Automatic packaging and braiding mechanism for semiconductor chip

Abstract

The utility model relates to an automatic packaging and braiding mechanism of a semiconductor chip, which comprises a mounting plate, a carrier tape guide rail fixedly mounted on the side wall of one end of the mounting plate, a heat sealing structure mounted above the middle section of the carrier tape guide rail, and cover tape unwinding devices mounted on the mounting plate on two sides of the heat sealing structure. When the taping structure is wound through the winding disc, the winding speed of the taping structure can be gradually increased along with increase of the thickness of the taping structure of the winding disc, the discharging speed of the conveying roller is fixed, and when the discharging speed of the conveying roller is smaller than the winding speed of the winding disc, the taping structure can apply rightward pulling force to the winding disc; the tension effect can pull the winding disc to drive the sliding plate to slide into the sliding pipe and extrude the spring to contract, so that the braid structure is kept in a tensioned state, meanwhile, the distance between the winding disc and the mounting plate is adjusted, and the braid structure is prevented from being broken due to hard pulling as much as possible.

Description

Technical Field

[0001] This utility model belongs to the field of tape and reel machine technology, specifically relating to an automatic packaging and tape-reeling mechanism for semiconductor chips. Background Technology

[0002] Tape and reel machines can be divided into two main categories: semi-automatic and fully automatic. They take loose components, process them through inspection, reversal, and testing, and then put them into carrier tape. With the continuous upgrading, refinement, and high integration of electronic products, electronic components have also been transformed from plug-in type to surface mount type to save circuit board installation space and expand product functions. This is a major revolution in the electronics industry.

[0003] Existing chip taping machines are generally equipped with a take-up reel for winding the carrier tape after taping, which facilitates the storage of the carrier tape. However, as the thickness of the carrier tape wound on the take-up reel increases, the winding speed of the carrier tape gradually increases. Since the taping speed of the taping machine is generally constant, the output speed of the taping machine will be faster than the winding speed of the carrier tape. At this time, the carrier tape is prone to being subjected to hard pulling, which can lead to the carrier tape breaking and affect the winding of semiconductor chips. Utility Model Content

[0004] The purpose of this invention is to provide an automatic packaging and taping mechanism for semiconductor chips that is simple in structure and reasonably designed in order to solve the above problems.

[0005] This utility model achieves the above objectives through the following technical solutions:

[0006] An automated packaging and taping mechanism for semiconductor chips includes a mounting plate. A carrier tape guide is fixedly mounted on one side wall of the mounting plate. A heat-sealing structure is mounted above the middle section of the carrier tape guide. Cover tape unwinding devices are mounted on the mounting plate on both sides of the heat-sealing structure. A feeding structure aligned with the end of the carrier tape guide is provided below the cover tape unwinding devices. A sliding tube is fixedly connected to the end of the mounting plate away from the carrier tape guide. Two symmetrically arranged guide rods are fixedly connected to the inner cavity of the sliding tube. One end of each guide rod is sleeved around its periphery and connected to the guide rod. A spring is fixedly connected to the rod. A slide plate is slidably connected to the free end of the slide tube. A sliding hole is opened in the slide plate and is aligned with the guide rod. The slide plate is sleeved on the guide rod through the sliding hole and can slide along the length of the guide rod. The other end of the spring is fixed to one end of the slide plate located in the inner cavity of the slide tube. A winding motor is fixedly installed on the rear side of the end of the slide plate located outside the slide tube. The output end of the winding motor passes through the slide plate and is rotatably connected to the slide plate. A winding reel is detachably connected to the output end of the winding motor.

[0007] As a further optimization of this utility model, an end cap is fixedly connected to the right end of the carrier tape guide rail, and the top wall of the end cap is provided with a feeding port for adding chips into the carrier tape.

[0008] As a further optimization of this utility model, the heat sealing structure includes a heat sealing knife disposed above the carrier belt guide rail, a cylinder is fixedly connected to the mounting plate above the heat sealing knife, a piston rod is installed at the output end of the cylinder, and the bottom end of the piston rod is fixed to the upper surface of the heat sealing knife.

[0009] As a further optimization of this utility model, the cover tape unwinding device includes a cover tape unwinding reel rotatably connected to the mounting plate on the left side of the heat sealing knife, and a set of guide rollers rotatably connected to the mounting plate on the right side of the heat sealing knife.

[0010] As a further optimization of this utility model, the material conveying structure includes two transmission rollers rotatably connected to the bottom of the cover tape unwinding reel, with a gap between the two transmission rollers for the carrier tape to pass through, and a transmission motor for driving one of the transmission rollers to rotate is fixedly installed on the back of the mounting plate.

[0011] As a further optimization of this utility model, a connector is fixedly installed on the output end of the winding motor, and the side of the winding reel near the winding motor is detachably connected to the output end of the winding motor through the connector.

[0012] The beneficial effects of this utility model are as follows: When the braided structure is wound by the take-up reel, as the thickness of the braided structure increases, the winding speed of the braided structure will gradually increase. However, the discharge speed of the conveyor roller is fixed. When the discharge speed of the conveyor roller is less than the winding speed of the take-up reel, the braided structure will apply a rightward pulling force to the take-up reel. This pulling force will pull the take-up reel to slide the slide plate into the slide tube and compress the spring to contract. This keeps the braided structure in a taut state while adjusting the distance between the take-up reel and the mounting plate, thus minimizing the risk of the braided structure breaking due to hard pulling. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall front structure of this utility model;

[0014] Figure 2 This is a utility model Figure 1 Enlarged view of a close-up detail at point A in the middle;

[0015] Figure 3 This is a schematic diagram of the overall back structure of this utility model;

[0016] Figure 4 This is a schematic diagram of the connection structure of the slide tube, slide plate, and winding reel of this utility model;

[0017] Figure 5 This is a utility model Figure 4 A schematic diagram of the cross-sectional structure.

[0018] In the diagram: 1. Mounting plate; 2. Carrier belt guide rail; 3. Feed port; 4. Transfer roller; 5. Transfer motor; 6. Cover belt unwinding reel; 7. Guide roller; 8. Heat sealing knife; 9. Cylinder; 10. Piston rod; 11. Slide tube; 12. Guide rod; 13. Slide plate; 14. Slide hole; 15. Spring; 16. Rewinding motor; 17. Rewinding reel. Detailed Implementation

[0019] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0020] Example

[0021] like Figure 1 - Figure 5 As shown, an automatic packaging and taping mechanism for semiconductor chips includes a mounting plate 1. A carrier tape guide rail 2 is fixedly mounted on one side wall of the mounting plate 1. An end cap is fixedly connected to the upper right end of the carrier tape guide rail 2. The top wall of the end cap has a feeding port 3 for adding chips into the carrier tape. When the carrier tape is transported along the inside of the carrier tape guide rail 2, the semiconductor chip can be placed in the cavity provided on the carrier tape through the feeding port 3.

[0022] A heat sealing structure is installed above the middle section of the carrier guide rail 2. The heat sealing structure includes a heat sealing knife 8 set above the carrier guide rail 2. A cylinder 9 is fixedly connected to the mounting plate 1 above the heat sealing knife 8. A piston rod 10 is installed at the output end of the cylinder 9. The bottom end of the piston rod 10 is fixed to the upper surface of the heat sealing knife 8. When in use, the heat sealing knife 8 is preheated first. When the heat sealing knife 8 is heated to the specified temperature, the cylinder 9 is started. The cylinder 9 pushes the piston rod 10 to extend, thereby pushing the heat sealing knife 8 to move down to perform the heat sealing work.

[0023] The mounting plates 1 on both sides of the heat-sealing structure are equipped with cover tape unwinding devices. The cover tape unwinding devices include a cover tape unwinding reel 6 rotatably connected to the mounting plate 1 on the left side of the heat-sealing knife 8, and a set of guide rollers 7 rotatably connected to the mounting plate 1 on the right side of the heat-sealing knife 8. The guide rollers 7 guide the end of the upper cover tape installed on the cover tape unwinding reel 6 to the top of the carrier tape after the chip is placed, so that the carrier tape and cover tape can be heat-sealed by the heat-sealing knife 8.

[0024] Below the cover tape unwinding device is a material conveying structure aligned with the end of the carrier tape guide rail 2. The material conveying structure includes two transmission rollers 4 rotatably connected to the bottom of the cover tape unwinding reel 6. A gap is left between the two transmission rollers 4 for the carrier tape to pass through. A transmission motor 5 for driving one of the transmission rollers 4 to rotate is fixedly installed on the back of the mounting plate 1. After the carrier tape and cover tape are heat-sealed by the heat-sealing knife 8, the end of the heat-sealed braided structure can be pulled so that the end of the braided structure passes through the gap between the two transmission rollers 4. At this time, the transmission motor 5 is started to drive the transmission roller 4 to rotate, and the braided structure can be conveyed by the friction between the transmission roller 4 and the braided structure.

[0025] A slide tube 11 is fixedly connected to one end of the mounting plate 1 away from the carrier rail 2. Two symmetrically arranged guide rods 12 are fixedly connected inside the slide tube 11. A spring 15, one end of which is fixedly connected to the guide rod 12, is sleeved around the periphery of the guide rod 12. A slide plate 13 is slidably connected to the free end of the slide tube 11. A sliding hole 14, which is aligned with the guide rod 12, is opened inside the slide plate 13. The slide plate 13 is sleeved on the guide rod 12 through the sliding hole 14 and can slide along the length of the guide rod 12. The other end of the spring 15 is fixed to one end of the slide plate 13 located in the cavity of the slide tube 11. When the slide plate 13 is subjected to a rightward pulling force, the slide plate 13 can slide along the guide rod 12 and the slide tube 11 through the sliding hole 14, and compress the spring 15 sleeved on the guide rod 12 to contract, thereby adjusting the distance between the left end of the slide plate 13 and the mounting plate 1.

[0026] A take-up motor 16 is fixedly installed on the rear side of one end of the slide plate 13 outside the slide tube 11. The output end of the take-up motor 16 passes through the slide plate 13 and is rotatably connected to the slide plate 13. A connector is fixedly installed on the output end of the take-up motor 16. The side of the take-up reel 17 near the take-up motor 16 is detachably connected to the output end of the take-up motor 16 through the connector. The take-up motor 16 is set to drive the take-up reel 17 to rotate and to take up the tape structure after the packaged chip. The connector is set to snap the take-up reel 17 onto the output end of the take-up motor 16, so that the user can install and remove the take-up reel 17.

[0027] It should be noted that, in the use of this automatic packaging and taping mechanism for semiconductor chips, the carrier tape is first passed through the inside of the carrier tape guide rail 2 and moved into the gap between the two transfer rollers 4. Then, the chip is placed on the carrier tape through the feeding port 3. At this time, the cover tape wound on the cover tape unwinding reel 6 can be pulled, and the end of the cover tape is wrapped around the guide roller 7 and attached to the carrier tape. At this time, the starting cylinder 9 pushes the piston rod 10 to extend, thereby pushing the heat sealing knife 8 heated to a suitable temperature to move down. The heat sealing knife 8 is used to squeeze the upper surface of the cover tape to heat seal the cover tape onto the carrier tape. The transfer motor 5 is started to drive the transfer roller 4 to rotate and transport the carrier tape, thus completing the continuous taping and packaging of semiconductor chips.

[0028] Meanwhile, the user can fix one end of the heat-sealed carrier tape and cover tape to the take-up reel 17 and start the take-up motor 16. The take-up motor 16 drives the take-up reel 17 to rotate, and the packaged tape structure is stored on the take-up reel 17. As the thickness of the tape structure wound on the take-up reel 17 increases, the tape winding speed gradually increases. The discharge speed of the transmission roller 4 is fixed. When the discharge speed of the transmission roller 4 is less than the winding speed of the take-up reel 17, the tape structure will apply a rightward pulling force to the take-up reel 17. This pulling force will pull the take-up reel 17 to slide the slide plate 13 into the slide tube 11 and compress the spring 15 to contract, so that the tape structure is in a taut state. At the same time, the distance between the take-up reel 17 and the mounting plate 1 is adjusted to avoid the tape structure from being broken by hard pulling.

[0029] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. An automatic packaging and strapping mechanism for semiconductor chips, comprising a mounting plate (1), a carrier tape guide rail (2) fixedly mounted on one end side wall of the mounting plate (1), a heat sealing structure mounted above a middle section of the carrier tape guide rail (2), a cover tape unwinding device mounted on the mounting plate (1) on both sides of the heat sealing structure, and a material conveying structure arranged below the cover tape unwinding device and aligned with an end portion of the carrier tape guide rail (2), characterized in that: The mounting plate (1) is fixedly connected with a sliding pipe (11) at one end away from the carrier tape guide rail (2), two symmetrically arranged guide rods (12) are fixedly connected in the inner cavity of the sliding pipe (11), a spring (15) is sleeved on the side of the guide rod (12) and fixedly connected with the guide rod (12) at one end, a sliding plate (13) is slidably connected with the free end of the sliding pipe (11), a sliding hole (14) is formed in the sliding plate (13) and arranged in position with the guide rod (12), the sliding plate (13) is sleeved on the guide rod (12) through the sliding hole (14) and can slide along the length direction of the guide rod (12), the other end of the spring (15) is fixed with one end of the sliding plate (13) in the inner cavity of the sliding pipe (11), a winding motor (16) is fixedly installed at the rear side of one end of the sliding plate (13) outside the sliding pipe (11), the output end of the winding motor (16) penetrates the sliding plate (13) and is rotatably connected with the sliding plate (13), and a winding disc (17) is detachably connected with the output end of the winding motor (16). ​ 2. The apparatus according to claim 1, wherein: The end cover is fixedly connected to the right end of the carrier tape guide rail (2), and a discharge port (3) for adding chips into the carrier tape is formed in the top wall of the end cover.

3. The automatic packaging and taping mechanism for semiconductor chips according to claim 1, characterized in that: The heat sealing structure comprises a heat sealing knife (8) arranged above the carrier tape guide rail (2), a gas cylinder (9) fixedly connected to the mounting plate (1) above the heat sealing knife (8), a piston rod (10) installed on the output end of the gas cylinder (9), and the bottom end of the piston rod (10) is fixedly connected with the upper surface of the heat sealing knife (8).

4. The automatic packaging and taping mechanism for semiconductor chips according to claim 3, characterized in that: The cover tape unwinding device comprises a cover tape unwinding disc (6) rotatably connected to the mounting plate (1) on the left side of the heat sealing knife (8), and a group of guide rollers (7) rotatably connected to the mounting plate (1) on the right side of the heat sealing knife (8).

5. The automatic packaging and taping mechanism for semiconductor chips according to claim 4, characterized in that: The material conveying structure comprises two transmission rollers (4) rotatably connected below the cover tape unwinding disc (6), a gap is formed between the two transmission rollers (4) for the carrier tape to pass through, and a transmission motor (5) for driving one of the transmission rollers (4) to rotate is fixedly installed on the back surface of the mounting plate (1).

6. The apparatus of claim 1, wherein: the apparatus further comprises a plurality of semiconductor chips; and the plurality of semiconductor chips are arranged in a plurality of rows and columns. A connector is fixedly installed on the output end of the winding motor (16), and the winding disc (17) is detachably connected with the output end of the winding motor (16) through the connector.

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