Mechanism platform system

Abstract

The mechanism platform system comprises a frame, a rotating device, a rotating disc, a position detection system and a control system. The shelf comprises a plurality of goods shelves arranged in the vertical direction. The rotating device is mounted on one of the plurality of shelves. A carousel is coupled to a rotating device, where the carousel is configured to support a wafer boat containing one or more semiconductor wafers, and the rotating device is configured to rotate the carousel to adjust an orientation of the wafer boat. The position detection system comprises a transmitting device and a receiving device which are installed on the goods shelf and located on the two opposite sides of the rotating disc, and the transmitting device and the receiving device are used for detecting light blocking elements of the wafer boats when the wafer boats are aligned to the rotating disc. And the control system is in communication connection with the rotating device and the position detection system, and is used for controlling the rotation of the turntable and monitoring the alignment condition of the wafer boat.

Description

Technical Field

[0001] This disclosure concerns an institutional platform system. Background Technology

[0002] The integrated circuit (IC) industry has experienced rapid growth. Technological advancements in IC materials and design have led to the production of generation after generation of ICs, each generation being smaller and more complex than the last. However, these advancements have also increased the complexity of processing and manufacturing ICs, and similar developments in IC processing and manufacturing are necessary to realize these advancements.

[0003] In the evolution of integrated circuits, functional density (i.e., the number of interconnect components per wafer region) has typically increased, while geometry (i.e., the smallest component (or line) that can be created using manufacturing processes) has decreased. This scaling down process generally provides benefits by increasing production efficiency and reducing associated costs. This scaling down also results in relatively high power dissipation values, which can be addressed by using low-power dissipation components such as complementary metal-oxide-semiconductor (CMOS) devices. Utility Model Content

[0004] In some embodiments, the mechanism platform system includes a frame, a rotating device, a turntable, a protective plate, a position detection system, and a control system. The frame includes multiple shelves arranged vertically. The rotating device is mounted on one of the shelves. The turntable is coupled to the rotating device, wherein the turntable includes a first linear groove recessed downwards from the top surface of the turntable and extending through opposite side walls of the turntable. The protective plate is mounted below the turntable, and the rotating device is coupled to the turntable through an opening in the protective plate. The position detection system includes a transmitter and a receiver mounted on the shelves and located on opposite sides of the turntable. The control system is communicatively connected to the rotating device and the position detection system.

[0005] In some embodiments, the mechanism platform system includes: a shelf, a rotating device, a turntable, and a position detection system. The shelf includes a plurality of shelves arranged in a vertical direction. The rotating device is mounted on one of the shelves. The turntable is coupled to the rotating device. The turntable configuration includes a linear groove. The linear groove is recessed downward from a top surface of the turntable and extends through opposite side walls of the turntable. The position detection system includes a transmitter and a receiver mounted on the shelves and located on opposite sides of the turntable. In a rotational position of the turntable, a virtual extension of the linear groove is aligned with the transmitter and receiver of the position detection system.

[0006] In some embodiments, the mechanism platform system includes: a shelf, a rotating device, a turntable, and a track. The shelf includes a plurality of shelves arranged in a vertical direction. The rotating device is mounted on one of the shelves. The turntable is coupled to the rotating device, wherein the turntable has a plurality of linear slots recessed downward from a top surface of the turntable, and in a top view, the linear slots extend parallel to each other. The track is adjacent to the shelf, wherein one direction of the track extends parallel to the direction of extension of one of the shelves within the shelf, and the height of the track is lower than the height of the rotating device. Attached Figure Description

[0007] When viewed in conjunction with the accompanying drawings, the best understanding of the nature of this disclosure is found in the following detailed illustrations. Note that, in accordance with standard industry practice, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of explanation.

[0008] Figure 1 This is a framework diagram of a manufacturing apparatus according to some embodiments of this disclosure;

[0009] Figure 2 The illustration depicts a semiconductor manufacturing plant according to some embodiments of this disclosure, including trolleys, production tools, stockers, and wafer transport channels.

[0010] Figure 3 It is a flowchart illustrating a semiconductor manufacturing method according to some embodiments of this disclosure;

[0011] Figures 4A to 4C A cross-sectional view of an intermediate stage of forming a semiconductor structure on a substrate is illustrated according to some embodiments of this disclosure;

[0012] Figure 5A and Figure 5B Schematic diagrams of wafer boats and wafer carriers according to some embodiments disclosed herein;

[0013] Figures 6A to 8B The illustration shows various stages of a method according to some embodiments of the present disclosure, in which the wafer is automatically moved (e.g., rotated) by an automated mechanism platform device.

[0014] [Symbol Explanation]

[0015] 1: Manufacturing equipment

[0016] 2: Manufacturing Line

[0017] 3: Manufacturing equipment

[0018] 8: Stroller

[0019] 12: Storage device

[0020] 16: Wafer Transfer Channel

[0021] 20: Network

[0022] 21: Load port

[0023] 25: Manufacturing System

[0024] 40: Measuring equipment

[0025] 55: Fault Detection and Classification System

[0026] 60: Control System

[0027] 62: Transmission Module

[0028] 62a: Wafer container clamping device

[0029] 62b: Linear Actuator

[0030] 62c: Lifting device

[0031] 62d: Rotating device

[0032] 63b: Horizontal slide rail

[0033] 64b: Movable carrier

[0034] 75: Storing databases

[0035] 85: Unit

[0036] 102: Wafer Boat

[0037] 102a: Handle

[0038] 102b: Light blocking element

[0039] 102c: Highlighting strip features

[0040] 104: Wafer Carrier

[0041] 110:Lower box

[0042] 112: Base plate

[0043] 114: Boxboard

[0044] 116: Front panel

[0045] 118: Rear panel

[0046] 120: Top Cover

[0047] 122: Top cover plate

[0048] 124: Side cover plate

[0049] 126: Front cover

[0050] 128: Rear cover

[0051] 200: shelf

[0052] 230: Exhaust System

[0053] 300: shelf

[0054] 310: Shelves

[0055] 310r: Groove

[0056] 311: Protection board

[0057] 311h: Hole

[0058] 315: Carrier support base

[0059] 320: Automated mechanism platform device

[0060] 322: Turntable

[0061] 322a: slot

[0062] 322b: slot

[0063] 324: Rotating device

[0064] 325: Metal Pad

[0065] 326: Position Detection System

[0066] 328a: Launching device

[0067] 328b: Receiving device

[0068] 330: Passivation layer

[0069] AS: Side

[0070] BS: rear side

[0071] D1: Distance

[0072] FG: Fluorinated gas

[0073] FS: Front

[0074] GF: airflow

[0075] HO: Opening

[0076] L1: Length

[0077] L2: Length

[0078] M: Method

[0079] PR: Photoresist layer

[0080] PRO: Opening

[0081] S1-S6: Steps

[0082] W: Wafer

[0083] W1: Width

[0084] W2: Width Detailed Implementation

[0085] The following disclosure provides numerous different implementations or examples for implementing various features of the provided object. Specific examples of components and configurations are illustrated below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For instance, in the following illustrations, the formation of a first feature above or on a second feature may include implementations where the first and second features are formed in direct contact, and may also include implementations where additional features may be formed between the first and second features so that the first and second features are not in direct contact. Furthermore, in various instances, references to numbers and / or letters may be repeated in this disclosure. This repetition is for simplicity and clarity and does not, in itself, define the relationships between the various implementations and / or configurations discussed.

[0086] Additionally, for ease of illustration, spatial relative terms such as “beneath,” “below,” “lower,” “above,” and “upper,” and similar terms, are used herein to illustrate the relationship between one element or feature as illustrated in the figures and another. These spatial relative terms are intended to cover different orientations of elements in use or operation, in addition to those depicted in the figures. Elements may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative illustration terms used herein may be interpreted accordingly. As used herein, “approximately,” “probably,” “around,” or “substantially” can mean within 20%, 10%, or 5% of a given value or range. However, those skilled in the art will understand that the values ​​or ranges listed throughout the illustrations are merely examples and may decrease as integrated circuits shrink. The numerical values ​​disclosed herein are approximate, and unless explicitly stated otherwise, terms such as “approximately,” “probably,” “around,” or “substantially” can be inferred.

[0087] Unless otherwise defined, all terms used in this disclosure (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and this disclosure, and shall not be interpreted as having an idealized or overly formal meaning, unless expressly defined herein.

[0088] This disclosure provides a method to address the problem of manually retrieving a semiconductor boat from an unsafe location after it has been placed on a storage rack by a transfer module. In some embodiments, retrieving the semiconductor boat from a location other than the handle may result in it falling and causing a hazard. Furthermore, the semiconductor boat may have been exposed to strong acids in the early stages of the process, rendering areas other than the handle unsuitable for handling. Therefore, various embodiments of this disclosure provide an automated turntable capable of rotating the semiconductor boat to a position where the handle faces the operator. The process can be automated, ensuring that the handle of the semiconductor boat is on the accessible side, thereby eliminating unsafe manual operation and promoting automation.

[0089] See Figure 1 . Figure 1 This is a framework diagram of a manufacturing apparatus according to some embodiments of the present disclosure. Manufacturing apparatus 1 can implement integrated circuit manufacturing processes to produce integrated circuit devices. For example, manufacturing apparatus 1 can perform semiconductor manufacturing processes for producing semiconductor wafers. It should be noted that, for the purpose of clearly illustrating the concepts of this disclosure, Figure 1 Manufacturing equipment 1 in the figure has been simplified. Other functions can be added to manufacturing equipment 1, and some functions described below may be replaced or omitted in other embodiments. Manufacturing equipment 1 may include multiple functional units. In some embodiments, it may also include other functional units not shown in the figures. In some embodiments, manufacturing equipment 1 may include a network 20 that allows functional units (such as manufacturing system 25, measuring device 40, fault detection and classification (FDC) system 55, control system 60, archive database 75, and other units 85) to communicate with each other. Network 20 may be a single network or a combination of multiple different networks, such as an intranet, the Internet, or other networks, or a combination thereof. Network 20 may include wired communication channels, wireless communication channels, or a combination thereof.

[0090] See Figure 2 . Figure 2An example manufacturing line 2 is illustrated for implementing integrated circuit manufacturing processes to produce integrated circuit devices. For example, the aforementioned manufacturing line 2 can perform semiconductor manufacturing processes to produce semiconductor wafers. It should be noted that, for clarity of the concepts disclosed herein, Figure 2 Manufacturing line 2 in the process has been simplified. For example... Figure 2 As shown, manufacturing line 2 may include a production tool 3. The aforementioned manufacturing line may also include a trolley 8, a stocker 12, and a wafer transport channel 16. The trolley 8 and the wafer transport channel 16 can be used to transport wafer boats 102 (see [reference]). Figure 5A and Figure 5B The wafer carrier 104 is a wafer boat 102. In some embodiments, the wafer carrier 104 may be made of quartz and / or polypropylene (PP). In some embodiments, the wafer boat 102 / wafer carrier 104 may be interchangeably referred to as a wafer holder, box, or front-opening unified pods (FOUPs). In some manufacturing processes, the wafer needs to pass through one or more of the above-mentioned tools. For example, the wafer carrier 104 may be transported by a trolley 8 to a storage device 12 having wafer storage units for storing wafers. The wafer boat 102 / wafer carrier 104 may also be transported to a loading port 21, which loads and removes wafers from the manufacturing machine 3. The manufacturing machine 3 can perform manufacturing steps on the wafers. Transport between manufacturing machines 3 may be carried out by a trolley 8 or an automated wafer transfer channel 16. In some embodiments, the manufacturing machine may be interchangeably referred to as equipment.

[0091] See Figures 3 to 5B . Figure 3 It is a flowchart illustrating a wafer processing method M according to some embodiments of this disclosure. Figures 4A to 4C Various stages of the aforementioned method M are illustrated, according to some embodiments of this disclosure. Figure 5A and Figure 5B This illustrates a schematic diagram of a wafer boat 102 and a wafer carrier 104 according to some embodiments of this disclosure. Method M may include steps S1-S6. In step S1, a photoresist layer PR is formed on a passivation layer 330 on the wafer W. In step S2, the passivation layer 330 is etched to expose the metal pad 325. In step S3, the wafer W is placed on the wafer boat 102, and then the wafer boat is moved to a rack 200 with a gas venting system (see [link]). Figure 6A A gas removal process is performed on the wafer W. In step S4, a lift-off process is performed on the wafer W to remove the photoresist layer PR. In step S5, an alloy is formed on the metal pad 325. It should be noted that... Figure 3 Additional steps may be provided before, during, or after steps S1-S5 shown, and certain steps may be substituted or omitted for other embodiments. The order of operations / processes may be interchanged.

[0092] See Figure 3 and Figure 4A Method M begins with step S1, where a photoresist layer PR can be formed on a passivation layer 330 on wafer W. Wafer W can be referred to as a semiconductor substrate. Wafer W can be made of a suitable elemental semiconductor (e.g., silicon, diamond, or germanium); or it can be made of a suitable alloy or compound semiconductor (e.g., group IV compound semiconductors (silicon germanium (SiGe), silicon carbide (SiC), silicon germanium carbide (SiGeC), tin germanium (GeSn), silicon tin (SiSn), silicon germanium tin (SiGeSn)), group III-V compound semiconductors (e.g., gallium arsenide (GaAs), indium gallium arsenide (InGaAs), indium arsenide (InAs), indium phosphide (InP), indium antimonide (InSb), gallium arsenide phosphide (GaAsP), or indium gallium phosphide (GaInP)) etc.). Furthermore, wafer W may include an epi-layer, which may be strain-treated to improve performance, and / or may include a silicon-on-insulator (SOI) structure.

[0093] In some embodiments, one or more active and / or passive devices may be formed on wafer W. Interconnect structures may be formed over the active and / or passive devices. The aforementioned interconnect structures may include metallization patterns, wherein metal lines extend horizontally and metal vias extend vertically into a dielectric layer. Subsequently, one or more metal pads 325 (also referred to as top metal layers) may be formed on the interconnect structure, making them in direct contact with the metallization patterns in the interconnect structure. Therefore, the metal pads 325 may be electrically connected to the metallization patterns in the interconnect structure. The metal pads 325 may be made of aluminum, aluminum-copper, aluminum alloys, copper, copper alloys, or other materials. For example, the metal pads 325 may include aluminum-copper pads (AlCu). The metal pads 325 may also be referred to as bond pads. A passivation layer 330 is formed to cover the metal pads 325. The passivation layer 330 can be fabricated from a dielectric material (e.g., undoped silicate glass (USG), silicon nitride, silicon oxide, silicon oxynitride, or a non-porous material) using any suitable method (e.g., chemical vapor deposition (CVD), physical vapor deposition (PVD), or other methods). The passivation layer 330 can be a single layer or a stack. It should be noted that, for illustrative purposes, only one metal pad 325 and passivation layer 330 are shown in the figures. However, other embodiments may include any number of metal pads and / or passivation layers.

[0094] The photoresist layer PR can be formed on the passivation layer 330 by a photolithography process. For example, the photolithography process may include photoresist coating (e.g., spin coating), soft baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning, drying (e.g., hard baking), and / or other suitable processes. The photoresist layer PR has an opening PRO for exposing the underlying passivation layer 330.

[0095] See Figure 3 and Figure 4B Method M proceeds to step S2, in which the manufacturing machine 3 (see...) Figure 2 The passivation layer 330 is etched to expose the metal pad 325. In some embodiments, a wet etching process can be performed by immersing the wafer W in a process chamber (e.g., an acid bath containing etching solution), while the wafer boat 102 (see...) Figure 5A and Figure 5B It can also be immersed in the process chamber simultaneously. In some embodiments, the etching solution may be hydrofluoric acid (HF) and buffered oxide etchant (BOE). In other embodiments, the etching solution may be an ammonia-peroxide mixture (APM, such as a mixture of NH4OH, H2O2 and water), phosphoric acid (H3PO4), or a combination of other materials.

[0096] In some embodiments, the passivation layer 330 can be etched using a dry etching process (e.g., using a fluorine-containing gas as an acid precursor). This process uses a photoresist layer PR as an etching mask, such that a first portion of the passivation layer 330 exposed by the opening PRO of the photoresist layer PR is etched away, while a second portion covered by the photoresist layer PR is spared from etching. As a result, an opening HO can be formed in the passivation layer 330 according to the contour and position of the opening PRO of the photoresist layer PR. In some embodiments, the metal pad 325 may be slightly worn away by the dry etching process, such that the top surface of the first portion of the metal pad 325 exposed by the opening HO is lower than the top surface of the second portion covered by the passivation layer 330.

[0097] Dry etching processes can use fluorinated gases such as SF6, CF4, CHF3, or combinations thereof. After the dry etching process, fluorides may remain on the sidewalls of the photoresist layer PR and on the metal pads 325, and fluorinated gas (FG) may be released from the wafer W. For example, fluorinated gas FG containing fluorine particles may be released from the wafer W. If the released fluorinated gas FG from the wafer W is not effectively removed, a reaction may occur between the fluorinated gas FG and the metal pads 325 (e.g., AlCu metal pads) exposed after the passivation etching process. Crystals may form on the passivation window, leading to pad defects before packaging. These pad defects can cause bonding failures, reduce wafer reliability, and sometimes even lead to wafer scrap, thereby reducing manufacturing yield.

[0098] See Figure 3 and Figure 4B Method M proceeds to step S3, in which the wafer W and wafer boat 102 (see...) Figure 5A Together they were moved or placed on shelf 200 (see Figure 6A The gas removal process is performed on the wafer boat 102. The wafer boat 102 may include multiple slots or fixtures for accommodating multiple wafers W and separating them from each other. In some embodiments, the wafer boat 102 is at an angle relative to the horizontal plane, so that the wafers W can be stably placed against their rear surfaces, while the front or top surfaces of the wafers W do not contact other objects. In some embodiments, the wafer boat 102 does not completely enclose the wafers W. Therefore, when the wafer boat 102 is moved or placed on the shelf 200, the wafers W can be exposed in the space of the shelf 200, which can be connected to the external environment and the exhaust system 230 (see [link]). Figure 6A (Connectivity). In some implementations, wafer boat 102 may include tags that identify the wafer W and can be used at various stages of the process.

[0099] According to some embodiments of this disclosure, by using the wafer boat 102 (see...) Figure 5A Move or place it onto rack 200, which has an exhaust system 230 (see...). Figure 6A On the wafer W, a gas removal process can be performed. During this process, the exhaust system 230 can effectively remove fluorinated gas FG containing fluorine particles released from the wafer W. Therefore, the formation of crystals on the passivation window can be suppressed, thereby reducing pad defects. In some embodiments, the wafer W can stand vertically on the wafer boat 102 along the Z-direction, and the gas flow GF generated by the exhaust system 230 also flows along the Z-direction. With this configuration, the gas flow GF can flow more uniformly across multiple wafers W. In some embodiments, the wafer boat 102 can also be placed in the wafer carrier 104.

[0100] like Figure 5B As shown, a wafer boat 102 can be placed within a wafer carrier 104. The wafer carrier 104 can be a box-like structure, for example, including a lower housing 110 and an upper cover 120, with the space for accommodating the wafer boat 102 located between the lower housing 110 and the upper cover 120. The lower housing 110 and the upper cover 120 can be pivotally connected via a rotation axis. With the aforementioned structure, the wafer carrier 104 can be opened or closed by flipping the upper cover 120. For example, the upper cover 120 can be rotated relative to the X direction to open or close the wafer carrier 104. In some embodiments disclosed herein, the lower housing 110 and the upper cover 120 of the wafer carrier 104 may have one or more openings. Through these openings, the space within the wafer carrier 104 can communicate with the external environment.

[0101] The lower housing 110 includes a bottom housing plate 112, two side housing plates 114, a front housing plate 116, and a rear housing plate 118. The upper cover 120 includes a top cover plate 122, two side cover plates 124, a front cover plate 126, and a rear cover plate 128. The front housing plate 116 of the lower housing 110 is connected to the front cover plate 126 of the upper cover 120, forming the front side FS of the wafer carrier 104. The rear housing plate 118 of the lower housing 110 is connected to the rear cover plate 128 of the upper cover 120, forming the rear side BS of the wafer carrier 104. One side housing plate 114 of the lower housing 110 is connected to one side cover plate 124 of the upper cover 120, forming one side AS of the wafer carrier 104; the other side housing plate 114 of the lower housing 110 is connected to the other side cover plate 124 of the upper cover 120, forming the other side AS of the wafer carrier 104. In some embodiments disclosed herein, the upper cover 120 and lower housing 110 of the wafer carrier 104 may have multiple openings to allow gases released from the wafer to exit the wafer carrier 104. For example... Figure 5A and Figure 5B As shown, wafer W can be moved or placed on wafer boat 102.

[0102] See Figures 6A to 8B After completing the gas removal process on rack 200, wafer boat 102 (see [link to wafer boat]) can be used. Figure 7A and Figure 7B The wafer W is moved to rack 300. Then, the wafer boat 102 carrying the wafer W (see...) Figure 8A and Figure 8B The wafer boat 102 can be rotated by an automated mechanism platform apparatus 320 located on shelf 300 to facilitate the next stage of processing. For example, the automated mechanism platform apparatus 320 on shelf 300 can be used to rotate the wafer boat 102 180 degrees, so that the handle 102a of the wafer boat 102 (see...) Figure 8A and Figure 8B The wafer W is positioned opposite the rack 300 and adjacent to the manufacturing machine 3. This configuration allows moving parts in the manufacturing line 2 to be transported using the handle 102a of the wafer boat 102. In some embodiments, manual operation may be used instead of automated moving parts. In other embodiments, the orientation of the wafer boat 102 can be changed by rotating it using an automated platform device 320 on the rack 300, making it ready for the next processing stage. By using the automated platform device 320 to rotate the wafer boat 102, vertical movement can be avoided during horizontal rotation. This method reduces the chance of vertical vibration, thereby reducing the risk of damage and contamination to the wafer W.

[0103] See Figures 6A to 6D .like Figure 6A As shown, rack 300 can be placed on one side of manufacturing machine 3, while rack 200 can be placed on the other side of manufacturing machine 3. A transfer module 62 can be installed between racks 300 and 200 and between manufacturing machine 3 to facilitate the wafer boat 102 (see [reference]). Figure 5A and Figure 5B The transfer module 62 ensures the smooth transfer of the wafer boat 102 or wafer carrier 104 along the path between the racks 300 and 200 and the manufacturing machine 3, thereby enabling efficient and precise operation in the semiconductor manufacturing process.

[0104] Specifically, the transfer module 62 integrated into racks 200 and 300 may include cooperating components for precisely controlling the operation and transport of the wafer boat 102 / wafer carrier 104 in multiple dimensions and directions. In some embodiments, the transfer module 62 may include a wafer container gripper 62a for securely gripping the wafer boat 102 / wafer carrier 104 during transport. The aforementioned wafer container gripper 62a may have various shapes and sizes to accommodate different container specifications, ensuring a safe and secure grip without damaging the contents. In some embodiments, the transfer module 62 may also include a linear actuator 62b, including a horizontal slide rail 63b and a movable carrier 64b. The aforementioned linear actuator can facilitate smooth horizontal movement along the slide rail, and the actuator can power these movements, thereby allowing precise positioning along the X-axis within the facility. In some embodiments, the transfer module 62 may further include a lifter 62c equipped with a vertical slide rail and a movable carrier operated by an actuator. The lifter 62c enables vertical movement, allowing the transfer module 62 to adjust the height of the wafer boat 102 / wafer carrier 104 to accommodate different layers within the racks 300 / 200 or to align with devices of different heights. In some embodiments, the transfer module 62 may further include a rotor 62d for controlling the rotational movement of the transfer module 62, thereby enhancing the orientation adjustment capability of the wafer container clamping device 62a.

[0105] Therefore, the wafer container gripper 62a can move seamlessly in three directions (e.g., horizontally along the X and Y axes and vertically along the Z axis). This multi-directional capability can be used to navigate the layout of semiconductor manufacturing equipment. On the other hand, the transfer module 62 can achieve omnidirectional movement, thus providing a high degree of freedom when manipulating the wafer boat 102 / wafer carrier 104. In some embodiments, each component in the transfer module 62, such as the linear actuator 62b, the lifting device 62c, and the rotating device 62d, can be independently controlled and finely adjusted to smoothly accelerate or decelerate. This precise control prevents positional displacement of the wafer container during rapid movement or transitions, thereby protecting the integrity of the wafer. In some embodiments, the transfer module 62 may include a robot.

[0106] Specifically, the rack 300 can be equipped with multiple shelves 310 of different heights. Each shelf 310 can accommodate at least one wafer boat 102 or at least one wafer carrier 104, allowing the wafers W in the wafer boat 102 and / or wafer carrier 104 to be prepared for the next processing stage. Each shelf 310 can be equipped with an automated platform device 320 and a carrier support base 315. The wafer boat 102 can be placed on the automated platform device 320, while the wafer carrier 104 is placed on the carrier support base 315. This configuration ensures that both the wafer boat and the carrier are securely positioned, ready for subsequent automated processing or operation stages. The shelf 310 in the rack 300 can extend along a horizontal slide rail 63b, thereby forming a spatial alignment with the movement paths of the wafer boat 102 and wafer carrier 104, ensuring efficient transport and positioning of the wafer boat 102 and wafer carrier 104 at various stages of semiconductor processing.

[0107] The automated platform devices 320 and carrier support bases 315 can be arranged in a matrix configuration on the rack 300. Specifically, multiple automated platform devices 320 and carrier support bases 315 can be distributed at different positions along each rack 310, providing flexible placement options and improving rack capacity utilization efficiency. For example, up to three automated platform devices 320 and / or carrier support bases 315 can be installed side by side along the length of the horizontal slide rail 63b. Four automated platform devices 320 and / or carrier support bases 315 can be arranged in a direction perpendicular to the horizontal slide rail 63b. This matrix arrangement allows each rack 310 to accommodate up to 12 units, optimizing space utilization and improving the accessibility of automated wafer processing.

[0108] In some embodiments, the wafer carrier 104 placed on the carrier support base 315 can remain stationary, while the wafer boat 102 placed on the automated platform device 320 can rotate horizontally, allowing selective rotation of the wafer boat 102 to correctly position the wafer W for subsequent processing stages. In some embodiments, the carrier support base 315 and the automated platform device 320 can be placed side-by-side on the same shelf 310 without installing additional automated platform devices. This layout optimizes space utilization, ensuring efficient arrangement of stationary and rotating components. In some embodiments, multiple automated platform devices 320 can be installed adjacent to each other on the same shelf 310. This layout allows for the simultaneous processing of multiple wafer boats, increasing throughput and efficiency. Furthermore, in some configurations, the automated platform device 320 and the carrier support base 315 can be aligned in the same column within the shelf 300, but located on different shelves 310. This vertical arrangement helps organize the workflow, ensuring easy access to the rotating wafer boat 102 and the stationary wafer carrier 104 with minimal interference.

[0109] like Figures 6B to 6D As shown, the automated platform device 320 may include a turntable 322 and a rotor 324 (see [reference]). Figure 6C ) and a position detection system 326. The rotating device 324 can rotate the turntable 322 to adjust the wafer boat 102 and the wafer W (see... Figures 7A to 8B The direction relative to the shelf 300 allows for optimal positioning during processing. In some embodiments, the height of the horizontal slide rail 63b is below the height of the rotating device 324 and the turntable 322, allowing the wafer boat 102 to be easily lifted from the horizontal slide rail 63b to the turntable 322 for subsequent processing, achieving efficient integration of the transport system with the automated platform device 320. In some embodiments, the rotating device 324 can be a micro-motor, providing precise rotation control. In some embodiments, the shelf 310 can be designed with recesses 310r (see...). Figure 6C The aforementioned groove can be covered by a protective plate 311 (see...). Figure 6A , Figure 6B and Figure 6D The protective panel 311 can be mounted on the shelf 310 and includes multiple periodically arranged holes 311h (see...). Figure 6B and Figure 6D To promote ventilation. Figure 6CAs shown, the rotating device 324 can be located in the groove 310r of the shelf 310 and pass through the protective plate 311. The turntable 322 is connected to the upper end of the rotating device and is located outside the groove 310r.

[0110] like Figure 6D As shown in the top view, the holes 311h of the protective plate 311 can be arranged around the turntable 322. The holes 311h can facilitate the wafer boat 102 (see...). Figure 7B and Figure 8B The aperture 311h facilitates airflow around the wafer, providing a consistent airflow throughout the wafer area, helping to remove stagnant air pockets, reduce heat buildup, and maintain uniform environmental conditions around the wafer. Furthermore, components such as the rotating device 324 may generate heat during wafer handling. The aperture 311h effectively dissipates heat by promoting natural or forced air circulation around the turntable and wafer boat, thus maintaining the temperature within a safe range and preventing quality issues or defects caused by thermal damage to the wafer. In addition, the aperture 311h helps reduce the risk of contamination. With proper ventilation, the aperture 311h helps remove particulate matter and gaseous byproducts from the environment, preventing these contaminants from depositing on the wafer W.

[0111] Turntable 322 may include slots 322a and 322b (see...) Figures 6B to 6D The design of slot 322a can accommodate the strip features 102c at the bottom of wafer boat 102 (see...). Figure 5A , Figure 7B and Figure 8B This ensures that the wafer boat 102 is stably positioned on the turntable 322. In some embodiments, the number of slots 322a on the turntable 322 may correspond to the number of protruding strip features 102c on the bottom of the wafer boat 102. In some embodiments, these slots 322a may extend parallel through the turntable 322. In some embodiments, the slots 322a may be straight, while in other embodiments, the slots 322a may be curved (e.g., circular slots). Furthermore, different slots 322a may have different patterns. For example, one slot 322a may be a straight slot, while another may be a curved slot. In some embodiments, the ends of the slots 322a may be located within the boundaries of the turntable 322, while in other configurations, the ends of the slots 322a may extend through the sidewalls of the turntable. This flexible design allows the turntable 322 to adapt to different wafer boat structures and ensures stable positioning during rotational movement.

[0112] Slot 322b on the turntable can work in conjunction with position detection system 326 (e.g., sensor) to determine the location of wafer boat 102 (see [link]). Figures 7A to 8BWhether it is in its designated position. Specifically, the position detection system 326 can be installed on the rack 310 to monitor the alignment of the wafer boat 102. If the position detection system 326 detects that the wafer boat 102 is deviating from its expected position, it can immediately notify the fault detection and classification (FDC) system 55 (see [link to Fault Detection and Classification (FDC) system]). Figure 1 An anomaly alarm is sent. Upon receiving this alarm, operation of the transmission module 62 can be immediately halted to allow for a thorough inspection and maintenance of its internal components. This ensures that the problem is addressed before it escalates, thereby maintaining operational safety and system reliability.

[0113] Specifically, the position detection system 326 can monitor the light-blocking element 102b (see Figure 5A , Figure 7B and Figure 8B This system detects any positional deviations in the wafer boat 102. When the protruding strip feature 102c of the wafer boat 102 is correctly embedded in the slot 322a of the turntable 322, the light-blocking element 102b can extend downward into the slot 322b. This alignment allows the position detection system to accurately confirm whether the wafer boat 102 is correctly positioned at the designated location. Any misalignment can be detected promptly, ensuring the correct positioning and stability of the wafer boat 102 in subsequent automated processing and operation steps.

[0114] For example, but not limited to, the position detection system 326 may include through-beam sensors (or transmitted-beam sensors). The system consists of two independent components: a transmitter 328a mounted on the shelf 310 on one side of the slot 322b, and a receiver 328b located on the opposite side of the slot 322b. The transmitter 328a emits a light beam (typically infrared), which is directly aimed at the receiver 328b mounted on the other side. When a target object (e.g., light-blocking element 102b) blocks the optical axis between the transmitter 328a and the receiver 328b, the detection system senses the obstruction. The receiver 328b is responsible for converting the received light signal into a corresponding electrical signal and transmitting the electrical signal to the control system 60 (see...). Figure 1 ( ), to determine the presence of the light blocking element 102b.

[0115] like Figure 6DAs shown in the top view, slots 322a and 322b can form an "H" shaped configuration. In some embodiments, slots 322a and 322b can form other configurations. In some configurations, the width W2 of slot 322b may be greater than the width W1 of slot 322a. However, in some embodiments, the width W2 of slot 322b may be equal to or less than the width W1 of slot 322a. Furthermore, in some embodiments, the length L2 of slot 322b may be greater than the length L1 of slot 322a, but in different implementations, the length L2 may also be equal to or less than the length L1. A spacing distance D1 may exist between the multiple slots 322a. For example, but not limited to, the aforementioned distance D1 may be between approximately 100 and 150 mm, such as approximately 100, 110, 120, 125, 130, 140, or 150 mm. These variations allow for flexible adjustment of slot dimensions to accommodate different wafer boat designs and ensure stable positioning and handling during operation. For example, the width W1 of the groove 322a can be between 1 and 5 mm, such as 1, 2, 3, 4, or 5 mm. In some embodiments, the length L1 of the groove 322a can be between 100 and 300 mm, such as 100, 150, 190, 200, 250, or 300 mm. In some embodiments, the depth of the groove 322a can be between 1 and 10 mm, such as 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 mm.

[0116] See Figure 7A and Figure 7B After wafer W is placed in wafer boat 102 and the gas removal process is completed on rack 200, transfer module 62 can move wafer boat 102 to rack 300. The wafer container gripper 62a of transfer module 62 can grasp wafer boat 102 from rack 200. Subsequently, linear actuator 62b can move wafer boat 102 to the appropriate position, while lifting device 62c assists in aligning wafer boat 102 with the corresponding automated platform device 320 on rack 300. Once aligned, wafer container gripper 62a can place wafer boat 102 on the designated automated platform device 320. This process ensures precise handling and positioning of wafer boat 102, facilitates a smooth transition of wafer W between different semiconductor manufacturing stages, and minimizes the risk of misalignment or damage.

[0117] At this time, the transmission module 62 can notify the control system 60 (see...) Figure 1The wafer boat 102 has been placed on the corresponding automated platform device 320. Subsequently, the position detection system 326 located near the automated platform device 320 can confirm whether the wafer boat 102 is correctly placed on the designated automated platform device 320 and whether it is correctly aligned, thereby ensuring that the position of the wafer boat 102 is correct. This helps maintain the integrity of subsequent automated processing and ensures the efficient and safe operation of the production line.

[0118] When the wafer boat 102 is in its predetermined position, the light blocking element 102b can be located within the slot 322b and aligned with the path of the optical signal emitted and received by the position detection system 326. In this case, the light blocking element 102b blocks the optical signal, preventing the receiving device 328b from receiving it. Therefore, in this situation, the output voltage of the receiving device is high. The control system 60 can detect the position of the light blocking element 102b and confirm that the wafer boat 102 is in the predetermined position.

[0119] Conversely, when the light-blocking element 102b is not in its predetermined position, it will be outside the slot 322b and will not block the path of the light signal emitted and received by the position detection system 326. In this case, the light signal can reach the receiving device 328b, so the output voltage of the receiving device is low. The control system 60 can confirm that the light-blocking element 102b is not in its predetermined position by detecting the low voltage output. Therefore, this voltage difference can serve as an effective monitoring and control mechanism for the system.

[0120] See Figure 8A and Figure 8B In some embodiments, once the wafer boat 102 is correctly placed on the turntable 322 of the automated platform device 320, the wafer boat 102 can be rotated by the automated platform device 320 to facilitate the next stage of wafer processing (see [link]). Figure 8A Specifically, the rotating device 324 can rotate the turntable 322, causing the wafer boat 102, securely fixed to the turntable 322, to rotate accordingly. In some embodiments, the wafer boat 102 can be rotated so that the side with the handle 102a faces the shelf 300 away from the manufacturing table 3. This orientation allows moving devices in the manufacturing line 2 to move using the handle 102a of the wafer boat 102. In some embodiments, manual operation can replace the automated moving device for transporting the wafer boat 102. Furthermore, by using the automated platform device 320 to rotate the wafer boat 102, vertical movement can be avoided during horizontal rotation, thereby reducing the risk of vertical vibration. This precaution helps to avoid potential damage and contamination of the wafer W, thus ensuring its integrity during the manufacturing process.

[0121] In some embodiments, after the wafer boat 102 is rotated on the turntable 322 of the automated platform device 320, the wafer W within the wafer boat 102 may be repositioned to prepare for the next stage of processing. Rotation allows the wafer W to continue into the same manufacturing machine 3 for further processing steps, or it can be moved to a different manufacturing machine 3 for subsequent operations. Therefore, the wafer W can be presented in a specific orientation to optimize interaction with the equipment at each processing stage.

[0122] The rotation angle of turntable 322 can be between 0 and 360 degrees. For example, turntable 322 can rotate approximately 180 degrees. Alternatively, the rotation angle of turntable 322 can also be approximately 30 degrees, 45 degrees, 60 degrees, 90 degrees, 120 degrees, 135 degrees, or 150 degrees. This flexibility in rotation angle allows for precise positioning of the wafer boat 102, thereby providing the optimal wafer W orientation for the next stage of the manufacturing process.

[0123] The rotational speed of turntable 322 can be set to a fixed value. In some embodiments, the rotational speed of turntable 322 can be variable (e.g., the speed of turntable 322 can be gradually increased or decreased). In some embodiments, over three consecutive time intervals (first, second, and third time intervals), the speed of turntable 322 in the second time interval may be greater than its speed in the first and third time intervals. This speed variation allows for fine control during processing, providing smoother acceleration and deceleration and preventing sudden jolts that could disturb or damage wafer W. Such speed adjustments help maintain stability during wafer rotation, thereby ensuring wafer safety and the reliability of the manufacturing process. For example, but not limited to, the rotational speed of turntable 322 can be between approximately 1 and 10 seconds per rotation, such as 1 second, 2 seconds, 3 seconds, 4 seconds, 5 seconds, 6 seconds, 7 seconds, 8 seconds, 9 seconds, or 10 seconds.

[0124] See Figure 3 and Figure 4C Method M proceeds to step S4, in which the wafer W undergoes its first photoresist removal, a process that can be accomplished using a lift-off process. The photoresist layer PR (see...) Figure 4B The photoresist can be removed, for example, by a dry stripping process using a suitable gas, such as nitrogen (N2), oxygen (O2), or a combination thereof. After the photoresist removal process, photoresist residue (i.e., residue of the photoresist layer PR) may still remain on the wafer W. Subsequently, a second photoresist removal can be performed on the wafer W by a wet stripping process using a suitable gas, such as ammonia (NH2OH), water (H2O), or a combination thereof.

[0125] See Figure 3Method M may proceed to step S5, in which an alloy layer may be formed on the metal pad 325 exposed by the passivation layer 330. In some alternative embodiments, step S5 (alloy formation) may be skipped or omitted. Method M may then proceed to another step, namely, performing a wafer acceptance test (WAT). Wafer acceptance testing can ensure the quality and stability of the wafer to a certain extent.

[0126] Therefore, based on the above discussion, it can be seen that this disclosure provides several advantages. However, it should be understood that other embodiments may offer additional advantages, not all advantages are disclosed herein, and not all embodiments require a particular advantage. Several embodiments of this disclosure provide an automated turntable capable of rotating a semiconductor boat to a position where its handle faces the operator. The aforementioned process can be automated, ensuring that the handle of the semiconductor boat is on the operator-accessible side, thereby eliminating unsafe manual operation and promoting automation.

[0127] In some embodiments, the method of operating the mechanism platform system includes: placing a wafer boat containing one or more semiconductor wafers on an automated mechanism platform device, the automated mechanism platform device being mounted on a shelf of a first rack, wherein the automated mechanism platform device includes a rotating device and a turntable located on the rotating device; confirming the placement position of the wafer boat on the turntable using a position detection system; and adjusting an orientation of the wafer boat by rotating the turntable.

[0128] In some embodiments, the placement position of the wafer boat is confirmed using a position detection system by monitoring the light-blocking element of the wafer boat in a slot extending to the turntable. In some embodiments, the orientation of the wafer boat is adjusted by rotating the turntable so that the handle of the wafer boat faces the accessible side for easy transport. In some embodiments, the turntable is rotated approximately 180 degrees to adjust the orientation of the wafer boat. In some embodiments, the operation method of the mechanism platform system further includes: generating an abnormal alarm if the wafer boat is not aligned with the turntable; and stopping the rotation of the turntable. In some embodiments, the operation method of the mechanism platform system further includes: controlling the rotation speed of the turntable. In some embodiments, the operation method of the mechanism platform system further includes: processing multiple semiconductor wafers within the wafer boat using a manufacturing machine, wherein a first rack position is adjacent to the manufacturing machine. In some embodiments, the operation method of the mechanism platform system further includes: after processing multiple semiconductor wafers on the manufacturing machine, transferring the multiple semiconductor wafers in the wafer boat to a second rack for a gas removal process; after the gas removal process, moving the wafer boat from the second rack to an automated mechanism platform device on the first rack. In some embodiments, the first rack and the manufacturing machine are separated by a transfer module, and the wafer boat is placed on the automated mechanism platform device on the first rack via the transfer module. In some embodiments, the manufacturing machine includes an acid bath for processing multiple semiconductor wafers.

[0129] In some embodiments, the method of operating the platform system includes: processing a plurality of semiconductor wafers in a wafer boat using an acid precursor generated by a manufacturing machine; after processing the plurality of semiconductor wafers, transferring the wafer boat containing the plurality of semiconductor wafers from the manufacturing machine to a rack; positioning the wafer boat containing the plurality of semiconductor wafers on a turntable, the turntable being a turntable device included on the rack; and rotating the wafer boat using the turntable to achieve a direction for the next stage of wafer processing.

[0130] In some embodiments, the transfer of the wafer boat is accomplished via a transfer module, which includes a horizontal slide rail mounted between the manufacturing machine and the rack, and a wafer container clamping device mounted on the horizontal slide rail. In some embodiments, the operation of the mechanism platform system further includes: using a position detection system to confirm the placement position of the wafer boat on the turntable. In some embodiments, the rotation speed of the turntable is approximately 2 to 4 seconds per rotation. In some embodiments, the operation of the mechanism platform system further includes: adjusting the rotation speed of the turntable.

[0131] In some embodiments, the mechanism platform system includes: a shelf, a rotating device, a turntable, a position detection system, and a control system. The shelf includes multiple racks arranged vertically. The rotating device is mounted on one of the racks. The turntable is coupled to the rotating device, wherein the turntable is configured to support a wafer boat containing one or more semiconductor wafers, and the rotating device is configured to rotate the turntable to adjust an orientation of the wafer boat. The position detection system includes a transmitter and a receiver mounted on the racks and located on opposite sides of the turntable for detecting light-blocking elements of the wafer boat when it is aligned with the turntable. The control system is communicatively connected to the rotating device and the position detection system for controlling a rotation of the turntable and monitoring the alignment of the wafer boat.

[0132] In some embodiments, the turntable includes a linear groove that is recessed downward from the top surface of the turntable and extends through opposite side walls of the turntable. In a rotational position of the turntable, a virtual extension of the linear groove is aligned with the transmitting and receiving devices of a position detection system, enabling the linear groove and the position detection system to work together to detect light-blocking elements of the wafer boat. In some embodiments, the turntable has multiple linear grooves that are recessed downward from the top surface of the turntable for receiving multiple protrusions on the bottom of the wafer boat, thereby securing the protrusions. From a top view, the multiple linear grooves extend parallel to each other. In some embodiments, the mechanism platform system further includes a protective plate mounted below the turntable, wherein a rotating device is coupled to the turntable through an opening in the protective plate. The protective plate also includes multiple holes arranged around the rotating device. In some embodiments, the mechanism platform system further includes a track adjacent to a shelf and configured for transporting the wafer boat along a defined path, wherein the track extends parallel to the extension directions of multiple shelves within the shelf, and the height of the track is lower than the height of the rotating device and the height of the turntable.

[0133] In some embodiments, the mechanism platform system includes: a frame, a rotating device, a turntable, a protective plate, a position detection system, and a control system. The frame includes multiple shelves arranged vertically. The rotating device is mounted on one of the shelves. The turntable is coupled to the rotating device, wherein the turntable includes a first linear groove recessed downwards from the top surface of the turntable and extending through opposite side walls of the turntable. The protective plate is mounted below the turntable, and the rotating device is coupled to the turntable through an opening in the protective plate. The position detection system includes a transmitter and a receiver mounted on the shelves and located on opposite sides of the turntable. The control system is communicatively connected to the rotating device and the position detection system.

[0134] In some embodiments, in a rotational position of the turntable, a virtual extension of the first linear slot is aligned with the transmitting and receiving devices of the position detection system. In some embodiments, the turntable has a plurality of second linear slots recessed downward from the top surface of the turntable, extending parallel to each other in a top view. In some embodiments, the protective plate also includes a plurality of holes arranged around the rotating device. In some embodiments, the mechanism platform system also includes a track adjacent to the shelf, wherein one extension direction of the track is parallel to one extension direction of the plurality of shelves within the shelf, and the height of the track is lower than the height of the rotating device and the height of the turntable.

[0135] In some embodiments, the mechanism platform system includes: a shelf, a rotating device, a turntable, and a position detection system. The shelf includes a plurality of shelves arranged in a vertical direction. The rotating device is mounted on one of the shelves. The turntable is coupled to the rotating device. The turntable includes a linear groove. The linear groove is recessed downward from a top surface of the turntable and extends through opposite side walls of the turntable. The position detection system includes a transmitter and a receiver mounted on the shelves and located on opposite sides of the turntable. In a rotational position of the turntable, a virtual extension of the linear groove is aligned with the transmitter and receiver of the position detection system.

[0136] In some embodiments, the mechanism platform system is characterized by further comprising: a protective plate installed below the aforementioned turntable, wherein the aforementioned rotating device is coupled to the aforementioned turntable through an opening in the aforementioned protective plate.

[0137] In some embodiments, the mechanism platform system is characterized by further comprising: a track adjacent to the aforementioned shelf, wherein an extension direction of the aforementioned track is parallel to an extension direction of a plurality of shelves within the aforementioned shelf, and a height of the aforementioned track is lower than a height of the aforementioned rotating device.

[0138] In some embodiments, the mechanism platform system includes: a shelf, a rotating device, a turntable, and a track. The shelf includes a plurality of shelves arranged in a vertical direction. The rotating device is mounted on one of the shelves. The turntable is coupled to the rotating device, wherein the turntable has a plurality of linear slots recessed downward from a top surface of the turntable, and in a top view, the linear slots extend parallel to each other. The track is adjacent to the shelf, wherein one direction of the track extends parallel to the direction of extension of one of the shelves within the shelf, and the height of the track is lower than the height of the rotating device.

[0139] In some embodiments, the mechanism platform system is characterized by further comprising: a protective plate installed below the aforementioned turntable, wherein the aforementioned rotating device is coupled to the aforementioned turntable through an opening in the aforementioned protective plate, and the aforementioned protective plate further comprises a plurality of holes arranged around the aforementioned rotating device.

[0140] The foregoing summary outlines the features of several embodiments, enabling those skilled in the art to better understand the nature of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or attain the same advantages of the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made without departing from the spirit and scope of this disclosure.

Claims

1. A mechanism platform system, characterized by Comprising: a shelf comprising a plurality of shelves arranged in a vertical direction; a rotating device mounted on one of the plurality of shelves; a turntable coupled with the rotating device, wherein the turntable comprises a first linear slot recessed downward from a top surface of the turntable and extending through opposite side walls of the turntable; a protection plate mounted below the turntable, wherein the rotating device is coupled with the turntable through an opening of the protection plate; a position detection system comprising a transmitting device and a receiving device mounted on the one of the plurality of shelves and located on opposite sides of the turntable; and a control system in communication with the rotating device and the position detection system.

2. The institutional platform system of claim 1, wherein, wherein in a rotated position of the turntable, a virtual extension line of the first linear slot is aligned with the transmitting device and the receiving device of the position detection system.

3. The institutional platform system of claim 1, wherein, wherein the turntable has a plurality of second linear slots recessed downward from the top surface of the turntable, the plurality of second linear slots extending parallel to each other as viewed from a top view.

4. The institutional platform system of claim 1, wherein, wherein the protection plate further comprises a plurality of holes arranged around the rotating device.

5. The institutional platform system of claim 1, wherein, Further comprising: a track adjacent to the shelf, wherein an extension direction of the track is parallel to an extension direction of the plurality of shelves in the shelf, a height of the track is lower than a height of the rotating device and a height of the turntable.

6. A mechanism platform system characterized by Comprising: a shelf comprising a plurality of shelves arranged in a vertical direction; a rotating device mounted on one of the plurality of shelves; a turntable coupled with the rotating device, wherein the turntable comprises a linear slot recessed downward from a top surface of the turntable and extending through opposite side walls of the turntable; and a position detection system comprising a transmitting device and a receiving device mounted on the one of the plurality of shelves and located on opposite sides of the turntable, wherein in a rotated position of the turntable, a virtual extension line of the linear slot is aligned with the transmitting device and the receiving device of the position detection system.

7. The mechanism platform system of claim 6, wherein, Further comprising: a protection plate mounted below the turntable, wherein the rotating device is coupled with the turntable through an opening of the protection plate.

8. The institutional platform system of claim 6, wherein, Further comprising: a track adjacent to the shelf, wherein an extension direction of the track is parallel to an extension direction of the plurality of shelves in the shelf, a height of the track is lower than a height of the rotating device.

9. A mechanism platform system, characterized by Comprising: a shelf comprising a plurality of shelves arranged in a vertical direction; a rotating device mounted on one of the plurality of shelves; a turntable coupled with the rotating device, wherein the turntable has a plurality of linear slots recessed downward from a top surface of the turntable, the plurality of linear slots extending parallel to each other as viewed from a top view; and a track adjacent to the shelf, wherein an extension direction of the track is parallel to an extension direction of the plurality of shelves in the shelf, a height of the track is lower than a height of the rotating device.

10. The institutional platform system of claim 9, wherein, Further comprising: a protection plate mounted below the turntable, wherein the rotating device is coupled with the turntable through an opening of the protection plate, the protection plate further comprises a plurality of holes arranged around the rotating device.

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