Wafer processing thinning equipment

Abstract

The utility model discloses wafer processing thinning equipment, and relates to the field of wafer processing. Wafer processing thinning equipment comprises a supporting table, side plates are fixedly connected to the two sides of the upper end of the supporting table, a supporting plate is fixedly connected to the upper ends of the side plates, a shell is fixedly connected to the upper end of the supporting table, a fixing sleeve, a grinding assembly and a lifting assembly are fixedly connected to the upper end of the shell, and the grinding assembly is located on the supporting plate; the fixing sleeve is located in the shell, the grinding assembly is used for grinding the wafer in the fixing sleeve, the lifting assembly is located in the shell and used for jacking the wafer in the fixing sleeve, and the grinding assembly comprises a hydraulic rod. The technical problems that according to existing thinning equipment, the thinning thickness of a wafer cannot be controlled, when people use the thinning equipment, the grinding position of the wafer cannot be adjusted, the thickness needing to be ground cannot be controlled, and the daily use requirement cannot be met are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing field especially relates to a wafer processing thinning equipment. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon, high-purity polycrystalline silicon is dissolved and then doped into silicon crystal seed, then slowly pulled out to form cylindrical monocrystalline silicon, that is, wafer, in the wafer processing process, the thinning equipment needs to be used to thin the wafer.

[0003] However, the prior art has some problems: the existing thinning equipment cannot control the wafer thinning thickness, when people use the thinning equipment, the wafer grinding position cannot be adjusted, so the thickness to be ground cannot be controlled, and the daily use demand cannot be met, therefore, it is necessary to provide a wafer processing thinning equipment to solve the above technical problems. UTILITY MODEL CONTENT

[0004] The utility model provides a wafer processing thinning equipment, solves the technical problem that the existing thinning equipment cannot control the wafer thinning thickness, when people use the thinning equipment, the wafer grinding position cannot be adjusted, so the thickness to be ground cannot be controlled, and the daily use demand cannot be met.

[0005] To solve the above technical problems, the utility model provides a wafer processing thinning equipment, which comprises:

[0006] The support table is provided with a support plate on the upper end of both sides, and the support plate is fixedly connected with the support plate on the upper end, and the support table is fixedly connected with the shell on the upper end, and the shell is fixedly connected with the fixed sleeve on the upper end.

[0007] The grinding assembly is located on the support plate, and the grinding assembly is used for grinding the wafer in the fixed sleeve, and the lifting assembly is located in the shell, and the lifting assembly is used for jacking the wafer in the fixed sleeve.

[0008] Preferably, the grinding assembly comprises a hydraulic rod, the output end of the hydraulic rod penetrates the lower end of the support plate and is fixedly connected with a fixed plate, the lower end of the fixed plate is fixedly connected with a motor, and the output end of the motor is fixedly connected with a grinding disc.

[0009] Preferably, the lifting assembly comprises a pneumatic cylinder, the output end of the pneumatic cylinder is fixedly connected with a top plate, the upper end of the top plate is fixedly connected with a top rod, and the upper end of the top rod extends to the inside of the fixed sleeve and is fixedly connected with a placing plate.

[0010] Preferably, both sides of the top plate are fixedly connected with limiting blocks, the surface of the limiting block is slidingly connected with a limiting slide rail, and the limiting slide rail is vertically fixedly connected in the inside of the shell.

[0011] Preferably, both sides of the fixing plate are fixedly connected with connecting blocks, the upper end of the connecting block is fixedly connected with a sliding rod, the upper end of the sliding rod penetrates through the upper end of the supporting plate and is sleeved with a sliding sleeve, and the lower end of the sliding sleeve is fixedly connected with the upper end of the supporting plate.

[0012] Preferably, the supporting legs are fixedly connected with anti-skid pads at the lower end of the supporting table.

[0013] Compared with the related art, the wafer processing and thinning equipment has the following beneficial effects:

[0014] The wafer processing and thinning equipment provided by the utility model has the advantages that the limiting block and the limiting slide rail are matched with each other, the top plate is limited in movement during use, and the problem that the top plate cannot be limited in movement during use is solved.

[0015] The wafer processing and thinning equipment provided by the utility model has the advantages that the supporting legs and the anti-skid pads are matched with each other, the supporting table is prevented from displacement during use, and the problem that the supporting table is prone to displacement during use is solved.

[0016] The wafer processing and thinning equipment provided by the utility model has the advantages that the connecting block, the sliding rod and the sliding sleeve are matched with each other, the fixing plate is stably moved during use, and the problem that the fixing plate is prone to shaking during use is solved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 The utility model provides a kind of wafer processing and thinning equipment for the structure schematic view of a preferred embodiment of the utility model;

[0018] Fig. 2 It is the supporting plate structure of the utility model and view from below;

[0019] Fig. 3 It is the shell and fixed sleeve structure section view of the utility model.

[0020] Reference numeral in drawing: 1, supporting table;2, side plate;3, supporting plate;4, shell;5, fixed sleeve;6, grinding assembly;61, hydraulic rod;62, fixing plate;63, motor;64, grinding disc;7, lifting assembly;71, air cylinder;72, top plate;73, top rod;74, placing plate;8, limiting block;9, limiting slide rail;10, connecting block;11, sliding rod;12, sliding sleeve;13, supporting leg. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described in connection with the drawings in the embodiments of the utility model.

[0022] Embodiment one:

[0023] Please refer to Figs. 1-3 The utility model provides a technical scheme: a wafer processing thinning equipment, it includes: support platform 1, both sides of support platform 1 upper end are fixedly connected with side plate 2, the upper end of side plate 2 is fixedly connected with support plate 3, the upper end of support platform 1 is fixedly connected with shell 4, the upper end of shell 4 is fixedly connected with fixed sleeve 5, grinding assembly 6 and lifting assembly 7, grinding assembly 6 is located on support plate 3, grinding assembly 6 is used for grinding the wafer piece in fixed sleeve 5, lifting assembly 7 is located in shell 4, and lifting assembly 7 is used for jacking the wafer piece in fixed sleeve 5.

[0024] In this embodiment, first, the wafer piece to be thinned is placed in the fixed sleeve 5, at this time, the cylinder 71 drives the top plate 72 to move upward, the top plate 72 drives the top rod 73 to move upward through the limiting block 8 and the limiting slide rail 9, the top rod 73 drives the placement plate 74 to move upward, and the placement plate 74 ejects the wafer piece out of the fixed sleeve 5.

[0025] Embodiment two:

[0026] Please refer to Figs. 1-3 As shown in the embodiment one, the utility model provides a technical scheme: grinding assembly 6 includes hydraulic rod 61, the output end of hydraulic rod 61 is fixedly connected with fixed plate 62 by penetrating to the lower end of support plate 3, the lower end of fixed plate 62 is fixedly connected with motor 63, the output end of motor 63 is fixedly connected with grinding disc 64, lifting assembly 7 includes cylinder 71, the output end of cylinder 71 is fixedly connected with top plate 72, the upper end of top plate 72 is fixedly connected with top rod 73, the upper end of top rod 73 extends to the inside of fixed sleeve 5 and is fixedly connected with placement plate 74, both sides of top plate 72 are fixedly connected with limiting block 8, the surface of limiting block 8 is slidingly connected with limiting slide rail 9, limiting slide rail 9 is fixedly connected in the inside of shell 4 vertically, both sides of fixed plate 62 are fixedly connected with connecting block 10, the upper end of connecting block 10 is fixedly connected with slide rod 11, the upper end of slide rod 11 penetrates to the upper end of support plate 3 and is sleeved with slide sleeve 12, the lower end of slide sleeve 12 is fixedly connected with the upper end of support plate 3, the periphery of the lower end of support platform 1 is fixedly connected with support leg 13, and the lower end of support leg 13 is fixedly connected with antiskid pad.

[0027] In this embodiment: the hydraulic rod 61 drives the fixed plate 62 to move downward, the fixed plate 62 drives the connecting block 10 to move downward, the connecting block 10 drives the sliding rod 11 to slide in the sliding sleeve 12, and the fixed plate 62 drives the motor 63 and the grinding disc 64 to move downward, the motor 63 drives the grinding disc 64 to grind and thin the wafer in the fixed sleeve 5.

[0028] The working principle of the wafer processing and thinning equipment is as follows:

[0029] The first innovation point implementation step is:

[0030] Step 1: first, the wafer to be thinned is placed in the fixed sleeve 5, at this time the cylinder 71 drives the top plate 72 to move upward, the top plate 72 drives the top rod 73 to move upward through the limiting block 8 and the limiting sliding rail 9;

[0031] Step 2: the top rod 73 drives the placing plate 74 to move upward, and the placing plate 74 drives the wafer to move out of the fixed sleeve 5.

[0032] The second innovation point implementation step is:

[0033] Step 1: the hydraulic rod 61 drives the fixed plate 62 to move downward, the fixed plate 62 drives the connecting block 10 to move downward, and the connecting block 10 drives the sliding rod 11 to slide in the sliding sleeve 12;

[0034] Step 2: the fixed plate 62 drives the motor 63 and the grinding disc 64 to move downward, and the motor 63 drives the grinding disc 64 to grind and thin the wafer in the fixed sleeve 5.

[0035] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer processing thinning apparatus, characterized by: Include: Supporting table (1), both sides of the upper end of the supporting table (1) are fixedly connected with side plates (2), the upper end of the side plate (2) is fixedly connected with a supporting plate (3), the upper end of the supporting table (1) is fixedly connected with a shell (4), and the upper end of the shell (4) is fixedly connected with a fixed sleeve (5); Grinding assembly (6) and lifting assembly (7), the grinding assembly (6) is located on the supporting plate (3), the grinding assembly (6) is used for grinding the wafer in the fixed sleeve (5), and the lifting assembly (7) is located in the shell (4), the lifting assembly (7) is used for jacking the wafer in the fixed sleeve (5).

2. The wafer processing thinning apparatus according to claim 1, wherein The grinding assembly (6) comprises a hydraulic rod (61), the output end of the hydraulic rod (61) penetrates to the lower end of the supporting plate (3) and is fixedly connected with a fixed plate (62), the lower end of the fixed plate (62) is fixedly connected with a motor (63), and the output end of the motor (63) is fixedly connected with a grinding disc (64).

3. The wafer processing thinning apparatus according to claim 1, wherein The lifting assembly (7) comprises a cylinder (71), the output end of the cylinder (71) is fixedly connected with a top plate (72), the upper end of the top plate (72) is fixedly connected with a top rod (73), the upper end of the top rod (73) extends to the inside of the fixed sleeve (5) and is fixedly connected with a placing plate (74).

4. The wafer processing thinning apparatus according to claim 3, wherein Both sides of the top plate (72) are fixedly connected with limit blocks (8), the surface of the limit block (8) is slidably connected with a limit sliding rail (9), and the limit sliding rail (9) is vertically fixedly connected in the inside of the shell (4).

5. The wafer processing thinning apparatus according to claim 2, wherein Both sides of the fixed plate (62) are fixedly connected with connecting blocks (10), the upper end of the connecting block (10) is fixedly connected with a sliding rod (11), the upper end of the sliding rod (11) penetrates to the upper end of the supporting plate (3) and is sleeved with a sliding sleeve (12), and the lower end of the sliding sleeve (12) is fixedly connected with the upper end of the supporting plate (3).

6. The wafer processing thinning apparatus according to claim 1, wherein The lower end of the supporting leg (13) is fixedly connected with a non-slip pad.

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