Multi-layer semiconductor device high and low temperature test air duct

Abstract

The utility model discloses a multilayer semiconductor device high and low temperature test air duct comprising a test assembly, the test assembly is composed of a box body, an air guide arc, a heater, a first fan, an air baffle, a second fan, an air outlet pore plate, a multilayer sample rack, a sample to be processed, an air suction pore plate and an evaporator, the box body is fixedly connected with the air guide arc, and the air guide arc is fixedly connected with the heater. Heaters are symmetrically and fixedly connected to the air guide arc, first fans are fixedly connected to the heaters, and the first fans are fixedly connected to the air partition plate; according to the utility model, by using the test assembly, a sample can be electrified for testing, the temperature uniformity is ensured, an air channel is divided into two paths of air circulation, each path of air is ensured to be uniformly distributed, and a plurality of layers of sample racks are adopted in the box, so that a large batch of samples can be tested with loads, and the working efficiency is high; by using the observation assembly, a user can observe the internal condition of the box body, the observation definition is guaranteed, and the use experience of the user is improved.

Description

Technical Field

[0001] This utility model relates to the field of high and low temperature testing technology for semiconductor devices, and in particular to a high and low temperature testing air duct for multilayer semiconductor devices. Background Technology

[0002] In recent years, the semiconductor, integrated circuit, artificial intelligence, and Internet of Things fields have developed rapidly, bringing strong innovation momentum to the electronics industry. Driven by technologies such as 5G, cloud computing, and big data, the electronics industry has undergone tremendous changes, with new technologies improving the performance of electronic products and optimizing the industrial structure. For example, advancements in semiconductor technology have led to continuous improvements in chip performance, providing more powerful computing capabilities for various electronic devices. The electronics industry in China has become a massive industry, with its development speed and scale constantly expanding, resulting in an increasing demand for high and low temperature test chambers and increasingly stringent requirements for the testing performance of these equipment.

[0003] Currently available high and low temperature test chambers on the domestic market have top-outlet and bottom-return air ducts, lack frequency converters for the motors, and have unadjustable airflow. This makes it impossible to guarantee temperature uniformity within the chamber after sample placement. Furthermore, most semiconductor tests now require power, and the heat generated by the samples themselves severely affects temperature uniformity within the chamber. High and low temperature test chambers also have limited sample layers, only suitable for testing a small number of products, resulting in low testing efficiency and high costs. Secondly, during testing, users need to observe the conditions inside the chamber, requiring clear observation and an improved user experience. Therefore, designing a multi-layer high and low temperature test air duct for semiconductor devices is essential. Utility Model Content

[0004] The purpose of this invention is to provide a multi-layer semiconductor device high and low temperature testing air duct to address the problems of existing high and low temperature test chambers. These chambers typically have an upward air outlet and downward return airflow, lack a frequency converter for the motor, and have no adjustable airflow speed. This makes it difficult to guarantee temperature uniformity within the chamber after sample placement. Furthermore, most semiconductor tests require power, and the heat generated by the samples themselves severely affects temperature uniformity. High and low temperature test chambers also have limited sample layers, limiting testing to a small number of products, resulting in low efficiency and high costs. Additionally, during testing, users need to observe the conditions inside the chamber, requiring clear observation and improved user experience.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a high and low temperature test air duct for multilayer semiconductor devices, including a test assembly, which consists of a housing, a guide arc, a heater, a first fan, an air baffle plate, a second fan, an air outlet plate, a multilayer sample rack, a sample to be processed, an air suction plate, and an evaporator. The guide arc is fixedly connected to the housing, and the heater is symmetrically fixedly connected to the guide arc. The first fan is fixedly connected to the heater, and the first fan is fixedly connected to the air baffle plate. The air baffle plate is fixedly connected to the housing. A double-layer observation window of the observation assembly is symmetrically fixedly connected to the housing, and a rotating motor is fixedly connected to the double-layer observation window.

[0006] As a further technical solution of this utility model, a first fan is fixedly connected to the box body, a second fan is fixedly connected to the air baffle plate, the second fan is fixedly connected to the heater, the second fan is fixedly connected to the box body, and an air outlet plate is fixedly connected to the box body.

[0007] As a further technical solution of this utility model, the air outlet plate is tightly attached to the first fan, the air outlet plate is tightly attached to the second fan, and the air outlet plate is tightly attached to the windbreak plate.

[0008] As a further technical solution of this utility model, a multi-layer sample rack is fixedly connected to the box body, and samples to be processed are placed on the multi-layer sample rack.

[0009] As a further technical solution of this utility model, an air suction plate is fixedly connected to the box body, the air suction plate is closely attached to the evaporator, the evaporator is closely attached to the air guide arc, and the evaporator is fixedly connected in the box body.

[0010] As a further technical solution of this utility model, the observation component consists of a double-layer observation window, a rotating motor, a fixed rod, a propulsion cylinder, a cleaning rod, a cleaning component, a damper, and a telescopic spring. The output end of the rotating motor passes through the double-layer observation window and is fixedly connected to the fixed rod. The propulsion cylinder is fixedly connected in the fixed rod. One end of the cleaning rod is fixedly connected to the output end of the propulsion cylinder. The cleaning rod is slidably connected in the fixed rod. A cleaning component is provided on both the fixed rod and the cleaning rod, and the cleaning component is in close contact with the double-layer observation window.

[0011] As a further technical solution of this utility model, a damper is fixedly connected to the cleaning component, and a telescopic spring is fixedly connected to the damper.

[0012] This utility model provides a high and low temperature testing air duct for multilayer semiconductor devices. Its advantages are as follows: By separately installing a first fan and a second fan on the chamber, with an air baffle in between, and using variable frequency centrifugal fans for adjustable airflow, the air outlets blow directly onto the sample to be processed, meeting the requirements for different sample load tests. Simultaneously, the evaporator absorbs heat from the chamber, cooling it to the set low temperature, while the heater provides the necessary heat for raising the equipment temperature. The first fan handles the circulation in the upper part of the air duct, and the second fan handles the circulation in the lower part, allowing for testing of different samples. The air outlets blowing directly onto the sample ensure a sufficiently high airflow velocity on the sample surface, meeting the requirements. The test chamber is designed to power on samples and ensure temperature uniformity. The air duct has two circulation paths to guarantee even air distribution. The chamber uses multi-layer sample racks to accommodate large batches of samples under load, resulting in high efficiency. Observation of the interior is achieved through a double-layered viewing window. Simultaneously, a rotating motor drives a fixed rod and a propulsion cylinder. The propulsion cylinder ensures that one end of the cleaning rod is positioned at the edge of the double-layered viewing window. A damper and a telescopic spring work together to press the cleaning rod and cleaning components on the fixed rod firmly against the double-layered viewing window. Cleaning the window with these components allows users to clearly observe the interior of the chamber, enhancing the user experience. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram showing the position of the first fan in this utility model;

[0016] Figure 3 This is a schematic diagram showing the position of the fixing rod in this utility model;

[0017] Figure 4 This is a schematic diagram showing the position of the damper in this utility model.

[0018] In the diagram: 1. Test component; 3. Observation component; 11. Box; 12. Air guide arc; 13. Heater; 14. First fan; 15. Air baffle; 16. Second fan; 17. Air outlet plate; 18. Multi-layer sample rack; 19. Sample to be processed; 20. Air suction plate; 21. Evaporator; 31. Double-layer observation window; 32. Rotary motor; 33. Fixing rod; 34. Propulsion cylinder; 35. Cleaning rod; 36. Cleaning component; 37. Damper; 38. Telescopic spring. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Please see the appendix Figure 1 -Appendix Figure 4This utility model provides an embodiment of a high and low temperature testing air duct for multilayer semiconductor devices, comprising a testing component 1. The testing component 1 consists of a housing 11, a guide arc 12, a heater 13, a first fan 14, an air baffle 15, a second fan 16, an air outlet plate 17, a multilayer sample rack 18, a sample to be processed 19, an air suction plate 20, and an evaporator 21. The guide arc 12 is fixedly connected to the housing 11, and the heater 13 is symmetrically fixedly connected to the guide arc 12. The first fan 14 is fixedly connected to the heater 13, and the first fan 14 is fixedly connected to the air baffle 15. 5. The air baffle 15 is fixedly connected to the housing 11. A double-layered observation window 31 from the observation assembly 3 is symmetrically fixedly connected to the housing 11. A rotating motor 32 is fixedly connected to the double-layered observation window 31. A first fan 14 is fixedly connected to the housing 11. A second fan 16 is fixedly connected to the air baffle 15. The second fan 16 is fixedly connected to the heater 13 and the housing 11. An air outlet plate 17 is fixedly connected to the housing 11. The air outlet plate 17 is tightly attached to the first fan 14 and the second fan 16. A multi-layer sample rack 18 is fixedly connected to the housing 11, with samples 19 to be processed placed on it. An air suction plate 20 is fixedly connected to the housing 11, closely attached to the evaporator 21, which is in close contact with the air guide arc 12. The evaporator 21 is fixedly connected inside the housing 11. The observation assembly 3 consists of a double-layer observation window 31, a rotating motor 32, a fixing rod 33, a propulsion cylinder 34, a cleaning rod 35, a cleaning component 36, a damper 37, and a telescopic spring 38. The output end of the rotating motor 32 passes through the double-layer observation window 31. A fixed connection is made to a fixed rod 33, and a propulsion cylinder 34 is fixedly connected to the fixed rod 33. One end of a cleaning rod 35 is fixedly connected to the output end of the propulsion cylinder 34. The cleaning rod 35 is slidably connected to the fixed rod 33. A cleaning component 36 is provided on both the fixed rod 33 and the cleaning rod 35. The cleaning component 36 is in close contact with the double-layer observation window 31 and is used to clean the double-layer observation window 31. A damper 37 is fixedly connected to the cleaning component 36, and a telescopic spring 38 is fixedly connected to the damper 37. The damper 37 is used to cooperate with the telescopic spring 38 to press the cleaning component 36 onto the double-layer observation window 31.

[0022] Specifically, in use, a first fan 14 and a second fan 16 are respectively installed on the chamber 11, with an air baffle 15 installed in between. The first fan 14 and the second fan 16 are variable frequency centrifugal fans with adjustable air speeds. The air outlets are directed at the sample 19 to be processed, which can meet the needs of different sample load tests. At the same time, the evaporator 21 absorbs heat from the chamber 11, cooling the chamber to the set low temperature. The heater 13 generates heat to provide the necessary heat for the equipment to heat up. The first fan 14 is responsible for the circulation of the upper part of the air duct, and the second fan 16 is responsible for the circulation of the lower part of the air duct, which can meet the needs of different samples for testing. The air outlets are directed at the samples to ensure a sufficiently high air velocity on the sample surface, which can meet the needs of the sample to be powered on for testing and ensure uniform temperature. The air duct has two-way air circulation to ensure even air distribution in each path. The chamber uses a multi-layer sample rack 18, which can meet the needs of large-scale sample loading and testing, resulting in high work efficiency. The interior of the chamber 11 can be observed through the double-layer observation window 31. At the same time, the output of the rotating motor 32 drives the fixed rod 33 and the propulsion cylinder 34 to rotate. The output of the propulsion cylinder 34 ensures that one end of the cleaning rod 35 is located at the edge of the double-layer observation window 31. Simultaneously, the damper 37 and the extension spring 38 work together to press the cleaning rod 35 and the cleaning component 36 on the fixed rod 33 tightly against the double-layer observation window 31. The cleaning component 36 is used to clean the double-layer observation window 31, allowing the user to observe the internal condition of the chamber 11 with clear observation and improving the user experience.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0025] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A multilayer semiconductor device high-low temperature test air duct comprising a test assembly (1), characterized in that: The test assembly (1) is composed of a box (11), a wind guide arc (12), a heater (13), a first fan (14), a wind isolation plate (15), a second fan (16), an air outlet hole plate (17), a multi-layer sample rack (18), a sample to be treated (19), an air suction hole plate (20) and an evaporator (21), the wind guide arc (12) is fixedly connected to the box (11), the heater (13) is fixedly connected to the wind guide arc (12) in a symmetrical manner, the first fan (14) is fixedly connected to the heater (13), the first fan (14) is fixedly connected to the wind isolation plate (15), the wind isolation plate (15) is fixedly connected to the box (11), the double-layer observation window (31) in the observation assembly (3) is fixedly connected to the box (11) in a symmetrical manner, and the rotating motor (32) is fixedly connected to the double-layer observation window (31).

2. The high-low temperature test air duct for multi-layer semiconductor devices of claim 1, wherein: The first fan (14) is fixedly connected to the box (11), the second fan (16) is fixedly connected to the wind isolation plate (15), the second fan (16) is fixedly connected to the heater (13), the second fan (16) is fixedly connected to the box (11), and the air outlet hole plate (17) is fixedly connected to the box (11).

3. The high-low temperature test air duct for multi-layer semiconductor devices of claim 2, wherein: The air outlet hole plate (17) is tightly attached to the first fan (14), the air outlet hole plate (17) is tightly attached to the second fan (16), and the air outlet hole plate (17) is tightly attached to the wind isolation plate (15).

4. The high-low temperature test air duct for multi-layer semiconductor devices of claim 2, wherein: The multi-layer sample rack (18) is fixedly connected to the box (11), and the sample to be treated (19) is arranged on the multi-layer sample rack (18).

5. The high-low temperature test air duct for multi-layer semiconductor devices of claim 4, wherein: The air suction hole plate (20) is fixedly connected to the box (11), the air suction hole plate (20) is tightly attached to the evaporator (21), the evaporator (21) is tightly attached to the wind guide arc (12), and the evaporator (21) is fixedly connected to the box (11).

6. The high-low temperature test air duct for multi-layer semiconductor devices of claim 1, wherein: The observation assembly (3) is composed of a double-layer observation window (31), a rotating motor (32), a fixed rod (33), a propelling air cylinder (34), a cleaning rod (35), a cleaning piece (36), a damper (37) and a telescopic spring (38), the output end of the rotating motor (32) penetrates through the double-layer observation window (31) and is fixedly connected to the fixed rod (33), the propelling air cylinder (34) is fixedly connected in the fixed rod (33), one end of the cleaning rod (35) is fixedly connected to the output end of the propelling air cylinder (34), the cleaning rod (35) is slidingly connected in the fixed rod (33), the cleaning piece (36) is arranged on the fixed rod (33) and the cleaning rod (35), and the cleaning piece (36) is tightly attached to the double-layer observation window (31).

7. The high-low temperature test air duct for multi-layer semiconductor devices of claim 6, wherein: The damper (37) is fixedly connected in the cleaning piece (36), and the telescopic spring (38) is fixedly connected in the damper (37).

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