supply component according to the contamination degree of the water surface identified by the visual identification system.

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