Automobile glove box mechanism with temperature adjusting function

By installing a temperature-regulating device and a temperature-conducting structure in the automotive glove box, the problem of the glove box's inability to independently adjust the temperature has been solved, enabling independent cooling and heating functions and improving the flexibility and efficiency of temperature control.

CN223764347UActive Publication Date: 2026-01-06AEW TECHNOLOGY GROUP CO LTD
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Patent Information

Application Number
CN202520496521.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-01-06
Estimated Expiration
2035-03-20

AI Technical Summary

Technical Problem

The cooling and heating functions of existing automotive glove boxes rely on the vehicle's air conditioning system and cannot be adjusted independently, lacking independent temperature control capabilities.

Method used

The instrument panel is equipped with a temperature control device, including a compressor, condenser, liquid receiver, throttling device and evaporator coil. It achieves independent cooling or heating functions through a temperature conduction structure and is equipped with a heating film and semiconductor plate to enhance temperature regulation capabilities.

Benefits of technology

It enables independent cooling or heating of the glove box, reducing reliance on the vehicle's air conditioning system and improving the flexibility and efficiency of temperature control.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an automobile glove box mechanism with a temperature adjusting function, which comprises an instrument panel, a temperature conducting structure is arranged on the instrument panel, and the temperature conducting structure is used for transferring heat; a glove box is rotationally connected to the instrument board, the glove box and the instrument board can define a first space, and a storage cavity communicated with the first space is formed in the side, close to the instrument board, of the glove box; a heating device is arranged on the side, away from the glove box, of the instrument panel and can refrigerate or heat the first space through the temperature guide structure. The temperature control device is arranged on the instrument board, the temperature in the first space is controlled through the temperature control device, the glove box mechanism does not depend on cold air or hot air blown out by an automobile air conditioning system for temperature control, the independent heating or refrigerating function is achieved, meanwhile, heat conduction is further accelerated through a temperature conduction structure on the instrument board, and the heat conduction efficiency is improved. And the temperature in the first space is quickly increased or decreased.
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Description

TECHNICAL FIELD

[0001] The application relates to the technical field of automobile parts, in particular to an automobile glove box mechanism with a temperature adjusting function. BACKGROUND

[0002] At present, common automobile glove box refrigeration and heating is realized through the assistance of an automobile air conditioning system, that is, an air conditioning ventilation pipeline is connected into the glove box, when the air conditioner is in a refrigeration mode, cold air enters the glove box, the temperature in the glove box is reduced, when the air conditioner is in a heating mode, hot air enters the glove box, the temperature in the glove box is increased, the above setting mode makes the refrigeration and heating functions of the glove box limited by the adjustment of the air conditioner of the whole vehicle, and the mode changes along with the air conditioner of the whole vehicle, and the independent refrigeration or heating function is lacked. CONTENT OF THE UTILITY MODEL

[0003] The application aims at the above problems, and provides an automobile glove box mechanism with a temperature adjusting function, which comprises:

[0004] An instrument panel is provided with a temperature guide structure, and the temperature guide structure is used for transferring heat;

[0005] A glove box is rotationally connected to the instrument panel and can be combined with the instrument panel to form a first space; the side of the glove box close to the instrument panel is provided with a storage cavity in communication with the first space;

[0006] A temperature adjusting device is arranged on the side of the instrument panel away from the glove box, and can perform refrigeration or heating on the first space through the temperature guide structure.

[0007] According to the technical scheme provided by some embodiments of the application, the temperature adjusting device comprises a compressor, a condenser, a liquid storage tank, a throttling component and an evaporator coil connected in sequence, the evaporator coil is fixed on the side of the temperature guide structure away from the first space, and when the compressor works, the refrigerant passing through the evaporator coil can perform refrigeration on the first space through the temperature guide structure.

[0008] According to the technical scheme provided by some embodiments of the application, the temperature adjusting device further comprises a heating film, the heating film is fixed on the side of the temperature guide structure away from the first space, and can perform heating on the first space through the temperature guide structure when powered.

[0009] According to the technical scheme provided by some embodiments of the application, the side of the temperature guide structure away from the first space is covered with a heat preservation component, and the evaporator coil and the heating film are arranged between the heat preservation component and the temperature guide structure.

[0010] According to the technical scheme provided in the embodiments of the present application, the throttling member can be a capillary tube or an expansion valve.

[0011] According to the technical scheme provided in the embodiments of the present application, one side of the condenser is further provided with a first fan.

[0012] According to the technical scheme provided in the embodiments of the present application, the temperature control device comprises a semiconductor plate, which is fixed on the temperature conducting structure away from the first space and can release or absorb heat from the first space through the temperature conducting structure when powered.

[0013] According to the technical scheme provided in the embodiments of the present application, the semiconductor plate is provided with a heat dissipation member away from the first space, which is used for dissipating heat of the semiconductor plate.

[0014] According to the technical scheme provided in the embodiments of the present application, the heat dissipation member is further provided with a second fan away from the semiconductor plate.

[0015] According to the technical scheme provided in the embodiments of the present application, the instrument panel is provided with a mixing device, which is used for making the gas in the first space flow, so as to make the gas circulate between the first space and the mixing device.

[0016] Compared with the prior art, the present application has the following beneficial effects: the present application provides a glove box mechanism with temperature regulation function, which comprises an instrument panel, a temperature conducting structure provided on the instrument panel and used for transferring heat, a glove box rotatably connected to the instrument panel, the glove box and the instrument panel together forming a first space, a storage cavity provided on one side of the glove box close to the instrument panel and communicating with the first space, and a temperature control device provided on one side of the instrument panel away from the glove box and used for refrigerating or heating the first space; the temperature control device is arranged on the instrument panel to control the temperature in the first space, so that the glove box mechanism does not rely on the cold air or hot air blown by the air conditioning system of the automobile to control the temperature, and realizes independent heating or refrigeration function; meanwhile, the temperature conducting structure on the instrument panel further accelerates the heat conduction, so that the temperature in the first space rises or falls rapidly.

[0017] It should be understood that the description of technical features, technical solutions, beneficial effects or similar language in the present application does not imply that all features and advantages can be realized in any single embodiment. On the contrary, it can be understood that the description of a feature or a beneficial effect means that the specific technical feature, technical solution or beneficial effect is included in at least one embodiment. Therefore, the description of technical features, technical solutions or beneficial effects in the specification does not necessarily refer to the same embodiment. Furthermore, the technical features, technical solutions and beneficial effects described in the embodiments can be combined in any appropriate manner. Those skilled in the art will understand that the embodiments can be implemented without one or more specific technical features, technical solutions or beneficial effects of a specific embodiment. In other embodiments, additional technical features and beneficial effects can be identified in specific embodiments that do not embody all embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any inventive labor.

[0019] Figure 1 A structure schematic diagram when the automobile glove box mechanism with temperature regulation function provided by the embodiments of the present application includes an air conditioning refrigeration system and a heating film in an open state;

[0020] Figure 2 A structure schematic diagram when the automobile glove box mechanism with temperature regulation function provided by the embodiments of the present application includes an air conditioning refrigeration system and a heating film in an open state;

[0021] Figure 3 A structure schematic diagram when the automobile glove box mechanism with temperature regulation function provided by the embodiments of the present application includes an air conditioning refrigeration system and a heating film in an open state;

[0022] Figure 4 A structure schematic diagram when the automobile glove box mechanism with temperature regulation function provided by the embodiments of the present application includes a semiconductor plate;

[0023] Figure 5 A structure schematic diagram when the automobile glove box mechanism with temperature regulation function provided by the embodiments of the present application includes a semiconductor plate in an open state;

[0024] Figure 6 A structure schematic diagram when the automobile glove box mechanism with temperature regulation function provided by the embodiments of the present application includes a semiconductor plate in an open state;

[0025] Figure 7 A split structure schematic diagram when the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application includes an air conditioning refrigeration system and a heating film;

[0026] Figure 8 A split structure schematic diagram when the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application includes a semiconductor plate;

[0027] Figure 9 A split structure schematic diagram when the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application includes an air conditioning refrigeration system and a heating film;

[0028] Figure 10 A split structure schematic diagram when the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application includes a semiconductor plate; Figure 9 An enlarged view of part A in the figure;

[0029] Figure 11 A split structure schematic diagram when the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application includes a semiconductor plate;

[0030] Figure 12 An enlarged view of part B in the figure; Figure 11 An enlarged view of part B in the figure;

[0031] Figure 13 Another split structure schematic diagram when the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application includes a semiconductor plate;

[0032] Figure 14 A split structure schematic diagram of a mixed flow device of the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application;

[0033] Figure 15 An internal structure schematic diagram of a first space of the automobile glove box mechanism with temperature adjustment function provided by the embodiment of the present application.

[0034] The text annotations in the figure represent:

[0035] 1, instrument panel; 2, glove box; 3, temperature guide metal plate; 4, cover shell; 5, third fan; 6, press switch; 11, first space; 12, first through hole; 13, air inlet hole; 14, air outlet hole; 21, storage cavity; 41, second space; 101, compressor; 102, condenser; 103, liquid storage tank; 104, throttling element; 105, evaporator coil; 106, first fan; 107, heating film; 108, heat preservation element; 109, first controller; 110, second controller; 111, double-sided adhesive tape; 112, fixed support; 201, semiconductor plate; 202, heat dissipation element; 203, second fan; 204, sealing element; 205, PCB board; 206, lower fixed plate; 207, upper fixed plate. DETAILED DESCRIPTION

[0036] In order to make the technical personnel in the art better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings, and the description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present application. Specifically, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the ordinary skilled in the art without creative labor should belong to the protection scope of the present application.

[0037] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] As mentioned in the background, to solve the problems existing in the prior art, the present embodiment provides a car glove box mechanism with temperature regulation function, comprising:

[0039] An instrument panel 1 is provided with a temperature guide structure for transferring heat.

[0040] A glove box 2 is rotatably connected to the instrument panel 1 and can form a first space 11 with the instrument panel 1. The glove box 2 has a storage cavity 21 on the side close to the instrument panel 1, which is in communication with the first space 11.

[0041] A temperature control device is arranged on the side of the instrument panel 1 away from the glove box 2, which can cool or heat the first space 11 through the temperature guide structure.

[0042] For example, Figures 1-6As shown, the instrument panel 1 is arranged on the center console in the vehicle cab, corresponding to the side of the co-driver, and has an open end on one side, and a first space 11 is formed inside the instrument panel 1. A first through hole 12 is arranged on the side of the instrument panel 1 away from the open end. The temperature guide structure is a temperature guide metal plate 3, which is closed at the first through hole 12 by screwing, welding, clamping or the like. The bottom end of the glove box 2 is rotatably connected to the instrument panel 1. The instrument panel 1 is locked and fixed to the top end of the glove box 2 by a locking assembly. The glove box 2 seals the open end, so that the first space 11 is relatively sealed. A press switch 6 is arranged above the open end on the instrument panel 1. The press switch 6 is in transmission connection with the locking assembly. By applying an external force to the press switch 6, the locking assembly can be unlocked, and the glove box 2 can be rotated relative to the instrument panel 1, so that the open end is opened, the first space 11 is communicated with the outside, and the external force applied to the press switch 6 is removed, and the locking assembly is switched to the locked state. The glove box 2 has a storage cavity 21 inside, which is communicated with the first space 11. The temperature control device is arranged inside the center console and is electrically connected with the vehicle power supply. When the temperature control device is started, the temperature control device can cool or heat the first space 11 through the temperature guide metal plate 3, so that the glove box mechanism realizes independent temperature control function.

[0043] The temperature control device is arranged on the instrument panel, and the temperature in the first space is controlled by the temperature control device, so that the glove box mechanism is not dependent on the cold air or hot air blown by the automobile air conditioning system for temperature control, and independent heating or cooling function is realized. At the same time, the temperature guide structure on the instrument panel further accelerates the conduction of heat, so that the temperature in the first space rises or falls rapidly.

[0044] In a preferred embodiment, the temperature control device comprises a compressor 101, a condenser 102, a liquid storage tank 103, a throttling element 104 and an evaporator coil 105 connected in sequence. The evaporator coil 105 is fixed on the side of the temperature guide structure away from the first space 11. When the compressor 101 works, the refrigerant passing through the evaporator coil 105 can cool the first space 11 through the temperature guide structure.

[0045] In a preferred embodiment, the temperature control device further comprises a heating film 107, which is fixed on the side of the temperature guide structure away from the first space 11, and can heat the first space 11 through the temperature guide structure when powered.

[0046] As Figure 7As shown, the temperature control device can realize refrigeration and heating functions through an air conditioning refrigeration system and the heating film 107 respectively. The air conditioning refrigeration system comprises a compressor 101, a condenser 102, a liquid storage tank 103, a throttling device 104 and an evaporator coil 105. The compressor 101 is arranged on a fixed support 113. The condenser 102 is arranged on one side of the fixed support 113. The liquid storage tank 103 is also arranged on the fixed support 113. The compressor 101 is electrically connected with a first controller 109. The first controller 109 can receive a first control signal and control the start and stop of the compressor 101 according to the first control signal. When the compressor 101 is started, the refrigerant is output as a high-temperature and high-pressure gas state through the compressor 101, releases heat to become a normal-temperature and high-pressure liquid state through the condenser 102, and is filtered of impurities and moisture in the liquid storage tank 103. After passing through the throttling device 104, the pressure of the refrigerant is reduced to become a normal-temperature and low-pressure liquid state. When entering the evaporator coil 105, the refrigerant absorbs heat to become a low-temperature and low-pressure gas state, and enters the compressor 101 again for the next cycle. Through the above arrangement, when the refrigerant passes through the evaporator coil 105, the first space 11 can be cooled by the temperature-conducting metal plate 3, so that the temperature in the first space 11 is reduced, thereby realizing the independent refrigeration function of the glove box mechanism. Further, the temperature control device can share the same compressor 101 with the vehicle air conditioning system, or an additional compressor 101 independent of the air conditioning system can be additionally arranged. The fixed support 113 can be arranged in the center console or the engine compartment, or other mountable positions. The positions of the compressor 101, the condenser 102, the liquid storage tank 103 and the first controller 109 on the fixed support 113 can also be adjusted according to actual conditions, for example, the condenser 102 can be placed on one side of the fixed support, or can be arranged on the top of the fixed support 113, which is not specially limited here.

[0047] The heating film 107 is fixed on the side of the temperature-conducting structure away from the first space 11 and is electrically connected with a second controller 110. The second controller 110 is used to control the on-off of the heating film 107. When the heating film 107 is powered on, the heating film 107 generates heat and heats the first space 11 through the temperature-conducting metal plate 3, so that the temperature in the first space 11 is increased, thereby realizing the independent heating function of the glove box mechanism. Further, the second controller 110 is also electrically connected with the first controller 109. The second controller 110 can receive a vehicle signal and generate a first control signal to be sent to the first controller 109. The first controller 109 controls the start and stop of the compressor 101 according to the first control signal. The second controller 110 can be arranged on the instrument panel 1 or in the center console or other mountable positions.

[0048] In a preferred embodiment, the side of the temperature-conducting structure away from the first space 11 is covered with a heat preservation member 108. The evaporator coil 105 and the heating film 107 are arranged between the heat preservation member 108 and the temperature-conducting structure.

[0049] like Figure 9 and Figure 10 As shown, the insulation component 108 is fixed on the instrument panel 1 at the position corresponding to the temperature-conducting metal plate 3. The insulation component 108 covers the evaporator coil 105 and the heating film 107, which can prevent the cold or heat from dissipating to the outside when the evaporator coil 105 or the heating film 107 exchanges heat with the first space 11 through the temperature-conducting metal plate 3. The insulation component 108 can be made of insulation cotton, sponge or other insulation materials, and no special limitation is made here.

[0050] Furthermore, such as Figure 7 As shown, the evaporator coil 105 is approximately S-shaped. The outer contour of the heating film 107 matches the shape formed by the evaporator coil 105. The two are staggered on the side of the heat-conducting metal plate 3 away from the first space 11. The evaporator coil 105 and the heating film 107 can be bonded to the heat-conducting metal plate 3 with double-sided adhesive tape 112, or other methods with the same bonding effect can be used instead.

[0051] In a preferred embodiment, the throttling element 104 may be either a capillary tube or an expansion valve.

[0052] like Figure 7 As shown, the throttling element 104 can be a capillary tube, an expansion valve, or other components with the same function.

[0053] In a preferred embodiment, a first fan 106 is also provided on one side of the condenser 102.

[0054] like Figure 7 As shown, the first fan 106 is also mounted on the fixed bracket 113 and located on one side of the condenser 102. When the high-temperature and high-pressure gaseous refrigerant passes through the condenser 102, it will release heat. The first fan 106 can accelerate the airflow around the condenser 102, thereby improving the cooling effect on the refrigerant.

[0055] In a preferred embodiment, the temperature control device includes a semiconductor plate 201, which is fixed on the side of the temperature-conducting structure away from the first space 11. When powered on, the semiconductor plate 201 can cool or heat the first space 11 through the temperature-conducting structure.

[0056] like Figure 8As shown, the temperature control device can also realize cooling and heating functions through the semiconductor board 201. The semiconductor board 201 is fixed on the side away from the first space 11 on the heat-conducting metal plate 3. The semiconductor board 201 is electrically connected to the PCB board 205. The PCB board 205 is used to control the current flow direction in the semiconductor board 201, which can switch the semiconductor board 201 between releasing heat and absorbing heat. The heat is transferred between the semiconductor board 201 and the first space 11 through the heat-conducting metal plate 3, thereby realizing the independent cooling or heating function of the glove box mechanism.

[0057] In a preferred embodiment, a heat sink 202 is provided on the side of the semiconductor plate 201 away from the first space 11, and the heat sink 202 is used to dissipate heat from the semiconductor plate 201.

[0058] In a preferred embodiment, a second fan 203 is also provided on the side of the heat sink 202 away from the semiconductor plate 201.

[0059] like Figures 11-13 As shown, a lower fixing plate 206 is provided on the side of the instrument panel 1 away from the first space. The lower fixing plate 206 has a second opening, which corresponds to the semiconductor board 201 so that the lower fixing plate 206 can be arranged around the semiconductor board 201. An upper fixing plate 207 is fixed on the side of the lower fixing plate 206 away from the instrument panel 1. The upper fixing plate 207 and the lower fixing plate 206 can be fixed by means of threaded connection, welding or snap-fit. The space formed by the upper fixing plate 207 and the lower fixing plate 206 is connected to the external environment through the channel formed by the circumferential edges of the two. The heat sink 202 is fixed on the side of the semiconductor board 201 away from the first space 11. The heat sink 202 and the PCB board 205 are arranged together in the space formed by the upper fixing plate 207 and the lower fixing plate 206. The upper fixing plate 207 has a third opening corresponding to the position of the heat sink 202. The second fan 203 is provided. The heat is placed at the third port. When the semiconductor board 201 is powered on, the heat generated by the semiconductor board 201 can be conducted to the heat sink 202. At this time, the second fan 203 is started, and the gas enters the space formed by the channel formed by the upper fixed plate 207 and the lower fixed plate 206 around their periphery. After contacting the heat sink 202, the gas takes away the heat on the heat sink 202 and is discharged through the third port under the drive of the second fan 203. In this embodiment, the heat sink 202 includes a heat sink plate with heat sink fins distributed on it. In other embodiments of this application, other heat sink materials can also be used instead. Furthermore, a sealing element 204 is also provided between the instrument panel 1 and the lower fixed plate 206. The sealing element 204 can be a foam pad. When the semiconductor board 201 exchanges heat with the first space 11, the sealing element 204 can prevent heat from dissipating to the outside and has a heat insulation effect.

[0060] In a preferred embodiment, the instrument panel 1 is provided with a mixing device, which is used to cause the gas in the first space 11 to flow, thereby causing the gas to circulate between the first space 11 and the mixing device.

[0061] like Figure 14 and 15 As shown, the mixing device includes a housing 4, which is located on the side of the instrument panel 1 away from the first space 11. The housing 4 has a second space 41 inside. Multiple air inlets 13 and multiple air outlets 14 are provided on the instrument panel 1 corresponding to the position of the housing 4. The second space 41 communicates with the first space 11 through the air inlets 13 and air outlets 14. A third fan 5 is also provided inside the housing 4. The third fan 5 is electrically connected to the vehicle's power supply. When the third fan 5 is activated, the gas in the second space 41 enters the first space 11 through the air outlets 14, causing gas flow within the first space 11. The gas enters the second space 41 through the air inlet 13, and then the gas can circulate between the first space 11 and the second space 41. Through the gas circulation, the heat transfer speed in the first space 11 is accelerated, and the heating or cooling effect of the temperature control device is further enhanced. In other embodiments of this application, the cover 4 and the third fan 5 can also be set in the first space 11, and the air inlet 13 and the air outlet 14 are opened on the cover 4. At the same time, there are no special limitations on the number, size, position and shape of the air inlet 13 and the air outlet 14, as long as they can connect the first space 11 and the second space 41.

[0062] Working principle: When the temperature control device achieves cooling and heating functions through the air conditioning refrigeration system and heating film 107, the second controller 110 receives the vehicle signal and generates a first control signal, which is transmitted to the first controller 109. The first controller starts the compressor 101 according to the first control signal. The refrigerant is output as a high-temperature, high-pressure gas through the compressor 101. When it passes through the condenser 102, it releases heat and is converted into a room-temperature, high-pressure liquid refrigerant. After passing through the liquid receiver 103 to filter out impurities and moisture in the refrigerant, and then passing through the throttling device 104, the pressure is reduced, and it is converted into a room-temperature, low-pressure liquid. After entering the evaporator coil 105, the refrigerant absorbs heat from the first space 11 through the heat-conducting metal plate 3, causing the temperature inside the first space 11 to decrease. The glove box mechanism then achieves independent cooling function. At the same time, the refrigerant changes from a normal temperature and low pressure liquid to a low temperature and low pressure gaseous refrigerant and re-enters the compressor 101 for the next cycle. The second controller 110 receives the vehicle signal and controls the heating film 107 to be energized. The heating film 107 generates heat and releases it into the first space 11 through the heat-conducting metal plate 3, causing the temperature inside the first space 11 to rise. The glove box mechanism then achieves independent heating function.

[0063] When the temperature control device realizes the cooling and heating functions through the semiconductor board 201, the PCB board 205 controls the semiconductor board 201 to be powered on. The semiconductor board 201 generates heat and releases it into the first space 11 through the heat-conducting metal plate 3, causing the temperature in the first space 11 to rise, and the glove box mechanism realizes the independent heating function. When the PCB board 205 changes the current direction in the semiconductor board 201, the semiconductor board 201 absorbs heat from the first space 11 through the heat-conducting metal plate 3, causing the temperature in the first space 11 to drop, and the glove box mechanism realizes the independent cooling function.

[0064] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. A car glove box mechanism with temperature regulation function, characterized in that, The utility model relates to an instrument panel (1) is provided with the temperature guide structure for transmitting heat on the instrument panel (1), a glove box (2) is rotatably connected on the instrument panel (1), can form first space (11) with the instrument panel (1) enclosure, the glove box (2) is provided with the storage cavity (21) that communicates with first space (11) on the side close to the instrument panel (1), a temperature control device is arranged on the side of the instrument panel (1) away from the glove box (2), and the first space (11) can be refrigerated or heated through the temperature guide structure. The temperature control device comprises a compressor (101), a condenser (102), a liquid storage tank (103), a throttling component (104) and an evaporator coil (105) connected in sequence, the evaporator coil (105) is fixed on the side of the temperature guide structure away from the first space (11), and the refrigerant passing through the evaporator coil (105) can refrigerate the first space (11) through the temperature guide structure when the compressor (101) works. The temperature control device further comprises a heating film (107) fixed on the side of the temperature guide structure away from the first space (11), which can heat the first space (11) through the temperature guide structure. The side of the temperature guide structure away from the first space (11) is covered with a heat preservation component (108), and the evaporator coil (105) and the heating film (107) are arranged between the heat preservation component (108) and the temperature guide structure.

2. The glove box mechanism for a vehicle having a temperature adjustment function according to claim 1, wherein The throttling component (104) can be a capillary tube or an expansion valve.

3. The glove box mechanism having a temperature adjustment function according to claim 2, wherein One side of the condenser (102) is further provided with a first fan (106).

4. The glove box mechanism having a temperature adjustment function according to claim 3, wherein The temperature control device comprises a semiconductor plate (201) fixed on the side of the temperature guide structure away from the first space (11), which can refrigerate or heat the first space (11) through the temperature guide structure when powered.

5. The glove box mechanism having a temperature adjustment function according to claim 2, wherein The side of the semiconductor plate (201) away from the first space (11) is provided with a heat dissipation component (202) for dissipating heat of the semiconductor plate (201).

6. The glove box mechanism having a temperature adjustment function according to claim 2, wherein The side of the heat dissipation component (202) away from the semiconductor plate (201) is further provided with a second fan (203).

7. The glove box mechanism having a temperature adjustment function according to claim 1, wherein The instrument panel (1) is provided with a mixing device for making the gas in the first space (11) flow, thereby making the gas circulate between the first space (11) and the mixing device.

8. The glove box mechanism having a temperature adjustment function according to claim 7, wherein ​ 9. The glove box mechanism having a temperature adjustment function according to claim 8, wherein ​ 10. The glove box mechanism having a temperature adjustment function for a vehicle according to claim 1, wherein ​