Micro LED virtual pixel module detection equipment

Abstract

The utility model discloses an M-micro LED virtual pixel module detection device, which relates to the technical field of semiconductor display and comprises a detection table, a moving frame, a pair of detection mechanisms and a displacement mechanism. The moving frame is arranged on the detection table, the two detection mechanisms are arranged on the moving frame in a sliding mode through sliding rods, the displacement mechanism is arranged on the moving frame and used for driving the two detection mechanisms to synchronously move on the moving frame, and lamp bead detection of a micro LED lamp bead circuit board can be rapidly completed. According to the design, the detection time of a single circuit board is greatly shortened, the overall detection efficiency is improved, and the design is particularly key to Micro LED products produced on a large scale.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor displays, and more specifically, to a Micro LED virtual pixel module detection device. Background Technology

[0002] With the rapid development of display technology, light-emitting diode (LED) technology, especially microLED technology at the micrometer scale, is gradually demonstrating its enormous application potential as a representative of the next generation of display technologies. MicroLED, with its self-emissive display characteristics, backlight-free design, and advantages over traditional organic light-emitting diode (OLED) technology such as higher brightness, better luminous efficiency, and lower power consumption, has become a research hotspot and a key direction for commercial applications in the future display field.

[0003] Specifically, due to their tiny size (on the micrometer scale), MicroLED chips present challenges in the manufacturing process, including difficulties in transferring large quantities of material and difficulties in precise identification by transfer equipment. These issues directly lead to a significant reduction in the yield of MicroLED products. Therefore, effectively and efficiently identifying whether the brightness of MicroLED chips meets the standards has become crucial for improving the quality control level of MicroLED products and accelerating their commercialization.

[0004] Based on this, we provide a Micro LED virtual pixel module testing device. Utility Model Content

[0005] To address the problems mentioned in the background, this invention provides a Micro LED virtual pixel module testing device that can quickly complete the testing of Micro LED beads on the circuit board. This design significantly shortens the testing time for a single circuit board and improves the overall testing efficiency, which is particularly crucial for large-scale production of Micro LED products.

[0006] The Micro LED virtual pixel module detection device provided by this utility model adopts the following technical solution:

[0007] A Micro LED virtual pixel module inspection device includes an inspection table, a movable frame, a pair of inspection mechanisms, and a displacement mechanism. The movable frame is mounted on the inspection table, and the two inspection mechanisms are slidably mounted on the movable frame via slide rods. The displacement mechanism is mounted on the movable frame and is used to drive the two inspection mechanisms to move synchronously on the movable frame. The displacement mechanism includes a drive shaft, a driven shaft, a fixed rod, a first transmission belt, and a second transmission belt. Both the drive shaft and the driven shaft are rotatably mounted on the top of the movable frame. A drive gear is located in the middle of the drive shaft, and a driven gear is located in the middle of the driven shaft. The drive gear and the driven gear are meshed together. A motor for driving the drive shaft is mounted on the movable frame. The fixed rod is fixedly mounted on the movable frame. One transmission belt is mounted between the fixed rod and the drive shaft, and the second transmission belt is mounted between the fixed rod and the driven shaft. The first and second transmission belts cooperate to enable the two inspection mechanisms to move synchronously on the inspection table.

[0008] Preferably, the detection mechanism includes a horizontal sleeve, a driving component, and a detection camera; the horizontal sleeve is sleeved between two sliding rods, the detection camera is slidably disposed on the side of the horizontal sleeve, and the driving component is disposed inside the horizontal sleeve for driving the detection camera to move on the horizontal sleeve; the top of one horizontal sleeve is fixedly connected to the middle of the first transmission belt, and the top of the other horizontal sleeve is fixedly connected to the middle of the second transmission belt.

[0009] Preferably, the bottom of the testing platform is equipped with an electric actuator, the movable frame is slidably mounted on the testing platform, and the support legs of the movable frame are arranged at the bottom of the testing platform. The output end of the electric actuator is connected to the support legs of the movable frame through a connecting plate.

[0010] Preferably, the top of the testing station is provided with a placement frame for placing Micro LED lamp bead circuit boards.

[0011] Preferably, the side of the testing platform is provided with an electric push rod two, the output end of which is connected to the placement frame and is used to push the placement frame out of the testing platform.

[0012] Preferably, a movable plate is placed inside the placement frame via a clip, a wedge block one is provided at the bottom of the movable plate, and a wedge block two is provided at the top of the detection platform. When the placement frame moves, the wedge block one contacts the wedge block two, causing the movable plate to move upward within the placement frame.

[0013] In summary, this utility model has the following beneficial technical effects:

[0014] 1. The motor drives the drive shaft to rotate, which in turn drives the transmission belt. Simultaneously, the drive gear on the drive shaft drives the driven gear to rotate, which in turn drives the driven shaft. The rotation of the driven shaft causes the transmission belt to rotate. The drive shaft and the driven shaft rotate in opposite directions. Thus, the transmission belts drive the corresponding detection mechanisms to move closer to each other. The two detection mechanisms synchronously detect the Micro LED lamp bead circuit board and acquire image information of the Micro LED lamp bead circuit. Through this structural design, the lamp bead detection of the Micro LED lamp bead circuit board can be completed quickly. This design significantly shortens the detection time of a single circuit board and improves the overall detection efficiency, which is especially crucial for the mass production of Micro LED products.

[0015] 2. By periodically moving the detection camera on the horizontal sleeve, a row of Micro LED beads is detected. In conjunction with the displacement mechanism, two detection cameras can simultaneously complete the detection of the Micro LED beads on the circuit board, which greatly shortens the detection time of a single circuit board. Moreover, when the two detection cameras reach the center point of the circuit board, a reset detection is performed, and the circuit board is inspected a second time. Through this structural design, the brightness status of each LED bead can be evaluated more comprehensively and accurately. Furthermore, this redundant design helps to reduce missed detections and false judgments, which can improve the reliability of the detection results to a certain extent.

[0016] 3. The fabrication method of Micro LED virtual pixel modules significantly improves the efficiency of Micro LED chip transfer and packaging. The use of laser lift-off and mass transfer technology ensures the accuracy of chip transfer and the stability after packaging. The virtual pixel array with RGGB arrangement improves display resolution and color saturation. By optimizing process steps and reducing material waste, the cost of module fabrication is reduced, solving the problems of high difficulty and high cost in the fabrication of virtual pixel modules.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a Micro LED virtual pixel module detection device according to an embodiment of this utility model;

[0019] Figure 2 This is a schematic diagram of the other side of a Micro LED virtual pixel module detection device according to an embodiment of this utility model;

[0020] Figure 3 This is a schematic diagram of the bottom structure of a Micro LED virtual pixel module detection device according to an embodiment of this utility model;

[0021] Figure 4 yes Figure 1 Enlarged structural diagram at point A;

[0022] Figure 5 This is a schematic diagram of the internal structure of a Micro LED virtual pixel module detection device according to an embodiment of this utility model;

[0023] Figure 6 This is a schematic diagram of the structure of the movable plate within the placement frame in an embodiment of this utility model;

[0024] Figure 7 This is a schematic diagram of the structure of the movable plate at the top of the placement frame in an embodiment of this utility model;

[0025] Figure 8 This is a schematic diagram of the structure of the Micro LED virtual pixel module in an embodiment of this utility model;

[0026] Figure 9 This is a schematic diagram of the module interface of the Micro LED virtual pixel module in an embodiment of this utility model;

[0027] Figure 10 This is a process flow diagram of the fabrication process of a Micro LED virtual pixel module according to an embodiment of this utility model.

[0028] Explanation of reference numerals in the attached drawings: 1. Testing table; 2. Moving frame; 3. Testing mechanism; 300. Horizontal sleeve; 301. Testing camera; 4. Displacement mechanism; 400. Drive shaft; 401. Driven shaft; 402. Fixed rod; 403. Transmission belt one; 404. Transmission belt two; 405. Drive gear; 406. Driven gear; 407. Motor; 5. Electric push rod one; 6. Placement frame; 7. Electric push rod two; 8. Moving plate; 9. Wedge one; 10. Wedge two. Detailed Implementation

[0029] The following is in conjunction with the appendix Figures 1 to 10 The present invention will be described in further detail below.

[0030] It should be noted that the accompanying drawings are schematic and not to scale. For clarity and convenience, the relative dimensions and proportions of the parts shown are exaggerated or reduced in size; all dimensions are merely illustrative and not limiting. Furthermore, the same reference numerals are used for the same structures, elements, or fittings appearing in more than two drawings to indicate similar features.

[0031] Example 1

[0032] This utility model discloses a Micro LED virtual pixel module detection device. (Refer to...) Figures 1 to 7 A Micro LED virtual pixel module inspection device includes an inspection platform 1, a movable frame 2, a pair of inspection mechanisms 3, and a displacement mechanism 4. The movable frame 2 is mounted on the inspection platform 1, and the two inspection mechanisms 3 are slidably mounted on the movable frame 2 via slide bars. The displacement mechanism 4 is mounted on the movable frame 2 and is used to drive the two inspection mechanisms 3 to move synchronously on the movable frame 2. The displacement mechanism 4 includes a drive shaft 400, a driven shaft 401, a fixed rod 402, a first transmission belt 403, and a second transmission belt 404. Both the drive shaft 400 and the driven shaft 401 are rotatably mounted on the top of the movable frame 2, and a drive gear 405 is provided in the middle of the drive shaft 400. A driven gear 406 is provided in the middle of the driven shaft 401, and the driving gear 405 is meshed with the driven gear 406. A motor 407 for driving the driving shaft 400 to rotate is provided on the moving frame 2. The motor 407 is a servo motor, which is controlled by the PLC controller program and can rotate in both directions. The fixed rod 402 is fixedly set on the moving frame 2. The first transmission belt 403 is sleeved between the fixed rod 402 and the driving shaft 400, and the second transmission belt 404 is sleeved between the fixed rod 402 and the driven shaft 401. The first transmission belt 403 and the second transmission belt 404 cooperate to make the two detection mechanisms 3 move synchronously on the detection table 1.

[0033] Specifically, the pulleys on the fixed rod 402 that connect to the first transmission belt 403 and the second transmission belt 404 are rotatably connected to the fixed rod 402, the pulleys on the drive shaft 400 that connect to the first transmission belt 403 are fixedly connected to the drive shaft 400, and the pulleys on the driven shaft 401 that connect to the second transmission belt 404 are fixedly connected to the driven shaft 401.

[0034] The Micro LED bead circuit board is placed on top of the testing platform 1 and continuously illuminated. A motor 407 drives the drive shaft 400 to rotate, which in turn drives the transmission belt 403. Simultaneously, the drive gear 405 on the drive shaft 400 drives the driven gear 406 to rotate, causing the driven shaft 401 to rotate. The rotation of the driven shaft 401 then drives the transmission belt 404. The drive shaft 400 and driven shaft 401 rotate in opposite directions. Thus, the transmission belts 403 and 404 respectively drive the corresponding testing mechanisms 3 to move closer together. The two testing mechanisms 3 synchronously test the Micro LED bead circuit board, acquiring image information of the Micro LED bead circuit. This structural design allows for rapid testing of the Micro LED bead circuit board, significantly reducing the testing time for a single circuit board and improving overall testing efficiency, which is particularly crucial for large-scale production of Micro LED products.

[0035] like Figure 1 and Figure 2 As shown, the detection mechanism 3 includes a horizontal sleeve 300, a driving component, and a detection camera 301. The horizontal sleeve 300 is sleeved between two sliding rods, the detection camera 301 is slidably disposed on the side of the horizontal sleeve 300, and the driving component is disposed inside the horizontal sleeve 300 for driving the detection camera 301 to move on the horizontal sleeve 300. The top of one horizontal sleeve 300 is fixedly connected to the middle of the first transmission belt 403, and the top of the other horizontal sleeve 300 is fixedly connected to the middle of the second transmission belt 404.

[0036] Specifically, the internal rotating connection of the horizontal sleeve 300 is a lead screw, and the upper part of the horizontal sleeve 300 is fitted with a servo motor that drives the lead screw to rotate. The middle thread of the lead screw is fitted with a sliding plate, and the detection camera 301 is mounted on the sliding plate.

[0037] Specifically, the detection camera 301 is a high-resolution camera.

[0038] The use of the detection mechanism 3 involves the periodic movement of the detection camera 301 on the horizontal sleeve 300 to detect a row of Micro LED beads. In conjunction with the displacement mechanism 4, the two detection cameras 301 can simultaneously complete the detection of the Micro LED beads on the circuit board, significantly shortening the detection time of a single circuit board. Moreover, when the two detection cameras 301 detect the center point of the circuit board, a reset detection is performed, and the circuit board is inspected a second time. Through this structural design, the brightness status of each bead can be evaluated more comprehensively and accurately. Furthermore, this redundant design helps to reduce missed detections and misjudgments, which can improve the reliability of the detection results to a certain extent.

[0039] Example 2

[0040] This embodiment is a further optimization based on the above embodiments. The parts that are the same as those in the foregoing technical solutions will not be repeated here. Figure 5 As shown, in order to better realize this utility model, the following arrangement is adopted: In this embodiment, the bottom of the detection table 1 is equipped with an electric push rod 5, the movable frame 2 is slidably arranged on the detection table 1, and the support legs of the movable frame 2 are arranged at the bottom of the detection table 1. The output end of the electric push rod 5 is connected to the support legs of the movable frame 2 through a connecting plate.

[0041] Specifically, the moving frame 2 can be moved up and down by pushing the electric push rod 5, thereby adjusting the position between the detection camera 301 and the circuit board.

[0042] like Figure 5 , Figure 6 and Figure 7As shown, the top of the testing station 1 is equipped with a placement frame 6 for placing Micro LED lamp bead circuit boards. By setting the placement frame 6, it can be ensured that the initial testing point of the Micro LED lamp bead circuit board is aligned with the two testing cameras 301.

[0043] like Figure 5 As shown, an electric push rod 7 is provided on the side of the testing platform 1. The output end of the electric push rod 7 is connected to the placement frame 6 and is used to push the placement frame 6 out of the testing platform 1. This design makes it convenient for staff to place Micro LED lamp bead circuit boards.

[0044] like Figure 6 and Figure 7 As shown, a movable plate 8 is placed inside the placement frame 6 via a clip. A wedge 9 is provided at the bottom of the movable plate 8, and a wedge 10 is provided at the top of the detection table 1. When the placement frame 6 moves, the wedge 9 contacts the wedge 10, causing the movable plate 8 to move upward within the placement frame 6.

[0045] When the placement frame 6 moves out of the testing table 1, the wedge 9 at the bottom of the moving plate 8 can contact the wedge 10, thereby the wedge 10 lifts the wedge 9, so that the moving plate 8 lifts the circuit board in the placement frame 6, making it convenient for the staff to pick up and place the circuit board.

[0046] Specifically, the control method of this utility model is controlled by a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming, and the control method and circuit connection will not be explained in detail here.

[0047] Example 3

[0048] A method for fabricating a Micro LED virtual pixel module includes the following steps:

[0049] S1. Select suitable red, green, and blue Micro LED chips (COW, Chip On Wafer); prepare a sapphire substrate as the carrier for chip transfer; prepare transfer adhesive for temporary bonding between the chip and the carrier; prepare a PCB substrate as the basis for circuit connections; prepare encapsulation adhesive, driving capacitors, resistors, driver ICs, transformers, floating connectors, and other electronic components.

[0050] S2. Electronic components such as capacitors, resistors, driver ICs, transformers, and floating connectors are mounted on the driving surface of the PCB substrate to form a circuit connection network.

[0051] S3. Perform a bumping process on the PCB substrate to create bumps on the PAD positions of the connecting devices through electroplating or chemical deposition, which are used for subsequent electrical connection with the Micro LED chip.

[0052] S4. Temporarily bond the sapphire substrate coated with transfer adhesive to the red, green and blue Micro LED chips respectively to form three independent bonding bodies;

[0053] S5. Using laser lift-off technology, the bonded red, green, and blue Micro LED chips are separated from the original wafer and transferred to a sapphire substrate;

[0054] S6. Using mass transfer technology, the red, green, and blue chips on the laser-lifted sapphire substrate are transferred in an orderly manner to another sapphire substrate coated with transfer adhesive, forming a virtual pixel array in RGGB (red-green-blue-green) arrangement.

[0055] S7. After welding is completed, the temporarily bonded sapphire substrate is removed by mechanical peeling.

[0056] S8. After removing the sapphire wafer, use chemical or physical methods to clean the remaining transfer adhesive to ensure the cleanliness of the chip surface;

[0057] S9. A protective film is applied to the display surface of the glass substrate using surface coating technology to encapsulate the Micro LED display chip inside, thus protecting the chip from the influence of the external environment.

[0058] S10. Perform electrical and optical performance tests on the packaged Micro LED virtual pixel module to ensure that the module performance meets the design requirements.

[0059] Through automated and refined process steps, the efficiency of Micro LED chip transfer and packaging has been significantly improved. The use of laser lift-off and mass transfer technology ensures the accuracy of chip transfer and the stability after packaging. The virtual pixel array with RGGB arrangement improves display resolution and color saturation. By optimizing process steps and reducing material waste, the cost of module manufacturing has been reduced, solving the problems of high difficulty and high cost in virtual pixel module manufacturing.

[0060] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0061] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0062] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0063] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0065] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0066] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1.A Micro LED virtual pixel module detection device, characterized in that, The utility model relates to a kind of detection device for Micro LED lamp bead circuit board, including: Detection platform (1), mobile frame (2), a pair of detection mechanism (3) and displacement mechanism (4); The mobile frame (2) is arranged on detection platform (1), and two detection mechanism (3) is slidably arranged on mobile frame (2) by slide rod, and displacement mechanism (4) is arranged on mobile frame (2), for driving two detection mechanism (3) synchronous movement on mobile frame (2); Wherein, the displacement mechanism (4) includes: Driving shaft (400), driven shaft (401), fixed rod (402), transmission belt one (403) and transmission belt two (404); Driving shaft (400) and driven shaft (401) are rotatably arranged on the top of mobile frame (2), and the middle part of driving shaft (400) is provided with driving gear (405), and the middle part of driven shaft (401) is provided with driven gear (406), and driving gear (405) is connected with driven gear (406) by meshing, and motor (407) for driving driving shaft (400) to rotate is arranged on mobile frame (2); Fixed rod (402) is fixedly arranged on mobile frame (2), transmission belt one (403) is sleeved between fixed rod (402) and driving shaft (400), and transmission belt two (404) is sleeved between fixed rod (402) and driven shaft (401); Transmission belt one (403) and transmission belt two (404) cooperate, so that two detection mechanism (3) synchronous movement on detection platform (1). 2.The Micro LED virtual pixel module detection device of claim 1, wherein: The detection mechanism (3) includes: Horizontal sleeve (300), driving part and detection camera (301); Horizontal sleeve (300) is sleeved between two slide rods, and detection camera (301) is slidably arranged on the side of horizontal sleeve (300), and driving part is arranged in horizontal sleeve (300), for driving detection camera (301) to move on horizontal sleeve (300); The top of one horizontal sleeve (300) is fixedly connected with the middle part of transmission belt one (403), and the top of another horizontal sleeve (300) is fixedly connected with the middle part of transmission belt two (404). 3.The Micro LED virtual pixel module detection device of claim 1, wherein: The bottom of detection platform (1) is equipped with electric push rod one (5), mobile frame (2) is slidably arranged on detection platform (1), and the leg of mobile frame (2) is arranged on the bottom of detection platform (1), and the output end of electric push rod one (5) is connected with the leg of mobile frame (2) through connecting plate. 4.The Micro LED virtual pixel module detection device of claim 1, wherein: The top of detection platform (1) is provided with placing frame (6), for putting Micro LED lamp bead circuit board. 5.The Micro LED virtual pixel module detection device of claim 4, wherein: The side of detection platform (1) is provided with electric push rod two (7), and the output end of electric push rod two (7) is connected with placing frame (6), for pushing placing frame (6) out of detection platform (1). 6.The Micro LED virtual pixel module detection device of claim 5, wherein: The inside of placing frame (6) is placed with movable plate (8) by clamping piece, the bottom of movable plate (8) is provided with wedge one (9), and the top of detection platform (1) is provided with wedge two (10), when placing frame (6) moves, wedge one (9) contacts wedge two (10) so that movable plate (8) moves up in placing frame (6).

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